Subsequent To Assembly Patents (Class 156/154)
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Patent number: 7341639Abstract: A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact surfaces, forming second protective layers on opposite surfaces of the ceramic base body, sintering the ceramic base body with the first and second protective layers at a first temperature, forming the contact surfaces on the ceramic base body, and sintering the contact surfaces at a temperature that is lower than the first temperature.Type: GrantFiled: September 6, 2006Date of Patent: March 11, 2008Assignee: EPCOS AGInventors: Günther Greier, Günter Engel, Renate Kofler, Axel Pecina, Robert Krumphals
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Patent number: 7311790Abstract: A hybrid structure (50) and method of manufacturing the same including a structural ceramic matrix composite (CMC) material (42) coated with a layer of ceramic insulating tiles (24). Individual ceramic tiles are attached to a surface (22) of a mold (20). The exterior surface (32) of the tiles may be subjected to a mechanical process such as machining with the mold in place to provide mechanical support for the tiles. A layer of CMC material is then applied to bond the tiles and the CMC material together into a hybrid structure. The mold may include a fugitive material portion (26) to facilitate removal of the mold when the hybrid structure has a complex shape. Tiles located in different regions of the structure may have different compositions and/or dimensions. The gaps between adjacent tiles may be filled from the outside before the CMC material is applied or from the inside after the mold is removed.Type: GrantFiled: January 29, 2004Date of Patent: December 25, 2007Assignee: Siemens Power Generation, Inc.Inventors: Jay A. Morrison, Gary B. Merrill, Michael A. Burke, Jay Edgar Lane, Steven James Vance
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Patent number: 7309397Abstract: A block of stacked green films provided with internal electrodes is laminated, at least one actuator is separated from the block, the actuator obtains its shape by means of a machining operation, is then sintered, and the sinter skin produced by the sintering is used as an insulating layer. The sinter skin is abraded at the points where the internal electrodes are connected to the external electrodes.Type: GrantFiled: January 9, 2004Date of Patent: December 18, 2007Assignee: Ceramtec AG Innovative Ceramic EngineeringInventors: Hans-Jürgen Schreiner, Reiner Bindig, Matthias Simmerl, Jürgen Schmidt
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Patent number: 7297040Abstract: A method for manufacturing a flexible panel is disclosed, which has the following steps. First, a first substrate having a plurality of functional switches or conducting lines thereon is provided. Then, a second substrate is bonded on the functional switches or conducting lines, and the first substrate is thinned to a predetermined thickness subsequently. Afterwards, a flexible third substrate is adhered on the first substrate, wherein the first substrate is sandwiched between the second substrate and the third substrate. Finally, the second substrate is removed.Type: GrantFiled: September 8, 2006Date of Patent: November 20, 2007Assignee: Industrial Technology Research InstituteInventors: Jung-Fang Chang, Chich-Shang Chang, Chi-Lin Chen
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Patent number: 7282105Abstract: Miniature planar IR waveguides of thickness 30–50 ?m, consisting of 12-mm long, 2-mm wide strips of Ge supported on ZnS substrates and tapered quasi-tapered waveguides, tapered from a thickness of 1 mm at the ends to a minimum of 1–100 ?m at the center, are disclosed. The surface sensitivity is increased as a function of incidence or bevel angle. The tapered waveguide improves the efficiency of the optical coupling both into the waveguide from an FTIR spectrometer, and out of the waveguide onto a small-area IR detector. The tapering makes it possible to dispense with using an IR microscope couple light through the waveguide, enabling efficient coupling with a detector directly coupled to an immersion lens. This optical arrangement makes such thin supported waveguides more useful as sensors, because they can be made quite long (e.g. 50 mm) and mounted horizontally.Type: GrantFiled: December 17, 2002Date of Patent: October 16, 2007Inventors: Susan E. Plunkett, James J. Stone, Mark Stephen Braiman
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Patent number: 7187859Abstract: The present invention is directed towards adhering a contact lens button on a fixture for use in shaping, forming and/or otherwise configuring a contact lens. For example, in accordance with one exemplary embodiments of the present invention, a combination of adhesive materials are used to adhere the lens to the fixture. For example, a first layer of water soluble adhesive is placed on the lens button. A second layer of non-water soluble adhesive is then placed on the first layer, and the button is mounted to the fixture. Both layers are subsequently removable by placing the button in a water bath, dissolving the water soluble layer and likewise separating the water insoluble layer.Type: GrantFiled: December 6, 2004Date of Patent: March 6, 2007Assignee: Paragon Vision Sciences, Inc.Inventor: Hank Stute
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Patent number: 7153379Abstract: Methods are provided for producing a ceramic matrix composite by slurry infiltration. The methods involve placing a desized ceramic cloth lay-up into a non-ceramic cloth bag, sealing the bag to form a bagged ceramic preform, infiltrating the bagged ceramic preform with a ceramic-containing slurry, and sintering the preform to convert the slurry to a ceramic while decomposing the non-ceramic bag. The methods of the present invention maximize slurry infiltration of the ceramic cloth tow bundle while minimizing damage to the ceramic cloth.Type: GrantFiled: October 15, 2004Date of Patent: December 26, 2006Assignee: General Electric CompanyInventors: Michael Lee Millard, Horace Richardson, Jr.
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Patent number: 7147531Abstract: A method for manufacturing a flexible panel is disclosed, which has the following steps. First, a first substrate having a plurality of functional switches or conducting lines thereon is provided. Then, a second substrate is bonded on the functional switches or conducting lines, and the first substrate is thinned to a predetermined thickness subsequently. Afterwards, a flexible third substrate is adhered on the first substrate, wherein the first substrate is sandwiched between the second substrate and the third substrate. Finally, the second substrate is removed.Type: GrantFiled: October 30, 2003Date of Patent: December 12, 2006Assignee: Industrial Technology Research InstituteInventors: Jung-Fang Chang, Chich-Shang Chang, Chi-Lin Chen
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Patent number: 7078802Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).Type: GrantFiled: November 8, 2004Date of Patent: July 18, 2006Assignee: International Business Machines CorporationInventors: Michael Gaynes, William R. Hill
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Patent number: 7022032Abstract: A golf club head and manufacturing method. The method includes the steps of: selectively forming through holes on a surface of a golf club head; preparing carbon-fiber plates which are made of prepared carbon-fiber fabrics; providing a cushion channel between an outer periphery of the carbon-fiber plate and an inner periphery of the through hole while each of the carbon-fiber plate is combined with the associated through hole of the golf club head; filling the cushion channel with a filler; and finishing the golf club head to produce an end product.Type: GrantFiled: April 28, 2003Date of Patent: April 4, 2006Assignee: Fu Sheng Industrial Co., Ltd.Inventor: Yun-Fang Chen
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Patent number: 7011731Abstract: Provided is a method for manufacturing a papermaking belt structure using tapes made of a solid thermoplastic resin surrounding a fibrous matrix. The method calls for applying a layer of CD oriented tapes to a mandrel surface, then applying a layer of MD oriented tapes over the CD layer, applying pressure and heat to the mandrel containing the CD and MD layers so to melt the resin and entirely bond/encapsulate the fibrous matrix. The belt structure thus obtained may thereafter be grooved, drilled or other processed as desired. Additionally, the above method can be reversed as to the MD/CD order of layering. Also, a layer entirely of resin can be applied, preferably prior to, but also after or in between the MD/CD layers. Also, rubber can comprise one or more layers.Type: GrantFiled: July 2, 2003Date of Patent: March 14, 2006Assignee: Albany International Corp.Inventor: Eric Romanski
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Patent number: 6998003Abstract: A method for manufacturing an optical device provides at least two sub-bodies of a base body and, at each sub-body, a surface so that the surfaces are complementary to each other and snugly fit on one another. Along at least one of the complementary surfaces, a first optical layer system is defined. The sub-bodies are joined along the complementary surfaces so as to embed the optical layer system between them and thus forming an assembled sub-body. Machining a continuous surface on the assembled sub-body and at a predetermined angle to the complementary surfaces and the embedded layer system then takes place, where the latter abut at the machined continuous surface. A second layer system is then provided along the continuous surface.Type: GrantFiled: October 2, 2002Date of Patent: February 14, 2006Assignee: Unaxis Balzers AktiengesellschaftInventor: Johannes Edlinger
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Patent number: 6986630Abstract: A perfect bound book construction is disclosed in which the book has a book block comprising a plurality of text pages, and a soft paper cover. The inner and outer faces of the cover are laminated with a plastic film so as to form a double laminated cover. The center portion of the inner lamination of the double laminated cover is conditioned or roughened, as by scarifying, so that an adhesive will adhere to the inner lamination and bind the spine of the book block to the double laminated cover. Apparatus for and a method of printing books on demand with such double laminated covers is also disclosed.Type: GrantFiled: December 7, 2001Date of Patent: January 17, 2006Inventor: Jeffrey D. Marsh
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Patent number: 6949158Abstract: A method and apparatus are disclosed for mounting a wafer on a mount and thinning the wafer. The wafer includes a front surface having bumps with an adhesive tape having a backing attached thereto and a back surface. The front surface of the wafer is mounted facedown on a suction surface with the backing of the adhesive tape abutting the surface. The wafer is then suctioned, after which the back surface of the wafer undergoes a grinding process to thin the wafer. Since the backing attached to the bumps on the wafer is substantially planar and sits substantially flat on the suction surface of the wafer mount, the force exerted on the wafer from the thinning process does not overcome the suction force holding the wafer on the wafer mount. Thus, the bumped wafer may be thinned without damaging the bumps and the active surface of the wafer.Type: GrantFiled: May 14, 2001Date of Patent: September 27, 2005Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Jose L. Sanchez
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Patent number: 6942746Abstract: A method of blocking ophthalmic lenses for edging comprises providing an ophthalmic lens having first and second surfaces, providing a first block for securing against the first lens surface and a second block for securing against the second lens surface. The method then includes placing an adhesive layer on the first block, placing a film having cling properties between the adhesive layer and the first lens surface, and urging the first block toward the first lens surface and the second block toward the second lens surface. The film having cling properties provides sufficient bonding force between the adhesive layer and the first lens surface to prevent the ophthalmic lens from slipping in the blocks during edging thereof.Type: GrantFiled: December 11, 2003Date of Patent: September 13, 2005Assignee: Optima, Inc.Inventors: Nicholas G. Niejelow, Shane M. Swift
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Patent number: 6889418Abstract: The method of the present invention is capable of processing a work piece with higher accuracy and providing highly reliable magnetic heads. The method of processing the magnetic head comprises the steps of: providing adhesive wax on a surface of a supporting jig; pressing a work piece onto the surface of the supporting jig so as to adhere the work piece thereon; heating the work piece supported by the supporting jig until the wax is melted so as to release stress in the work piece; and processing the work piece.Type: GrantFiled: June 22, 1999Date of Patent: May 10, 2005Assignee: Fujitsu LimitedInventor: Tomokazu Sugiyama
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Patent number: 6849148Abstract: A magnetic tape head assembly is provided along with a method of manufacturing a magnetic tape head. The magnetic tape head comprises a cluster of thin film inductive or magnetoresistive read/write elements, an I-block preferably made of a ceramic material, a U-bar also preferably made of a ceramic material, and a base preferably made of a ceramic or metal material. The U-bar has a substantially U-shaped form providing a recess into which the I-block and the cluster are fixed. A bottom surface of the U-bar, I-block, and cluster is fixed to the base to form a slider assembly. A top surface of the U-bar, I-block, and cluster is machined or etched to form one or more tape bearing surfaces thereon.Type: GrantFiled: April 2, 2003Date of Patent: February 1, 2005Assignee: Lafe Technology LimitedInventor: Chuck Fai Lam
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Patent number: 6833039Abstract: A mat (10) comprises a pile surface fabric (40) and a rubber or rubber-like backing layer (20). The pile surface fabric (40) is connected to and extends to the edges of the backing layer (20). The pile surface fabric (40) is provided with a border portion (22) having on its upper surface (26) a contrasting color and/or texture to the remainder (24) of the pile surface fabric and extending along at least a portion of the edge of said pile surface fabric. The mat (10) can be formed in a single cutting operation by cutting the mat from a roll of mat material (30) comprising a pile surface fabric having elongate areas (32, 34) of contrasting surface color and/or texture bonded to a rubber backing layer. The cuts (36, 38) are made along the elongate areas (32, 34). Since the border (22) is formed in the pile, colors and shapes can be selected to suit customer requirements, while the mat (10) serves to clean footwear over its entire area.Type: GrantFiled: November 1, 2001Date of Patent: December 21, 2004Assignee: Milliken & CompanyInventors: Soren Andersen, Peter Helge Sorensen, Thomas Brock
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Patent number: 6827802Abstract: An optical recording head is provided which includes a slider body having a leading edge. A void is formed in the slider body to receive a sphere of optically transparent material. The sphere is inserted into the void such that a portion of the sphere protrudes from the slider body. The protruding portion is lapped to be coplanar with a surface of the slider body to form a near-field lens. A mesa may be formed onto the lapped portion and may include a coil. The slider body, mesa, near-field lens, and coil may be formed in one batch process.Type: GrantFiled: June 18, 2002Date of Patent: December 7, 2004Assignee: TeraStar CorporationInventors: John R. Osborne, Hong Li, John Berg, David Kindler
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Patent number: 6797099Abstract: A new method for the bonding of painted construction parts, in particular for the structural bonding of painted metals surfaces is described. In a first step of the inventive method, a carcase work adhesive is applied onto all parts of the oiled steel sheet on which later on, during assembly, bonding shall be performed. For the bonding, the lacquer layers on the carcase work adhesive are removed prior to the application of an assembly adhesive. Said method is simple and rugged. In comparison with the state of the art it is more economic, enables a highly structural and high strength joining with high torsional strength and a high ageing resistant compound quality.Type: GrantFiled: January 24, 2002Date of Patent: September 28, 2004Assignee: Sika Schweiz AGInventor: Peter W. Merz
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Publication number: 20040172914Abstract: A seamless door and a method manufacturing a seamless door are provided. The door is comprised of: a core composed of processed wood product being a grade suitable for routering without chip-out, vertical members, veneer which covers the front and back of the door and edging which covers the peripheral edges of the door. The door has no visible seams or joints and can be constructed to mimic a rail and stile door by carving profiles into the door.Type: ApplicationFiled: March 20, 2003Publication date: September 9, 2004Inventor: Sergio Lancia
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Patent number: 6783620Abstract: The present invention provides thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. “Finishing” methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided.Type: GrantFiled: September 5, 2000Date of Patent: August 31, 2004Assignee: Matsushita Electronic Materials, Inc.Inventors: Terrence A. Smith, Howard R. Elliott
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Publication number: 20040134590Abstract: The annular workpiece (P) to be machined is positioned by one of its bases and with axial alignment onto a cylindrical base structure (1) onto which the workpiece remains secured due to the presence of a suitable adhesive (2) which for example has been previously distributed onto the said base structure. After the setting of the adhesive, the workpiece to be machined is loaded onto the machine tool, so as to be clamped by the chuck of this latter through the base structure (1) which carries it, and no more directly as in the known art. The clamping forces of the chuck are thus discharged onto the base structure (1) and they do not deform at all the workpiece (P) which can be machined with high precision and quickly, both on its inner and outer surfaces and, if required, also on its free base.Type: ApplicationFiled: October 24, 2003Publication date: July 15, 2004Inventor: Marcus Caldana
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Publication number: 20040103976Abstract: A sleeve for a print cylinder comprising a fiber reinforced, thin-walled material and having a seamless surface ready to be covered with a surface material. The sleeve may be used in flexographic printing, either as a support for photo-polymerized printing plates or rubber layers. The sleeve has the advantages of having low manufacturing cost and providing the necessary heat resistance to withstand rubber vulcanization temperatures. The sleeve is also airtight, and remains properly positioned during printing operations.Type: ApplicationFiled: November 25, 2003Publication date: June 3, 2004Inventors: Mario Busshoff, Michael Kockentiedt, Brett Tracy Scherrman
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Patent number: 6740183Abstract: A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate 2 after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.Type: GrantFiled: April 24, 2000Date of Patent: May 25, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shigetoshi Segawa, Hiroshi Ochi, Yasuyuki Baba, Osamu Shiraishi, Masao Konishi
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Publication number: 20040070092Abstract: Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly facing surface of each disk may be simultaneously subjected to texturing by equipment designed to texture one double-sided disk.Type: ApplicationFiled: May 9, 2003Publication date: April 15, 2004Inventors: Gerardo Buitron, Walter Crofton, Barry Okamoto, Lynnette A. Sagen, Nghia Ta
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Publication number: 20040045931Abstract: This invention relates to the printing of a substrate having a pre-printed “print pattern” with a “design layer” of ink where there is differential adhesion within and without the print pattern. The print pattern is receptive to an ink, and the design layer ink forms a durable image material with good bond to the print pattern, but the ink does not form a durable image material on the portions of the substrate outside the print pattern. The design layer ink is a UV-curable ink, and the print pattern may have a higher surface energy than the portions of the substrate outside the print pattern.Type: ApplicationFiled: January 23, 2003Publication date: March 11, 2004Inventors: George Roland Hill, Chris David Parry
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Patent number: 6699349Abstract: A method for the production of a trim part for decorative purposes, especially for the forming of interior and/or exterior trim parts for motor vehicles, having a thin ornamental layer made from an inorganic and/or crystalline material that is fragile in thin-layer form, especially natural stone, includes the following method steps: first, a flexible, at least partially transparent stabilizing material is applied to the surface of a block of inorganic and/or crystalline material and is separated together with a thin ornamental layer from the block of inorganic and/or crystalline material; then the laminate of ornamental layer and stabilizing material is placed in a casting mold for the trim part; the casting mold is closed by moving an upper mold and a lower mold relative to one another, and the ornamental layer is thereby shaped into a desired three-dimensional form determined by the casting mold; then the casting mold is filled with at least approximately transparent material and the ornamental layer is theType: GrantFiled: January 16, 2002Date of Patent: March 2, 2004Assignee: DaimlerChrysler AGInventors: Frank Spörle, Michael Walter, Anita Warmuth
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Patent number: 6679962Abstract: Extruded sections of synthetic fibers extruded from a side face of each rib in a V-ribbed belt are plastically deformed in the shape of sectors gradually broadened toward their distal ends. The extruded sections of the synthetic fibers are not heated beyond their melting point during a grinding process so as to be kept unmelted. The extruded sections of the synthetic fibers are raised from the side face of the rib so that microscopic unevenness is formed over the side face of the rib. The synthetic fiber is formed of nylon with a filament diameter of 20 &mgr;m or more.Type: GrantFiled: August 21, 2001Date of Patent: January 20, 2004Assignee: Bando Chemical Industries, Ltd.Inventors: Yoshitaka Kurose, Kazuyoshi Tani, Koji Watanabe
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Patent number: 6669800Abstract: Imageable seamed intermediate transfer belts having a large seam surface area, and marking machines that use such imageable seamed intermediate transfer belts. The seamed intermediate transfer belt having an inner surface and an outer surface having predefine surface properties for the purpose of imaging. A belt is formed from a semiconductive substrate having a first end and a second end that are mated to form a seam. An adhesive is disposed over the joint whereupon joint can be burnished or overcoated with a material that substantially imitate predefined surface properties of the belt.Type: GrantFiled: September 27, 2002Date of Patent: December 30, 2003Assignee: Xerox CorporationInventors: Constance J. Thornton, Edward L. Schlueter, Jr., Joseph A. Swift, Santokh S. Badesha, Theodore Lovallo, Xiaoying (Elizabeth) Yuan, T. Edwin Freeman
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Patent number: 6669797Abstract: A number of k sets of light transmissive members are prepared, k being an integer of 2 or greater, where each set thereof may consist of a plurality of first light transmissive plates and a plurality of second light transmissive plates, and (K+1) third light transmissive plates having a greater thickness than those of the first and the second light transmissive plate. A composite plate member is produced by alternately arranging and bonding one set of the plurality of first light transmissive plates and the plurality of second light transmissive plates to each of the spaces between the (K+1) third light transmissive plates, and alternately arranging a plurality of polarization separating films and a plurality of reflecting films on each interface in the composite plate member.Type: GrantFiled: March 26, 2002Date of Patent: December 30, 2003Assignee: Seiko Epson CorporationInventor: Masami Murata
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Publication number: 20030232583Abstract: Apparatus is provided for superpolishing the inside diameter surface of a seam of a flexible continuous photoreceptor belt.Type: ApplicationFiled: June 14, 2002Publication date: December 18, 2003Applicant: Xerox CorporationInventors: Paul F. Mastro, Daniel L. Coughlin
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Patent number: 6663739Abstract: The present invention provides a method of forming an abradable seal between rotating and non-rotating components of a machine. A sheet of abradable material is formed and then cut to a desired shape to form an abradable sheet piece. An adhesive composition is applied to at least a portion of a substrate surface and the sheet piece is contacted with the adhesive composition to adhesively bond the sheet piece to the substrate to form the abradable seal. An abradable seal is also provided having an adhesive composition deposited over at least a portion of a substrate surface with an abradable sheet piece bonded to the substrate by the adhesive composition.Type: GrantFiled: September 17, 2001Date of Patent: December 16, 2003Assignee: Elliott Turbomachinery Co., Inc.Inventors: Michael S. Walker, Phillip Dowson
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Publication number: 20030209310Abstract: Typically, the frontside of a wafer is protected by a tape during backgrinding. Electrostatic charge may accumulate on the tape during the backgrinding operation. The wafer may warp after the backgrinding operation because the thinned wafer is not sufficiently rigid to counteract the bending forces resulting from the accumulation of electrostatic charge. In order to reduce wafer warpage, ionized air may be directed onto the wafer and tape to reduce the accumulation of electrostatic charge.Type: ApplicationFiled: May 13, 2002Publication date: November 13, 2003Inventors: Anastacio C. Fuentes, Reynaldo S. Atienza, Chesalon M. Clavio
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Publication number: 20030201054Abstract: A method for making in a single step a multiple-ply panel comprising the steps of forming and sandwiching a raw mat assembly of resinated furnish between two sheets of green incised wood veneer, applying a layer of thermosetting high-moisture tolerant adhesive at interfaces between the green veneer and core mat, and applying pressure and heat to cure the consolidated panel assembly for a duration sufficient to secure good internal bond within the substrate panel.Type: ApplicationFiled: April 26, 2002Publication date: October 30, 2003Inventor: James McPherson
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Publication number: 20030173017Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.Type: ApplicationFiled: March 31, 2003Publication date: September 18, 2003Inventors: Franz Hecht, Werner Kroninger, Melanie Lutzke
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Patent number: 6616784Abstract: A fabrication method for a transmission electron microscope (TEM) slide is described. A die having device structures formed thereon is provided. A thermal adhesive fills the surface of device structures formed on the die. The thermal adhesive is covered by a glass piece. A polishing step is performed to a non-device side of the die to form a thin sheet from the die. The glass piece is removed to expose the thermal adhesive. A sacrificial layer is then formed above the exposed thermal adhesive on the thin sheet. A slicing step is performed to form a TEM slide from the thin sheet.Type: GrantFiled: April 11, 2001Date of Patent: September 9, 2003Assignee: United Microelectronics Corp.Inventors: Wen-Tung Chang, Hsing-Shuang Chou
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Publication number: 20030157285Abstract: A sleeve for a print cylinder comprising a fiber reinforced, thin-walled material and having a seamless surface ready to be covered with a surface material. The sleeve may be used in flexographic printing, either as a support for photo-polymerized printing plates or rubber layers. The sleeve has the advantages of having low manufacturing cost and providing the necessary heat resistance to withstand rubber vulcanization temperatures. The sleeve is also airtight, and remains properly positioned during printing operations.Type: ApplicationFiled: February 19, 2002Publication date: August 21, 2003Inventors: Mario Busshoff, Michael Kockentiedt, Brett Tracy Scherrman
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Patent number: 6589855Abstract: The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base 1a or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier 1 in such a manner that a rear surface of the semiconductor wafer 2 with no circuit elements formed therein is opposite to the carrier to form a wafer composite 10, and the third step of holding the carrier of the wafer composite 10 with its semiconductor wafer 2 side up and spin-coating an etchant on the rear surface of the semiconductor wafer 2 thereby to make the semiconductor wafer 2 thin.Type: GrantFiled: November 26, 2001Date of Patent: July 8, 2003Assignee: Hitachi, Ltd.Inventors: Toshio Miyamoto, Kunihiro Tsubosaki, Mitsuo Usami
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Publication number: 20030102075Abstract: Method of making an electromechanical roll such as a bias transfer roll for use in an electrostatographic apparatus such as a printing or copying apparatus comprising a conductive core having a segmented layer of compressible material positioned in a tandem relation to another thereon to form a generally cylindrical roll.Type: ApplicationFiled: November 30, 2001Publication date: June 5, 2003Applicant: Xerox CorporationInventor: Joseph A. Swift
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Patent number: 6551440Abstract: An object of the invention is to prolong the seal life of a color EL display apparatus. The initial thickness of a light-transmitting main substrate is larger than a predetermined reference thickness WC. First, a plurality of thin-film EL devices are formed on one surface of the main substrate. Then, a sealing substrate having a concave portion formed in one surface thereof is bonded onto the one surface of the main substrate at predetermined intervals. Then, a protective material for protecting the thin-film EL devices is filled in the gap between the one surface of the main substrate and the sealing substrate. Then, the main substrate is processed so as to have the reference thickness WC. Then, a color filter portion is formed on the other surface of the main substrate. Lastly, a reinforcing substrate is attached to the other surface of the main substrate with the color filter portion in between.Type: GrantFiled: July 25, 2001Date of Patent: April 22, 2003Assignee: Sharp Kabushiki KaishaInventor: Koichi Tanaka
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Publication number: 20030047269Abstract: A method of manufacturing circuit board comprising: holding a laminate with metal foil or resin-coated metal foil disposed on both surfaces or on one surface of board material or board material with metal foil circuit formed thereon between metal plates, and applying at least one of heat and pressure to the laminate. A hard coat layer formed on both surfaces or on one surface of the metal plate protects the metal plate. Accordingly, the metal plate is hardly scratched by its contact with the conveyor and the like or by handling by the operator during the production of the circuit boards. Further, since the hard coat layer surface is smoothly finished, resin or contamination sticking to the metal plate can be easily removed, thereby prolonging the life of the metal plate. As a result, it is possible to produce high-quality circuit boards at low costs.Type: ApplicationFiled: August 12, 2002Publication date: March 13, 2003Inventors: Kiyohide Tatsumi, Toshihiro Nishii, Shinji Nakamura
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Publication number: 20030037859Abstract: Imageable seamed intermediate transfer belts having a large seam surface area, and marking machines that use such imageable seamed intermediate transfer belts. The seamed intermediate transfer belt having an inner surface and an outer surface having predefine surface properties for the purpose of imaging. A belt is formed from a semiconductive substrate having a first end and a second end that are mated to form a seam. An adhesive is disposed over the joint whereupon joint can be burnished or overcoated with a material that substantially imitate predefined surface properties of the belt.Type: ApplicationFiled: September 27, 2002Publication date: February 27, 2003Applicant: Xerox CorporationInventors: Constance J. Thornton, Edward L. Schlueter, Joseph A. Swift, Santokh S. Badesha, Theodore Lovallo, Xiaoying (Elizabeth) Yuan, T. Edwin Freeman
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Publication number: 20030031866Abstract: A pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet enables efficient processing of a work piece with high precision. In particular, the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration.Type: ApplicationFiled: July 16, 2002Publication date: February 13, 2003Applicant: Lintec CorporationInventors: Hayato Noguchi, Yoshihisa Mineura, Kazuyoshi Ebe
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Publication number: 20030029544Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less.Type: ApplicationFiled: May 6, 2002Publication date: February 13, 2003Applicant: LINTEC CORPORATIONInventors: Hayato Noguchi, Yoshihisa Mineura, Kazuyosi Ebe, Katsuhiko Horigome
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Patent number: 6514367Abstract: A plastic smart card, such as a card having a radio frequency identification (RFID) proximity function, including at least one electronic element embedded therein and a physical contact card function and the hot lamination process for the manufacture of this dual function smart card and other plastic cards including a micro-chip embedded therein. The process results in a card having a preferred overall thickness in the range of 0.028 inches to 0.032 inches with a surface suitable for receiving dye sublimation printing—the variation in card thickness across the surface should not exceed 0.0005 inches. A card manufactured in accordance with the present invention also complies with all industry standards and specifications. Also, the hot lamination process of the present invention results in an aesthetically pleasing card. The invention also relates to a plastic card formed in accordance with the hot lamination process of the present invention.Type: GrantFiled: August 5, 1999Date of Patent: February 4, 2003Inventor: Keith R. Leighton
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Patent number: 6514369Abstract: The invention includes a method for producing a covered roll having a reinforcement fiber mat under layer infused with low viscosity thermoset resin and a smooth high temperature, high performance polymeric outer layer. The mat is formed of a plurality of layers, each layer having a leading edge that abuts a following edge when wrapped over the roll core, each subsequent layer being affixed to the previous layer along a seam, the seams being spaced apart angularly from one another to prevent irregularities over the surface of the resulting roll core. One or more layers of the dry reinforcement fiber mat may be formed of a two-ply construction, the first ply having fibers arranged in a random pattern, the second ply having aligned fibers oriented either parallel or perpendicular to the roll core central axis. The invention also includes an improved mold tape assembly for use in applying a polymeric cover over a roll core and an inventive apparatus for fabricating the mold tape assembly.Type: GrantFiled: November 28, 2000Date of Patent: February 4, 2003Assignee: Advanced Materials CorporationInventor: Yang T. Shieh
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Patent number: 6493159Abstract: An optical device has a base body with a surface, a first optically effective, multilayer system in the base body, terminating at an intersection, and a second optically effective, multilayer system. The second system has a layer along the base body surface, spanning the intersection. The surface of the base body, including the intersection, are jointly treated by at least one of: milling, grinding, polishing, and lapping. A further base body with a further surface and a third optically effective system terminating at a further intersection area at the further surface also has a further layer between the second optically effective multilayer system and the further surface.Type: GrantFiled: November 26, 1996Date of Patent: December 10, 2002Assignee: Unaxis Balzers AktiengesellschaftInventor: Johannes Edlinger
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Patent number: 6491852Abstract: A method of making terrazzo floors with design inlays. The method utilizes pre-molded inserts as inlays in the finished floor, and generally includes four steps. First, inserts are pre-molded, which has design elements in terms of their color, nature of inclusions (chips, glass fragments, etc. and their colors), shape and/or a pattern of grooves in their upper surfaces. Second, the pre-molded inserts are placed on and affixed to the sub-flooring in a predetermined arrangement. Third, epoxy flooring mixture is poured to a height that fills the grooves in the inserts' upper surfaces and preferably cover the inserts. Fourth, the floor, after cured and hardened, is ground and polished to expose the upper surfaces of the inserts, which now become seamlessly integrated inlays within the overall finished floor.Type: GrantFiled: April 20, 2000Date of Patent: December 10, 2002Assignee: Durite Concepts Inc.Inventor: Allen Sedaka
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Patent number: 6488798Abstract: Imageable seamed intermediate transfer belts having a large seam surface area, and marking machines that use such imageable seamed intermediate transfer belts. The seamed intermediate transfer belt having an inner surface and an outer surface having predefine surface properties for the purpose of imaging. A belt is formed from a semiconductive substrate having a first end and a second end that are mated to form a seam. An adhesive is disposed over the joint whereupon joint can be burnished or overcoated with a material that substantially imitate predefined surface properties of the belt.Type: GrantFiled: November 28, 2000Date of Patent: December 3, 2002Assignee: Xerox CorporationInventors: Constance J. Thornton, Edward L. Schlueter, Jr., Joseph A. Swift, Santokh S. Badesha, Theodore Lovallo, Xiaoying (Elizabeth) Yuan, T. Edwin Freeman