Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: [Problems] Addition of an organic acid such as a dicarboxylic acid to a soldering flux in order to improve wettability causes a reaction with copper oxide to form a metallic soap of copper having a green color. Although this metallic soap of copper is not corrosive and does not decrease reliability, its external appearance is impossible to distinguish it from verdigris which is indicative of corrosion. There is need for a soldering flux which does not form a metallic soap of copper. [Means for Solving the Problems] Addition of a tetrazole or a tetrazole derivative to a soldering flux can prevent carboxyl groups from reacting exclusively with copper ions, thereby suppressing the formation of a metallic soap of copper having a green color.

Abstract: A welding flux for stainless steel includes 30-55 wt % of silicon dioxide, 20-40 wt % of titanium dioxide, 10-20 wt % of chromium oxide, 5-20 wt % of molybdenum oxide, 5-10 wt % of molybdenum sulfide, and 5-10 wt % of halide.

Abstract: The present invention relates to a solder paste composition, a solder paste and a soldering flux. The soldering flux comprises a resin, a thixotropic agent, an activator, a solvent as well as a long-chain thiol and/or an organic chelating agent.

Abstract: A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier.

Abstract: A flux composition includes an alditol (A) and a polymer (B) which has a repeating structural unit represented by Formula (1): (wherein R1 is a hydrogen atom or a methyl group, and Z is a hydroxyl group, an oxo group, a carboxyl group, a formyl group, an amino group, a nitro group, a mercapto group, a sulfo group, an oxazoline group, an imide group, a group having an amide structure, or a group having any of these groups). The flux composition allows substrates with bumps such as pillar bumps to be electrically connected to each other by reflowing of such bumps without causing any exposure of the bumps from the flux during reflowing, thus resulting in a satisfactory electrically connected structure.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a color-imparting component with an appropriate color to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The color-imparting component is utilized to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.

Abstract: A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.

Abstract: Disclosed are quaternary ammonium salts containing non-halogen anions such as carbonates, bicarbonates, phosphates, glycolates and mixtures thereof as conversion coatings or additives imparting anti-corrosive properties to paints. The invention relates to a method for inhibiting the corrosion of metal surfaces by applying a composition containing one or more quaternary ammonium carbonate or bicarbonate. The disclosure is also directed to anti-corrosive coatings for metal substrates containing these compounds and to metal substrates having these anticorrosive coatings.

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: Aqueous flux preparations with increased dynamic viscosity are provided. In the flux preparations, irreversibly dehydrated K2AlF5 (also denoted as orthorhombic K2AlF5 or phase II salt) provides for an increase of the dynamic viscosity if the aqueous flux preparations are aged, i.e., a contact between water comprised in the preparation and irreversibly dehydrated K2AlF5 is maintained for a certain time span, preferably for at least 12 minutes. The higher viscosity improves the brazing process, for example because less flux preparation drops off from the parts to be brazed.

Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.

Abstract: A lead-free, cream solder composition that is printable includes a SnZn alloy which is lead-free and which is a powder; a solder flux including an epoxy resin; microcapsules that are organic carboxylic acid particles encapsulated with a resin selected from a group consisting of epoxy, polyimide, polycarbonate, polyamide, polyester, polyurea, polyolefin, and polysulfone resins; and a solvent which is a glycol. The presence of the organic carboxylic acid encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid Alternately, the solder flux may include the epoxy resin; an organic carboxylic acid; and the solvent; and microcapsules that are particles of a SnZn alloy encapsulated with the described resin. The presence of the SnZn alloy encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid so that viscosity and solderability are stabilized.

Abstract: The present invention comprises a compound of a compound of Formula 1 wherein Rf is a C2 to C12 perfluoroalkyl optionally interrupted by one to four moieties each independently selected from the group consisting of —CH2—, —O—, —S—, —S(O)—, and —S(O)2—; n is 1 to 6; m is 0 to 2, provided that m is less than or equal to n. X and Y are each independently O or NR, R is hydrogen or C1 to C6 alkyl; R1, and R2 are each independently C1 to C6 alkyl, optionally containing one or more oxygen atoms and may form a ring selected from the group of piperidine, pyrrolidine, and morpholine; and R3 is O?, (CH2)pC(O)O?, (CH2)pCH(OH)(CH2)SO3?, and (CH2)qSO3?; p is 1 to 4; and q is 2 to 4 which is useful as a surfactant.

Abstract: A flux or a flux preparation, which contains complex alkali metal fluorides and additionally includes a water-soluble polymer, preferably polyvinyl alcohol or a polyvinyl alcohol derivative. The water-soluble polymer may be contained in the flux preparation as a granulate or powder or used as a water-soluble package for the flux or flux preparation.

Abstract: The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

Abstract: A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: An anti-oxidative agent for molten metal containing at least nonylphenol polyoxyethylene ether, organic amine, phosphoric acid, and phytic acid. A method of preparing the anti-oxidative agent for molten metal, by a) heating an organic amine to between 60 and 100° C., adding a nonylphenol polyoxyethylene ether, and stirring for between 3 and 5 min to yield a mixture; and b) cooling the mixture to between 30 and 100° C., and adding phosphoric acid and phytic acid and stirring for between 10 and 15 min. The anti-oxidative agent for molten metal has no flash point and spreads quickly on the liquid surface, providing high reduction efficiency at lost cost.

Abstract: A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an organic solvent (d); and the component (d) is a hydrocarbon type organic solvent having no aromatic ring and no hydroxyl group and the composition is in a paste-like state having a viscosity of 6,000 to 200,000 mPa·s at 23° C. and accordingly, the storage stability and applicability (practically, discharge property and pressure stability by using a dispenser) and brazing property can be improved in good balance.

Abstract: A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 comprises at least two tertiary carbons and is selected from an unsubstituted C5-80 alkyl group, a substituted C5-80 alkyl group, an unsubstituted C12-80 arylalkyl group and a substituted C12-80 arylalkyl group; and, wherein the two nitrogens shown in formula I are each separately bound to one of the at least two tertiary carbons of R7; with the proviso that when the polyamine fluxing agent of formula I is represented by formula Ia: then zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the polyamine flux composition.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; and, wherein R9 is selected from a hydrogen, a C1-30

Abstract: A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with

Abstract: A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: The present invention provides an aluminum alloy brazing sheet that is applied particularly to a tube material of a heat exchanger and is excellent in brazability and erosion resistance. The present invention is an aluminum alloy brazing sheet having a core material comprising an Al—Mn system alloy and a brazing filler metal comprising an Al—Si system alloy containing Fe by 0.45 mass % or less on one surface or both the surfaces of the core material and is characterized in that, after subjected to a brazing treatment for 3 minutes at 600° C.: the area ratio of eutectic Si that is the flow passage of the brazing filler metal in a cross section of a solidified brazing filler metal is 35% or less; and the grain size in the rolling direction at the center section in the sheet thickness direction of the core material is 80 ?m or more.

Abstract: Soldering flux includes: a solvent of which solubility in water is more than 0.01% by weight and less than 6.8% by weight; an organic acid component; and amine counteracting the organic acid component. A solubility of the amine in water is more than 5.0% by weight, and the amine is able to be linked to a conductive metal via a coordination linkage. A solder bump is formed by heating a solder ball with the soldering flux. The residue of the flux on the surface of the solder bump has water solubility, and is easily eliminated. Further, the conductive metal coordinated to the amine is deposited on the surface of the solder bump by water washing. As a result, when testing the semiconductor device having the solder bump 7 by a contact pin contacting with the solder bump, the contact pin is prevented from contamination, the contact pin is certainly contacted with the solder bump, and the semiconductor device is accurately tested.

Abstract: Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.

Abstract: A flux for use in soldering comprises a primary solids constituent present in an amount greater than about 50 wt. % and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: A flux for application on and for reduction of oxide layers on a metal surface. The flux includes potassium fluoride, sodium fluoride, remaining moieties of water and gelatin. The can also include a reactant comprising moieties of at least one of the compositions of zirconium fluoride, lithium fluoride, sodium fluoride, potassium cryolite and potassium aluminum fluoride (KaAlF4), moieties of salts on the basis of at least one of the elements zirconium, lithium, potassium, sodium, bismuth boron and titanium and gelatin. The flux can be used in a method to reduce oxide layers on a metal surface by applying the flux onto the metal surface.

Abstract: Improved cored-wire fabrication replaces multiple roller pairs with one or more dies. In the preferred embodiment, flat stock is pulled through a single cylindrical die including an upper tab to ensure and orient the formation of a gap to receive internal powders. Once the powders are introduced, a cylindrical die is used for closure though again, one or more rollers may be used between the powder feed and the die used for closing. In the preferred embodiment, however, a single gap-forming die is used before the powder feed, and a single closing die is used after the powder feed, replacing numerous rollers and other moving parts, thereby dramatically simplifying the apparatus and method of manufacture.

Abstract: It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.

Abstract: Aqueous compositions useful as pretreatments prior to painting and to prevent the formation of white rust in the uncoated condition include an organopolyphosphonic acid or salt thereof, an organosilane, and a trivalent chromium compound. A method for treating a surface of a zinc-containing metal includes contacting the surface with an aqueous composition including an organopolyphosphonic acid or salt thereof, an organosilane, and a trivalent chromium compound. The composition may also include an agent for reducing hydrophilicity, such as a polyacrylic acid. The aqueous composition has been found to be particularly well-suited for treating a zinc-containing metal to passivate the surface, improve paint adhesion, and/or improve corrosion resistance.

Abstract: Disclosed are quaternary ammonium salts containing non-halogen anions such as carbonates, bicarbonates, phosphates, glycolates and mixtures thereof as conversion coatings or additives imparting anti-corrosive properties to paints. The invention relates to a method for inhibiting the corrosion of metal surfaces by applying a composition containing one or more quaternary ammonium carbonate or bicarbonate. The disclosure is also directed to anti-corrosive coatings for metal substrates containing these compounds and to metal substrates having these anticorrosive coatings.

Abstract: Improved compositions and processes for zincating magnesium and magnesium alloy substrates. An aqueous zincating composition having a pH of from about 8 to about 11 and including zinc ions, a complexing agent, fluoride ions and a reducing agent. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including immersing the substrate in the non-electrolytic aqueous zincating composition for a time sufficient to deposit a zincate on the substrate. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including preparing a aqueous non-electrolytic composition comprising zinc ions, a complexing agent, fluoride ions and a pH in the range from about 8 to about 11; adding to the composition an amount of a reducing agent sufficient to improve deposition of zincate on the magnesium or magnesium alloy substrate; and immersing the substrate in a composition for a time sufficient to deposit the zincate on the substrate.

Abstract: The invention provides a technique and a device that dramatically improve joint reliability of miniature joints of fine electronic components. According to the invention, when producing a tin or a solder alloy used for electronic components, an ingot of a tin or a solder alloy is heated, melted and delivered to a reactor. Also, a solution containing organic acid having a carboxyl group (—COOH) is delivered to the reactor. After stirring and mixing the two liquids intensively, the mixed liquid is separated into a molten tin or a molten solder alloy liquid and an organic acid solution according to the difference in specific gravity. Then, the respective liquids are circulated to the reactor, and the metal oxides and the impurities existing in the molten tin or the molten solder alloy are removed, and the molten tin or the molten alloy is purified to have oxygen concentration of 5 ppm or less.

Abstract: A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux material flows from the core and out of the seam. The length of wire is in the form of a loop having a certain circumference so that when the preform is heated, the flux material disperses uniformly from the circumference of the preform for evenly treating the surface of a component on which the preform is placed. The length of wire may include a silver alloy.