Abstract: An optical system includes an enlarging optical system that enlarges a section of an incident light, a mask that passes some of a light passing through the enlarging optical system, and a reduction optical system that reduces a section of a light passing through the mask.

Abstract: The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer.

Abstract: A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.

Abstract: A liquid crystal display device includes an array substrate, an opposite substrate and a liquid crystal display layer. The array substrate includes a pixel electrode and a lower reactive mesogen layer. The pixel electrode includes a plurality of slit portions disposed on a plurality of domains in different directions. The lower reactive mesogen layer is disposed on the pixel electrode to induce an inclined direction of liquid crystal molecules. The opposite substrate includes an upper substrate. An upper reactive mesogen layer is disposed on a common electrode of the opposite substrate. The liquid crystal layer includes liquid crystal molecules arranged to have a pretilt angle between a surface of the lower reactive mesogen layer and a surface of the upper reactive mesogen layer.

Abstract: Method for producing a cladding element. The method includes applying a resin to a visible surface and to a contact surface of a wood material base board, applying at least one non-resin impregnated paper ply to the visible surface and at least one non-resin impregnated paper ply to the contact surface of the wood material base board, and pressing the at least one non-resin impregnated paper ply onto the resin applied visible surface and the at least one non-resin impregnated paper ply onto the resin applied contact surface. In this manner, the at least one paper ply on the visible surface and at least one paper ply on the contact surface are fully impregnated.

Abstract: A component comprising a stacked interleaved film structure that includes a plurality of layers inert to light. Alternating layers are either doped with a reverse saturable absorber (RSA) material or the RSA material is located between the adjacent inert layers. In some embodiments, the inert alternating layers have different refractive indices. A data storage device and methods of manufacture are also disclosed.

Abstract: Disclosed herein are laminated structures comprising a metal sheet including a first face and a second face with a thickness of from about 0.5 mm to about 2 mm extending between the first face and the second face. The laminated structure further includes a first chemically strengthened or non-chemically strengthened glass sheet including a thickness of less than or equal to about 2 mm and a first interlayer attaching the first glass sheet to the first face of the metal sheet. Also disclosed herein are methods of manufacturing a laminated structure comprising the steps of laminating a metal sheet and a first glass sheet together with an interlayer.

Abstract: An imaging optic comprising a first combination element comprised of at least two individual lens elements, aligned with each other along an optical axis and adhered to each other, a second combination element comprised of at least one individual lens element and an aperture disposed between the first and second combination elements, the surfaces of the imaging optic having less than about 3 minutes tilt relative to the optical axis and less than about 0.005 mm de-center relative to the optical axis. A method of making the imaging optic and an endoscope comprising the imaging optic.

Abstract: A method of preparing a package comprises joining a first and a second piece of material. The first piece of material comprises a multi-layered material that a mechanically stabilizing layer, an electrically conducting layer, and a weldable layer. The mechanically stabilizing layer comprises a carton material. The first piece of material is arranged so that the weldable layer can be melted by supplying energy to the electrically conducting layer. The method further pressing the weldable layer against the second piece of material, and supplying energy to the electrically conducting layer. The energy supply per time unit, to the electrically conducting layer is varied from a maximum value to a minimum value during the period of time in which energy is supplied to the electrically conducting layer. The maximum value is supplied for the initial at least 40% of the period.

Abstract: A method of obtaining a high-strength bonded body between composite materials, each containing a thermoplastic resin and carbon fibers, with a low current in a short period of time, wherein the bonded body is rarely susceptible to deformation such as warp. The method of manufacturing a bonded body, comprises the steps of: (i) preparing a plurality of composite materials, each containing a thermoplastic resin and discontinuous carbon fibers which are randomly oriented; (ii) overlapping the composite materials each other; (iii) sandwiching at least a part of the overlapped portion between a pair of electrodes; and (iv) applying electricity between the electrodes to weld together the thermoplastic resins with Joule heat.

Abstract: Discrete or continuous products are disclosed including formation of laminates containing an additive matter. Such additive matters comprise gels, superabsorbent polymers, particulate additives and the like. Pulp-free absorbent cores for use in disposable products such as diapers and sanitary napkins can be formed by the methods and apparatus of the present invention. Additive matter is carried between two layers in void spaces in a scrim layer to form a laminate.

Abstract: A composite structure fabricated by thermoplastic welding, and a method for producing such structures. First and second composite parts are provided, having first and second surfaces, respectively, that define an interface where the parts are to be joined. The parts include a thermoplastic matrix. An insert is provided, which includes a film portion, which may include the same thermoplastic matrix. The insert is provided with an electric resistance heating element. The first and second parts are urged together using low fusion pressure while the insert is heated using the electric resistance heating element. After a selected period of time, the electrical supply to the resistance heating element is turned off. A high fusion pressure is then applied to urge the parts together. The weldment joint is allowed to cool. After cooling, excess material may be removed, to form a composite structure.

Abstract: A method for fabricating a liquid crystal display device having a TFT substrate in which an alignment film is formed over a pixel including a pixel electrode and a TFT, an opposing substrate which faces the TFT substrate, and liquid crystals sandwiched between the TFT substrate and the opposing substrate, the alignment film on the TFT substrate including a first and a second alignment film. The method includes depositing a mixture liquid of polyamide acid ester, 80 percent or more of which is polyamide acid ester including cyclobutane, and polyamide acid not including cyclobutane onto the TFT substrate and the opposing substrate, and after drying and firing the TFT substrate and the opposing substrate to harden the alignment film, irradiating the alignment film with ultraviolet light for photo-alignment of the alignment film and, thereafter, heating the TFT substrate and the opposing substrate, thereby forming the alignment film.

Abstract: A diffuser-integrated prism sheet is provided, in which diffuser layers are provided on the upper and lower surfaces of the prism sheet and prism-shaped protrusions are formed in the prism sheet. The prism sheet for backlight units includes a lower diffuser layer having a light diffusion structure, a lower layer formed on the lower diffuser layer, a first intermediate layer formed on the lower layer and having prism-shaped protrusions formed parallel to each other, a second intermediate layer formed on the first intermediate layer, an upper layer formed on the second intermediate layer, and an upper diffuser layer formed on the upper layer and having a light diffusion structure, wherein an air layer is formed between the lower surface of the second intermediate layer and the valleys of the prism-shaped protrusions of the first intermediate layer. Also, a method of manufacturing the diffuser-integrated prism sheet is provided.

Abstract: A plurality of thermoplastic articles are superimposed against a support, an infrared transparent solid is superimposed to form a superimposed body and infrared is irradiated to the superimposed body from the side of the infrared transparent solid. For the irradiation source, an Er: YAG laser or fiber laser is used. The interface temperature of the thermoplastic article becomes relatively lower and a high temperature region can be developed within the superimposed body due to the infiltration of laser energy. As a result, degradation of the surface configuration due to thermal damages in the infrared irradiation side surface layer of the thermoplastic articles can be suppressed.

Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.

Abstract: A method includes receiving a carrier with a release layer formed thereon. A first adhesive layer is formed on a wafer. A second adhesive layer is formed over the first adhesive layer or over the release layer. The carrier and the wafer are bonded with the release layer, the first adhesive layer, and the second adhesive layer in between the carrier and the wafer.

Abstract: A method for attaching an adhesive label to an item. The label includes a substrate having face and rear sides and an adhesive layer applied on the rear side. The adhesive layer is non-tacky but activatable by external energy from an energy source to become tacky. The adhesive layer includes a deactivating agent that is activatable by the external energy exerted on the adhesive layer from an energy source so that the deactivating agent, when activated, begins to transform the adhesive layer to become non-tacky. The deactivating agent is activated with the energy source to start the transformation of the adhesive layer. A delay is arranged during which the thermal effect of external energy used for activation reduces in the label. The label is attached to the item so that the adhesive surface comes in contact with the surface of the item. The use of an adhesive in labelling.

Abstract: Disclosed are systems and methods for bonding wafers by use of microwave energy. Various components that facilitate relatively quick and efficient bonding provided by microwave energy are disclosed. In certain embodiments, devices and methods for applying desirable compression to the wafers can be implemented. In certain embodiments, devices and methods for providing a controlled gas environment such as vacuum can be implemented. In certain embodiments, devices and methods for maintaining the integrity of microwave mode of operation during the bonding process can be implemented. In certain embodiments, devices and methods for increasing throughput of the bonding process can be implemented.

Abstract: A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation.

Abstract: A latent solvent-based microfluidic apparatus and method involves laminate bonding of two non-elastomeric, cyclic olefin copolymer (COC) components having opposing surfaces to be bonded, wherein in a contacted state there is at least one interstitial space between the contacted surfaces, applying an organic latent solvent to at least one of the opposing surfaces, wherein the latent solvent is in an inactive state, contacting the two opposing surfaces together, actively removing the latent solvent from the at least one interstitial space; and adjusting a latent solvency parameter to activate the latent solvent, wherein the opposing contacted surfaces become bonded.

Abstract: A method of forming a thermal conductive pillar in a metal core printed circuit board comprises providing a substrate, depositing a dielectric layer on top surface of the substrate, depositing a conductive layer on top surface of the dielectric layer, forming a space in the metal core printed circuit board by selectively removing at least part of dielectric material from the dielectric layer, and depositing thermal conductive material in the space to form a thermal conductive pillar, wherein the thermal conductive pillar conducts heat generated by a device that is assembled with the metal core printed circuit board.

Abstract: A low-temperature plasma treatment is applied to a surface of an aramid paper so as to allow the surface to have a compositional atomic ratio X (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging from 110% to 220% of a theoretical atomic ratio. The treatment is performed at an intensity ranging from 120 to 1500 W·min/m2 with a low-temperature plasma treatment apparatus of internal electrode system. The aramid paper is superposed with a nonhydrolyzable resin film and the resulting article is pressurized to give an aramid-resin film laminate. The laminate is inexpensive, has both superior electrical properties and high mechanical strength, excels in elasticity, and is useful as an insulation material.

Abstract: The specification and drawings present a new apparatus and method for joining a window assembly (e.g., a glass window assembly) in electronic devices using optical/laser welding. A window assembly, transparent to an optical beam, may comprise an optical window such as glass window with a laminated layer (e.g., made of plastic) glued to a backside of the optical window and a back print ink layer between portions of the optical window and of the laminated layer. This window assembly may be attached to a frame such as a plastic frame, non-transparent to the optical beam, having at least one boundary with the laminated plastic layer of the window assembly using a welding joint at the at least one boundary made by the optical beam propagating transparently (with negligible optical absorption) through the window assembly and absorbed by the plastic frame.

Abstract: In various embodiments, a method for producing a lighting apparatus is provided. The method may include providing a light strip with a strip-shaped carrier and a plurality of semiconductor light sources arranged in a row on the carrier; attaching at least one preshaped wall to the carrier, which wall, when attached to the carrier, consists of a curable but not yet completely cured material; filling regions above the carrier next to the at least one wall with at least one curable filler; and curing at least the filler.

Abstract: The invention relates to a method for producing self supporting container parts, such as dishes or covers, for containers for foodstuffs to be treated in a microwave oven, said containers each comprising at least one compartment for receiving the foodstuffs, along at least part of the circumferential surface of which compartment a microwave-radiation influencing material layer is provided in the wall of at least one associated container part, comprising the steps of providing a multilayer foil comprising said microwave radiation-influencing material layer and at least one material layer that does not influence microwave radiation, which is bonded thereto on at least one side of the microwave radiation-influencing material layer, bonding one side of the multilayer foil to a remaining portion of the container part in question, in such a manner that the material layer of the multilayer foil that does not influence microwave radiation is present on a free surface of the container part.

Abstract: Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.

Abstract: There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.

Abstract: A non-adherent cell support for use as a substrate in fluidic chambers used for cell culturing and assays. The non-adherent cell support allows for the formation of sphere cultures from single cells, which can better mimic primary tumor-like behavior in the study of cancer stem cells. The non-adherent cell support can allow for adhesive culturing and may include a hydrophobic substrate having a lower body and a raised support structure extending upwardly from an upper surface of the body. The support structure comprises one or more vertically extending support members that extend from a proximal portion at the upper surface of the body to a distal end spaced from the upper surface of the body. The support structure may be formed from a biocompatible material such as poly-2-hydroxyethyl methacrylate, polydimethylsiloxane, polymethyl methacrylate, polystyrene, or a polyethylene glycol diacrylate-based hydrogel.

Abstract: The present invention relates to electromechanical converters at least comprising a polymer layer composite with voids (5) formed therein, wherein the polymer layer composite at least comprises a polymer layer base element (1) comprising a carrier layer (1a) having a softening temperature TgA and en electret layer (1b), extensively bonded thereto, having a softening temperature TgE, wherein TgA>TgE, and a second polymer layer element (2), wherein the polymer layer base element (1) is at least partially bonded with its electret layer (1b) to the second polymer layer element (2) to form voids (5). The invention relates further to a process for the production of an electromechanical, for example piezoelectric, converter and to the use thereof.

Abstract: The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10?3 mbar.

Abstract: A climate control system according to implementations of the invention includes one or more vacuum chambers. The vacuum chamber is encompassed by a chamber wall that is substantially impervious to gases. The vacuum chamber houses one of several combinations. In one combination, the near vacuum has yet to be created, and the vacuum chamber houses substantially-pure carbon dioxide and un-reacted carbon dioxide reducing agent. In a second combination, the near vacuum has been created, and the vacuum chamber houses reaction products of a chemical reaction between substantially-pure carbon dioxide and carbon dioxide reducing agent in a near vacuum. Various methods are used for creating vacuum chambers and for generating near vacuum conditions within such chambers. Various systems and structures can utilize such vacuum chambers and panels containing such chambers.

Abstract: There is described a heating induction sealing device for forming a seal in a packaging material comprising an electrically conductive element and advancing along a direction; sealing device comprises one first inductive element and one second inductive element; first inductive element comprises a first portion facing second inductive element and defining with second inductive element a passage for packaging material; and a second portion; sealing device is selectively arrangeable in a first configuration, in which alternate currents flow within first and second inductive element; first portion and second inductive element are configured to generate a first magnetic flux transversally to direction, when sealing device is arranged in first configuration; second portion is configured to generate, in use, a second magnetic flux with a main component parallel to direction, when sealing device is arranged in first configuration.

Abstract: A liquid crystal display device includes a liquid crystal display element including a first alignment film and a second alignment film and a liquid crystal layer that is provided between the first alignment film and the second alignment film, wherein the first alignment film includes a compound in which a polymer compound that includes a cross-linked functional group or a polymerized functional group as a side chain is cross-linked or polymerized, the second alignment film includes the same compound as the compound that configures the first alignment film, and the formation and processing of the second alignment film is different from the formation and processing of the first alignment film and when a pretilt angle of the liquid crystal molecules which is conferred by the first alignment film is ?1 and a pretilt angle of the liquid crystal molecules which is conferred by the second alignment film is ?2, ?1>?2.

Abstract: A method for electromagnetic welding of molded parts wherein a mold and at least two molded parts for coupling are placed in the mold, wherein at least a contact surface between the molded parts comprises a thermally activiated coupling means and an induction-senstive component. The coupling means is activated by heating the induction-senstive component by means of an inductor. The inductor comprises an electrical conductor which, under alternating voltage, generates an electromagnetic field which is substantially cylindrical in at least a direction of welding. The molded parts are pressed together in the configuration defined by the mold, wherein the molded parts are coupled by the thermally activated coupling means. Also disclosed is an assembly of molded parts, an inductor, an assembly of the inductor with an alternating current generator, and a device for electromagnetic welding.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the ceramic body includes a capacitance forming part contributing to capacitance formation and a non-capacitance forming part provided on at least one of upper and lower surfaces of the capacitance forming part, and when the capacitance forming part is divided into three areas in a thickness direction of the ceramic body, a difference in continuity between internal electrodes in a middle area of the three areas and internal electrodes in upper and lower areas thereof is 1% to 5%.

Abstract: Lab-on-a-chip microfluidic devices having micro-channels able to withstand an internal channel pressure of more than 4,000 psi are described. The micro-channels have rounded cross-sections that prevent turbulent flow within a fluid conveyed within the channel. The channel may have serpentine-shaped length extending between a channel inlet and a channel outlet, the channel thereby being of sufficient length to observe both the stationary and moving phases of the fluid in a chip having a sufficiently small footprint that it is suitable for incorporation into a miniaturized spectrometer. Methods of fabricating lab-on-a-chip microfluidic devices are described by etching recesses in chip substrates such that a first substrate recess mirrors a second substrate recess in an opposed orientation, aligning the substrates such the recesses cooperatively define a micro-channel having a rounded cross-section, and bonding the substrates to define a smooth-walled micro-channel.

Abstract: A method of disposing catalyst in a reformer is disclosed. The method of disposing catalyst comprises the steps of providing a silicon-based substrate with a predetermined pattern thereon; providing a cover with an inlet hole and an outlet hole therein; bonding the silicon-based substrate with the cover; and disposing a catalyst solution on a wall of the predetermined pattern by centrifuging in a predetermined speed for a predetermined time so as to obtain a catalyst layer with a gradient-thickness on the wall.

Abstract: Disclosed herein is a method for making transparent ceramic spinel windows, domes and other complex shapes via edge bonding.

Abstract: The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.

Abstract: The present invention provides a method for adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: The invention relates to a Co-extruded, multilayer and biaxially-oriented polypropylene film, which comprises of at least one first sealable covering layer and at least one vacuolate layer, having a thickness of at least 5 ?m, is further treated by laminating, pasting, printing, varnishing and/or coating; the result registered as follows: after drying or hardening during further treatments using electron-beam irradiation, the vacuolate layer has a thickness of at least 5 ?m. Hot tack is not damaged by electron-beam processing.

Abstract: A method of spacing a plurality of electrical conductors for carrying electrical current in an electrical machine may include positioning between the electrical conductors an uncured spacer body. The uncured spacer body may include a curable material, and an activatable heat generating material mixed with the curable material. The method may further include activating the activatable heat generating material to heat the curable material to form a cured spacer to thereby space the electrical conductors in the electrical machine.

Abstract: Process for manufacturing a plastic fuel tank provided with at least one accessory (14) connected to the internal space of the tank via at least one orifice (12) in the wall (10) of the tank, the accessory including a projecting element (24) extending to the outside of the tank, the processing comprising the steps consisting in providing a film (22) that includes a peripheral region (28) and a border region (30) around an opening in the film, in placing the film on the wall of the tank and on the outer surface of the accessory in such a way that the projecting element passes through the film via the opening, in welding the film over its entire peripheral region to the wall of the tank, and in welding the film, over its entire border region, to the outer surface of the accessory.

Abstract: A method for adhesive bond joining of two surfaces, where a metallic or non-metallic solder is applied to at least one of the two surfaces, where the solder has a temperature-dependent optical property. The solder is radiated with electromagnetic radiation with a predetermined spectrum, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces, such that the temperature-dependent optical property is modified reversibly or irreversibly at the predetermined temperature of the solder. The solder is cooled to below its melting temperature, such that the solder solidifies and connects the surfaces in an adhesive bond.

Abstract: A method of attaching a body of superhard material to a substrate comprises placing a layer of a first brazing material on or over at least a portion of a surface of the substrate; the first brazing material having an associated melting temperature. A second brazing material is located between the first brazing material and a face of a pre-formed body of superhard material to form an assembly; the second brazing material having an associated melting temperature lower than the melting temperature of the first brazing material. The assembly is heated to a temperature sufficient to melt the second brazing material and bond the second brazing material to the superhard material and to the first brazing material.

Abstract: To provide a process for producing an airtight member, which can improve bonding property of a sealing layer to a highly thermally conductive substrate and reliability, in airtight sealing of a space between a glass substrate and a highly thermally conductive substrate by local heating by electromagnetic waves. A glass substrate having a sealing material layer having electromagnetic wave absorbing property provided on a sealing region, and a highly thermally conductive substrate having a glass layer formed on a sealing region, are laminated while the sealing material layer and the glass layer are brought into contact with each other. The sealing material layer is irradiated with electromagnetic waves through the glass substrate to heat and melt the sealing material layer thereby to bond it to the glass layer, so as to form a sealing layer which airtightly seals the space between the glass substrate and the thermally conductive substrate.

Abstract: A method for bonding composites together that is fast and effective, and can be applied to any structure regardless of its size and shape, and its related product are disclosed. The method comprises first subjecting at least a part of a composite work piece to a low-temperature, atmospheric pressure plasma, wherein the reactive gas from the plasma is projected out of the device and onto the surface of the composite work piece, then applying an adhesive to the surface of the treated composite work piece, and joining the composite work piece together with a second work piece. The adhesive may be cured such that it forms a strong, permanent bond. The atmospheric plasma delivery device may be translated over the composite surface by hand or with a robot. The plasma device may be self-contained and portable, and can be moved to a location that is convenient for treating the composites.

Abstract: An airbag is made by producing a laminated material including a backing layer, a first polymer layer facing the backing layer, and a second polymer layer facing away from the backing layer. The first polymer layer has a glass transition temperature of 10° C. or less. The second polymer layer has a storage modulus at least 1 MPa at 90° C.