Abstract: A composite coil spring includes a coil body that has a core and fiber layers impregnated with a polymer material. The fiber layers are wound around the core. The fiber layers extend around the coiled axis at oblique fiber angles. Each of the fiber layers includes a number of fibers that is a product of a common base number of fibers multiplied by a positive non-zero integer from a set of positive non-zero integers from 1 to 20. The positive non-zero integer of at least one of the fiber layers is different from the positive non-zero integer of at least one other of the fiber layers. At least one of the fibers layers is glass fibers and another of the fiber layers is carbon fibers, and each of an innermost fiber layer and an outmost fiber layer of the fiber layers is independently selected from glass fibers and carbon fibers.

Abstract: The present invention provides, in at least one embodiment, a memorial process in the memorial industry utilizing a novel photo resist process and novel state of the art design ordering software. The software allows the customer to create and order a design online with the family present. The software solves problems including that the conventional process requires an approval of a layout or requires a professional draftsman on site to draw the customer's design. The software also allows for barcode label tracking throughout the process. Finely detailed engravings are achieved using the photo resist engraving process in the memorial industry, where the photo resist is repositionable prior to being applied to the memorial.

Abstract: Disclosed are a friction rivet for joining a non-steel material and a steel material and a joining method using the same, wherein inserts are applied to the friction rivet and, thus, the friction rivet doesn't need to be replaced according to materials of a lower plate and damage to an upper plate caused by penetration into the upper plate by the friction rivet may be repaired.

Abstract: A formed ligneous body having a highly original and excellent design and exhibiting a novel handsome appearance is provided, and a method of making the formed ligneous body. The formed ligneous body includes a translucent base portion, and decorative spot portions whose degree of translucency is different from that of the base portion and which are integrated with the base portion. The base portion and the decorative spot portion are formed of respective resin-impregnated ligneous materials having respective different color tones. The base portion is formed with a predetermined thickness, while the decorative spot portions are integrally embedded within and/or exposed on at least one of front and back surfaces of the base portion in a predetermined pattern of local arrangement.

Abstract: A ligneous decorative design part having a high degree of originality and excellent design, and exhibiting a novel handsome appearance, due to properties of a ligneous material which has translucency when impregnated with a resin material. The ligneous decorative design part has a surface layer portion including a ligneous sliced veneer which is impregnated with a resin material and disposed on a side of a front surface of the surface layer portion, and which defines a decorative design surface, and a base layer portion superposed on a back surface of the surface layer portion, and formed integrally with the surface layer portion. The surface layer portion has translucency, and the ligneous decorative design part further includes another material interposed between the surface layer portion and the base layer portion and which is visible on a side of the front surface of the surface layer portion.

Abstract: The invention relates to a method for contactless determining a behavior of a loaded tire or wheel, comprising the steps of determining a contour of at least a portion of the tire or wheel; simulating loading of the tire or wheel with a virtual loading element bearing against the tire for at least one rotary position of the wheel on the basis of the determined contour, a displacement of the determined contour caused by the virtual loading element and at least one parameter associated to the tire or wheel or to a part of the tire; and determining the behavior of the loaded wheel using the simulation results.

Abstract: Wafer processing methods are provided. The methods may include cutting respective edges of a wafer and an adhesive a predetermined angle before grinding a back surface of the wafer.

Abstract: A rigid polymer porous material sheet is produced by feeding a slurry of polymer mixture comprising ultrafine polyvinylchloride particle, non-phthalate plasticizer, foaming agent and thermal stabilizer, polymer chips, fillers and fire retardant chemicals into a heated mold and pressing the mixture with high applied pressure. The temperature of the mold is below 190° C. to soften the polymer mixture and decompose the foaming agent forming the closed cell polyvinylchloride foam with 10 to 40% density with closed air cells. The thermal resistance of the rigid polymer porous sheet and sound attenuation properties are significantly improved. The rigid polymer porous sheet can be bent at sharp angles without crack formation facilitating its use as wall boards. The sheets produced may be embossed or molded to produce decoration boards, advertising boards, cabinet doors and furniture with decorative features. They can also be used in aeronautical applications as acoustic thermal insulation systems.

Abstract: A method of forming an object includes installing multiple foil drums within a processing chamber of an ultrasonic consolidation system. The multiple foil drums each include different materials than the other foil drums. The multiple foil drums are positioned so that one of the foils is selected to be placed on top of the build platform. The selected foil is welded onto the build platform or onto a previously processed layer. A portion of the welded foil is then cut. The multiple foil drums are retracted away from the build platform. The portion of the welded foil that was just cut is then consolidated to the object. The build platform is incrementally lowered before the process is repeated to form the next layer of the object.

Abstract: The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.

Abstract: A manufacturing device for a field pole magnet body includes a reference jig having reference surfaces in the lengthwise direction, width direction, and thickness direction for positioning a plurality of cleaved and divided magnet fragments in an aligned state. The manufacturing device further includes a first pressing means that presses the plurality of magnet fragments to the thickness direction reference surface from the thickness direction of a magnet body to align them in the thickness direction, and a second pressing means that presses the plurality of magnet fragments to the width direction reference surface from the width direction of the magnet body to align them in the width direction. An operational axis line of a pressing part of at least one of the first and second pressing means is arranged to be tilted such that it approaches the lengthwise direction reference surface at the side that abuts the magnet fragments.

Abstract: Methods for fabricating microelectronic packages and microelectronic packages are provided. In one embodiment, the microelectronic package fabrication method includes producing a molded panel containing a sidewall substrate. The molded panel is singulated to produce a Fan-Out Wafer Level Package core including a molded body having a fan-out region in which the sidewall substrate is embedded. A side connect trace is printed or otherwise formed on a sidewall of the Fan-Out Wafer Level Package core and extends at least partially across the embedded sidewall substrate.

Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.

Abstract: Improved pliable print rollers for high speed drink can printing machines increase the pliable roller life five- to ten-fold at comparable ink thickness and machine speed. The improved performance results from the selection of materials utilized including a combination of elastomers, and in some case an essentially oil-free composition, and an associated manufacturing process not previously utilized to create pliable print rollers for high speed drink can printing machines. In particular a particular embodiment, the composition includes a combination of elastomers (e.g., 75% polyisoprene and 25% polybutadiene), a filler (e.g., silica), a curing agent (e.g., peroxided), and other additives (e.g., pigment, antioxidant, antiozonant) with little or no oil added as a softener. An illustrative composition including 150 parts by weight contains 100 parts elastomer, 35 parts filler, 4 parts curing agent, and 11 parts other additives (i.e., zero parts oil softener).

Abstract: Hot melt adhesive compositions which have enhanced adhesion to difficult substrates, particularly at refrigerator/freezer temperatures or at elevated temperatures. The inventive compositions require a base polymer comprising an ethylene vinyl acetate-containing polymer; a tackifier; an adhesion promoting additive comprising at least one semi-crystalline polymer having a weight average molecular weight of about 30,000 daltons or less; and optional wax; and an optional antioxidant. It has been found that the adhesion promoting additive of this invention enhances the adhesion properties of a hot melt adhesive composition having ethylene vinyl acetate-containing polymer, particularly at elevated temperatures or at low refrigerator and freezer temperatures where other conventional adhesives have been unsuccessful.

Abstract: An accommodating intraocular lens comprises a first lens component, a second lens component, and an adhesive between portions of the two lens components. The cured adhesive bonds the lens components to form a fluid chamber. The lens components are bonded to one another along a seam which extends circumferentially along at least a portion of the lens components. The lens components may comprise the same polymer material. The cured adhesive also comprises the polymer or a prepolymer of the polymer to provide increased strength. The polymer is hydratable such that the lens components and the cured adhesive therebetween can swell together to inhibit stresses between the lens components and the cured adhesive.

Abstract: A method for producing an aircraft structure component is disclosed the component having an outer skin provided with a smooth outer surface. The method includes providing an aircraft structure component having an outer skin including at least one recess, detecting the location of said at least one recess by a recess detecting device, and filling said at least one recess at the detected location with particles of a filling material, said particles of filling material being applied into said at least one recess by an ink jet printing device.

Abstract: There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, the entire fixing agent spreading between the both translucent rigid substrates is cured every time the translucent rigid substrates are bonded.

Abstract: A method for placing an optical lens, with a first side and a second side, on a block piece for holding the optical lens and which has a coupling part for holding the block piece in a workpiece chuck and with a holding part for fastening the lens. The holding part has a convex or concave holding surface corresponding to a first side of the lens. The holding surface is, according to the shape of the lens to be held, provided in the form of a negative free-forming surface, and the block piece is made from a plastic that can be machined.

Abstract: A wafer is mounted to a dicing frame using a holding tape. A plurality of semiconductor devices are provided on a center portion of a major surface of the wafer. A ring-like reinforcing section is provided on a periphery of the major surface. The holding tape is adhered to the major surface The holding tape is heated to at least 0.6 times of melting temperature of the holding tape so as to adhere the holding tape along a step of the ring-like reinforcing section.

Abstract: A device for removing a thin outer layer from the surface of a cartridge or tubular container such as a caulk cartridge for removal of ink, contaminant, adhesive, or printed or stamped label from the outside of the cartridge. The apparatus includes cartridge hopper and a cartridge handling mandrel or plunger which automatically removes a cartridge from the hopper aligning same for insertion of the cartridge axially through the throat of a spinning ring which contains at least one and preferably a plurality of inwardly extending knifes. The spinning knife distal end trims or peels off the label, adhesive, ink, imperfections, or even a thin film from an outer layer of a selected thickness effectively reconditioning the cartridge for reuse to be filled with virgin material or to be used as uncontaminated re-ground material to be sold as scrap.

Abstract: A method for shaping dry preform material prior to resin infusion is disclosed. The starting material to be shaped is a preform blank (e.g. flat sheet) of dry, fibrous material. The shaping process is a vacuum forming process that relies on controlling the vacuum pressure and deformation speed to produce a shaped preform with three-dimensional configuration. The purpose of the shaping process described herein is to enable an automated process to replace the conventional hand lay-up operation.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.

Abstract: Techniques are described for directly bonding different substrates together. In some examples, a technique includes placing a first surface of a first substrate in contact with a second surface of a second substrate to directly bond the first substrate to the second substrate at a contact location. The contact location is defined where at least a portion of the first surface of the first substrate contacts at least a portion of the second surface of the second substrate. The technique may also include directing a laser beam on at least a portion of the contact location to strengthen the direct bond between the first substrate and the second substrate. In this manner, a direct bond may be heated with localized laser energy to strengthen the direct bond. Localized laser energy may create a strong direct bond while minimizing thermal defects in regions proximate the direct bond.

Abstract: The present invention relates to a method for minimizing breakage of wafers during or after a wafer thinning process. A method of forming a rounded edge to the portion of a wafer remaining after surface grinding process is provided. The method comprises providing a semiconductor wafer having an edge and forming a recess in the edge of the wafer using any suitable mechanical or chemical process. The method further comprises forming a substantially continuous curved shape for at least the edge of the wafer located above the recess. Advantageously, the shape of the wafer is formed prior to the backside grind process to prevent problems caused by the otherwise presence of a sharp edge during the backside grind process.

Abstract: A method of preparing a plurality of workpieces for concurrent cutting using a stone cutting machine is disclosed. Each workpiece can include a stone slab that has two parallel faces and one or more edges, a substrate that is bonded to a first face, and a substrate that is bonded to a second face of the stone slab. The stone cutting machine can have a plurality of stone cutting elements and it can be configured to concurrently create a plurality of stone cuts. The method can include: providing a plurality of workpieces; and positioning the plurality of workpieces by placing a set of shims between adjacent pairs of workpieces. The set of shims can be placed to compensate for variations in workpiece thickness and/or to position each of the workpieces with one edge of each stone slab in relative alignment with one of the stone cutting elements.

Abstract: A method for producing an endless transport belt for guiding substrates during the printing operation of a printing press is disclosed. The ends of a transport belt are welded together. The transport belt is ground, after one or multiple welding operations without or with the addition of material, to a nominal thickness that is smaller than or equal to the minimal thickness of the transport belt.

Abstract: Various methods are described for manufacturing a plastic drum that includes injection-molding upper and lower drum body portions having sidewalls that terminate at an open end. The open end of each drum body portion includes a drum body welding platform. The platform is characterized by a thickening of the drum body portion sidewall. The methods also include aligning the upper drum body portion with respect to the lower drum body portion such that the upper drum body welding platform is aligned with the lower drum body welding platform at an interface, and joining the upper drum body portion to the lower drum body portion at the interface to form the plastic drum. Also described are plastic drums made by the noted methods.

Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

Abstract: A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 PSI against a release film having a higher hardness than the resin of the prepreg but a lower hardness than the cured resin, and heating through a curing cycle while maintaining pressure.

Abstract: The present invention provides a method of powder coating a heat-sensitive item having an edge, which includes sealing the edge against moisture loss from the item, applying powder to a surface of the item, and curing the powder. The present invention also provides another method of powder coating a heat-sensitive item, the method including applying a powder to a surface of the item, heating the surface in a melting stage for between about 60 seconds and about 90 seconds such that the surface has a surface temperature that reaches a maximum that is above a curing temperature to melt the powder, and heating the surface in a curing stage to maintain the surface temperature at the curing temperature for between about 120 seconds and about 180 seconds to cure the powder.

Abstract: A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

Abstract: A method for producing a scintillator array comprising fixing a scintillator substrate to a support plate via a double-coated adhesive sheet, at least an adhesive surface thereof to be in contact with the scintillator substrate being thermally peelable; providing the scintillator substrate with lattice-patterned grooves to form pluralities of scintillator cells; filling gaps between the scintillator cells with a liquid hardening reflector resin; curing the liquid hardening reflector resin by heating to form a resin-hardened scintillator cell body; and then peeling the double-coated adhesive sheet from the resin-hardened scintillator cell body by heating.

Abstract: A method is provided for making electrical contact with an electronic component in the form of a stack formed from a plurality of material layers, which react upon application of an electric field, and a plurality of electrode layers, wherein each material layer is arranged between two of the electrode layers. An insulation structure is generated on at least one stack circumferential region of the stack, which exposes each second electrode layer of the at least one stack circumferential region for electrical contact to be made. Also, a contact-making structure is applied to the at least one stack circumferential region which is provided with the insulation structure. Before the step of generating the contact-making structure, the material layers are partially removed by a material-removing method such that the electrode layers are exposed close to the surface.

Abstract: An optical coupler may include a fiber optic structure that has a portion of an outer surface that is beveled at a predetermined angle relative to a longitudinal axis of the fiber optic structure. The beveled outer surface portion may be optically coupled with a waveguide core of an optical integrated circuit. The fiber optic structure may also include a second outer surface portion that is butt coupled to an end of an optical fiber to optically couple the second outer surface portion with the optical fiber.

Abstract: An optical device for illuminating the vasculature of a mammal using ultraviolet, visible, and/or infrared light is described. The optical device includes an optical fiber encased in a biocompatible sheath, and is dimensioned to lie within an intravascular catheter. When placed within a vascular space and coupled with a suitable light source the optical device illuminates the vascular space and its contents. The faces of the optical fiber are configured to optimize the capture of ultraviolet, visible, and/or infrared light from a light source without the use of active optics.

Abstract: A flat display panel cutting method includes the following steps: coating a first packaging adhesive on a surface of a first substrate at which display units are formed, wherein the first substrate is formed of a first-substrate-material and the first packaging adhesive is made of a first-substrate-material-based material; bonding a second substrate to the surface of the first substrate to form the panel, having a first surface and a second surface opposite to the first surface; forming at least one crack on the first surface of the panel corresponding to the first packaging adhesive with a cutting tool to form at least one crack; applying a force on the second surface at a position corresponding to the at least one crack so as to break the panel.

Abstract: A projection screen has a gold coated projection receiving surface that reflects light. The projection screen includes a support structure and an adhesive layer on top of the support structure. A fiber support is adhered to the support structure using the adhesive layer. A chalk and adhesive layer is applied on to the fiber support and a clay and adhesive layer is applied on to chalk and adhesive layer. A gold layer is applied to the clay and adhesive layer. A light or a portion thereof passes through each of the multiple ordered layers, including the gold layer, the clay and adhesive layer, the chalk and adhesive layer and reflects back a lustrous, iridescent image that has motion and depth qualities with transmuted color characteristics.

Abstract: This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.

Abstract: A method of making a coated polymer-matrix composite (PMC) having high-temperature oxidation protection includes bonding a first surface of a flexible sublayer that is free of water to a first surface of a dry PMC substrate having a first coefficient of thermal expansion. The flexible sublayer includes an electrically conductive material in an effective amount to enable electrical conductivity of the flexible sublayer, and includes a low-modulus-of-elasticity material. The method includes heating the bonded flexible sublayer and the PMC substrate, and bonding a first surface of an oxygen-impervious, dense barrier-coating layer to a second surface of the flexible sublayer to form the coated PMC having high-temperature oxidation protection.

Abstract: A panel for use in an architectural installation includes a poplar bark slab having a top face, bottom face and two opposed sides. The bottom face is laminated to a backing to make a composite, the top face has lands and crevasses. A filler on the top face fills the crevasses and a coating covers the filler and presenting a smooth, flat outer surface. The resulting composite panel with filler and coating is machined to obtain a shape selected from the group consisting of flooring, wall panel, ceiling panel, chair rail, door or window frame or crown molding.

Abstract: A display device and a method of manufacturing the display device. The display device includes: a first substrate including a display region at which pixels are located; a second substrate on the first substrate while covering the display region; a sealant between the first substrate and the second substrate and surrounding the display region; and at least one protruding pattern located at an outer side of the sealant with respect to a center of the first substrate or the second substrate, on at least one of the first substrate or the second substrate.

Abstract: A method of fabricating an aircraft landing gear rocker beam comprising a body having a clevis (24) with two lugs (19, 21) parallel to a direction that is radial relative to the body, the method comprising the steps of: forming a first mandrel; applying one or more first braided fiber layers (11) on the first mandrel; fitting a second mandrel element on the assembly as constituted in this way, the second mandrel element extending between the two lugs (19, 21) of the clevis (24) that is to be formed; applying one or more second braided fiber layers (17) on the assembly as constituted in this way; injecting resin into the various layers (11, 17) and polymerizing the resin; and machining the resulting workpiece blank in order to cut away a region of the second braided layers (17) in order to separate the two lugs (19, 21) of the clevis (24) from each other.

Abstract: A reflector array optical device has a plurality of dihedral corner reflector array optical elements which are disposed side by side on the same plane. Each of the dihedral corner reflector array optical elements has a substrate and a plurality of dihedral corner reflectors which each have at least two orthogonal side faces perpendicular to the principal surface of the substrate and orthogonal to each other, and which are formed on the substrate so that the orientations of the interior angles of the orthogonal side faces are aligned with each other.

Abstract: A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.

Abstract: A cylindrical carbon fiber arrow shaft formed with an increased external diameter of 0.380 inches. This arrow shaft is formed with an axial bore which has a first internal diameter throughout a substantial portion of the shaft length, and a second, smaller, internal diameter throughout the fletching end of the arrow. The second internal diameter corresponds to the internal diameter of standard arrows having external diameters of 0.295 inches. Using this standard internal diameter at the fletching-end of the arrow, standard nooks may be used without the need for any spacer or insert, thereby decreasing fletching-end weight significantly and providing for the proper and more desired location of the center of gravity forward on the arrow.

Abstract: A laser device is disclosed that provides at least an ultraviolet laser beam and preferably both an ultraviolet laser beam and a visible laser beam. The laser device includes a semiconductor laser device (e.g. a laser diode) to generate visible laser light which is coupled into a frequency doubling crystal taking the form of a single crystal thin film frequency-doubling waveguide structure. The single crystal thin film frequency-doubling waveguide converts a portion of the visible light emitted by the laser diode into ultraviolet light. Both visible and ultraviolet laser light is emitted from the waveguide. As an example, the single crystal thin film frequency-doubling frequency doubling waveguide includes a frequency doubling crystal region composed of ?-BaB2O4 (?-BBO), a cladding region composed of materials that are transparent or nearly transparent at the wavelength of the ultraviolet laser light beam and a supporting substrate composed of any material.

Abstract: A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components. A thin copper foil is then laminated over the substrate to adhere the foil to the adhesive pattern. The foil is then peeled off the substrate such that the foil overlying the adhesive pattern remains, and the foil that is not overlying the adhesive pattern is removed. In one embodiment, the foil is cut or weakened along the edges of the adhesive pattern to minimize tearing of the foil. The foil may be first affixed to a sheet for increased mechanical integrity, prior to the foil being laminated over the substrate, followed by kiss-cutting the foil while on the sheet to avoid tearing of the foil during the lift-off step.

Abstract: The disclosed embodiments offer a solution for controlling the thickness of a finished structural composite part when precise tolerances must be complied with for the quality of the assembly and in order to ease the assembly operations of this part. In order to implement the method according to the disclosed embodiments, an additional layer of plies made out of a non-structural composite material, called calibrating plies, is applied onto the structural plies of the structural part, at least in an area where the thickness must be maintained within close tolerances and, after the composite material has been cured, the calibrating plies are machined in order to obtain the thickness required for the finished part. The thickness of the calibrating plies applied is determined according to the possible thicknesses of structural plies, taking into account the manufacturing spreads so that the machining operation for the calibrating plies does not affect the structural plies.