Abstract: A treating solution for forming on a surface of either zinc or a zinc alloy a hexavalent-chromium-free trivalent-chromium chemical conversion coating which has an even black appearance and satisfactory corrosion resistance. The treating solution has a long treating-bath life. Also provided is a method of forming a black trivalent-chromium chemical conversion coating. The aqueous treating solution, which is for forming a black trivalent-chromium chemical conversion coating on zinc or a zinc alloy, contains trivalent chromium ions, a phosphoric ester and/or phosphorous ester, and a sulfur compound. The method is a method of chemically treating zinc or a zinc alloy which comprises using the aqueous treating solution to chemically treat the zinc or zinc alloy at a solution temperature of 10-60° C., whereby a black trivalent-chromium chemical conversion coating is formed on the zinc or zinc alloy.

Abstract: A process for passivating a metallic surface by treating it with an acidic aqueous preparation comprising at least one itaconic acid homo- or copolymer. Passivating layers and metallic surfaces obtainable by means of the process.

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux. Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.

Abstract: A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.

Abstract: A solder composition and a method of making the composition. The solder composition comprises a Sn-containing base material and a barrier component having a reactivity with Sn which is higher than a reactivity of Ni or Cu with Sn, the barrier component being present in the composition in an amount sufficient to reduce a reactivity of Sn with both Ni and Cu.

Abstract: In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium and a second nickel base alloy material containing chromium and cobalt, applying the brazing paste to an area of the metal workpiece containing at least one crack, and subjecting the workpiece and the brazing paste to a brazing cycle by heating the brazing paste and the workpiece, preferably to a temperature in the range of from 2000 to 2200 degrees Fahrenheit. During the brazing cycle, the brazing paste flows into and fills the at least one crack and thus repairs the metal workpiece.

Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: A volatile soldering aid for solder bonding surfaces. A thermally decomposable solid that is suspended in a carrier or dissolved in a solvent is incorporated in a solder assembly having two surfaces separated by a solder preform. The solvent or carrier is subsequently evaporated, and the assembly is heated to decompose the solid and produce a reducing gas. The assembly is then further heated to melt the solder preform. A vacuum may be introduced to remove the gas prior to melting of the solder preform. The solder preform in the assembly may be a monolithic preform or it may be a powder. The solder preform may be provided as a thin film deposited on one or both of the surfaces to be joined. Upon heating, the volatile soldering aid is converted to vapor without forming a liquid phase at the melting point of the solder.

Abstract: It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 ?m and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.

Abstract: A solder flux composition is formulated to lower contact wetting angles on bond pads, and to remain stable until the reflow temperature of the solder. A process includes contacting a bond pad with the solder flux composition and reflowing the solder bump that is in contact with the bond pad and the solder flux composition.

Abstract: Improved cored-wire fabrication replaces multiple roller pairs with one or more dies. In the preferred embodiment, flat stock is pulled through a single cylindrical die including an upper tab to ensure and orient the formation of a gap to receive internal powders. Once the powders are introduced, a cylindrical die is used for closure though again, one or more rollers may be used between the powder feed and the die used for closing. In the preferred embodiment, however, a single gap-forming die is used before the powder feed, and a single closing die is used after the powder feed, replacing numerous rollers and other moving parts, thereby dramatically simplifying the apparatus and method of manufacture.

Abstract: [Problems] Addition of an organic acid such as a dicarboxylic acid to a soldering flux in order to improve wettability causes a reaction with copper oxide to form a metallic soap of copper having a green color. Although this metallic soap of copper is not corrosive and does not decrease reliability, its external appearance is impossible to distinguish it from verdigris which is indicative of corrosion. There is need for a soldering flux which does not form a metallic soap of copper. [Means for Solving the Problems] Addition of a tetrazole or a tetrazole derivative to a soldering flux can prevent carboxyl groups from reacting exclusively with copper ions, thereby suppressing the formation of a metallic soap of copper having a green color.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: A flux for a lead-free solder that is able to reduce “void(s) appear within solder joint”, “void(s) appear within solder joint”, and “solder-balling” without impairing general solderabilities. The flux for a lead-free solder comprising 6-55 wt % of a polyvalent alcohol ester of a resin acid (a1) as a base resin (A). Further, a solder paste comprising the said flux for a lead-free solder and a lead-free solder powder provides a very small number of void(s) or a very small amount thereof.

Abstract: A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.

Abstract: A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below ?50° C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.

Abstract: A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.

Abstract: An activating flux for welding stainless steel includes: from 25 to 40 weight percent of titanium dioxide (TiO2); from 25 to 30 weight percent of chromium oxide (Cr2O3); from 10 to 30 weight percent of silicon dioxide (SiO2); from 10 to 15 weight percent of molybdenum disulphide (MoS2); and from 5 to 15 weight percent of molybdenum trioxide (MoO3) which are of active additive materials. A welding rod or wire includes a welding material and an activating flux. The activating flux layer is provided on or in the welding rod or wire, and is formed as an outer layer or a core portion of the welding rod or wire.

Abstract: This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is further directed to the composition's uses for LTCC (low temperature co-fired ceramic) tape, for fabrication of multilayer electronic circuits and in high frequency microelectronic applications.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.

Abstract: Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device with the substrate. Underfill material may be included around the interconnect structure between the microelectronic device and the substrate. The underfill material may include an organic rosin acid moiety derived from an anhydride adduct of a rosin compound that was used as a fluxing agent. Methods of making such microelectronic packages using anhydride adducts of rosin compounds are also disclosed.

Abstract: A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be included in the welding flux. The colloidal binder can constitute 100 percent of binder or form only part of the binder.

Abstract: A process for recovering a solder contaminant from a substrate surface with a wick structure comprising a plurality of heat conductive metal strands and a desoldering flux comprising a mixture of a first component of a partially polymerized rosin having a melting point of at least 98° C., a second component which is present in the desoldering flux formulation in an amount which is no more than the amount of the first component and comprises an ester of a polyhydric alcohol and benzoic acid, and a third component, which is present in an amount which is less than the amount of the second component, and comprises an aliphatic dicarboxylic acid. The solder contaminant is contacted with the wick structure in the presence of the desoldering flux and the wick structure and the solder contaminant are heated to melt the solder contaminant to cause the melted solder to flow into the wick structure in contact with the heat conductive metal strands.

Abstract: The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

Abstract: A dispensable brazing paste useful in lamp manufacturing includes a brazing powder and a water soluble vehicle that has water, glycerin, a binder, and a dispersant that includes ammonium stearate and ammonium citrate. Preferably, the brazing powder is 84-87 wt % of the paste, the water is 3-5 wt %, the glycerin is 3-4 wt %, the binder is 1-2 wt %, and the dispersant is 4-6 wt %, and a weight of the water is within a range of 60-90% of a weight of the dispersant. The brazing paste does not include the troublesome organic solvents of the prior art.

Abstract: A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding to the end faces of conductive layers in the through-hole. Therefore, the paste does not require through-hole plating. The conductive paste comprises (A) 100 parts by weight of a resin component that contains an acrylate resin and an epoxy resin, (B) from 200 to 1800 parts by weight of a metal powder of at least two metals that contain at least one low-melting-point metal having a melting point of not higher than 180° C. and at least one high-melting-point metal having a melting point of not lower than 800° C., (C) from 0.5 to 40 parts by weight of a curing agent that contains from 0.3 to 35 parts by weight of a phenol-type curing agent, and (D) from 0.3 to 80 parts by weight of a flux.

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Abstract: A welding flux that includes a flux agent, water glass and colloidal compound formed from small particles of silicon dioxide. The welding flux has a very low hygroscopicity, thus is well suited from low hydrogen electrodes.

Abstract: Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal to be cast and the different metal are joined simultaneously with a casting process.

Abstract: A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.

Abstract: An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. After deposition the layer is dried until a solid protective film is obtained. An additional advantage obtained by the present invention is that the protective layer can be deposited also by means of an offset printing process, avoiding the use of the stencil and of the screening steps. Screening process is a labourious operation which requires very sophisticated equipment and a very high precision in the design of the stencil. Because of these requirements, screening is an expensive process. On the other hand offset printing is a very simple, cheap and reliable method. In addition, the film forming properties allow the material to create a protective film even with a thin deposited film.

Abstract: An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet. The present invention provides a method for forming the bumps, which includes forming a solder alloy material layer and flux material layer one by one on an intermediate metallic layer formed on an external electrode pad in a semiconductor device, and then fusing these layers, wherein each of the solder alloy material layer and flux material layer is formed by a liquid spraying method (e.g., ink jetting method).

Abstract: A welding flux for use in welding stainless steel parts to increase welding penetration, consisting essentially a base material obtained from manganese peroxide (MnO2), and an activator selected from a material group that includes zinc oxide (ZnO), silicon dioxide (SiO2), chromium oxide (CrO2), titanium dioxide (TiO2), molybdenum dioxide (MoO2), and iron oxide (Fe2O2).

Abstract: A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyceryl monostearate, 3–10% acid activator, 3–10% water, and 4–15% mineral salt. The acid activator is preferably a mineral acid and, most preferably, hydrobromic acid. The mineral salt is preferably zinc bromide.

Abstract: Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.

Abstract: A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be included in the welding flux. The colloidal binder can constitute 100 percent of binder or form only part of the binder.

Abstract: A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-aqueous flux vehicle that is mixed with a solder alloy powder to make a solder paste used in the manufacture of printed circuit boards.

Abstract: The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with a smaller pitch. A flux 3 contains an adhesive resin and a hardening agent. This flux or a soldering paste containing the flux is applied onto a component mounting board 1, and then, an electronic component 4 is mounted and soldered onto the component mounting board 1.

Abstract: A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.

Abstract: Disclosed is a lead-free solder alloy containing 43 to 47% by weight of bismuth, 0.5 to 2.5% by weight of silver, 0.25 to 0.75% by weight of copper, 0.25 to 0.75% by weight of indium, 0.02 to 0.09% by weight of nickel and the balance of tin.

Abstract: Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing or soldering. Conventional fluxing agents or other fluorometallates, such as alkali metal fluorozincates and/or alkali metal fluorosilicates, can also be added to the fluorostannate-containing fluxing agent. The fluxing agents of the invention can be applied by either dry or wet fluxing methods.

Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 ?m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.

Abstract: In a method of making finned tubes as components of air-cooled systems or condensers, a sheet metal strip of aluminum is first shaped into a waved finned structure with plural fins in parallel relationship and arched ends for connecting the fins, thereby defining crests on opposite ends of the finned structure. A fluxing agent of cesium-aluminum tetrafluoride is applied in lines onto the crests on at least one of the ends of the finned structure. The finned structure is then placed upon a broad side of a flat steel tube coated with a zinc/aluminum alloy. The finned structure and the flat tube are subsequently joined in a brazing furnace in the presence of an inert gas at a temperature between 370° C. and 470° C. to produce a unitary structure which is then allowed to cool down at room temperature.

Abstract: An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group of a carboxylic acid attached at an acyl group of the organic rosin acid moiety. In another aspect, the anhydride adduct of the rosin compound contains a plurality of linked organic rosin acid moieties. Methods of using the underfill materials and packages formed by curing the underfill materials are also disclosed.

Abstract: A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux material flows from the core and out of the seam. The length of wire is in the form of a loop having a certain circumference so that when the preform is heated, the flux material disperses uniformly from the circumference of the preform for evenly treating the surface of a component on which the preform is placed. The length of wire may include a silver alloy.

Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.

Abstract: The invention relates to a composite sheet material for brazing, the composite sheet material having a structure comprising an aluminium or aluminium alloy substrate on at least one side coupled to a layer comprising a polyolefin/acrylic acid copolymer as a carrier filled with brazing flux material, and optionally also with a metal powder, in an amount sufficient to achieve brazing. The invention further relates to a method of manufacturing composite sheet material for brazing, which method comprises the steps (a) mixing the polyolefin/acrylic acid copolymer with the brazing flux material and/or metal powder, and (b) applying to at least one surface of the metal substrate a mixture of said copolymer filled with the brazing flux material and/or metal powder, in an amount sufficient to achieve subsequent brazing.

Abstract: The invention relates to a flux salt composition for flux baths which is available for particularly simple regeneration and deferrizing. The deferrizing flux salt composition for flux baths, containing zinc chloride and alkali metal chloride, contains at least one or more alkalizing constituents and one or more constituents which, in aqueous solution, oxidize iron(II) to form iron(III).

Abstract: A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be included in the welding flux. The colloidal binder can constitute 100 percent of binder or form only part of the binder.