Epoxy Resin Patents (Class 156/330)
  • Patent number: 10442965
    Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: October 15, 2019
    Assignee: Zephyros, Inc.
    Inventors: Sylvain E. Gleyal, Laurent Meistermann
  • Patent number: 10246613
    Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The thermosetting resin composition includes a diglycidyl isocyanuryl modified polysiloxane represented by the formula (1), and a curing agent for an epoxy resin.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: April 2, 2019
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Morita, Tomoyasu Sunaga
  • Patent number: 10241237
    Abstract: An anti-fog coating composition is described comprising an aqueous polymeric dispersion; a crosslinker, and a surfactant. The dried and cured coating composition does not exhibit fogging within 8 seconds after being soaked in 25° C. water for 1 hour. In favored embodiments, the dried and cured coating composition does not exhibit fogging within 60 seconds after being soaked in 50° C. water for 24 hours. Also described are articles comprising the dried and cured coating composition disposed on a substrate as well as a method a providing an anti-fog coating on a substrate.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: March 26, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Naiyong Jing, Yongshang Lu, Dang Xie, Zhigang Yu, John L. Battiste, Alan L. Levin, Caroline M. Ylitalo, Mahfuza B. Ali
  • Patent number: 10227476
    Abstract: The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G?Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: March 12, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Yasuhiro Fukuhara, Hisaya Ushiyama, Manabu Kaneko
  • Patent number: 10217649
    Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: February 26, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jin-Yuan Lai, Tang-Yuan Chen, Ying-Xu Lu, Dao-Long Chen, Kwang-Lung Lin, Chih-Pin Hung, Tse-Chuan Chou, Ming-Hung Chen, Chi-Hung Pan
  • Patent number: 10196491
    Abstract: Disclosed herein are methods and formulations for the microencapsulation of aminosiloxanes, for example for use as an additive in protective material formulations such as those used in the protection and/or joining of metal substrates. The additives may be used in conjunction with a second reactant that may or may not be similarly microencapsulated for self-healing (and associated corrosion resistance) or delayed cure applications, or they may be used alone or in conjunction with other corrosion inhibitors for protective formulations with improved corrosion resistance on appropriate substrates.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: February 5, 2019
    Assignee: Autonomic Materials, Inc.
    Inventors: Gerald O. Wilson, Subramanyam V. Kasisomayajula, Mei-Hsiu Lai, Christopher R. Dayton, Angela C. Smith
  • Patent number: 10190028
    Abstract: The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: January 29, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Andreas Lutz, Benjamin Alexander Haag, Beda Steiner
  • Patent number: 10107444
    Abstract: A method of manufacturing a Field Joint Coating (FJC) for a pipeline, the method comprising: providing a pipe section to be joined to a similar pipe section or free end of a pipeline, wherein each pipe section is provided with a coating comprising a thermal insulation layer over a length of the pipe section having a protruding section, wherein the end zones of each pipe section are free of thermal insulation, thereby allowing access to the ends of the pipe section and the pipeline to connect the pipe section with the free end of the pipeline, applying an anti-corrosion coating layer on a connection region of the joined ends of the pipe section and the pipeline, heating the protruding section and applying an intermediate coating layer of a thermoplastic material on the anti-corrosion coating layer and the protruding section, applying a thermal insulation layer on the intermediate coating layer.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: October 23, 2018
    Assignee: HEEREMA MARINE CONTRACTORS NEDERLAND SE
    Inventors: Helen Rose Boyd, Lara Elizabeth Wills
  • Patent number: 10093839
    Abstract: Disclosed herein are compositions comprising a first copolymer derived from monomers comprising a (meth)acrylate monomer, an acid monomer, and optionally at least one additional monomer selected from the group consisting of styrene, ?-methyl-styrene, vinyl toluene, and mixtures thereof, wherein the first copolymer is derived in the absence of a molecular weight regulator and wherein the first copolymer has a weight average molecular weight of less than 10,000 Daltons, and methods of making the same. The compositions and methods disclosed can be used, for instance, in pressure-sensitive adhesive applications.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: October 9, 2018
    Assignee: BASF SE
    Inventors: Matthias Gerst, Michael Gross, Rafael Galvan
  • Patent number: 10059861
    Abstract: A method of repairing or reinforcing a target structure includes preparing an adhesive sheet having at least an adhesive layer and a repairing or reinforcing material, irradiating the adhesive sheet with ionizing radiation, and attaching the adhesive layer to the target structure after the irradiation with the ionizing radiation.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: August 28, 2018
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kentaro Hoshi, Kazuki Tsukiyama, Sotaro Ban, Takahisa Taniguchi
  • Patent number: 10025432
    Abstract: Provided is a capacitive touch panel which has enhanced sensitivity and is usable in an image display panel, etc. in this capacitive touch panel, a window, a first transparent film having a first transparent conductive electrode pattern formed on one surface thereof, and a second transparent film having a second transparent conductive electrode pattern which is formed on one surface thereof and disposed with respect to the first transparent film in such a manner as to allow a capacitance to be formed therebetween, are stacked in turn. The capacitive touch panel comprises a first transparent inter-layer resin provided between the window and the first transparent film, and a second transparent inter-layer resin provided between the first transparent film and the second transparent film, wherein the first transparent inter-layer resin has a dielectric constant greater than that of the second transparent inter-layer resin.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: July 17, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiroaki Kishioka, Mayumi Kishioka, Tomohide Banba, Mitsuru Honjo, Naoki Nagaoka, Kazumasa Igarashi, Yuki Hasegawa, Hiroshi Wada, Yuki Tsubaki, Tomotake Nashiki
  • Patent number: 9900726
    Abstract: A communications network is available to implement at least M2M communications between a transmitting unit and a receiving unit. The units can communicate via the Internet as a primary network. They can also communicate via a cellular-type network. At least some of the units include respective subscriber information to provide access and services via the networks. Groups of units can share a common data plan with other related units. Subscriber information can be included in respective SIM cards. At least one of the SIM cards can provide voice or data service via the common data plan.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: February 20, 2018
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventor: Kenneth L. Addy
  • Patent number: 9856344
    Abstract: The present disclosure provides a method for reducing the aldehyde content in an amine catalyst by treating the amine catalyst with an organic acid. The organic acid-treated amine catalyst may then be used in the production of polyurethane materials which exhibit reduced aldehyde emissions.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: January 2, 2018
    Assignee: HUNTSMAN PETROCHEMICAL LLC
    Inventors: Frank Rodriguez, Robert A Grigsby, Jr., Eugene P Wiltz, Jr., Ernest L Rister, Jr., Bhajendra N Barman
  • Patent number: 9856405
    Abstract: Disclosed are an acryl-silicone-based hybrid emulsion adhesive composition and a method of preparing the same. Particularly, an acryl-silicone-based hybrid emulsion adhesive composition that includes an acrylic emulsion resin prepared by emulsion polymerization of an acrylic monomer mixture and a seed formed of a reactive silicone resin and thus has high weather resistance and heat resistance and a method of preparing the same are provided.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: January 2, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Jae Woung Ha, Young-Min Kim, Jung Sup Han, Kong Ju Song, Mi Young Kim, Kumhyoung Lee
  • Patent number: 9845387
    Abstract: A curable resin composition comprising: a) an epoxy resin; b) an anhydride hardener; c) a polyol; d) a core shell rubber, and (e) a catalyst, is disclosed. When cure the resin composition can be used to formulate composites, coatings, laminates, and adhesives.
    Type: Grant
    Filed: October 13, 2013
    Date of Patent: December 19, 2017
    Assignee: BLUE CUBE IP LLC
    Inventors: Gyongyi Gulyas, Maurice J. Marks
  • Patent number: 9834641
    Abstract: A polyester polyol comprising at least one esterified unit of formula (I) wherein L is a difunctional aliphatic group having from two to six carbon atoms and R is a C1-C4 alkyl group.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: December 5, 2017
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Jorge Jimenez, Kevin K. Miyake, Pavel L. Shutov, David E. Vietti, Joseph J. Zupancic
  • Patent number: 9820384
    Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: November 14, 2017
    Assignee: Intel Corporation
    Inventors: Sasha Oster, Robert L. Sankman, Charles Gealer, Omkar Karhade, John S. Guzek, Ravi V. Mahajan, James C. Matayabas, Jr., Johanna Swan, Feras Eid, Shawna Liff, Timothy McIntosh, Telesphor Kamgaing, Adel Elsherbini, Kemal Aygun
  • Patent number: 9758706
    Abstract: Methods and compositions, and components comprising the compositions, are disclosed relating to improved resin-based adhesives comprising encapsulating at least a catalyst compound. Further methods and compositions are disclosed relating to encapsulated catalysts in uncured resin-based adhesives, said encapsulated catalysts configured to release the catalyst compound and cure the uncured resin-based adhesive on-demand.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: September 12, 2017
    Assignee: THE BOEING COMPANY
    Inventors: Keith Daniel Humfeld, Gwen M. Gross
  • Patent number: 9752022
    Abstract: A composition that is configured for use in creating a film. The composition includes a vinyl acetate containing polymer, such as a vinyl acetate ethylene (VAE) copolymer, and at least one additive that is a pigment, a surfactant, a dispersant, a wetting agent, a plasticizer, a defoamer, a coupling agent, a solvent, a UV absorber, a fire retardant, or a light stabilizer.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: September 5, 2017
    Assignee: Avery Dennison Corporation
    Inventor: Frank Y. Shih
  • Patent number: 9744702
    Abstract: In a complex of the invention, a resin member made of a resin material including a polyolefin and a metal member are joined together through a primer layer. In addition, the resin member is obtained by molding the resin material by injection, a coexistence layer in which a primer resin material configuring the primer layer and the resin material coexist is formed between the primer layer and the resin member, and a thickness of the coexistence layer is in a range of more than or equal to 5 nm and less than or equal to 50 nm.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 29, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Hiroshi Okumura, Kiminori Uchida, Kazuki Kimura, Goro Inoue, Takeharu Isaki
  • Patent number: 9718311
    Abstract: A pneumatic tire includes: an inner liner having a thermoplastic resin film, a carcass, and an adhesive layer disposed between the inner liner and the carcass, in which the dynamic storage modulus E's at ?20° C. of the thermoplastic resin film, the adhesive layer, and the carcass are defined as E1?, E2?, and E3?, respectively, and the relationship among E1?, E2?, and E3? satisfies E1?>E2?>E3?. This pneumatic tire has excellent anti-crack property in a low-temperature environment of the inner liner.
    Type: Grant
    Filed: May 28, 2012
    Date of Patent: August 1, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventors: Takuya Ogasawara, Hideyuki Chiashi, Hideki Kitano
  • Patent number: 9700833
    Abstract: A complex for acid gas separation includes an acid gas separation membrane, a permeated gas flow path member, and a sealing portion. The acid gas separation membrane includes a porous support with pores having an average pore diameter of 0.5 ?m or less, and an acid gas separation layer disposed on the porous support. The permeated gas flow path member allows acid gas, which has permeated through the acid gas separation layer, to pass therethrough. The sealing portion seals a region required to be sealed with resin, the region being on the periphery of the permeated gas flow path member and the porous support. The sealing portion is made of epoxy resin, the Tg of epoxy resin is 90° C. or higher and the content of an inorganic filling material is less than or equal to 30% by mass.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: July 11, 2017
    Assignee: FUJIFILM Corporation
    Inventor: Ryo Ouchi
  • Patent number: 9683145
    Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 20, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Arlin L. Weikel, Larry R. Krepski, Jason D. Clapper, Wayne S. Mahoney, Babu N. Gaddam
  • Patent number: 9670377
    Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: June 6, 2017
    Assignee: NAMICS CORPORATION
    Inventors: Pawel Czubarow, Toshiyuki Sato, Tsutomu Masuko
  • Patent number: 9562176
    Abstract: A composition is described which includes A) a chain-extended prepolymer, which can be obtained from the reaction of a) a polymer containing at least one amino, thiol or hydroxyl group, b) at least one polyisocyanate and c) at least one alkoxylated bisphenol as chain extender, and optionally d) an epoxide compound containing a primary or secondary hydroxy group, said compound containing a primary or secondary hydroxyl group, or at least one epoxy resin A which contains this epoxide compound, and optionally B) an epoxy resin B. The composition is suitable as a toughener or as an A component of a 2k epoxy resin adhesive which contains this toughener. The adhesive is suitable particularly for bonding in windmills.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: February 7, 2017
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Ulrich Gerber, Jürgen Finter
  • Patent number: 9553284
    Abstract: A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: January 24, 2017
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Yuji Minamibori, Honglin Wang
  • Patent number: 9505731
    Abstract: A novel low viscosity epoxide having the following general Structure (I): Structure (I) wherein R1 and R2 can be, but is not limited to, hydrogen or a hydrocarbon group having from C1 to about C20 carbon atoms; with the proviso that R1 and R2 are not both hydrogen.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: November 29, 2016
    Assignee: BLUE CUBE IP LLC
    Inventors: Stephanie L. Potisek, Robert J. Wright, Michael J. Mullins
  • Patent number: 9441069
    Abstract: The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: September 13, 2016
    Assignee: DIC Corporation
    Inventors: Kazuo Arita, Hajime Watanabe
  • Patent number: 9382460
    Abstract: A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be molded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: July 5, 2016
    Assignee: Zephyros, Inc.
    Inventor: Michael Czaplicki
  • Patent number: 9382373
    Abstract: A curable composition comprising (a) at least one low viscosity epoxide resin compound having the following chemical structure: (I) wherein R1 and R2 are hydrogen or a hydrocarbon group having from 1 to 20 carbon atoms, with the proviso that R1 and R2 are not both hydrogen, and (b) at least one curing agent or UV photoinitiator; and a thermoset prepared from the above curable composition.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: July 5, 2016
    Assignee: BLUE CUBE IP LLC
    Inventors: Stephanie L. Potisek, Michael J. Mullins
  • Patent number: 9365749
    Abstract: Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: June 14, 2016
    Assignee: Sunray Scientific, LLC
    Inventor: S. Kumar Khanna
  • Patent number: 9364797
    Abstract: The present invention relates to the production of high flux hollow fiber ultrafiltration membrane prepared from poly(acrylonitrile-co-methacrylic acid), (polysulfone and poly(acrylonitrile-co-methacrylic acid)) and (polysulfone and ion exchange resin (sulfonated polystyrene-divinyl benzene copolymer)) blend and the point-of-use filtration unit there from for water purification and disinfection. The produced membrane has an active layer with pore size which effectively rejects pathogens and other bacteria from contaminated water while allowing the passage of water to produce biologically pure water for drinking. Therefore, the present invention relates to development of hollow fiber ultrafiltration membrane that delivers biologically pure water at a desirable rate, that is at a rate 25-200 liters/m2.h. The membrane performance in terms of flux and rejection efficiency is dependent on polymer material type and surface properties.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: June 14, 2016
    Assignee: Council of Scientific & Industrial Research
    Inventors: Alamuru Venktarami Reddy, Paramita Ray, Puyam Sobhindro Singh, Parashuram Kallem, Sandipkumar Maurya, Jitendra Jaydevprasad Trivedi
  • Patent number: 9284447
    Abstract: Silanes of formula (I): or inorganic fillers whose surface is coated or derivatized with a silane of formula (I), are curing agents for epoxy resins that are activatable at elevated temperature. The thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability. They are therefore very well suited for single-component thermosetting epoxy adhesives, which in particular may contain impact modifiers.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: March 15, 2016
    Assignee: SIKA TECHNOLOGY AG
    Inventor: Andreas Kramer
  • Patent number: 9181463
    Abstract: Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: November 10, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Andreas Lutz, Daniel Schneider, Christof Braendli, Irene Maeder
  • Publication number: 20150145242
    Abstract: A retention sleeve comprising a predetermined material and shape which provides a predetermined tensile capability may be placed about a tube to be disposed in an umbilical without the use of a welded retention sleeve by selecting a high strength glue or epoxy and using that high strength glue or epoxy to affix the retention sleeve at a predetermined position along a length of a tube disposed in an umbilical.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Applicant: OCEANEERING INTERNATIONAL, INC.
    Inventors: Stephen Owen Mast, Alan Hendry Gibson, Ross Doak
  • Patent number: 9039854
    Abstract: The invention relates to a method for connecting a first tube to a second tube, the tubes being interconnected in an overlapping region by means of an adhesive that fills a gap in the overlapping region between the tubes. Said method is characterized in that: a) adhesive is applied to the overlapping region of at least one of the tubes and the adhesive is selected in such a way that it is solid at temperatures of below 30° C.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: May 26, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventors: Andrea Ferrari, Eugen Bilcai
  • Publication number: 20150129128
    Abstract: A strip of curable prepreg comprising unidirectional fibres aligned with the length of the strip, the fibres being at least partially impregnated with curable thermosetting resin and comprising a flexible polymeric sheet on an outer face of the strip, wherein the strip has a substantially rectangular cross-section defining a width and a thickness of the strip.
    Type: Application
    Filed: January 23, 2015
    Publication date: May 14, 2015
    Inventors: John Ellis, Emilie Fisset
  • Publication number: 20150132581
    Abstract: An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: Cooper Technologies Company
    Inventors: Chao Li, Stephen John Rigby, Clay Lynwood Fellers, Marco James Mason, Saboura Rokhsair Azar
  • Publication number: 20150122911
    Abstract: An adhesively bonded frame section for an agricultural sprayer boom is provided. One agricultural sprayer boom section includes a first support member and a second support member disposed adjacent to the first support member. The boom section also includes a side plate adhesively bonded to a first lateral side of the first support member, and to a first lateral side of the second support member to couple the first support member to the second support member.
    Type: Application
    Filed: January 5, 2015
    Publication date: May 7, 2015
    Inventors: John Paul Honermann, Scott David Reese
  • Publication number: 20150114554
    Abstract: Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Tak Kui Wang, Ye Chen, Frank Yashar
  • Patent number: 9011629
    Abstract: An adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in Fig. 1A wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C. using an E type viscometer is A2 (Pa·s), the range including values on the solid lines but not including values on the dashed line, and a blending amount of the curing agent is 5 to 150 parts by weight and a blending amount of the inorganic filler is 60 to 400 parts by weight based on 100 parts by weight of the curable compound.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: April 21, 2015
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Carl Alvin Dilao, Akinobu Hayakawa, Shujiro Sadanaga, Munehiro Hatai
  • Patent number: 9005740
    Abstract: Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: April 14, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Naoyuki Kondo, Junko Yashiro, Tooru Nakasiba, Shinji Hashimoto
  • Patent number: 9007677
    Abstract: A wavelength conversion element includes a core formed of a ferroelectric crystal having a periodically poled structure in which first and second domains having mutually inverted directions of spontaneous polarization are alternately aligned side by side, and a cladding covering all side surfaces of the core along a light propagation direction and having a uniform refractive index. Boundary surfaces of the first and second domains are arranged in a non-parallel manner with respect to the light propagation direction.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: April 14, 2015
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Tadashi Kishimoto
  • Publication number: 20150096680
    Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
    Type: Application
    Filed: August 15, 2014
    Publication date: April 9, 2015
    Applicant: Cytec Industries Inc.
    Inventors: Yiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah
  • Publication number: 20150096663
    Abstract: The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Inventors: Patrick Siboni, John Blancaneaux
  • Publication number: 20150096257
    Abstract: The invention relates to a frame structure, such as a window sash or a frame for a window or door, comprising a core made from at least one core member made from expanded polystyrene (EPS) with a density of 80-200 kg/m3 and a shell of polyurethane (PUR) encasing the core. The core may include a plurality of core members, some of which may be made from a different material.
    Type: Application
    Filed: May 10, 2013
    Publication date: April 9, 2015
    Applicant: VKR HOLDING A/S
    Inventors: Ruben Sinnathamby, Michael Melsen, Kristian Ørnsvig Nielsen
  • Publication number: 20150086791
    Abstract: One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate. One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate during building or reconfiguring a product.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: GM Global Technology Operations LLC
    Inventors: Alan L. Browne, Tao Xie, John C. Ulicny, William R. Rodgers, Nilesh D. Mankame, Xingcheng Xiao, Nancy L. Johnson, Jessica A. Schroeder, John N. Owens, Ingrid Rousseau, Hamid G. Kia, Paul E. Krajewski
  • Publication number: 20150086783
    Abstract: The present invention is directed to compositions useful for sealing substrates and substrates coated therewith. Additionally, methods of sealing and improving sealing performance using such compositions are provided.
    Type: Application
    Filed: December 1, 2014
    Publication date: March 26, 2015
    Inventors: Shabbir Attarwala, Viraj Kadam, Qinyan Zhu, Pradhyumna Ingle, Gregg Rossier
  • Publication number: 20150079401
    Abstract: A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1): (In the formula (1), R1 represents a C4-20 hydrocarbyl group; R2 represents a C1-20 saturated hydrocarbylene group; R3 represents a C2-3 saturated hydrocarbylene group; R4 represents a C1-8 hydrocarbylene group; k represents an integer of 0 to 20; l represents an integer of 0 to 20; m represents an integer of 0 to 20; and n represents an integer of 1 or 2, wherein where a plurality of Ri (i is 1 to 4) exist, the plurality of Ri may be the same as or different from each other; k —COR2O— groups, l —R3O— groups, and m —COR4COO— groups may be in any order; and where n is 2, two R1O(COR2O)k(R3O)l(COR4COO)m groups may be the same as or different from each other.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 19, 2015
    Inventor: Hideki Ohno
  • Patent number: 8980043
    Abstract: A method for producing a joined structure, the method involving pressure-bonding first and second circuit members together via an anisotropic conductive film while the circuit members are being heated, to thereby join the circuit members with each other. The anisotropic conductive film electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface facing the first circuit member, wherein the anisotropic conductive film, the first layer and the second layer are further defined including the provisions that at least one of the first and second layers includes conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: March 17, 2015
    Assignee: Dexerials Corporation
    Inventor: Tomoyuki Ishimatsu