Abstract: The invention relates to veneer strips made of individual veneer layers (1), wherein adjacent veneer layers overlap (7) and comprise a joint (4) having a wedge-shaped cross-section in the region of the overlapping. The veneer layers are connected to each other by means of adhesive. The invention further relates to a method, to a device for performing the method, and to a use of the veneer strips.

Abstract: A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

Abstract: A device housing for an electronic device is provided. The device housing includes a metal main body and at least one metal decorative member. The metal main body has at least one receiving recess defined in an outer surface thereof. The at least one metal decorative member has a top surface. The top surface has a mirror finish. The at least one metal decorative member is received in the at least one receiving recess, with the top surface exposed out of the outer surface. The at least one metal decorative member forms a desired symbol, logo, or pattern on the device housing.

Abstract: Embodiments of the present invention generally comprise a method and apparatus for preparing and bonding a cylindrical sputtering target tube to a backing tube to form a rotary target assembly. In one embodiment, a cylindrical target assembly includes bonding material that has a cylindrical surface and is substantially concentric to the backing tube. In one embodiment, a method for forming a cylindrical target assembly includes filling a gap defined between sputtering target tubes with a spacer. The method also includes removing the spacer after the sputtering target tubes are bonded to a backing tube. In one embodiment, an apparatus for fabricating a cylindrical target assembly comprises of a support tube, two end fittings, and a plurality of clamp elements operable to clamp the support tube between the two end fittings.

Abstract: A wall repair compound useful for filling and repairing cracks, holes, and other imperfections in a wall surface includes a conventional filler material, a conventional binder material, and a dust reducing additive which reduces the quantity of airborne dust particles generated when sanding the hardened joint compound. Airborne dust reducing additives include oils, surfactants, solvents, waxes, and other petroleum derivatives. The additive can be added to conventional ready-mixed joint compounds and to setting type joint compounds. A method of reducing the quantity of airborne dust generated when sanding a fully hardened joint compound includes mixing a sufficient quantity of the dust reducing additive with the joint compound prior to when the joint compound has been applied to the wall.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.

Abstract: A guide carriage for a linear roller bearing is supportable in a longitudinally displaceable manner via at least one row of rollers on a guide rail which extends in a longitudinal direction, a separate rolling surface part which includes a rolling surface for the rollers is assigned to each row of rollers, and the rolling surface part is connected via an adhesive layer to a carrier body. The adhesive layer is designed essentially planar on the back side of the rolling surface part which faces away from the rolling surface, the rolling surface part being accommodated in a recess—which has an L-shaped cross section—of the carrier body.

Abstract: A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape.

Abstract: A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.

Abstract: A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

Abstract: A brick product includes multiple brick segments respectively bonded to one another via an adhesive agent and a blind hole defined in a body of the respectively bonded brick segments such that the brick product is capable of receiving objects and functions in a way different from the conventional one.

Abstract: An article for fire protecting a duct includes a first layer of a first material including a noncombustible fibrous material and a second layer of a second material including an intumescent material. The first layer is adjacent the second layer. The article is non-self-supporting and has an initial thickness of less than about three inches when in a first application condition, and an expanded thickness when in a second heated condition. The expanded thickness is greater than the initial thickness. At the expanded thickness, the article meets Section 5.5 of AC101 Acceptance Criteria for Grease Duct Enclosure Assemblies, as specified in April 2001 by the International Council of Building Officials (ICBO-ES).

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: According to an example embodiment, a wood film includes a patterned wood film, a non-woven fabric attached to a surface of the patterned wood film, and a resin film attached to a surface of the non-woven fabric. According to an example embodiment, a method of molding a wood film includes attaching a non-woven fabric to a first surface of a patterned wood film, attaching a resin film to a surface of the non-woven fabric, grinding a second surface of the patterned wood film to reduce a thickness of the patterned wood film to form the wood film, and molding a portion of the wood film into a desired shape by pressing and heating the wood film using a press mold. The second surface of the patterned wood film is opposite to the first surface of the patterned wood film.

Abstract: Tapes for marking valuable components and their housings and supporting posts are described along with a process for utilizing the tapes including the steps of sequentially marking the copper and the equipment with a MR marking (e.g. barcodes, Q-R codes and/or EF transmitters). EF or related broadcasting transmitters or their equivalent would be thin enough and responsive to a signal; machine reading a MR sequence on copper that is brought; marking the copper sold before, after or at the point of sale; identifying the location and coding the copper as stolen at the point of theft, utilizing a nationwide system of copper marking tied to the buyer's information; visually marking the copper in a non-sequential way, potentially by region or state in order to minimize the amount of overlap and would also include the concepts of mandatory scanning of copper products at installation or recycling.

Abstract: Disclosed is a method for manufacturing a fiber-reinforced composite sabot for use in APFSDS (Armor. Piercing Fin Stabilized Discarding Sabot) wherein a plurality of fiber mats are laminated instead of one-directional prepreg ply and whole part is reinforced by stitching through long fiber bundle in order to enhance circumferential shear strength, and high quality fiber-reinforced composite sabot is manufactured in a short time using resin-injection vacuum assisted resin transfer molding after stitching.

Abstract: A flame resistant wood veneer assembly in the four embodiments, includes a decorative wood veneer layer, and a combination of aluminum foil layer(s)/backing(s) and a non-decorative wood veneer layer(s)/backing(s), the aluminum foil layer is bonded to the decorative wood veneer layer and between the non-decorative wood veneer layer(s)/backing(s) with phenolic adhesive at high pressure and high temperature wherein the high pressure is at least 150 pounds per square inch and the high temperature is at least 275 degrees Fahrenheit and where such high pressure and temperature is applied for at least four minutes. The resulting assembly is preferably wide belt sanded to produce a smooth, flat veneer product.

Abstract: An optical device wafer has a device area where a plurality of optical devices are formed on the front side of a sapphire substrate, and a peripheral marginal area surrounding the device area. The device area projects from the peripheral marginal area. A break start point is formed on the front side of the sapphire substrate by applying a laser beam along the boundary between the device area and the peripheral marginal area. A protective member is attached to the front side of the optical device wafer. The optical device wafer is held on a chuck table of a grinding apparatus so that the protective member comes into contact with a holding surface of the chuck table. The back side of the sapphire substrate is ground to reduce the thickness thereof to a predetermined thickness.

Abstract: Tapered layers of pre-cured composite material are integrated into a tapered, highly stressed laminate structure in order to provide improved compressive strength. The pre-cured composite material can advantageously be cured under tension as pultruded material, to further augment compressive strength. The thickness of composite layers can be tapered on their termination edges by mechanically abrading, chemical abrading, or other methods. Especially preferred embodiments include aircraft structural components such as wings, wing spars, wing skins, fuselage skins, rotor blades, propellers, and propeller blades. Preferred laminates can be constructed to have at least 6, 10, 30, 50, or 100 layers of material, and can have a maximum thickness of at least 0.15, 0.25, 0.5, 1.0, or 5.0 inches.

Abstract: A method of manufacturing a through electrode-attached glass substrate includes: forming a plurality of electrode through holes and a dummy through hole in plate-shaped glass; inserting electrode members into the electrode through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other.

Abstract: Provided is a manufacturing method for a pneumatic tire including the steps of: shaping a cylindrical film formed of a thermoplastic resin or a thermoplastic elastomer composite in which a thermoplastic resin is blended with an elastomer, folding the film into a sheet shape, laminating rubber layers on both surfaces of the folded film, opening the laminate of the film and the rubber layers into a cylindrical shape, fitting the laminate thus opened on a tire making drum, forming the tire pneumatic tire including the film as an air permeation preventing layer, and curing the uncured tire.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: A fire resistant wood veneer assembly includes at least a decorative veneer layer and at least one aluminum foil layer. The aluminum foil layer is bonded to the decorative wood veneer with phenolic adhesive at high pressure and high temperature to produce a fire resistant veneer assembly. A additional non-decorative veneer layer may also be bonded to the aluminum foil layer and the resulting veneer assembly may be precision belt sanded on the non-decorative side to produce a flat decorative fire resistant veneer assembly.

Abstract: An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).

Abstract: A temporary adhesive for which temporary adhesion is simple and subsequent detachment is also simple, meaning productivity can be improved. Also, a method of producing a thin wafer that uses the temporary adhesive. The temporary adhesive composition comprises: (A) an organopolysiloxane comprising: (I) 40 to 99 mol % of siloxane units represented by R1SiO3/2 (T units), (II) 0 to 49 mol % of siloxane units represented by R2R3SiO2/2 units (D units) and (III) 1 to 25 mol % of siloxane units represented by R4R5R6SiO1/2 units (M units) (wherein each of R1 to R6 represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 10 carbon atoms), and having a weight-average molecular weight exceeding 2,000, and (B) an organic solvent having a boiling point of not more than 220° C.

Abstract: In one embodiment, a first substrate having a plurality of array regions is prepared. A seal material is formed in each of the array regions. A peripheral seal material is arranged outside the array regions extending in a first direction. The peripheral seal material has an exhaust opening provided at a portion of the peripheral seal material extending in a second direction. A dummy seal material is formed between the peripheral seal material extending in the first direction and the seal material formed in the array region. A second substrate is arranged on a surface of the first substrate in a jig. The inside of the jig is decompressed, and the atmosphere between the first and second substrates is exhausted while applying a pressure to the first and second substrates. Then, the first and second substrates are attached by curing the seal material, the peripheral seal material and the dummy seal material.

Abstract: A cladding layer 7 is formed on a base body made of a material for an optical waveguide, and a groove is formed in the base body and the cladding layer 7. The base body and the cladding layer are joined to a supporting substrate with the cladding layer 7 positioned on the side of the supporting substrate 1. The base body is machined and thinned to form a thin plate 30 so that the groove penetrates through the thin plate 30. An end face 14A on the groove 12 side of the optical waveguide 13A is contacted with a light absorbing material or light reflecting material 9 to form a reflecting mirror.

Abstract: A water-shedding flashing for use in a cavity wall is disclosed. The flashing includes a modified textured surface with a super-hydrophobic layer that achieves water contact angles between 120 degrees and 165 degrees. Water and water vapor do not adhere to the flashing, causing the water to bead and fall from the flashing. Such combination results in a flashing that works in conjunction with the exterior channels in the outer wythe to produce an efficient water removal and ventilation system within the cavity wall structure. A labor-saving peel-and-stick adhesive with release sheet for installation on the inner wythe utilizes clear, nondrooling adhesives.

Abstract: The invention provides a drywall finishing method. The method may include the steps of taping one or more drywall joints with drywall tape and allowing drying; applying a coat of joint compound composition covering substantially all of the drywall tape and allowing to dry; and applying a finishing coat of joint compound composition to substantially all of a drywall surface and allowing to dry. The invention further provides a joint compound composition suitable for use in the method of finishing drywall, wherein the joint compound composition comprises a composition compatible with conventional jointing compound material and exhibits improved properties of thickness, self leveling, elasticity, durability, photographing and/or mold resistance over that of conventional joint compound compositions.

Abstract: An article of manufacture is provided that includes an optic fiber comprising a core and a cladding surrounding the core and a sapphire tube bonded to the optic fiber. A total internal reflection surface is positioned such that light guided within the core of the optic fiber reflects off the total internal reflection surface and through the sapphire tube. In other embodiments, a sapphire rod having a total internal reflection surface is fused to an optic fiber comprising a core and a cladding surrounding the core. A glass coating is present on the exterior surface of portions of the sapphire rod such that the glass coating defines an opening that exposes portions of the sapphire rod where light exits the sapphire rod after reflecting off the total internal reflection surface.

Abstract: A method of manufacturing an electronic component includes forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

Abstract: A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.

Abstract: Reinforced multi-body optical devices. In one example embodiment, a method for fabricating a reinforced multi-body optical device includes various acts. First, a supporting plate is bonded, using pressure and heat, to a multi-body optical device to form a reinforced multi-body optical device. The supporting plate has a coefficient of thermal expansion (CTE) that is within about 0.5 parts per million of the CTE of the multi-body optical device. Then, the multi-body optical device is ground to reduce the thickness of the multi-body optical device.

Abstract: A wavelength variable interference filter includes: a first substrate which has a light transmissive property; a second substrate which has a light transmissive property and is disposed to face one surface of the first substrate and is bonded thereto; a first reflection film which is provided on the first substrate; a second reflection film which is provided on the second substrate; and a variable section which varies the gap; wherein the second substrate includes: a first layer which has a movable section; and a second layer which is laminated to a surface of the first layer facing the first substrate, is formed in a plate shape with a uniform thickness, and has a support section configured to displaceably support the movable section; and the first layer is not laminated to at least a region overlapping with the support section in the planar view.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: The invention relates to a method for producing an outer limiting element for a sliding board body, such as a ski or a snowboard, and a method for producing a sliding board body equipped with said limiting element. The limiting element is formed by a one-piece part component composed of at least one cover layer and at least one part of the strengthening top band. The limiting element is then connected in a subsequent method step to the additional components of the sliding board body, such as its running surface and its strengthening lower band. It is essential in this case that the limiting element prior to connection with the additional components of the sliding board body is connected to at least one strip-like side wall element forming a lateral wall section of the sliding board body, in that the at least one strip-like side wall element is adhered to at least one longitudinal side edge of the cover layer or to the top band arranged on the lower side of the cover layer.

Abstract: A slip-resistant shock absorbing golf club grip that includes a felt layer, a fabric mesh formed of fibers and a polyurethane coating covering the mesh and felt, the fibers of the mesh defining grooves in the surface of the slip-resistant polyurethane which are engaged by a users' hands, with the polyurethane coating being buffed to partially expose the fibers.

Abstract: A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

Abstract: The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Abstract: An absorbent article is disclosed in which an absorbent body intervenes between a liquid permeable front sheet and a back sheet. A middle-height portion is provided by thickening a front surface of an approximately center area of the absorbent body with respect to a standard portion absorbent body. The article includes leakage preventing grooves which extend to a longitudinal direction of the absorbent article are provided on both sides which sandwich a body fluid discharge portion area in the area of the middle-height portion, respectively.

Abstract: A wavelength splitting element for splitting a multiplexed light beam into separate wavelength bands and emitting the beams from separate emission ports including a first filter for splitting the multiplexed light beam into light beams in wavelength band ?1, which passes in a first direction, and wavelength bands ?2 and ?3, which reflects; a second filter, for splitting the reflected light into light beams in wavelength band ?3, which passes in a second direction, and wavelength band ?2, which reflects in a third direction; and a third filter, for passing the light beam in the wavelength band ?2. The first filter passes the light beam in the wavelength band ?2 reflected by the second filter and incident to the first filter again based on an incident angle, and the third filter passes only the light beam in the wavelength band ?2 that the first filter passes in the third direction.

Abstract: A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.

Abstract: According to embodiments of the invention, a lens assembly and method for forming the same is provided. The method includes providing a first lens layer having a first transparent substrate and a first lens on the first transparent substrate, providing a second lens layer having a second transparent substrate and a second lens on the second transparent substrate, forming a spacer structure between the first lens layer and the second lens layer, and thinning the first transparent substrate to a first thickness after the spacer is formed.

Abstract: A projector with a specially manufactured optical compensation element is disclosed. One method of manufacturing the optical compensation element temporarily attaches an inorganic substrate made of a birefringent inorganic material to a base member with a temporary bond, grinds/polishes the inorganic substrate, attaches a light transmissive support substrate to a surface of the inorganic substrate on the opposite side to the side of the base member, and separates the inorganic substrate with the light transmissive support substrate from the base member.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: An injection molding nozzle having improved corrosion and wear resistance is disclosed for use in a hot runner injection molding system. The nozzle includes a nozzle body having a nozzle melt channel for receiving a melt stream of moldable material from a melt source. The nozzle has a nozzle seal comprised of a tip retainer and a nozzle tip having a tip melt channel, wherein the tip retainer secures the nozzle tip to the nozzle body such that the tip melt channel receives the melt stream from the nozzle melt channel. The nozzle tip further includes a tip base of a thermally conductive material that has a diamond crown secured to a downstream end thereof. The diamond crown sits within a vestige area of the injection molding system and provides improved corrosion and wear resistance to the nozzle tip.