With Polymerization Completion, I.e., Curing, After Assembly Patents (Class 156/331.1)
  • Publication number: 20110318586
    Abstract: The invention relates to innovative flexible packaging forms comprising at least 2 different layers of material joined by means of one or more adhesive layers, at least one of these adhesive layers comprising a carbodiimide or a mixture of two or more carbodiimides, to a method for producing them and to the use thereof.
    Type: Application
    Filed: May 25, 2011
    Publication date: December 29, 2011
    Applicant: RHEIN CHEMIE RHEINAU GMBH
    Inventors: Ana Maria Cano Sierra, Christian Scheffner, Andrea Fruth, Bruce Ernst
  • Patent number: 8043534
    Abstract: The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: October 25, 2011
    Assignee: Designer Molecules, Inc.
    Inventor: Stephen Dershem
  • Patent number: 8017925
    Abstract: A device to polymerize plastics that are to be hardened by means of UV irradiation comprises two different irradiation sources for UV irradiation and IR irradiation, respectively, whose irradiation is projected onto the plastic to be hardened. The irradiation source for the UV irradiation includes a solid-state laser.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: September 13, 2011
    Assignee: IIE GmbH & Co. KG
    Inventor: Ekkehard Kress
  • Publication number: 20110214810
    Abstract: A composition that includes aldimines of Formula (I). The composition can be a two-component polyurethane composition. The composition can have a long open time, but build up an early strength quickly, and in the cured state can have high tensile strength and a high modulus of elasticity. The composition can be odorless or at least low-odor before, during and after curing.
    Type: Application
    Filed: May 16, 2011
    Publication date: September 8, 2011
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Urs BURCKHARDT, Ursula Stadelmann
  • Publication number: 20110139819
    Abstract: The invention relates to cured (meth)acrylate based adhesive composition, comprising at least two co-continuous phases of interpenetrating networks and at least two types of polymeric inclusions, in which one of the co-continuous phases comprises a polymer or copolymer based on at least one acrylic or methacrylic acid monomer or a derivative thereof. These compositions exhibit better facture toughness, especially at low temperatures.
    Type: Application
    Filed: February 17, 2011
    Publication date: June 16, 2011
    Applicant: Huntsman International LLC
    Inventors: Pauline Goodall Barker, Dimiter Lubomirov Kotzev
  • Patent number: 7955471
    Abstract: A moisture-reactive hot-melt adhesive composition, useful as an adhesive, is provided. The composition is particularly useful as an adhesive for bonding profile-wrap articles. Also provided are a method for making profile-wrap articles using the composition and the profile-wrap articles so made.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: June 7, 2011
    Assignee: Rohm and Haas Company
    Inventor: Mark Alan Kesselmayer
  • Patent number: 7951295
    Abstract: An improved method of fabricating a spiral wound module seals a juncture between each scroll face, preferably a smooth, trimmed scroll face, and a central permeate tube. The tube is generally perpendicular to the scroll face. Modules produced using the improved method have fewer insertion point leaks than those produced without using the improved method. Fast curable cyanoacrylate adhesive is used preferably.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: May 31, 2011
    Assignee: Dow Global Technologies LLC
    Inventors: Alvin O. Larson, Steven D. Jons, Pearl I. Moody
  • Patent number: 7887668
    Abstract: An amine organoborane polymerizable composition and uses for the composition are disclosed. Also disclosed are assemblies and methods of forming those assemblies using the polymerizable composition as an adhesive.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: February 15, 2011
    Assignee: Dow Global Technologies Inc.
    Inventors: Yee Y. Wang, Barbara J. Walter
  • Patent number: 7879956
    Abstract: A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: February 1, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20110017400
    Abstract: The invention is based on the discovery that addition of certain carboxylic acid derivatives of siloxanes to thermosetting adhesive compositions and die-attach pastes renders such compositions and pastes extremely resistant to resin bleed. The present invention provides siloxane-carboxylic acid compounds useful as anti-bleed additives. Also provided are adhesive compositions and pastes containing the compounds of the invention, which are particularly useful in applications that require little to no resin bleed prior to curing of the compositions (such as e.g., electronic packaging applications).
    Type: Application
    Filed: March 23, 2009
    Publication date: January 27, 2011
    Applicant: DESIGNER MOLECULES, INC.
    Inventor: Stephen M. Dershem
  • Publication number: 20100291368
    Abstract: The present invention relates to moisture-reactive hot-melt adhesive compounds, comprising at least one polyurethane polymer P which is solid at room temperature and which has isocyanate groups, at least one polyaldimine ALD of the formula (Ia) or (Ib), and at least one acid K in the form of an organic monocarbon acid, or dicarbon acid, or an organic monosulphonic acid, or disulphonic acid, or a compound which can be hydrolyzed to give one of these acids. These hot-melt adhesive compounds cure without bubbles and exhibit exceptionally quick crosslinking speed and good strength after crosslinking.
    Type: Application
    Filed: November 16, 2007
    Publication date: November 18, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Kai Paschkowski, Martin Linnenbrink, Sven Rosenau
  • Publication number: 20100273924
    Abstract: The invention particularly relates to curable compositions comprising at least one polyisocyanate, at least one amine that is blocked by means of aldehyde or ketone, and at least one carboxylic acid hydrazide or sulfonic acid hydrazide which has a minimum melting point of 100° C., especially at least 150° C. Surprisingly, after being cured using moisture at room temperature and when being heated to increased temperatures, significantly fewer volatile components of such compositions volatilize than in the corresponding compositions that do not contain said hydrazide.
    Type: Application
    Filed: December 19, 2008
    Publication date: October 28, 2010
    Applicant: SIKA Technology AG
    Inventor: Urs Burckhardt
  • Patent number: 7816487
    Abstract: A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer diluent. Combinations of the low molecular weight oligomer diluent and the reactive polymer diluent are included. The die-attach composition is applied to surface mount technology such as wire-bond dice. A computing system is also included that uses the die-attach composition.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: October 19, 2010
    Assignee: Intel Corporation
    Inventors: Rahul N. Manepalli, Ravindra V. Tanikella
  • Patent number: 7759431
    Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: July 20, 2010
    Assignee: Tyco Healthcare Group LP
    Inventor: Mark S. Roby
  • Patent number: 7718730
    Abstract: A two-component adhesive, sealant, or coating composition containing (i) a first component containing a portion of an alkoxysilane-functional urethane and water; and (ii) a second component containing the remaining portion of the alkoxysilane-functional urethane and a catalyst. The alkoxysilane-functional urethane includes the reaction product of (a) the reaction product of a hydroxy functional compound and a polyisocyanate, that contains isocyanate groups; with (b) an amine functional aspartate. The composition is used in a method of bonding a first substrate to a second substrate. The method includes (a) combining component i) and component ii) to form a mixture, applying a coating of the mixture to at least one surface of the first substrate or the second substrate, and contacting a surface of the first substrate with a surface of the second substrate. The method is used make an assembly.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: May 18, 2010
    Assignee: Bayer MaterialScience LLC
    Inventors: Richard R. Roesler, Kurt C. Frisch, Craig E. Jansen, Dinesh Pethiyagoda, Kevan E. Hudson
  • Patent number: 7691949
    Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: April 6, 2010
    Assignee: Tyco Healthcare Group LP
    Inventor: Mark S. Roby
  • Patent number: 7687551
    Abstract: Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: March 30, 2010
    Assignee: Henkel Corporation
    Inventors: Alexander P. Mgaya, Balasubramaniam Ramalingam
  • Publication number: 20100065211
    Abstract: The present invention provides a 1-component polyurethane adhesive composition based on at least one NCO-terminated polyurethane prepolymer, which comprises polyamide fibers and at least 10% by weight of fillers.
    Type: Application
    Filed: November 20, 2007
    Publication date: March 18, 2010
    Inventors: Bernhard Gruenewaelder, Thomas Bachon, Birgit Ness, Kerstin Schroeder, Thomas Terveer
  • Publication number: 20100032093
    Abstract: A fastening element for the fixed attachment of an object to a surface. The element comprises a base body which is capable of accommodating an element for holding the object and can be attached to the surface with the aid of a moisture-curable bonding and fixing agent. The base body is capable of acting at least in part as a water reservoir and/or of accommodating a water reservoir therein such that the agent can receive moisture for curing from the water reservoir. An installation system comprising the fastening element and a moisture-curable agent and a method of curing the agent are also disclosed. This Abstract is not intended to define the invention disclosed in the specification, nor intended to limit the scope of the invention in any way.
    Type: Application
    Filed: August 7, 2009
    Publication date: February 11, 2010
    Applicant: NIE WIEDER BOHREN AG
    Inventor: Frank BRAUN
  • Patent number: 7645831
    Abstract: Reactive hot melt adhesives compositions with long open time and/or high green strength are prepared by the use of urethane diols. These results are achievable at moderate/low application viscosity or low application temperature.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: January 12, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Andrew Slark, Neal Williams, Gavin Toovey
  • Publication number: 20100003526
    Abstract: A one-component, moisture curing composition that has a) at least one polyurethane polymer P1, being liquid at room temperature and having isocyanate groups and b) at least one polyurethane polymer A of the formula (Ia) or (Ib), being solid at room temperature and having aldimine groups with a melting point in the range from 40° C. to 80° C., the composition 1) being capable of being applied warm; 2) having adjustable cure times and a good initial strength with suitable application properties; 3) curing under the influence of humidity without bubbles; and 4) having a good elasticity and mechanical rigidity after curing.
    Type: Application
    Filed: October 31, 2007
    Publication date: January 7, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Michael Schlumpf
  • Patent number: 7635738
    Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: December 22, 2009
    Assignee: Tyco Healthcare Group LP
    Inventor: Mark S. Roby
  • Patent number: 7629056
    Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Patent number: 7604868
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: October 20, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Publication number: 20090181259
    Abstract: A soft magnetic metal strip laminate that has high adhesion strength between metal strips, free from delamination, an excellent magnetic property, a high space factor, and a process for production thereof. A process for production of a soft magnetic metal strip laminate that includes plural soft magnetic metal strips laminated by using a polyamide acid solution includes the steps of applying the polyamide acid solution on the soft magnetic metal strip, performing semicuring heat treatment to obtain the degree of imidization of the polyamide acid solution which is in the range of 15 to 70%, laminating plural soft magnetic metal strips to each other through the polyamide acid solution, and performing the heat treatment of the heating and the hot pressing to obtain the degree of imidization of the polyamide acid solution which is more than 90%.
    Type: Application
    Filed: April 5, 2007
    Publication date: July 16, 2009
    Inventors: Koichiro Kurihara, Yoshitsugu Furui
  • Publication number: 20090165926
    Abstract: A method and system is described herein for using a polyimide adhesive to bond a first metal layer to a second metal layer used in a gas turbine engine. The polyimide adhesive may be a film or a paste and is able to withstand operating temperatures in excess of 600 degrees Fahrenheit (315 degrees Celsius). In an exemplary embodiment, the second metal layer is an outer face skin of an exhaust nozzle and the first metal layer is a metal doubler configured to cover a damaged portion of the outer face skin. In some embodiments, the first and second metal layers may be formed of titanium.
    Type: Application
    Filed: October 24, 2007
    Publication date: July 2, 2009
    Applicant: United Technologies Corporation
    Inventors: Daniel M. Stadtlander, William F. Bogue, Charles R. Watson
  • Publication number: 20090159204
    Abstract: The invention relates to compositions which contain at least one isocyanate-containing polyurethane polymer P, which is produced from at least one polyisocyanate and at least one polyol, in addition to at least one aldimine-containing compound of formula (I). The compositions are stable during storage and harden quickly under the influence of moisture, are non-porous and do no not separate rich substances. Said compositions, the hardened compositions, and the resulting separated products are odour-less. The compositions can be used as an adhesive, sealant or coating which exhibit good mechanical properties and adhesion.
    Type: Application
    Filed: September 29, 2006
    Publication date: June 25, 2009
    Inventor: Urs Burckhardt
  • Patent number: 7537839
    Abstract: The present invention generally relates to anaerobically curable compositions of: (a) a cyanate ester compound having the structure of formula I: R1O—C?N)m??(I) ?wherein m is from 2 to 5 and R1 is an aromatic nucleus-containing residue; (b) a (meth)acrylate monomer; and (c) an anaerobic cure inducing composition comprising peroxide and saccharin, wherein said composition is free of added metallic catalyst.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: May 26, 2009
    Assignee: Henkel Corporation
    Inventors: Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski
  • Publication number: 20090101280
    Abstract: A method of producing a flexible single-sided polyimide copper-clad laminate having excellent flex properties. The method comprises: (A) forming a polyamic acid coating by applying a polyamic acid to the surface of a copper foil starting material, (B) forming a laminate by bonding a polyimide film to the polyamic acid coating, and (C) heat treating the laminate, wherein the copper foil starting material is a material for which, if the copper foil starting material is subjected to a heat treatment for 30 minutes at 200° C. in a non-oxidizing atmosphere and the intensity of the (200) plane determined by X-ray diffraction following this heat treatment is termed I, and if the intensity of the (200) plane determined by X-ray diffraction of a copper powder that has not been subjected to heat treatment is termed I0, I and I0 satisfy a relationship represented by a formula (I) shown below: I/I0>20 ??(I).
    Type: Application
    Filed: October 17, 2008
    Publication date: April 23, 2009
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun ASAZUMA, Masahiro USUKI, Tadashi AMANO
  • Patent number: 7507461
    Abstract: Core-skin bonding is improved between honeycomb and composite face sheets by applying a nylon-based (polyamide) adhesive to the edge of the honeycomb prior to bonding. Edge coating of honeycomb with polyamide adhesives is useful in further increasing the bond strength between honeycomb and prepreg face sheets, especially when the matrix resin of the prepreg is designed to adhere the prepreg to the honeycomb.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: March 24, 2009
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Robert Morrison, Clark Smith
  • Patent number: 7495059
    Abstract: Polyurethane-based pressure-sensitive adhesive, characterized in that the polyurethane is composed of the following starting materials which are reacted catalytically with one another in the stated proportions: a) at least one aliphatic or alicyclic polyisocyanate having a functionality of in each case less than or equal to three, b) a combination of at least one triol A based on polypropylene glycol and having an average number-averaged molecular weight Mn of less than or equal to 1000 and a triol B based on polypropylene glycol and having an average number-averaged molecular weight Mn of greater than or equal to 1000, preferably greater than or equal to 3000, the ratio of the number of hydroxyl groups of the triol component A to the number of hydroxyl groups of the triol component B being between greater than 0 and 12, the ratio of the number of isocyanate groups to the total number of hydroxyl groups being between 0.8 and 1.15, preferably between 0.95 and 1.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: February 24, 2009
    Assignee: tesa AG
    Inventors: Uwe Schümann, Kirstin Weiland, Philippe Hesse
  • Patent number: 7495035
    Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: February 24, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Yasushi Mizuta, Yuichi Ito
  • Patent number: 7482064
    Abstract: Disclosed is a composite wood component having upper and lower surface layers and a core layer; a first glueline layer; a second glueline layer; and an overlay layer.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: January 27, 2009
    Assignee: Huber Engineered Woods LLC
    Inventor: Brian Christopher Gerello
  • Publication number: 20080311412
    Abstract: Adhesive polymers are formed when polyvalent azides and alkynes are assembled into crosslinked polymer networks by copper-catalyzed 1,3-dipolar cycloaddition. The condensation polymerization is efficiently promoted by Cu ions either leached from the metal surface or added to the monomer mixture, and strong interactions with metal surfaces are provided by the multiple triazole binding elements produced. The adhesive polymers may be formed either as adhesive polymer coatings or as adhesive polymer cement.
    Type: Application
    Filed: July 22, 2005
    Publication date: December 18, 2008
    Applicant: THE SCRIPPS RESEARCH INSTITUTE
    Inventors: Valery Fokin, M. G. Finn, K. Barry Sharpless
  • Patent number: 7465778
    Abstract: A curable, alkoxysilane-functional polyether urethane composition formed by combining a) a first silane terminated polyurethane prepared by reacting i) a mono-functional compounds with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one or more reactive silane groups to form a moisture-curable, alkoxysilane-functional polyether urethane; and b) a second silane terminated polyurethane prepared by reacting i) an alkyl monofunctional alcohol, amine, and/or thiol, with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one more reactive silane groups. The urethane composition can be used in coating, sealant and/or adhesive compositions. The coating compositions are used to form a coated substrate.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: December 16, 2008
    Assignee: Bayer MaterialScience LLC
    Inventors: Richard R. Roesler, Derek L. Crawford
  • Patent number: 7462651
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 9, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Jie Cao, Donald E. Herr
  • Patent number: 7459047
    Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: December 2, 2008
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
  • Patent number: 7397045
    Abstract: An exposure apparatus includes a loading device, a first energy-producing device, and a second energy-producing device. The loading device comprises a plurality of supporting elements, supporting a panel. The first and second energy producing devices are disposed above and below the loading device, respectively.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: July 8, 2008
    Assignee: AU Optronics Corp.
    Inventor: Ying-Jyh Liao
  • Publication number: 20080078502
    Abstract: The invention relates to a method for preparing a laminate comprising providing an aluminum foil inner layer, a paper middle layer, and an aluminum foil outer layer; laminating the inner aluminum foil layer to the middle layer by a process selected from the group consisting of adhesive lamination with polyurethane, polyvinyl acetate, and an acrylic-type adhesive, and extrusion lamination with polyethylene; curing the inner aluminum foil layer and middle paper layer; laminating the middle paper layer and the outer aluminum foil layer by a process selected from the group consisting of adhesive lamination with polyurethane, polyvinyl acetate, and an acrylic-type adhesive, and extrusion lamination with polyethylene; and curing the inner aluminum foil layer, the middle paper layer and the outer aluminum foil layer.
    Type: Application
    Filed: October 2, 2006
    Publication date: April 3, 2008
    Inventors: Wilfred L. Castillo, Grace N. Mercado, Johnny D. Lee, Miling C. Fong, Calixto Y. Laureano
  • Publication number: 20080053613
    Abstract: An amine organoborane polymerizable composition and uses for the composition are disclosed. Also disclosed are assemblies and methods of forming those assemblies using the polymerizable composition as an adhesive.
    Type: Application
    Filed: August 21, 2007
    Publication date: March 6, 2008
    Inventors: Yee Y. Wang, Barbara J. Walter
  • Publication number: 20070254152
    Abstract: Polyurethane-based pressure-sensitive adhesive, characterized in that the polyurethane is composed of the following starting materials which are reacted catalytically with one another in the stated proportions: a) at least one aliphatic or alicyclic polyisocyanate having a functionality of in each case less than or equal to three, b) a combination of at least one triol A based on polypropylene glycol and having an average number-averaged molecular weight Mn, of less than or equal to 1000 and a triol B based on polypropylene glycol and having an average number-averaged molecular weight Mn of greater than or equal to 1000, preferably greater than or equal to 3000, the ratio of the number of hydroxyl groups of the triol component A to the number of hydroxyl groups of the triol component B being between greater than 0 and 12, the ratio of the number of isocyanate groups to the total number of hydroxyl groups being between 0.8 and 1.15, preferably between 0.95 and 1.
    Type: Application
    Filed: June 23, 2006
    Publication date: November 1, 2007
    Applicant: tesa AG
    Inventors: Uwe Schumann, Kirstin Weiland, Philippe Hesse
  • Patent number: 7271227
    Abstract: The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength on oily metal surfaces.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: September 18, 2007
    Assignee: Henkel Corporation
    Inventors: Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski
  • Patent number: 7267886
    Abstract: Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I wherein R1 is C1–C10 alkyl, R2, R3 and R4, which may be the same or different, are, C1–C10 alkyl or C3–C10 cycloalkyl, phenyl, or phenyl-substituted C1–C10 alkyl or C3–C10 cycloalkyl, provided that any two of R1–R4 may optionally be part of a carbocyclic ring, and M+ is a metal ion or a quaternary ammonium ion. Particular examples of initiator compounds include sodium tetraethyl borate and lithium tetraethyl borate, lithium phenyl triethyl borate and tetraethylammonium phenyl triethyl borate.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: September 11, 2007
    Assignee: Loctite (R&D) Limited
    Inventors: Brendan J. Kneafsey, Gerry Coughlan
  • Patent number: 7268183
    Abstract: Reactive polyurethane hotmelts comprising crystallizing polyesterpolyols based on fumaric acid and 1,6-hexanediol. These hotmelts exhibit good pressure-sensitive adhesive (PSA) properties over a very broad temperature range. The reactive polyurethane hotmelts are prepared by mixing a polyol mixture containing at least on crystallizing polyesterpolyol with an excess of polyisocyanates.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: September 11, 2007
    Assignee: Bayer MaterialScience AG
    Inventors: Matthias Wintermantel, Hermann Perrey, Christian Wamprecht, Walter Meckel, Jürgen Ramthun
  • Patent number: 7250091
    Abstract: The present invention discloses a seating system that includes a seat back (20) with one or more plastic panels (22) that extend across a lateral distance of the seat back (20). The seat back (20) preferably includes one or more reinforcements (30) attached to the plastic panels (22).
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: July 31, 2007
    Assignee: Dow Global Technologies Inc
    Inventors: Vikas Gupta, Hein J. Koelman, Eric Kurtycz
  • Patent number: 7247388
    Abstract: A vulcanizable adhesive composition, which comprises 100 parts by weight of phenolxylylene resin or phenolbiphenyl resin, 10 to 1,000 parts by weight of resol-type phenol resin, 0 to 1,000 parts by weight of novolak-type phenol resin, 10 to 1,000 parts by weight of unvulcanized nitrile rubber and 10 to 500 parts by weight of chlorinated polyethylene, is effectively applied to (hydrogenated) nitrile rubber with a nitrile content of 18 to 48%, and has a suppression effect on a decrease in the adhesiveness even if exposed to dip in various cryogenic liquids such as flon gas, polyalkylene glycol, water, etc. for a long time.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: July 24, 2007
    Assignee: NOK Corporation
    Inventors: Kiyofumi Fukasawa, Tomohiro Kaise
  • Patent number: 7189457
    Abstract: The present invention is a laminate comprising at least one layer of an polyallylamine-based coating that is and in direct contact with at least one other polymeric layer.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: March 13, 2007
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Jerrel C. Anderson
  • Patent number: 7060759
    Abstract: A moisture-reactive hot-melt adhesive composition is provided. Particularly, a composition that includes a polyol, an anhydride-functional polymer, and a polyisocyanate. Also provided are a method for forming the adhesive composition and a method for bonding substrates using the adhesive.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: June 13, 2006
    Assignee: Rohm and Haas Company
    Inventor: Larry Frank Brinkman
  • Patent number: 7025853
    Abstract: A moisture-reactive hot-melt composition, useful as an adhesive, is provided that has improved balance of open time and green strength. In particular, the composition is made from a polyol, a polyisocyante, and an acrylic polymer. Also provided are a method for making such compositions and a method for using such compositions for bonding substrates.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: April 11, 2006
    Assignee: Rohm and Haas Company
    Inventor: Mark Alan Kesselmayer
  • Patent number: 7022804
    Abstract: The invention relates to a moisture-crosslinkable hot-melt adhesive which is composed of a polyurethane prepolymer obtained by polyaddition of at least one polyol to at least one isocyanate chosen from the group of diisocyanates trimerized as isocyanurates and reaction products of diisocyanates with water, the prepolymer having a content of free NCO group of between 1 and 25% by weight. The adhesive according to the invention may be used for the adhesive bonding of fixing components of the Velcro® type to articles intended for hygiene.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: April 4, 2006
    Assignee: Bostik SA
    Inventors: Michel Miskovic, François Bauduin, Patrick Bouttefort, Jean-François Chartrel