Abstract: A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.

Abstract: A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article.

Abstract: A method of forming a lead includes providing an elongated lead body defining an annular groove disposed around a circumference of the lead body along one of a distal end or a proximal end of the lead body. A pre-contact is disposed around the circumference of the lead body within the annular groove. The pre-contact includes a pre-contact body having opposing first and second ends and first and second tabs extending outwardly from the opposing first and second ends, respectively. The first and second tabs are crimped together and folded flat against an outer surface of the pre-contact body. A polymeric material of the lead body is re-flowed to facilitate coupling of the pre-contact to the lead body. An outer surface of the pre-contact body is ground down to form a contact disposed along the one of the distal end or the proximal end of the lead body.

Abstract: Disclosed herein is an insulating layer conduction method, and more particularly, an insulating layer conduction method of conducting between the insulating layers through a bump. The method includes providing a hard insulating layer; configuring a land on the hard insulating layer; configuring a bump on the land; laminating a soft insulating layer on the hard insulating layer while being penetrated by the bump; curing the laminated soft insulating layer; and polishing, by a polishing machine, the cured soft insulating layer and an upper surface of the bump.

Abstract: A method includes receiving a carrier with a release layer formed thereon. A first adhesive layer is formed on a wafer. A second adhesive layer is formed over the first adhesive layer or over the release layer. The carrier and the wafer are bonded with the release layer, the first adhesive layer, and the second adhesive layer in between the carrier and the wafer.

Abstract: A stone-wood composite base engineered wood flooring having a stone-wood composite base layer in which at least one mesh layer is embedded. Adhered to the base layer is a wood veneer layer. Interlocking design such as tongue-and-groove is provided on at least two sides of the engineered flooring. The wood veneer layer of the engineered wood flooring has improved fireproof performance, waterproof performance and moisture-proof performance. When the pieces of flooring are bonded to either each other or the floor, undesired warping of joints is consequently minimized.

Abstract: A mixture of an elastomer, carbon black, and inorganic fillers provides a highly useful laser-ablatable flexographic printing plate precursor formulation. This formulation is sensitive to infrared radiation. Both flexographic printing plates and printing sleeves can be made using the mixture.

Abstract: A connector comprising a base formed using a base material with an obverse face, a reverse face, and at least one wall member that defines the perimeter of the base; a multiplicity of inserts each having a first end and a second end, which extend through the base; wherein the inserts are of a different material than the base material, and the inserts are generally parallel to one another, wherein a single hole extends longitudinally through each of at least a subset of the inserts, and wherein each hole is configured to receive a single optical fiber; and a method of making the connector.

Abstract: There is provided a capacitor, including: a substrate part including a first substrate having a groove portion and a second substrate positioned above the first substrate and having a protrusion portion; a first capacitance part formed on one surface of the first substrate and having a shape corresponding to that of the groove portion; and a second capacitance part formed on one surface of the second substrate and having a shape corresponding to that of the protrusion portion.

Abstract: A wafer is divided by setting the focal point of a laser beam inside the wafer at positions corresponding to division lines, thereby forming modified layers inside the wafer along the division lines. Each modified layer has a thickness ranging from the vicinity of the front side of the wafer to the vicinity of the back side of the wafer. An etching gas or an etching liquid is supplied to the wafer to erode the modified layers, thereby dividing the wafer into individual devices. The modified layers are not crushed, so fine particles are not generated in dividing the wafer. Accordingly, fine particles do not stick to the surface of each device and cause a reduction in quality. Further, since the modified layers are removed by etching, it is possible to prevent a reduction in die strength of each device due to the remainder of the modified layers.

Abstract: The invention is directed to an embossing assembly and methods for its preparation. The assembly comprises a drum, a non-expandable insert and an embossing sleeve and it is particularly useful for the preparation of microcups used in a display device. The assembly may also comprise only a drum and an embossing sleeve.

Abstract: Disclosed herein is a method for making transparent ceramic spinel windows, domes and other complex shapes via edge bonding.

Abstract: Disclosed are an insulator for a build-up PCB and a method of manufacturing a printed circuit board using the insulator. The insulator for a build-up PCB in accordance with an embodiment of the present invention includes: an insulation film layer, of which one surface has an area corresponding to a circuit board to be built-up; and a cover film layer, which is stacked on the insulation film layer and of which one surface has a larger area than the one surface of the insulation film layer so as to cover an entire outer perimeter of the insulation film layer.

Abstract: An article of manufacture includes a substrate having an outer surface clad with a metal construct including one or more continuous metal layers, at least one of which is an amorphous layer or a microcrystalline layer having a grain size below 5000 nm. A bonding layer is provided between the substrate and the layered metallic construct so that the bonding layer is in direct contact with the substrate and with the layered metallic construct. The bonding layer is made of a substantially fully cured resin including at least 10% of a rubber. The layered metallic construct has peel strength greater than 10N/cm. Also provided is a process for making the article including coating an article outer surface with a bonding layer and a layered metallic construct. The bonding layer is substantially fully cured before the layered metal construct is bonded to the article. The coated article is annealed.

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.

Abstract: A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

Abstract: Thermally laminated foam boards, methods for making thermally laminated foam boards, apparatus for making thermally laminated foam boards, smaller foam pieces made from thermally laminated foam boards, methods for making smaller foam pieces from thermally laminated foam boards, parts made from thermally laminated foam boards, methods for making parts from thermally laminated foam boards, and tools for making parts from thermally laminated foam boards are disclosed. The thermally laminated foam boards are made by thermally bonding at least two polystyrene boards together.

Abstract: A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

Abstract: A method for preparing a resizing sleeve for lining a joining point in a pipe assembly having pipes of thicker and thinner diameter. The method includes stretching the resizing sleeve in diameter to the size of the thicker pipe in diameter of the pipe assembly, installing an installation hat according to the thicker pipe in diameter of the pipe assembly by airtightly gluing it onto the stretched resizing sleeve, and returning the resizing sleeve to the size of the thinner pipe in diameter of the pipe assembly to be lined. A suitable tool for implementing the method is also disclosed.

Abstract: A method of forming a sprocket comprising forming a sprocket member having a tooth profile, forming grooves in the sprocket member base, installing a plurality of sprocket members in a mandrel thereby forming a build, applying an elastomer member between adjacent sprocket members, wrapping a tensile member about the sprocket members and elastomer members, curing the build, removing the build from the mandrel, and inverting the build and joining the build to a rigid core.

Abstract: A method for assembling a lens module is provided. The lens module includes a lens barrel, a lens holder, a lens and a filter. The lens barrel includes a first portion and a second portion. The method for assembling the lens module includes the steps of; providing a tray which defines a plurality of perforations, each of which is for accommodating the lens barrel; spreading glue on the second portion, and affixing the filter on the second portion by means of glue; solidifying the glue; cleaning the inside of the lens barrel after the filter is mounted on the second portion; cutting the filter into a plurality of filter portions whose shape matches the shape of the second portion; and placing the lens holder with the lens into the lens barrel complete with a filter portion after the lens barrel has been cleaned.

Abstract: Porous nano-imprint lithography templates may include pores, channels, or porous layers arranged to allow evacuation of gas trapped between a nano-imprint lithography template and substrate. The pores or channels may be formed by etch or other processes. Gaskets may be formed on an nano-imprint lithography template to restrict flow of polymerizable material during nano-imprint lithography processes.

Abstract: A method for producing an ophthalmic lens comprised of a base lens and a film structure bound to said base lens includes a pressure-free heating. Said heating is performed after assembling the film structure with a semi-finished lens (1), and before said semi-finished lens is machined for obtaining the base lens. Although a maximum heating temperature is higher than a glass-transition temperature of the semi-finished lens, no image distortion and optical aberration is produced for the final ophthalmic lens. The maximum heating temperature is also lower than a glass-transition temperature of the film structure.

Abstract: The present invention relates to processes for making decorative or artistic panels on glass surfaces and polymeric surfaces in multiple layers and their application in commercial and artistic decoration, such as dividing walls, ceilings, pictorial pictures, sculptures, floor lamps, desk or ceiling lamps, spectacular domes, stained glass, shower wall, as well as to decorate residential and industrial spaces.

Abstract: A method of making High Temperature Resistant Models and Tools is provided. An assembly of substrates can be formed with intermediate adhesive layer of curable paste and same curable paste can be used as topcoat or sealer. The curable paste can be machine dispensed from a mixer mixing 2 components composition. The composition can contain a resin, a filler, a chemical thixotropy agent, a latent hardener and another hardener. The method provides easy and cost-effective manufacture of models or tools.

Abstract: A cleanroom box made from a substantially inflexible material, to be used for the storage of fluids within a clean room; the box comprising easy clean surfaces, an internal access point leading to a specially designed space for the deposit of tubing, and fitted with a forkliftable pallet base for easy mobility within a workroom.

Abstract: The method of preserving the anodized finish of a barrier door of a process module includes bonding a seal to a metal surface, anodizing the metal surface, and then using a CNC machine to polish the metal surface without damaging the seal. The metal surface is polished by traversing a polishing path along the metal surface with a polishing head maintaining frictional contact with the metal surface. The integrity of the seal is preserved by bounding the polishing head to skirt the edge of the seal by following the polishing path.

Abstract: To provide a method of manufacturing a semiconductor device including a step of attaching a surface protective tape onto the surface of a wafer which has completed the wafer process, a step of subjecting the back surface of the wafer to back grinding, and a step of attaching a peeling assist tape onto the surface protective tape while vacuum-adsorbing the back surface of the wafer to apply a tension to the assist tape, thereby separating the surface protective tape from the wafer, wherein a vacuum suction system has a peripheral suction system for the peripheral part of the wafer and an internal suction system for the internal region of the wafer.

Abstract: A network comprising: (a) a fiber having first and second ends; (b) a transmitter connected to the first end of the fiber and configured to launch a test signal having a first wavelength down the fiber; and (c) a thin-film selective reflector configured to reflect the first wavelength, the thin-film selective reflector optically connected to the second end of the first fiber.

Abstract: A prescription label identity peeler includes a box-shaped housing. A lid extends over the box-shaped housing. A sanding member is adjustably carried within the box-shaped housing. A pair of linkage arms is pivotally extend between the lid and the sanding member. The motorized linkage arms will move the sanding member simultaneously and horizontally against the empty pill bottle in an inverted position, while the wheel on the swing arm assembly will contact a bottom end of the empty pill bottle via compression of the springs, thereby removing the label from the empty pill bottle when the inverted empty pill bottle rotates.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: A lens pad includes a blank, first adhesive layer, and release sheet. The first adhesive layer is formed on one surface of the blank. The release sheet comes into tight contact with the surface of the first adhesive layer to protect this surface. The arithmetic average roughness of the surface of the release sheet on the side of the first adhesive layer is 0.1 ?m or less. The surface of the first adhesive layer from which the release sheet is peeled off is attached onto a lens as an edging target. A lens pad, a lens pad manufacturing method, a lens manufacturing method, and an adhesive member are also disclosed.

Abstract: A fuel cell module and a method manufacturing the same that improves a contact structure of the inter-connectors to prevent gas leaks, thereby to improving the performance and the durability of the unit cell. The fuel cell module includes a plurality of inter-connectors, wherein at least one of the inter-connectors has a first face contacting a first electrode layer, a second face opposing the first face, and third and fourth faces connecting the first face to the second face, respectively, wherein at least a portion of the at least one of the inter-connectors also contacts an electrolytic layer, wherein a length of the first face of the at least one of the inter-connectors is 20% to 80% of a length of the second face.

Abstract: A wafer processing laminate is provided comprising a support, a temporary adhesive layer on the support, and a wafer laid on the temporary adhesive layer. The temporary adhesive layer has a trilayer structure consisting of a first bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the circuit-forming front surface of the wafer, a second bond layer (B) of thermosetting modified siloxane polymer which is laid on the first bond layer, and a third bond layer (A?) of thermoplastic organosiloxane polymer which is laid on the second bond layer and releasably bonded to the support.

Abstract: An oil gas separation membrane combines a gas permeable yet oil and temperature resistant bulk polymer membrane such as poly(tetrafluoroethylene) and poly(tetrafluoroethylene-co-hexafluoropropylene); a porous metal support such as sintered metal frit disk made with stainless steel, bronze or nickel; and an highly gas permeable adhesive that bonds firmly the bulk polymer membrane and the metal frit surface together. The adhesive is either a homogenous polymer that has desirable gas permeability, or a coalescent porous polymer particulates network. A gas sensor employing the oil gas separation membrane for detecting and monitoring fault gases of oil filled electrical equipment requires no mechanical wearing or moving part such as pump and valve and the gas sensor is operated normally under various temperature and pressure conditions.

Abstract: A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.

Abstract: A micro-fluidic device is described. The micro-fluidic device includes a semiconductor substrate; at least one micro-reactor in the semiconductor substrate; one or more micro-fluidic channels in the semiconductor substrate, connected to the at least one micro-reactor; a cover layer bonded to the semiconductor substrate for sealing the one or more micro-fluidic channels; and at least one through-substrate trench surrounding the at least one micro-reactor and the one or more micro-fluidic channels.

Abstract: A method of manufacturing a honeycomb structure having honeycomb segments, which includes a masking step (S1) of attaching masking materials (8) to both end surfaces (2a) of the honeycomb segments (2), a stacked body bonding step (S2) of bonding the honeycomb stacked body (3) by bonding the plurality of honeycomb segments (2) together while interposing adhesive layers therebetween, an adhesive layer drying step (S3) of integrally fixing the honeycomb stacked body (3) by heating and drying the adhesive layers, a masking material separating step (S4), of separating the masking materials (8), and a grinding step (S5) of grinding an outer peripheral portion of the honeycomb stacked body (3) into a predetermined shape.

Abstract: The present invention relates to a method for manufacturing a hull for vessels, containers or equivalents. The method comprises the steps: preparing an elastic or viscoelastic glue through mixing of at least two components; monitoring and/or controlling the mixing for determining if a correct desired mixing product has been achieved; applying a layer of the glue onto the hull (2) or on a first side of a sheet (4) of cellular plastic or other light weight material; mounting the sheet onto the hull, the sheet being equipped with a multiplicity of through-going air evacuation holes (12); placing an air permeable material (6) on top of the other side of the sheet (4), mounting a vacuum foil (8) onto the other side of the sheet; gluing by vacuum suction; observing visually if the glue exits out of the air evacuation holes on the other side of the sheet.

Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

Abstract: A method of making a mirror from a single crystal blank may include fine grinding top and bottom surfaces of the blank to be parallel. The blank may then be heat treated to near its melting temperature. An optical surface may be created on an optical side of the blank. A protector may be bonded to the optical surface. With the protector in place, the blank may be light weighted by grinding a non-optical surface of the blank using computer controlled grinding. The light weighting may include creating a structure having a substantially minimum mass necessary to maintain distortion of the mirror within a preset limit. A damaged layer of the non-optical surface caused by light weighting may be removed with an isotropic etch and/or repaired by heat treatment. If an oxide layer is present, the entire blank may then be etched using, for example, hydrofluoric acid. A reflecting coating may be deposited on the optical surface.

Abstract: A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.

Abstract: A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.

Abstract: A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.

Abstract: A method of manufacturing an electronic device includes: roughening an underside surface of a film made of a resin, opposite to a mounting surface of the film for mounting a circuit chip; forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the film where the conductor pattern is formed; and attaching a thermoset adhesive to a conductor-pattern-formed surface of the substrate. The method further includes: mounting the circuit chip to be connected to the conductor pattern on the substrate via the thermoset adhesive; clamping the substrate by a heating apparatus having a presser section and a support section, the presser section abutting the circuit chip mounted on the substrate and the support section abutting the underside surface of the roughened film; and fixing the circuit chip to the conductor pattern by heating and hardening the thermoset adhesive using the heating apparatus.

Abstract: A guide carriage for a linear roller bearing is supportable in a longitudinally displaceable manner via at least one row of rollers on a guide rail which extends in a longitudinal direction, a separate rolling surface part which includes a rolling surface for the rollers is assigned to each row of rollers, and the rolling surface part is connected via an adhesive layer to a carrier body. The adhesive layer is designed essentially planar on the back side of the rolling surface part which faces away from the rolling surface, the rolling surface part being accommodated in a recess—which has an L-shaped cross section—of the carrier body.

Abstract: Provided is a highly durable liquid jet head capable of improving conversion efficiency in converting deformation of side walls (6) into change in capacity of grooves (5). A liquid jet head (1) includes side walls (6) forming grooves (5), a reinforcing plate (17) which is formed of a ceramic material and is placed below the side walls (6), a nozzle plate (4) including nozzles (3) communicating with the grooves (5), respectively, the nozzle plate being placed on the reinforcing plate (17) on a side opposite to the side walls (6), drive electrodes (7) formed on wall surfaces (WS) of the side walls (6), and a cover plate (10) placed above the side walls (6), the cover plate including a supply port (8) for supplying liquid to the grooves (5) and a discharge port (9) for discharging liquid from the grooves (5).

Abstract: A tape bonding device for bonding a tape member to a work piece, wherein the tape bonding device has a main body section, and a cover body section provided reopenable to the main body section. The main body section has a mount member on the upper surface of which the work piece is mounted; a tape holding unit which holds the tape member in a stretching state, and, at the same time, locates the tape member in the upper portion of the work piece mounted on the mount member; and a sucking unit for vacuum suction of space between the tape member and the work piece. The cover body section has a concave section which is depressed upward in the blocked state of the cover body section, and, at the same time, the upper bottom surface of the concave section presses downward the work piece and the tape member, which move upward.

Abstract: The present invention relates to a preparation method of a long cycle life negative electrode as well as the organic hybrid capacitor battery using this negative electrode. The preparation steps of the negative electrode include: blending all materials including carbon material with a fast lithium intercalation capability, and a binder, and adding in solvent; pressing the blended material to get an electrode plate of a certain thickness; stirring the conductive agent to a paste, and attaching it to a cathode current collector; attaching the electrode plate to the conductive agent coated negative current collector; Drying, grinding, cutting and vacuum drying to form a negative electrode. In the present invention, the process of pressing the electrode plate into shape first and then attaching to the negative current collector is used, which enables the negative electrode to have a high compressed density and cycle life.

Abstract: Highly flexible finished wood laminate, formed by several substrates that include a transparent plastic film finish, a layer of pre-varnished sanded wood, a plastic film with corona treatment on both faces and a flexible substrate. It is easy to affix using glue on straight and shaped surfaces and even adapts to acute corners without cracking; manufacturing process for the laminate.