Abstract: A nozzle includes a body having an entrance location and an exit location. The body has a curved exit surface defined at the exit location. An internal chamber is defined in the body below the curved exit surface and a channel extends between the entrance location and the internal chamber. A slit defines an opening in the curved exit surface. The slit extends from the curved exit surface into the internal chamber. The curved exit surface and the slit are configured to define a fanned spray when liquid flows out of the slit. A method for rinsing the backside of a semiconductor wafer includes the operations of forming a wafer transport truck into a nozzle, and spraying a liquid from the nozzle onto the backside of the wafer.

Abstract: Friction force between a scrubbing brush and a substrate during a cleaning process is measured and utilized as a metric in characterizing effectiveness of the cleaning process under a variety of conditions. A friction force setpoint may also be used to perform closed loop control over the cleaning process.

Abstract: An electric toothbrush has a balanced mass provided on a shaft extension that rotates freely about a longitudinal axis, inside a cavity in a brush head The shaft extension and the brush head are flexibly coupled to a drive shaft and to a remote end of a shank respectively. When the shaft is rotated by an electric motor in a handle, of the toothbrush, an off-set stub axle, effectively at a remote end of the shaft extension and fitted to a bearing in the brush head, causes the brush head to vibrate. The shank is not caused to vibrate to any extent.

Abstract: A method and a device for cleaning the undersurface of footwear and wheels of shopping trolleys and other transport expedients to minimize the amount of dirt and moisture brought into a building by persons entering the building. The objective of the invention is to provide a device which provides sustained high-performance cleaning, even in adverse weather conditions and with heavy use. To this end the invention uses a mat rotated as an endless loop between guide rollers within a floor opening at an entranceway or elsewhere within a building. In a section running in one direction, the mat acts at least partially as a tread surface and absorbs dirt and moisture, while in a section running back in the opposite direction, which has gathered dirt and moisture from its exposure to persons entering the building, the mat is cleaned and reconditioned by mechanical, hydraulic or pneumatic mechanisms within the floor opening.

Abstract: The apparatus of claim 30, further comprising a container having said brush and said cleaning element dispersed and an apparatus brush cleans the inside surface of a cylindrical photoreceptor substrate such as used in xerography. The substrate can be in a cleaning solution and brushes can also be located both inside and outside the substrate. There is relative motion, e.g., rotation, translation, a combination of both, etc., between the brushes and the substrate. A photoreceptor coating is directly applied after the cleaning without intervening processing steps.

Abstract: A teat cleaning device for animals includes a plurality of circumferentially separated elongated brushes individually rotatable about a vertical longitudinal axis, each of the brushes having bristles extending outwardly from a vertical shaft, the brushes together defining a central teat receiving space where the bristles of a lower portion of each brush are inclined upwardly from the vertical shaft.

Abstract: A cleaning processing system for applying a cleaning processing to a substrate such as a semiconductor wafer comprises a cleaning processing section including a plurality of process units each serving to apply a predetermined treatment to a wafer W and a loading/unloading section 2 for loading and unloading the wafer W into and out of the cleaning processing section.

Abstract: The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

Abstract: This soldering iron cleaning apparatus comprises a main body having an introduction hole, a motor, a sensor mechanism which detects the insertion of the soldering head to the introduction hole and drives the motor, a cleaning member which removes solder remaining on the soldering head, a power transmission mechanism which drives the cleaning member by the driving force from the motor. The power transmission mechanism rotates the cleaning member, by the driving force of the motor, in such a way that the cleaning member scrapes the external surface of the soldering head from the base side to the tip side of the soldering head while turning the cleaning member around the soldering head.

Abstract: A substrate cleaning tool having little particle sticking to the tool and a substrate cleaning apparatus having the substrate cleaning tool are provided. The substrate cleaning tool 23 has a plurality of thready brush members 46 in a bundle. The brush members 46 are capable of passing cleaning liquid through and ejecting the cleaning liquid through respective surfaces of the members 46. In operation, the substrate cleaning tool 23 is brought into contact with a substrate W in their relative movement in order to clean the substrate W. As the cleaning liquid is ejected from the surfaces of the brash members 46, particles are washed away from the surfaces of the brash members 46. Consequently, it is possible to eliminate a possibility that the particles etc. are transferred to the substrate W.

Abstract: In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.

Abstract: A method for making plates from photopolymer sheets which have previously been exposed to ultraviolet radiation, to convert the sheets into printing plates for flexographic, letterpress or dry-offset printing, includes brushing the exposed faces of the sheets with a brush assembly having a row of flat brushes with generally rectangular brushing surfaces. The brushes each undergo a movement of horizontal rotation and the brush assembly also undergoes at least one movement of reciprocating horizontal translation. Each brush is offset by 180° in its horizontal rotation with respect to the immediately adjacent brush, or to the two immediately adjacent brushes in the row. Also disclosed is an apparatus for performing the method.

Abstract: An arm scrubbing system comprises a housing. The housing has upper, lower, distal, proximal and side walls. The walls define a chamber. Two circular rear apertures are formed in the distal wall and two circular proximal apertures are formed in the proximal wall. A pair of plastic transparent tubes are provided. Each tube has a distal end and a proximal end. A plurality of tufts secured to the interior face of each tube define openings. Further provided is a plurality of apertures through the tubes between the tufts for the passage of cleansing/disinfectant fluid a from the chamber into the tubes for cleaning the arms of a user. Provided last is a drive assembly. The drive assembly includes a motor with drive pulleys. The drive assembly further includes driven pulleys extending distally from each tube. A drive belt couples the drive pulleys and the driven pulleys.

Abstract: A body washer device for cleaning the hard-to-reach areas of a person's body. The body washer device includes a plurality of body washing members which are selected from a group consisting of netting, sponges such as loofah, buffing pads, and exfoliated fabric, and also includes either a mat or an elongate member having curved ends which support the body washing members; and further includes suction cup members for attaching to a structure such as a shower wall or a bathtub floor.

Abstract: A cleaning method and apparatus using very dilute Standard Clean 1 (SC1) for cleaning semiconductor substrates, including silicon wafers. The SC1 is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses SC1 to convert substrate surfaces from a hydrophobic state to a hydrophilic surface state while cleaning the wafer with the brush. A hydrophilic surface state is necessary to successfully remove surface contaminants by chemical mechanical brush cleaning.

Abstract: A large animal, such as a cow, is brushed by a system that includes a brush mounted on a frame that is pivotally mounted on a structure such as a stall adjacent to the animal. A motor is connected to the brush to rotate the brush and is activated when the animal presses against the brush. A timer mechanism automatically de-activates the motor after a pre-set interval so another, separate, force must be applied to the brush to re-start the cycle. The brush is moved by the animal pressing against the brush to automatically accommodate different animal sizes.

Abstract: A cleaning apparatus of the present invention includes a roll brush for scrubbing the surface of the substrate, and an ultrasonic nozzle for blowing an aqueous cleaning solution against the surface of the substrate and generating an ultrasonic wave, wherein the roll brush and the ultrasonic nozzle are provided so as to oppose one another so that the substrate can be set in between. With the synergetic effects of brush scrubbing cleaning, ultrasonic cleaning and shower-cleaning, the precision cleaning of the upper surface of the substrate can be performed at a sufficient level of cleanliness. Moreover, in a state where the substrate to be cleaned is set, the roll brush can be cleaned automatically by the ultrasonic nozzle, and it is therefore possible to maintain the roll brush at high level of cleanliness without requiring maintenance operations.

Abstract: A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.

Abstract: Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (c) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.

Abstract: A multifunction apparatus for engaging a surface is particularly suited for removal of snow and ice from the windshields and hoods of vehicles. The apparatus includes a support frame having two pulleys and a handle for manipulating the apparatus. An endless belt is entrained on the pulleys for movement along a continuous path. A bi-directional electrical motor is mounted on the frame and has forward and reverse modes for driving the endless belt along the continuous path. A plurality of surface engaging device assemblies having a first end connected to the endless belt and a second end extending outward from the endless belt provide for the multifunction operational modes. More specifically, each surface engaging device assembly includes first and second heads such as a scraper for removing ice and a brush for removing snow.

Abstract: A semiconductor processing system, such as a system for scrubbing both sides of a wafer at the same time, that includes a brush box containment apparatus for use with highly-acidic or other volatile chemical solutions, a roller positioning apparatus and a (brush) placement device.

Abstract: An automatic erasing device is used for erasing chalk marks on a writing board, and includes an erasing mechanism having an elongated housing disposed frontwardly of and slidable relative to the writing board along a longitudinal axis. The housing extends in a transverse axis relative to the longitudinal axis, and has a rear wall formed with an elongated rear opening to confront the writing board, and a lower portion formed with a water tank. An eraser unit is disposed within the elongated housing, and is biased to protrude outwardly and rearwardly of the rear wall via the elongated rear opening for abutting against the writing board. The eraser unit is connected to the water tank in such a manner that water flows from the water tank into the eraser unit so as to soak the eraser unit while the eraser unit moves on the writing board.

Abstract: An apparatus and method for cleaning squeegees of the type having a handle with one edge joined to an edge of an elastomeric flat plate having a scraping edge. The apparatus includes a pair of brushes such as flat brushes used to scrub floors and supported facing one another so that bristles of one brush touch bristles of the other brush. A tube with a row of apertures is positioned along an upper edge of each brush An appropriate solvent is pumped through the tubes and flushes the surfaces of the plate of the squeegee as the plate is swiped between the brushes.

Abstract: For cleaning a wafer by a cleaning apparatus, a cleaning liquid is contained in a cleaning bath. Leaving two brushes open, the wafer is inserted to the cleaning bath, placed on oscillation and rotation rollers and retained by the rollers. The brushes are closed and the wafer is held by the brushes. Next, the two brushes are rotated while the wafer is oscillated and rotated by the rollers and so on. Furthermore, ultrasonic vibrations are applied to the cleaning liquid in the cleaning bath by an ultrasonic generator. Scrub cleaning with the two brushes and ultrasonic cleaning by ultrasonic vibrations are thereby performed on the wafer.

Abstract: A method of removing particles adhering to a surface of a semiconductor wafer including the steps of: providing a container having a drain valve; positioning the semiconductor wafer in the container; directing a jet stream consisting of water against the surface of the semiconductor wafer; removing particles adhering to the surface of the semiconductor wafer by scrubbing the surface of the semiconductor wafer with a brush while the jet stream of water is directed against the surface of the semiconductor wafer; closing the drain valve while the jet stream of water is directed against the semiconductor wafer, wherein the water accumulates in the container to thereby completely immerse the brush and the semiconductor wafer in the water in the container; and maintaining the brush and the semiconductor wafer completely immersed in the water from the jet stream for a predetermined period of time.

Abstract: A device is disclosed for removing fingernail polish simultaneously from a plurality of fingernails of a hand. The device includes a base having a first area adapted for simultaneously receiving a plurality of fingers of the hand. A rotatable sponge is coupled to the base such that the plurality of fingernails of the hand are positionable in contact with the rotatable sponge when the plurality of fingers are positioned in the first area. A palm positioned in the base and coupled to the rotatable sponge controllably rotates the sponge. A hand activated switch on the base actuates the motor when the plurality of fingers of the hand are positioned in the first area of the base to thereby rotate the sponge and remove the fingernail polish from the plurality of fingernails. A hand activated pump controllably supplies fingernail polish removing fluid to the sponge to aid in removal of the fingernail polish.

Abstract: Systems and methods for cleaning are provided. The systems encompass a loading area for objects to be cleaned, a sub-system for cleaning each object, a reservoir for holding a cleaning solution formulation consisting of sodium bicarbonate, sodium carbonate and trisodium phosphate in aqueous solution, a sub-system for drying each object and an area for off-loading the objects after cleaning and drying. In some embodiments of the present invention the cleaning sub-system has scrubbing devices for scrubbing objects having surface texture or grooves. In some embodiments of the present invention no scrubbing devices are employed. Methods of the present invention also provide for cleaning surfaces that contact the objects being cleaned during the object's normal use.

Abstract: The substrate washing apparatus of the present invention comprises a film scrub member permeable to liquid, which is moved relatively to a substrate held substantially horizontally while being in contact with the substrate, a supporting portion for supplying the film scrub member, a supply pipe for supplying a cleaning liquid to the substrate through the film scrub member, cleaning liquid supply means for supplying the cleaning liquid to the supply pipe, pressing means for pressing the film scrub member supplied with the cleaning liquid and swollen, to the substrate, and relative moving means for horizontally moving the film scrub member supplied with the cleaning liquid and swollen, relative to the substrate.

Abstract: The present invention describes a method and apparatus used in a substrate cleaning system wherein a substrate is placed into a first brush station while a chemical solution is delivered to the first brush station at a desired concentration level. The substrate is then scrubbed in the first brush station. After the substrate is scrubbed in the first brush station the substrate is transferred to a second brush station. The chemical solution used in the first brush station is then delivered to a brush in the second brush station in a ramp up manner in order to clean the brush in the second brush station. The delivery of the chemical solution to the second brush station is then stopped and deionized water is delivered to the second brush station. The substrate is then scrubbed using the deionized water in order to rinse the chemical solution from the substrate prior to transferring the substrate from the second brush station to another processing station.