Abstract: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.

Abstract: Disclosed is a whisker-formation resistant composition that is suitable for use as a lead-free soldering composition. The composition includes a fusible material and a matrix material that is aggregated with the fusible material. Typically the fusible material has a lower melting temperature than the melting temperature of the matrix material and has a coefficient of thermal expansion that is higher than the coefficient of thermal expansion of the matrix material. Also provided is a method of reducing the formation of whiskers adjacent solder that bridges a joint. The method includes the step of melting a fusible material adjacent the joint. A further step is solidifying the fusible material while establishing a static tensile stress tendency in the fusible material.

Abstract: A wire for use in a brazing or soldering operation is provided. The wire preferably includes a body formed of a metallic material. A flux solution is provided within a channel along at least a portion of the length of the body and a surface of the flux solution is exposed. The body is preferably formed into an annular ring having an inner wall and an opposing outer wall. The flux solution preferably includes a solvent, a polymer dissolved in the solvent, and a powdered flux added to the polymer solution.

Abstract: An activating flux for welding stainless steel includes: from 25 to 40 weight percent of titanium dioxide (TiO2); from 25 to 30 weight percent of chromium oxide (Cr2O3); from 10 to 30 weight percent of silicon dioxide (SiO2); from 10 to 15 weight percent of molybdenum disulphide (MoS2); and from 5 to 15 weight percent of molybdenum trioxide (MoO3), which are active additive materials. A welding rod or wire includes a welding material and an activating flux. The activating flux layer is provided on or in the welding rod or wire and is formed as an outer layer or a core portion of the welding rod or wire.

Abstract: The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the surface is carried out.

Abstract: A flux for use in a hot dip galvanization process has an acidic component so that the flux has a pH of about 1.5 or less. The flux also includes an alkali metal chloride and a nonionic surfactant containing polyoxyethylenated straight-chain alcohols with a hydrophile-lipophile balance (HLB) of less than 11. Depending on the particular application, the flux also includes other components, such as ferric chloride, an inhibitor containing an amino derivative and bismuth oxide.

Abstract: Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and WA(g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and WOH(g), respectively, then AV×WA:OHV×WOH=1:0.4 to 0.6.

Abstract: A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: The method for bonding a semiconductor element comprises the step of applying to solder bumps 10 of a semiconductor chip 12 a soldering flux 16 which contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the thermosetting resin remains uncured after reflow-bonding, the step of reflow-bonding the solder bumps 10 to the electrodes 18 of the circuit board 20 with the soldering flux 16 while melting the solder bumps 10, and the step of filling an underfill material 22 between the semiconductor chip 12 and the circuit board 20 with the soldering flux 16 being left, the underfill material 22 containing a thermosetting resin of the same group as the thermosetting resin contained in the soldering flux 16 and at least one of a curing agent and a cure catalyst for curing the thermosetting resins.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.

Abstract: A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.

Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.

Abstract: A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a colour-imparting component with an appropriate colour to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The colour-imparting component is utilised to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.

Abstract: A highly basic particle flux for submerged arc welding that produces less than 7 ml/100 gr of diffusible hydrogen in the weld metal, which flux comprises a carbon dioxide containing compound with an effective amount of heat releasable carbon dioxide in the range of 0.5-3.5% by weight of the flux over 10% by weight of a low melting point compound and a binder.

Abstract: Disclosed is an aluminum alloy brazing sheet for heat exchanger which excels in resistance to corrosion from its inside and simultaneously attains satisfactory erosion resistance and high strength. This includes a core material of an Al alloy containing predetermined amounts of Si, Mn, Cu, Mg, and Ti; a clad material of an Al alloy containing predetermined amounts of Si, Mn, and Zn, having a predetermined thickness, and lying on one side of the core material so as to constitute an inner side of a tube member of the heat exchanger; and a filler material of an Al alloy containing a predetermined amount of Si, having a predetermined thickness, and lying on the other side of the core material so as to constitute an outer side of the tube member. The crystal grain size of the core material after brazing under specific conditions is 50 ?m or more but less than 300 ?m in a rolling direction.

Abstract: A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a first melting point temperature and a second metal having a second melting point temperature, the first melting point temperature being greater than the second melting point temperature. The precursor material is heated to a process temperature (Tp) that is greater than the second melting point temperature and less than the first melting point temperature, and the precursor material is isothermally held at the process temperature (Tp) for a preselected holding period so as to form a metal alloy material having a melting point temperature that is greater than the process temperature. The solder material can be used to bond two components together in a device specified for use at an application temperature (Ta), where Ta/Tp>1.

Abstract: Lead-free solders based on an Sn—In—Ag solder alloy contain 88 to 98.5 wt. % Sn, 1 to 10 wt. % In, 0.5 to 3.5 wt. % Ag, 0 to 1 wt. % Cu, and a doping with a crystallization modifier, the crystallization modifier preferably being a maximum of 100 ppm neodymium.

Abstract: A Penetration Enhancing Activating Flux (PEAF) in paste form for autogenous TIG welding of austenitic stainless steels adapted for ready application with a brush on top weld surface prior to conducting autogenous TIG welding to favour single weld pass, of austenitic stainless steels of AISI 304LN and AISI 316LN varieties with weld bead penetration up to a section thickness of 12 mm. Importantly, the above (PEAF) paste based TIG welding of the invention achieves an increase in weld bead penetration of about 300% over the conventional TIG process without activating flux. The PEAF paste based TIG welding also favours higher productivity and high quality apart from being cost-effective due to less requirement of consumables and controlled heat input to arrest distortion, making it widely acceptable for variety of industrial applications for welding of austenitic stainless steel.

Abstract: The invention relates to an aqueous coating material for metallic substrates, comprising a water-dispersible and/or water-soluble polymer P with covalently bonded ligands A, which form chelates with the metal ions released during the corrosion of the substrate and/or with the substrate surface, and having crosslinking functional groups B, which with themselves, with further complementary functional groups B? of the polymer P and/or with further functional groups B and/or B? are able to form covalent bonds to crosslinkers V, and at least one surface-active substance OS at the surface of the substrate to be coated.

Abstract: A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly formulated for limited pass welding applications which exhibit high impact strength, good slag detachability, low weld metal hydrogen and nitrogen absorption, and facilitates in the formation of smooth and consistent weld beads.

Abstract: A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.

Abstract: The present invention relates to a brazing material comprising an alloy containing essentially of: 15 to 30 wt % chromium (Cr); 0.1 to 5.0 wt % manganese (Mn); 9 to 20 wt % nickel (Ni); 0 to 4.0 wt % molybdenum (Mo); 0 to 1.0 wt % nitrogen (N); 1.0 to 7.0 wt % silicone (Si); 0 to 0.2 wt % boron (B); 1.0 to 7.0 wt % phosphorus (P); optionally 0.0 to 2.5 wt % of each of one or more of elements selected from the group consisting of vanadium (V), titanium (Ti), tungsten (W), aluminum (Al), niobium (Nb), hafnium (Hf) and tantalum (Ta); the alloy being balanced with Fe, and small inevitable amounts of contaminating elements; and wherein Si and P are in amounts effective to lower melting temperature. The present invention relates further to a method of brazing, a product brazed with the brazing material.

Abstract: High strength, reliable bulk metallic glass (BMG) solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes. BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric (ILD) materials due to thermal stress in materials with different coefficients of thermal expansion (CTE). BMG solder materials may physically, electrically, or thermally couple a feature to another feature, or any combination thereof. For example, in an embodiment of the invention, a BMG solder material may physically and electrically couple an electronic component to a printed circuit board. In another embodiment of the invention, a BMG solder material may physically and thermally couple an integrated heat sink to a semiconductor device.

Abstract: A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at least one further initial phase at least one resultant phase, the solidus temperature of which is higher that the solidus temperature of the initial phases. Heat treatment takes place in two stages, wherein the temperature of the second heat treatment is preferably 800-1200° C. The brazing composition may likewise be of the type MCrAlX, and the power particles of the initial phase may be in the form of nanoparticles.

Abstract: Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The invention relates to a solder ally that comprises gallium and/or germanium, preferably forms the Y? phase and has improved mechanical properties.

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

Abstract: A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.

Abstract: A composition comprising a compound of formula (I) or (II): (A)w-P(O)(O?M+)3-w ??(I) or wherein A is Rf—(CH2)k?[(CF2CF)y—(CH2CH2)z]mO and contains from about 8 to about 22 carbon atoms; Rf is CnF2n+1; n and k are each independently 1 to about 6; y, z, and m are each independently 1, 2, 3, or mixture thereof; w is 1 or 2 or a mixture thereof; and M is hydrogen, ammonium ion, an alkali metal ion, or an alkanolammonium ion.

Abstract: An alloy having a low melting point for liquid-phase diffusion bonding capable of bonding both Ni-based heat resistance alloy material and Fe-based steel material. The alloy comprises in atom percent (%): 22<Ni?60, B: 12-18, C: 0.01-4, and the balance being Fe and residual impurities; or comprises in atom percent (%): 22<Ni?60, B: 7-18, 4?C?11, and the balance being Fe and residual impurities.

Abstract: A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.

Abstract: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge.

Abstract: A flux for soldering of the present invention, in connecting a mounting pad exposed on a board to a solder ball, is applied onto at least one of a surface of the mounting pad and the solder ball. The flux for soldering contains a solvent, and the solvent contains a compound, which is represented by a general formula (1) and having a boiling point of 218° C. or higher and 240° C. or lower: R1-R2n-OH . . . (1).

Abstract: A composite composition and methods for making the composition, providing a metal matrix and dispersed inorganic oxide particles with a bound organofunctional group on a surface of the particles are described. A composite solder composition and methods for making and using the composition, providing a metal matrix and dispersed inorganic oxide particles with a bound organofunctional group on a surface of the particles are described. An apparatus comprising this composite solder composition is also described. In particular, organofunctional POSS, and POS, particles are described. The compositions provide cast metals and solders.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.

Abstract: Braze compositions containing flux compositions and processes for using such braze compositions, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze composition contains an aqueous binder system, multiple inorganic compounds, titanium hydride, and a metallic braze alloy. The braze composition is useful when brazing superalloys that are prone to oxidation at elevated brazing temperatures.

Abstract: An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an excellent brazeability. The thixotropic index of the brazing composition is adjusted to 1.01-1.20 by adding a (meth)acrylic acid/(meth)acrylate copolymer emulsion to the brazing composition as a precipitation inhibitor in an amount of 0.03-1.50 wt % of 100 wt % of the brazing composition. Since the (meth)acrylic acid/(meth)acrylate copolymer emulsion is used as the precipitation inhibitor in a specific amount instead of other types of compounds used for a powder-containing paint, such as ultrafine particle silica, poly(meth)acrylate, or polyvinyl alcohol, the precipitation of the zinc-based flux can be prevented without impairing the brazeability.

Abstract: Boric acid-free fluxes based on inorganic boron compounds for brazing metallic materials in combination with silver, copper or nickel base solders are known. Starting from this, in order to provide a further flux for brazing that is free of boric acid and contributes to a good wetting of the workpieces to be joined and that is distinguished by residues of low corrosivity, it is suggested according to the invention that the boron compounds should comprise potassium pentaborate and potassium metaborate, the ratio of the weight parts of potassium pentaborate and potassium metaborate being in the range between 4 and 10.

Abstract: A wire for use in a brazing or soldering operation is provided. The wire preferably includes a body formed of a metallic material. A flux solution is provided within a channel along at least a portion of the length of the body and a surface of the flux solution is exposed. The body is preferably formed into an annular ring having an inner wall and an opposing outer wall. The flux solution preferably includes a solvent, a polymer dissolved in the solvent, and a powdered flux added to the polymer solution.

Abstract: Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.

Abstract: The invention relates to a phosphating solution and a process for the phosphating of metallic surfaces with aqueous, acidic phosphating solutions that comprise zinc and phosphate ions, at least one source of peroxide and one or more aliphatic chelating carboxylic acids containing 2 to 7 carbon atoms; the phosphating solution having a free acid content of one point or less.

Abstract: An improved lead-free solder of Sn-0.7 wt % Cu which contains 0.001-1.5 wt % Ti and an alkaline element of Li, Na, K, Rb, Cs, etc. The alkaline element accounts for 0.0001-0.8 wt %. Compared with the traditional lead-free solder of Sn-0.7 wt % Cu, the lead-free solder of the present invention is characterized by the resulting welding spots with glossier and smoother surface, alloy solder with improved diffusivity, and solder surface with enhanced oxidation resistance.

Abstract: ABSTRACT OF THE DISCLOSURE The present invention is directed to a high protection coating process that is particularly useful for substrates in need of corrosion protection. The invention provides methods of applying a non-chrome passivating layer or conversion coating to a substrate and optionally, a secondary conversion or passivating layer to the non-chrome passivating layer or conversion coating, and articles having said coatings thereon.

Abstract: A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic peroxide radical whose oxygen-oxygen bond has been released. Since this organic peroxide radical is active, it abstracts hydrogen from the hydrocarbon compound. The formation of a hydrocarbon compound radical is accelerated by the organic peroxide so that even at a relatively low heating temperature, a sufficient amount of a hydrocarbon compound radical can be formed. As a result, an oxide film can be removed from the metal surface even at a relatively low heating temperature by the reduction caused by a hydrocarbon compound radical.