Abstract: A complex for acid gas separation includes an acid gas separation membrane, a permeated gas flow path member, and a sealing portion. The acid gas separation membrane includes a porous support with pores having an average pore diameter of 0.5 ?m or less, and an acid gas separation layer disposed on the porous support. The permeated gas flow path member allows acid gas, which has permeated through the acid gas separation layer, to pass therethrough. The sealing portion seals a region required to be sealed with resin, the region being on the periphery of the permeated gas flow path member and the porous support. The sealing portion is made of epoxy resin, the Tg of epoxy resin is 90° C. or higher and the content of an inorganic filling material is less than or equal to 30% by mass.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

Abstract: A composition is described which includes A) a chain-extended prepolymer, which can be obtained from the reaction of a) a polymer containing at least one amino, thiol or hydroxyl group, b) at least one polyisocyanate and c) at least one alkoxylated bisphenol as chain extender, and optionally d) an epoxide compound containing a primary or secondary hydroxy group, said compound containing a primary or secondary hydroxyl group, or at least one epoxy resin A which contains this epoxide compound, and optionally B) an epoxy resin B. The composition is suitable as a toughener or as an A component of a 2k epoxy resin adhesive which contains this toughener. The adhesive is suitable particularly for bonding in windmills.

Abstract: A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin.

Abstract: A novel low viscosity epoxide having the following general Structure (I): Structure (I) wherein R1 and R2 can be, but is not limited to, hydrogen or a hydrocarbon group having from C1 to about C20 carbon atoms; with the proviso that R1 and R2 are not both hydrogen.

Abstract: The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.

Abstract: A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be molded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

Abstract: A curable composition comprising (a) at least one low viscosity epoxide resin compound having the following chemical structure: (I) wherein R1 and R2 are hydrogen or a hydrocarbon group having from 1 to 20 carbon atoms, with the proviso that R1 and R2 are not both hydrogen, and (b) at least one curing agent or UV photoinitiator; and a thermoset prepared from the above curable composition.

Abstract: The present invention relates to the production of high flux hollow fiber ultrafiltration membrane prepared from poly(acrylonitrile-co-methacrylic acid), (polysulfone and poly(acrylonitrile-co-methacrylic acid)) and (polysulfone and ion exchange resin (sulfonated polystyrene-divinyl benzene copolymer)) blend and the point-of-use filtration unit there from for water purification and disinfection. The produced membrane has an active layer with pore size which effectively rejects pathogens and other bacteria from contaminated water while allowing the passage of water to produce biologically pure water for drinking. Therefore, the present invention relates to development of hollow fiber ultrafiltration membrane that delivers biologically pure water at a desirable rate, that is at a rate 25-200 liters/m2.h. The membrane performance in terms of flux and rejection efficiency is dependent on polymer material type and surface properties.

Abstract: Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.

Abstract: Silanes of formula (I): or inorganic fillers whose surface is coated or derivatized with a silane of formula (I), are curing agents for epoxy resins that are activatable at elevated temperature. The thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability. They are therefore very well suited for single-component thermosetting epoxy adhesives, which in particular may contain impact modifiers.

Abstract: Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths.

Abstract: A retention sleeve comprising a predetermined material and shape which provides a predetermined tensile capability may be placed about a tube to be disposed in an umbilical without the use of a welded retention sleeve by selecting a high strength glue or epoxy and using that high strength glue or epoxy to affix the retention sleeve at a predetermined position along a length of a tube disposed in an umbilical.

Abstract: The invention relates to a method for connecting a first tube to a second tube, the tubes being interconnected in an overlapping region by means of an adhesive that fills a gap in the overlapping region between the tubes. Said method is characterized in that: a) adhesive is applied to the overlapping region of at least one of the tubes and the adhesive is selected in such a way that it is solid at temperatures of below 30° C.

Abstract: A strip of curable prepreg comprising unidirectional fibres aligned with the length of the strip, the fibres being at least partially impregnated with curable thermosetting resin and comprising a flexible polymeric sheet on an outer face of the strip, wherein the strip has a substantially rectangular cross-section defining a width and a thickness of the strip.

Abstract: An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

Abstract: An adhesively bonded frame section for an agricultural sprayer boom is provided. One agricultural sprayer boom section includes a first support member and a second support member disposed adjacent to the first support member. The boom section also includes a side plate adhesively bonded to a first lateral side of the first support member, and to a first lateral side of the second support member to couple the first support member to the second support member.

Abstract: Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX.

Abstract: An adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in Fig. 1A wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C. using an E type viscometer is A2 (Pa·s), the range including values on the solid lines but not including values on the dashed line, and a blending amount of the curing agent is 5 to 150 parts by weight and a blending amount of the inorganic filler is 60 to 400 parts by weight based on 100 parts by weight of the curable compound.

Abstract: A wavelength conversion element includes a core formed of a ferroelectric crystal having a periodically poled structure in which first and second domains having mutually inverted directions of spontaneous polarization are alternately aligned side by side, and a cladding covering all side surfaces of the core along a light propagation direction and having a uniform refractive index. Boundary surfaces of the first and second domains are arranged in a non-parallel manner with respect to the light propagation direction.

Abstract: Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.

Abstract: The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.

Abstract: The invention relates to a frame structure, such as a window sash or a frame for a window or door, comprising a core made from at least one core member made from expanded polystyrene (EPS) with a density of 80-200 kg/m3 and a shell of polyurethane (PUR) encasing the core. The core may include a plurality of core members, some of which may be made from a different material.

Abstract: The present invention is directed to compositions useful for sealing substrates and substrates coated therewith. Additionally, methods of sealing and improving sealing performance using such compositions are provided.

Abstract: One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate. One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate during building or reconfiguring a product.

Abstract: A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1): (In the formula (1), R1 represents a C4-20 hydrocarbyl group; R2 represents a C1-20 saturated hydrocarbylene group; R3 represents a C2-3 saturated hydrocarbylene group; R4 represents a C1-8 hydrocarbylene group; k represents an integer of 0 to 20; l represents an integer of 0 to 20; m represents an integer of 0 to 20; and n represents an integer of 1 or 2, wherein where a plurality of Ri (i is 1 to 4) exist, the plurality of Ri may be the same as or different from each other; k —COR2O— groups, l —R3O— groups, and m —COR4COO— groups may be in any order; and where n is 2, two R1O(COR2O)k(R3O)l(COR4COO)m groups may be the same as or different from each other.

Abstract: A method for producing a joined structure, the method involving pressure-bonding first and second circuit members together via an anisotropic conductive film while the circuit members are being heated, to thereby join the circuit members with each other. The anisotropic conductive film electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface facing the first circuit member, wherein the anisotropic conductive film, the first layer and the second layer are further defined including the provisions that at least one of the first and second layers includes conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.

Abstract: A reinforcing method and structure for a steel structure and an elastic layer forming material for reinforcing a steel structure are provided that can prevent a reinforcing effect from being lowered by direct sunlight, can obtain a sufficient reinforcing effect, and can prevent a fiber sheet from being peeled away from a steel structure surface before the fiber sheet is torn. The reinforcing method for a steel structure, in which a fiber sheet including reinforcing fibers is bonded to a surface of the steel structure to integrate the fiber sheet with the steel structure, includes (a) a step of applying and hardening a polyurea resin putty to the surface of the steel structure to form an elastic layer, and (b) a step of bonding the fiber sheet to the surface of the steel structure having the elastic layer formed thereon with an adhesive agent.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.

Abstract: Provided are a hollow-fiber membrane unit in which the membranes are prevented from decreasing in permeation rate and the membrane area per unit volume has been rendered suitable and which can hence treat water in an increased rate and a hollow-fiber membrane module which is for use in such hollow-fiber membrane unit. The hollow-fiber membrane module comprises either a hollow-fiber membrane sheet composed of hollow-fiber membranes disposed in a sheet arrangement or a stack of such sheets and a box-shaped water collection member which holds the hollow-fiber membrane sheet or stack, wherein one surface of the water collection member has an opening that is filled with a fixing resin (potting resin) and is for fixing the hollow-fiber membrane sheet stack.

Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.

Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.

Abstract: The present disclosure provides a method of forming a flame retarded composite article using a halogen-free thermosetting composition comprising a benzoxazine compound, a monobenzoxazine monomer, and a naphthalene epoxy. The flame retarded composite article formed is especially suited for use in aerospace, automobile, rail and marine applications.

Abstract: The membrane module according to the present invention comprises a tubular case, and a membrane fixed with a resin and accommodated in the state where filtered water is capable of being taken out from at least one end of the tubular case, in the tubular case, wherein the resin has an elution rate of chloride ions per unit surface area and per unit time of less than 10 ?g/(m2·hr) in an elution test using hot water.

Abstract: A sealant article useful for sealing a substrate surface having a first surface and a second surface is provided. The first surface comprises a deformable composition that is capable of conforming to a substrate surface when subjected to heat and/or pressure. The second surface of the sealant article has been at least partially cured by exposing said surface to an amount of radiation effective to induce at least partial curing of the second surface of the sealant article. Prior to such curing, the second surface also is comprised of the deformable composition. Such at least partial curing is effective to render the second surface less deformable than the first surface.

Abstract: A multi-part mask has a pattern plate, which includes a planar portion that has the desired aperture pattern to be used during workpiece processing. The multi-part mask also has a mounting frame, which is used to hold the pattern plate. Prior to assembly, the pattern plate has an aligning portion, which has one or more holes through which reusable alignment pins are inserted. These alignment pins enter kinematic joints disposed on the mounting frame, which serve to precisely align the pattern plate to the mounting frame. After the pattern plate has been secured to the mounting frame, the aligning portion can be detached from the pattern plate. The alignment pins can be reused at a later time. In some embodiments, the pattern plate can later be removed from the mounting frame, so that the mounting frame may be reused.

Abstract: Adhesives and sealants comprising submicron particles and nanomaterials, methods of making such adhesives and sealants, and methods of using such adhesives and sealants are provided.

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.

Abstract: Curable adhesive compositions comprising i. a curable epoxy resin ii. an amine curing agent, iii. a polymeric toughening agent, iv. a filler and v. a phosphoric acid ester according to the formula as an adhesion promoter, wherein R represents an aliphatic or aromatic residue that contains one or more carboxylic acid ester units and/or one or more urethane units and that further contains at least one ether group and n represents an integer of 1 or 2, methods of making them, bonded articles and methods for bonding.

Abstract: A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

Abstract: The invention provides an assembly comprising at least one substrate being bonded to a structural adhesive wherein the structural adhesive is obtained by curing a precursor comprising a cross-linkable polymer, wherein a surface area of the substrate bonded to the structural adhesive comprises at least one metal, said surface area being treated with a liquid activator.

Abstract: The present invention is one liquid type cyanate-epoxy composite resin composition that is comprised of cyanate ester resin (A), epoxy resin (B) and latent curing agent (C) and has high thermal resistance as well as excellent fast curing properties and storage stability, characterized in that the above latent curing agent is comprised of a modified amine compound (a) and a phenol resin (b). Where, the modified-amine compound (a) is obtained by the reaction of at least one kind of amine compounds (a-1), selected from amine compounds having one or more tertiary amino groups and one or more primary and/or secondary amino groups, with an epoxy compound (a-2), in particular. It is preferable that one liquid type cyanate-epoxy composite resin composition of the present invention contains 1-10,000 mass parts of the epoxy resin component of the component (B) relative to 100 mass parts of cyanate-ester resin component of the component (A).

Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent including a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

Abstract: A method for making a pressure sensitive adhesive comprising: (a) reacting (i) at least one dibasic acid or anhydride thereof with (ii) at least one epoxide having at least two epoxy groups, one diol or polyol, or one diamine at a stoichiometric molar excess of reactive carboxylic acid groups relative reactive epoxy groups, hydroxyl groups or amine groups to produce a thermoplastic prepolymer or oligomer capped with a carboxylic acid group at both prepolymer or oligomer chain ends, or a thermoplastic branched prepolymer or oligomer with at least two of the prepolymer or oligomer branches and chain ends capped with a carboxylic acid group; and (b) curing the resulting carboxylic acid-capped prepolymer or oligomer with at least one polyfunctional epoxy to produce a pressure sensitive adhesive, wherein the polyfunctional epoxy is not an epoxidized vegetable oil.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: A flywheel includes a wheel having a composite rim structure with multiple radial layers of steel material. Epoxy type adhesive can bond the multiple layers of stainless steel together.

Abstract: The present invention A process for providing an extended tubular article or one or more sections of the extended tubular article with a corrosion protecting system, wherein (a) a layer of an adhesive composition is applied to the surface of the extended tubular article or the one or more sections of the extended tubular article, and (b) a corrosion protecting layer is applied to the layer of the adhesive composition, the adhesive composition comprising a polyolefin blend, wherein the polyolefin blend comprises 30% to 100% by weight of a polyisobutene and 0% to 70% by weight of an olefin polymer, based on the total weight of the polyolefin blend, wherein said polyisobutene is has a glass transition temperature of lower than ?40° C. and a number average molecular weight Mn of 1300 to 1,000,000.