Abstract: A method of coating a field joint, pipe sections for forming a coated field joint, and a coated field joint formed thereby. First and second angular cut backs are provided in the parent coating of each pipe section. The first angular cut back is at an angle of about 30°+?0.5° relative to the longitudinal axis of the field joint, and the second angular cut back is positioned further from the field joint than the first angular cut back. The first and second angular cut backs result in the parent coating having a stepped profile, a step in the stepped profile between the first and second angular cut backs, the step is substantially parallel to the longitudinal axis of the field joint and is often substantially free of indentations. The field joint coating may be injection moulded to have an upstand that is less than or equal to about 5 mm.

Abstract: Provided are an adhesive composition for a polarizing plate, a polarizing plate, and an optical display device, the adhesive composition comprising an epoxy-based compound, a (meth)acrylate-based compound, a photo-acid generator, and an optical radical initiator, the (meth)acrylate-based compound comprising a mixture of a bifunctional (meth)acrylate-based compound and a monofunctional (meth)acrylate-based compound having a hydrophobic functional group, wherein the adhesive strength measured after the adhesive composition for a polarizing plate is separately applied to a PET film, a TAC film, and a COP film, to which a polarizer is then bound, followed by photo-curing, is about 200 gf/inch or more.

Abstract: An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): (wherein R1 and R2 are each independently H, CH3, OCH3, OC2H5, NO2, halogen, or NH—CO NR3R4; and R3 and R4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R3 and R4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

Abstract: A tooling assembly for manufacturing a porous composite structure. The tooling assembly includes a first tooling member and a second tooling member. The first tooling member includes a first body that defines a first internal volume and a first inlet. The first inlet is fluidly coupled with the first internal volume. The first tooling member also includes a first tooling surface that defines a plurality of first perforations that are fluidly coupled with the first internal volume. The second tooling member includes a second body that defines a second internal volume and a second inlet. The second inlet is fluidly coupled with the second internal volume. The second tooling member also includes a second tooling surface that defines a plurality of second perforations that are fluidly coupled with the second internal volume.

Abstract: A structural adhesive composition having high elongation and impact resistance contains an epoxy resin, a urethane resin formed by using a polyol comprising a long chain as a functional group, and an epoxy curing agent.

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

Abstract: A pipeline having a series of interconnected pipe sections forming Field Joints, each pipe section having a coating with a thermal insulation layer which extends over a substantial portion of a length of the pipe section, and an anti-corrosion layer situated underneath the thermal insulation layer. The pipeline has a Field Joint Coating (FJC) at connection regions where ends of the adjacent pipe sections are interconnected. Each FJC has an anti-corrosion coating layer, an intermediate coating layer of a thermoplastic material which covers the anti-corrosion coating layer, and a FJC thermal insulation layer which covers the intermediate coating layer.

Abstract: A joined material and a method of manufacturing the joined material are provided which enable a metal layer and a carbon material layer to be easily joined to each other while making the thickness of the metal layer larger and which can inhibit failure. A joined material includes a CFC layer (3) and a tungsten layer (4) that are joined to each other. A sintered tungsten carbide layer (5), a mixed layer (6) of SiC and WC, and SiC and WC (7) that have been sintered while intruding into the CFC layer (3), are formed between the CFC layer (3) and the tungsten layer (4), and these layers (3, 4, 5, 6, and 7) are joined to each other by sintering.

Abstract: An adhesive formulation comprising i) an adduct of an epoxy resin and an elastomer, ii) a phenoxy resin; iii) a core/shell polymer; iv) a curing agent which provides a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.

Abstract: The present invention relates to a heat-resistant resin composition including a first copolymer including a conjugated diene-based polymer, units derived from an aromatic vinyl-based monomer, and units derived from a vinyl cyan-based monomer; a second copolymer including units derived from an aromatic vinyl-based monomer and units derived from a vinyl cyan-based monomer and having a glass transition temperature of 115° C. or more; and a third copolymer including units derived from an aromatic vinyl-based monomer and units derived from a vinyl cyan-based monomer, wherein the second copolymer has a linear shape, and the third copolymer has a branched shape and a branched degree of 2 to 8.

Abstract: Disclosed is a temporary protective film for semiconductor sealing molding 10 including a support film 1; and an adhesive layer 2 provided on the support film 1 and containing an acrylic rubber. A solid shear modulus at 200° C. of the temporary protective film for semiconductor sealing molding 10 may be 5.0 MPa or higher.

Abstract: A thickness-detecting bond primer is disclosed. In various embodiments, the thickness-detecting bond primer includes a solvent configured for application to a metallic surface; and a dye dispersed within the solvent, the dye having a concentration within a range of about 0.001 weight percent to about 5.0 weight percent of the thickness-detecting bond primer.

Abstract: Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix.

Abstract: A coil and an electrical strip or electrical sheet with at least one heat-hardening hotmelt varnish, namely a baked enamel layer, provided on its flat sides, which has an epoxy resin base, at least one hardener, and at least one filler, are disclosed. In order to achieve a high storage stability and long-term temperature stability, the proposal is made for the filler of the baked enamel layer to have a metal carbonate, sulfate, sulfide, silicate, or phosphate or any mix of a plurality of these.

Abstract: A resin component includes a natural wooden veneer, a light-transmitting ink printed layer, an adhesive layer, and a light-transmitting reinforcement layer. The veneer includes a sparseness portion and a denseness portion of conduits, is 50% or more and 80% or less in light transmittance, and is 0.1 mm or more and 0.6 mm or less in plate thickness. The light-transmitting ink printed layer is formed on a first surface of the veneer, is 2 ?m or more and 20 ?m or less in thickness, and contains a pigment or a dye. The adhesive layer is formed on a second surface which is an opposite side of the first surface of the veneer. The reinforcement layer is formed on a surface, which is an opposite side of the veneer, of the adhesive layer.

Abstract: A manufacturing process, which includes: (i) preparing a preform; (ii) laying the preform within a mold; (iii) heating the mold to a predetermined temperature; and (iv) injecting a modified resin system, wherein the modified resin system is formulated to have a viscosity below a threshold viscosity at a specific temperature and a high level of toughness. In one embodiment, the modified resin system contains a combination of epoxies, a curing agent, core-shell rubber particles, a thermoplastic material in an amount of less than 7% by weight, wherein in a cured condition, the thermoplastic material is separated into aggregate domains from the base resin, each aggregate domain having an island-like morphology.

Abstract: Thermosetting epoxy resin compositions on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface tack, and, moreover, in the fully cured state are of high impact strength and at the same time exhibits high adhesion, particularly to metallic substrates. These compositions are ideally suited to the production of self-adhesive reinforcing elements.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating light-stabilizers.

Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, at least one curing agent, a silane compound, a low amount of a carbon-based material in particulate form, and optional additives. The carbon-based material is selected from graphene, graphene oxide (GO), graphite, carbon with various structures in micron-scale or nanoscale size, and combination thereof.

Abstract: A computer stylus may be provided that includes an elongated body with a tip and an opposing end coupled together by a shaft that includes a metal tube. The stylus may include a substrate at the end of the elongated body and conductive traces on the substrate. The conductive traces on the substrate may form an antenna ground, an antenna resonating element arm, and a return path. The antenna resonating element arm may be a helical structure that wraps around the substrate. The antenna ground formed from the conductive traces may be coupled to the metal tube using an intermediate metal layer. A cap structure formed at the opposing end and over the substrate may be interposed between the conductive traces and adhesive to protect the conductive traces from the adhesive. A metal portion of the cap structure may serve as an antenna signal reflector.

Abstract: The present invention relates to thermoplastic polyurethanes obtainable or obtained by reaction of at least one aliphatic polyisocyanate; at least one chain extender; and at least one polyol composition, where the polyol composition comprises a polyol selected from the group consisting of polyetherols and at least one bisphenol derivative selected from the group consisting of bisphenol A derivatives with a molecular weight Mw>315 g/mol and bisphenol S derivatives with a molecular weight Mw>315 g/mol, where at least one of the OH groups of the bisphenol derivative is alkoxylated, and to processes for producing such thermoplastic polyurethanes and to the use of a thermoplastic polyurethane according to the invention for producing extrusion products, films and moldings.

Abstract: A gasket (20) adapted for a microwave oven or a cooking oven with microwave heating function, that includes at least one elastic material and includes a front portion (30) and a rear portion (32), wherein the front portion (30) of the gasket (20) is an electrically non-conductive material, whereas the rear portion (32) of the gasket (20) is an electrically conductive material.

Abstract: A prepreg comprising a fibrous material contacting a polymerizable resin, at least 50 wt % of the polymerizable resin comprising at least one polymerizable monomer having at least two carbon-carbon unsaturated functional groups, the monomer being polymerizable by reaction of the unsaturated functional groups to form a cured resin, wherein the resin has a heat of polymerization of less than 230 KJ/kg to provide a maximum increase in temperature of the prepreg of 60° C. during polymerization under adiabatic conditions.

Abstract: A curable composition includes (A) a first component having from 5.0 wt % to 39.0 wt %, based on the total weight of the first component, of a toughening agent component including a Bisphenol F based epoxy resin and an urethane acrylate component, a hardener component having at least one amine based hardener and is present in a ratio of 0.8 to 1.2, based on a number of equivalents of amino hydrogen groups in the hardener component to a number of equivalents of reactive groups in the first component capable of forming a covalent link with the amine reactive groups in the hardener, and an epoxy base component that accounts for a remainder of the total weight of the first component and that has at least one epoxy resin separately provided from the Bisphenol F based epoxy resin. The Bisphenol F based epoxy resin is present in an amount from 2.5 wt % to 50.0 wt % and the urethane acrylate component is present in an amount from 50.0 wt % to 97.5 wt %, based on the total weight of the toughening agent component.

Abstract: In some aspects, the disclosure relates to thermoset polymeric compositions consisting of functional bio-based epoxies and/or their derivatives (e.g. epoxidized vegetable oil(s)), along with carboxyl functional acrylics and/or polyesters. When cured, example compositions yield high performance products suitable for composite, coating, adhesive, sealant, and/or elastomer applications. When used in stone composite formulations with suitable fillers like quartz and titanium dioxide, example products have high hardness, very low water absorption, and high mechanical strength along with stain, chemical, and heat resistance. When used in coating formulations, example cured films have excellent adhesion, high gloss, clarity, toughness, low water absorption, solvent and chemical resistance, flexibility, and impact resistance without compromising hardness. Coating formulation properties may also include exterior durability.

Abstract: Mounting arrangements for pool skimmers, methods for mounting pool skimmers, and pool skimmer installation kits are disclosed which overcome the limitations of the prior art. Aspects of the invention include a pool skimmer mounting arrangement for mounting a skimmer assembly on an insulated wall of a pool. The pool wall may have an internal side panel, an external side panel, and internal insulation. The mounting arrangements include a penetration in the internal side panel of the pool wall; an adapter plate having an internal cavity and perforations mounted over the penetration in internal side panel; a penetration in the external side panel adapted to receive the inlet of the skimmer assembly; and fasteners adapted to engage the perforations in the adapter plate and the skimmer assembly to mount the skimmer assembly to the insulated pool wall. Methods of practicing the invention and installation kits are also provided.

Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The thermosetting resin composition includes a diglycidyl isocyanuryl modified polysiloxane represented by the formula (1), and a curing agent for an epoxy resin.

Abstract: An anti-fog coating composition is described comprising an aqueous polymeric dispersion; a crosslinker, and a surfactant. The dried and cured coating composition does not exhibit fogging within 8 seconds after being soaked in 25° C. water for 1 hour. In favored embodiments, the dried and cured coating composition does not exhibit fogging within 60 seconds after being soaked in 50° C. water for 24 hours. Also described are articles comprising the dried and cured coating composition disposed on a substrate as well as a method a providing an anti-fog coating on a substrate.

Abstract: The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G?Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Abstract: Disclosed herein are methods and formulations for the microencapsulation of aminosiloxanes, for example for use as an additive in protective material formulations such as those used in the protection and/or joining of metal substrates. The additives may be used in conjunction with a second reactant that may or may not be similarly microencapsulated for self-healing (and associated corrosion resistance) or delayed cure applications, or they may be used alone or in conjunction with other corrosion inhibitors for protective formulations with improved corrosion resistance on appropriate substrates.

Abstract: The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.

Abstract: A method of manufacturing a Field Joint Coating (FJC) for a pipeline, the method comprising: providing a pipe section to be joined to a similar pipe section or free end of a pipeline, wherein each pipe section is provided with a coating comprising a thermal insulation layer over a length of the pipe section having a protruding section, wherein the end zones of each pipe section are free of thermal insulation, thereby allowing access to the ends of the pipe section and the pipeline to connect the pipe section with the free end of the pipeline, applying an anti-corrosion coating layer on a connection region of the joined ends of the pipe section and the pipeline, heating the protruding section and applying an intermediate coating layer of a thermoplastic material on the anti-corrosion coating layer and the protruding section, applying a thermal insulation layer on the intermediate coating layer.

Abstract: Disclosed herein are compositions comprising a first copolymer derived from monomers comprising a (meth)acrylate monomer, an acid monomer, and optionally at least one additional monomer selected from the group consisting of styrene, ?-methyl-styrene, vinyl toluene, and mixtures thereof, wherein the first copolymer is derived in the absence of a molecular weight regulator and wherein the first copolymer has a weight average molecular weight of less than 10,000 Daltons, and methods of making the same. The compositions and methods disclosed can be used, for instance, in pressure-sensitive adhesive applications.

Abstract: A method of repairing or reinforcing a target structure includes preparing an adhesive sheet having at least an adhesive layer and a repairing or reinforcing material, irradiating the adhesive sheet with ionizing radiation, and attaching the adhesive layer to the target structure after the irradiation with the ionizing radiation.

Abstract: Provided is a capacitive touch panel which has enhanced sensitivity and is usable in an image display panel, etc. in this capacitive touch panel, a window, a first transparent film having a first transparent conductive electrode pattern formed on one surface thereof, and a second transparent film having a second transparent conductive electrode pattern which is formed on one surface thereof and disposed with respect to the first transparent film in such a manner as to allow a capacitance to be formed therebetween, are stacked in turn. The capacitive touch panel comprises a first transparent inter-layer resin provided between the window and the first transparent film, and a second transparent inter-layer resin provided between the first transparent film and the second transparent film, wherein the first transparent inter-layer resin has a dielectric constant greater than that of the second transparent inter-layer resin.

Abstract: A communications network is available to implement at least M2M communications between a transmitting unit and a receiving unit. The units can communicate via the Internet as a primary network. They can also communicate via a cellular-type network. At least some of the units include respective subscriber information to provide access and services via the networks. Groups of units can share a common data plan with other related units. Subscriber information can be included in respective SIM cards. At least one of the SIM cards can provide voice or data service via the common data plan.

Abstract: Disclosed are an acryl-silicone-based hybrid emulsion adhesive composition and a method of preparing the same. Particularly, an acryl-silicone-based hybrid emulsion adhesive composition that includes an acrylic emulsion resin prepared by emulsion polymerization of an acrylic monomer mixture and a seed formed of a reactive silicone resin and thus has high weather resistance and heat resistance and a method of preparing the same are provided.

Abstract: The present disclosure provides a method for reducing the aldehyde content in an amine catalyst by treating the amine catalyst with an organic acid. The organic acid-treated amine catalyst may then be used in the production of polyurethane materials which exhibit reduced aldehyde emissions.

Abstract: A curable resin composition comprising: a) an epoxy resin; b) an anhydride hardener; c) a polyol; d) a core shell rubber, and (e) a catalyst, is disclosed. When cure the resin composition can be used to formulate composites, coatings, laminates, and adhesives.

Abstract: A polyester polyol comprising at least one esterified unit of formula (I) wherein L is a difunctional aliphatic group having from two to six carbon atoms and R is a C1-C4 alkyl group.

Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

Abstract: Methods and compositions, and components comprising the compositions, are disclosed relating to improved resin-based adhesives comprising encapsulating at least a catalyst compound. Further methods and compositions are disclosed relating to encapsulated catalysts in uncured resin-based adhesives, said encapsulated catalysts configured to release the catalyst compound and cure the uncured resin-based adhesive on-demand.

Abstract: A composition that is configured for use in creating a film. The composition includes a vinyl acetate containing polymer, such as a vinyl acetate ethylene (VAE) copolymer, and at least one additive that is a pigment, a surfactant, a dispersant, a wetting agent, a plasticizer, a defoamer, a coupling agent, a solvent, a UV absorber, a fire retardant, or a light stabilizer.

Abstract: In a complex of the invention, a resin member made of a resin material including a polyolefin and a metal member are joined together through a primer layer. In addition, the resin member is obtained by molding the resin material by injection, a coexistence layer in which a primer resin material configuring the primer layer and the resin material coexist is formed between the primer layer and the resin member, and a thickness of the coexistence layer is in a range of more than or equal to 5 nm and less than or equal to 50 nm.

Abstract: A pneumatic tire includes: an inner liner having a thermoplastic resin film, a carcass, and an adhesive layer disposed between the inner liner and the carcass, in which the dynamic storage modulus E's at ?20° C. of the thermoplastic resin film, the adhesive layer, and the carcass are defined as E1?, E2?, and E3?, respectively, and the relationship among E1?, E2?, and E3? satisfies E1?>E2?>E3?. This pneumatic tire has excellent anti-crack property in a low-temperature environment of the inner liner.

Abstract: A complex for acid gas separation includes an acid gas separation membrane, a permeated gas flow path member, and a sealing portion. The acid gas separation membrane includes a porous support with pores having an average pore diameter of 0.5 ?m or less, and an acid gas separation layer disposed on the porous support. The permeated gas flow path member allows acid gas, which has permeated through the acid gas separation layer, to pass therethrough. The sealing portion seals a region required to be sealed with resin, the region being on the periphery of the permeated gas flow path member and the porous support. The sealing portion is made of epoxy resin, the Tg of epoxy resin is 90° C. or higher and the content of an inorganic filling material is less than or equal to 30% by mass.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.