Abstract: The present invention provides a cationically curable resin composition for assembling hard disk devices which comprises a resin having a cationically polymerizable functional group (a component A) and a cationic polymerization initiator (a component B), the component B being at least one selected from the group consisting of X+(SbF6)?(B1), X+(B(C6F5)4)?(B2) and X+((Rf)nPF6-n)?(B3) (in the formulae, X+ is iodonium or sulfonium, Rf is a fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6). The invention also provides a hard disk device manufacturing method using the composition, and a hard disk device assembled with the composition.

Abstract: A joint includes a first body, a second body, and an adhesive. The first body includes a coated portion and an uncoated portion. The second body includes a coated portion and an uncoated portion. The adhesive is positioned on the uncoated portion of each of the first and second bodies. The adhesive is expandable to cover at least a part of the coated portion of each of the first and second bodies. The first body and the second body can be fabricated for dissimilar materials. The adhesive includes insulating properties that can insulate the first body from the second body to inhibit galvanic corrosion. During a method of forming a joint between a first body and a second body, the adhesive can be at least partially cured so as to hold the first body and second body in the proper relative alignment during the formation process.

Abstract: Acrylic adhesion promoters having an improved property such as cohesive failure are produced from a monocyclic anhydride of phosphonic acid containing multiple carboxylic acids that is subsequently reacted with a hydroxyalkyl methacrylate. The adhesion promoters are useful in bonding to metal substrates including oily metal substrates.

Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at ?40° C.

Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: A package for an arcuate planar lightwave circuit (PLC) chip includes a heater plate coupled to a base by a thick and soft support layer. The arcuate PLC is attached to the heater plate by soft adhesive. A hard adhesive is applied to a multi-waveguide end of the arcuate PLC, to additionally strengthen the attachment of the arcuate PLC to the heater plate. The structure allows the mechanical stress due to fiber pull/shock/vibration to be dissipated in the support layer without introducing large wavelength shifts in the arcuate PLC. The support layer also serves as a heat insulator, facilitating uniform heating of the arcuate PLC.

Abstract: Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures.

Abstract: A slip assembly for a downhole tool, such as a bridge plug, has a slip body composed of independent segments. The segments are affixed together along their longitudinal sides by a bond, which can be composed of thermoplastic or thermoset resins, an elastomer, epoxy adhesives, bonding agent manufactured using ceramic, metallic agent, or a combination of these. The surface area over which the bonding agent is applied can be controlled for a particular implementation. Thus, more or less of the longitudinal sides of the segments can be bonded to other segments. This provides greater control of the required force to break the bond itself, which can be tailored as desired.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: The subject matter of the present application is a curable adhesive composition having PTC characteristics after curing, containing (i) a reactive binder system, based on an epoxy-resin-component and a curing agent-component, (ii) particles of a carbon modification in a range of 0.01 wt % to 15.0 wt %, based on the total weight of the curable adhesive composition, and (iii) copper powder in a range of 0.5 wt % to 5.0 wt %, based on the total weight of the curable adhesive composition, wherein the reactive binder system comprises>70 wt % of all organic polymers of the adhesive composition.

Abstract: Silanes of formula (I): or inorganic fillers whose surface is coated or derivatized with a silane of formula (I), are curing agents for epoxy resins that are activatable at elevated temperature. The thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability. They are therefore very well suited for single-component thermosetting epoxy adhesives, which in particular may contain impact modifiers.

Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a second type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a first type having a surface area to mass ratio of 0.05 to 0.15 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

Abstract: An inspectable joint in a medical device is disclosed that includes at least one medical-grade tube having an end, a medical-grade fitting having at least one joining surface configured to accept the end of the tube, and a joining material disposed between the tube and the joining surface. The joining material includes a first component configured to couple the tube to the fitting and a second component configured to provide observable evidence of the presence of the joining material between the tube and the joining surface.

Abstract: The invention relates to a method for adhesively bonding a magnet onto the surface or into a slot of a rotor or stator of an electric motor or a generator, wherein i) the surface or surfaces to be glued of the magnet, rotor or stator are pre-coated with an adhesive that is not liquid at 22° C. and that does not cure without an activation step, iii) the magnet is brought into contact with the rotor or stator at the adhesive location, and iv) the adhesive is activated by heating or by high-energy radiation so that it cures, characterized in that the adhesive comprises a) at least one reactive epoxide prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers. The adhesive preferably comprises a blowing agent. The invention further relates to a corresponding pre-coated magnet.

Abstract: A flywheel includes a wheel having a composite rim structure with multiple radial layers of steel material. Epoxy type adhesive can bond the multiple layers of stainless steel together.

Abstract: The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.

Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.

Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone.

Abstract: An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.

Abstract: A structural adhesive exhibiting good humidity resistance in the uncured state, good failure mode after curing, good crash stability, and good corrosion resistance, is provided, as well as methods of use thereof. The structural adhesive and methods of use thereof are applicable, e.g., in complete knock down (CKD) assembly systems, e.g., in the assembly of automobile body structures.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at ?40° C.

Abstract: An apparatus and method of manufacturing a skeg protector to cover a motorboat skeg to prevent damage to the skeg and to the propellers. The SkegProtector™ apparatus is made of a composite of non-stainless steel woven material of high material strength and durability, such as carbon fiber, Kevlar®, fiberglass, titanium, and polyethylene fiber. It is affixed over the skeg using marine grade underwater adhesive, and without installing bolts or other mechanical means to secure it. Methods of manufacture comprise the use of curing using a heated platen press on aluminum molds encasing multiple layers (7) of woven material and a mandrel.

Abstract: Silanes of formula (I), or of substrates whose surface is coated or derivatized with a silane of formula (I), as a curing agent for epoxy resins which is activatable at elevated temperature. Such thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability.

Abstract: The present invention relates to a lacquer composition, particularly an adhesive and corrosion-protective lacquer for rare earth magnets, on the basis of an epoxy resin mixture, a setting accelerator, a silane-based epoxy functional adhesion promoter and a solvent or a solvent mixture, wherein the lacquer composition includes 5 to 20 wt. %, with respect to the amount of solid resin in the base of the epoxy resin mixture, of a highly viscous epoxy resin based on bisphenol-A with an elastomer content of more than 30 wt. %.

Abstract: A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 ?m at 80° C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of ?50 to 50° C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 ?m, and (C) a colorant.

Abstract: Quaternary ammonium bicarbonates are suitable for use as catalysts in curable epoxy compositions. The curable compositions prepared therewith are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Methods for preparation and curing are also provided. Of particular utility are compositions comprising benzytrimethyl ammonium bicarbonate. The curable composition is coated onto a first film or sheet, including a polyimide film or sheet. The coated sheet is then contacted to the surface of second film or sheet, where preferably there are discrete metallic conductive pathways disposed thereupon.

Abstract: A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures.

Abstract: A method of forming a thermal conductive pillar in a metal core printed circuit board comprises providing a substrate, depositing a dielectric layer on top surface of the substrate, depositing a conductive layer on top surface of the dielectric layer, forming a space in the metal core printed circuit board by selectively removing at least part of dielectric material from the dielectric layer, and depositing thermal conductive material in the space to form a thermal conductive pillar, wherein the thermal conductive pillar conducts heat generated by a device that is assembled with the metal core printed circuit board.

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: A method for connecting a first joining partner to a second joining partner. After provision of the first joining partner and the second joining partner, a lacquer layer is applied to the first joining partner. Then the first joining partner and the second joining partner are saturated together with an impregnating resin. The lacquer layer is produced from a lacquer composition based on an epoxy resin mixture, a curing accelerator, a silane-based, epoxy-functional bonding agent, and a solvent. The epoxy resin mixture has 10 wt.-% to 94 wt.-% of at least one solid epoxy resin with a maximum epoxy count of 2 Eq/kg, 1 wt.-% to 50 wt.-% of at least one solid, multifunctional epoxy resin with an epoxy count >4 Eq/kg, and 5 wt.-% to 40 wt.-% of a phenol and/or kresol novolak with a melting point >30° C. After impregnation, the viscosity of the impregnating resin is reduced such that the first joining partner and the second joining partner are connected to one another.

Abstract: An adhesive material and articles incorporating the same is disclosed. The adhesive material includes at least three of epoxy resin; impact modifier; flexibilizer, blowing agent; curing agent; and filler. The adhesive material is preferably used for structural adhesion but may be used for sealing, baffling or reinforcing an article of manufacture such as an automotive vehicle.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Abstract: Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.

Abstract: The present invention relates to aromatic aldimines, which are based on primary aromatic polyamines, which are solid at room temperature and liquid at room temperature and which have the lowest possible viscosity, hydrolyze with little odor, and can be used as blocked amines in curable compositions, in particular in compositions having one-component and two-component isocyanate groups. Said compositions have a relatively long open time, but cure surprisingly rapidly, said curing occurring without strong odor formation and without bubbling. In addition, the compositions have outstanding mechanical properties after curing, in particular high strength with high ductility, and good resistance to heat and moisture.

Abstract: A method, composition, and article are disclosed relating to the formation of a hump seal on an aircraft transparency. The method includes applying to the aircraft transparency an adhesive composition having a Part A and a Part B. Part A includes a plasticizer, a cross-linking agent, and an adhesion promoter. Part B includes a moisture resister and an abrasion resister, with the adhesive composition being substantially sulfide free. In one example, the moisture resister includes polybutadiene. In another example, the adhesion promoter includes an epoxy silane.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Abstract: The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Abstract: An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.

Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.

Abstract: The present invention provides an aqueous resin composition that can form a cured resin layer that exhibits high adhesion to a base member and high moisture-heat resistance. The present invention relates to a heat-sealing material including an aqueous urethane resin (A), an aqueous polyolefin resin (B), a cross-linking agent (C), and an aqueous medium (D), wherein the cross-linking agent (C) contains an alkylated methylolmelamine resin (c1) and an epoxy compound (c2), the content of the alkylated methylolmelamine resin (c1) is in the range of 5% to 50% by mass, one or both of the aqueous urethane resin (A) and the aqueous polyolefin resin (B) have a functional group [X] that is capable of reacting with an epoxy group, and the molar ratio of the amount of substance having an epoxy group to the total amount of substance having the functional group [X] is 5/1 to 1/5.

Abstract: A method for mounting a specimen on a specimen carrier for milling in an ex-situ lift-out (EXLO) milling process is described where “cross-section” specimens, plan view specimens, or bulk specimens may be lifted-out for analysis. The method comprising positioning the specimen on a recessed surface within a specimen carrier top surface so that a region to be milled is centered about a carrier opening formed through the specimen carrier. Peripheral edges of the specimen are then wedged against inwardly sloping side walls framing the recessed surface. Finally, the specimen is mounted to the specimen carrier so that a path of a milling beam intersects the region to be milled and carrier opening.

Abstract: This invention relates to a polyether-amido-amine corn-pound, obtainable by a two-step reaction of a poly-etheramine with an alkyl acrylate and a polyalkyle-neimine, whereas the polyetheramine and the polyalkyleneimine have at least one primary or secondary amine group, in which the first step comprises the reaction of the polyetheramine with the alkyl acrylate and the second step comprises the reaction of the polyalkyleneimine with the product of the first step. The invention also relates to a method for synthesising a polyether-amido-amine compound by a two-step-reaction. Another object of this invention is a curable composition containing at least one polyether-amido-amine-compound of this invention and a method for coating the surface of a substrate or for binding at least two substrates together using such a curable composition.

Abstract: A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: An adhesion method capable of strongly adhering two members without using an adhesive and without impairing a fine structure or optical properties of a joining surface, and a biochemical chip and optical component made by the same are provided. The adhesion method includes step A of forming a coating film 13 of a first film compound having a first functional group on a first joining surface 11 of a first member 21, step B of forming a coating film 14 of a second film compound having a second functional group on a second joining surface 12 of a second member 22, and step C of bringing the first joining surface 11 into contact by pressure with the second joining surface 12 while bringing a coupling agent having at least one coupling reactive group that forms a bond by a coupling reaction with the first functional group and the second functional group into contact with the first and second functional groups to form bonds by the coupling reaction.

Abstract: The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.

Abstract: There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.