With Polymerization Completion, I.e., Curing, After Assembly Patents (Class 156/331.1)
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Publication number: 20110318586Abstract: The invention relates to innovative flexible packaging forms comprising at least 2 different layers of material joined by means of one or more adhesive layers, at least one of these adhesive layers comprising a carbodiimide or a mixture of two or more carbodiimides, to a method for producing them and to the use thereof.Type: ApplicationFiled: May 25, 2011Publication date: December 29, 2011Applicant: RHEIN CHEMIE RHEINAU GMBHInventors: Ana Maria Cano Sierra, Christian Scheffner, Andrea Fruth, Bruce Ernst
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Patent number: 8043534Abstract: The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.Type: GrantFiled: April 12, 2007Date of Patent: October 25, 2011Assignee: Designer Molecules, Inc.Inventor: Stephen Dershem
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Patent number: 8017925Abstract: A device to polymerize plastics that are to be hardened by means of UV irradiation comprises two different irradiation sources for UV irradiation and IR irradiation, respectively, whose irradiation is projected onto the plastic to be hardened. The irradiation source for the UV irradiation includes a solid-state laser.Type: GrantFiled: May 30, 2008Date of Patent: September 13, 2011Assignee: IIE GmbH & Co. KGInventor: Ekkehard Kress
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Publication number: 20110214810Abstract: A composition that includes aldimines of Formula (I). The composition can be a two-component polyurethane composition. The composition can have a long open time, but build up an early strength quickly, and in the cured state can have high tensile strength and a high modulus of elasticity. The composition can be odorless or at least low-odor before, during and after curing.Type: ApplicationFiled: May 16, 2011Publication date: September 8, 2011Applicant: SIKA TECHNOLOGY AGInventors: Urs BURCKHARDT, Ursula Stadelmann
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Publication number: 20110139819Abstract: The invention relates to cured (meth)acrylate based adhesive composition, comprising at least two co-continuous phases of interpenetrating networks and at least two types of polymeric inclusions, in which one of the co-continuous phases comprises a polymer or copolymer based on at least one acrylic or methacrylic acid monomer or a derivative thereof. These compositions exhibit better facture toughness, especially at low temperatures.Type: ApplicationFiled: February 17, 2011Publication date: June 16, 2011Applicant: Huntsman International LLCInventors: Pauline Goodall Barker, Dimiter Lubomirov Kotzev
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Patent number: 7955471Abstract: A moisture-reactive hot-melt adhesive composition, useful as an adhesive, is provided. The composition is particularly useful as an adhesive for bonding profile-wrap articles. Also provided are a method for making profile-wrap articles using the composition and the profile-wrap articles so made.Type: GrantFiled: May 12, 2004Date of Patent: June 7, 2011Assignee: Rohm and Haas CompanyInventor: Mark Alan Kesselmayer
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Patent number: 7951295Abstract: An improved method of fabricating a spiral wound module seals a juncture between each scroll face, preferably a smooth, trimmed scroll face, and a central permeate tube. The tube is generally perpendicular to the scroll face. Modules produced using the improved method have fewer insertion point leaks than those produced without using the improved method. Fast curable cyanoacrylate adhesive is used preferably.Type: GrantFiled: December 6, 2006Date of Patent: May 31, 2011Assignee: Dow Global Technologies LLCInventors: Alvin O. Larson, Steven D. Jons, Pearl I. Moody
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Patent number: 7887668Abstract: An amine organoborane polymerizable composition and uses for the composition are disclosed. Also disclosed are assemblies and methods of forming those assemblies using the polymerizable composition as an adhesive.Type: GrantFiled: August 21, 2007Date of Patent: February 15, 2011Assignee: Dow Global Technologies Inc.Inventors: Yee Y. Wang, Barbara J. Walter
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Patent number: 7879956Abstract: A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.Type: GrantFiled: August 20, 2007Date of Patent: February 1, 2011Assignee: Hitachi Chemical Company, Ltd.Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
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Publication number: 20110017400Abstract: The invention is based on the discovery that addition of certain carboxylic acid derivatives of siloxanes to thermosetting adhesive compositions and die-attach pastes renders such compositions and pastes extremely resistant to resin bleed. The present invention provides siloxane-carboxylic acid compounds useful as anti-bleed additives. Also provided are adhesive compositions and pastes containing the compounds of the invention, which are particularly useful in applications that require little to no resin bleed prior to curing of the compositions (such as e.g., electronic packaging applications).Type: ApplicationFiled: March 23, 2009Publication date: January 27, 2011Applicant: DESIGNER MOLECULES, INC.Inventor: Stephen M. Dershem
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Publication number: 20100291368Abstract: The present invention relates to moisture-reactive hot-melt adhesive compounds, comprising at least one polyurethane polymer P which is solid at room temperature and which has isocyanate groups, at least one polyaldimine ALD of the formula (Ia) or (Ib), and at least one acid K in the form of an organic monocarbon acid, or dicarbon acid, or an organic monosulphonic acid, or disulphonic acid, or a compound which can be hydrolyzed to give one of these acids. These hot-melt adhesive compounds cure without bubbles and exhibit exceptionally quick crosslinking speed and good strength after crosslinking.Type: ApplicationFiled: November 16, 2007Publication date: November 18, 2010Applicant: SIKA TECHNOLOGY AGInventors: Urs Burckhardt, Kai Paschkowski, Martin Linnenbrink, Sven Rosenau
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Publication number: 20100273924Abstract: The invention particularly relates to curable compositions comprising at least one polyisocyanate, at least one amine that is blocked by means of aldehyde or ketone, and at least one carboxylic acid hydrazide or sulfonic acid hydrazide which has a minimum melting point of 100° C., especially at least 150° C. Surprisingly, after being cured using moisture at room temperature and when being heated to increased temperatures, significantly fewer volatile components of such compositions volatilize than in the corresponding compositions that do not contain said hydrazide.Type: ApplicationFiled: December 19, 2008Publication date: October 28, 2010Applicant: SIKA Technology AGInventor: Urs Burckhardt
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Patent number: 7816487Abstract: A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer diluent. Combinations of the low molecular weight oligomer diluent and the reactive polymer diluent are included. The die-attach composition is applied to surface mount technology such as wire-bond dice. A computing system is also included that uses the die-attach composition.Type: GrantFiled: September 30, 2004Date of Patent: October 19, 2010Assignee: Intel CorporationInventors: Rahul N. Manepalli, Ravindra V. Tanikella
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Patent number: 7759431Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.Type: GrantFiled: February 18, 2010Date of Patent: July 20, 2010Assignee: Tyco Healthcare Group LPInventor: Mark S. Roby
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Patent number: 7718730Abstract: A two-component adhesive, sealant, or coating composition containing (i) a first component containing a portion of an alkoxysilane-functional urethane and water; and (ii) a second component containing the remaining portion of the alkoxysilane-functional urethane and a catalyst. The alkoxysilane-functional urethane includes the reaction product of (a) the reaction product of a hydroxy functional compound and a polyisocyanate, that contains isocyanate groups; with (b) an amine functional aspartate. The composition is used in a method of bonding a first substrate to a second substrate. The method includes (a) combining component i) and component ii) to form a mixture, applying a coating of the mixture to at least one surface of the first substrate or the second substrate, and contacting a surface of the first substrate with a surface of the second substrate. The method is used make an assembly.Type: GrantFiled: December 19, 2003Date of Patent: May 18, 2010Assignee: Bayer MaterialScience LLCInventors: Richard R. Roesler, Kurt C. Frisch, Craig E. Jansen, Dinesh Pethiyagoda, Kevan E. Hudson
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Patent number: 7691949Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.Type: GrantFiled: September 21, 2009Date of Patent: April 6, 2010Assignee: Tyco Healthcare Group LPInventor: Mark S. Roby
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Patent number: 7687551Abstract: Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).Type: GrantFiled: September 6, 2006Date of Patent: March 30, 2010Assignee: Henkel CorporationInventors: Alexander P. Mgaya, Balasubramaniam Ramalingam
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Publication number: 20100065211Abstract: The present invention provides a 1-component polyurethane adhesive composition based on at least one NCO-terminated polyurethane prepolymer, which comprises polyamide fibers and at least 10% by weight of fillers.Type: ApplicationFiled: November 20, 2007Publication date: March 18, 2010Inventors: Bernhard Gruenewaelder, Thomas Bachon, Birgit Ness, Kerstin Schroeder, Thomas Terveer
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Publication number: 20100032093Abstract: A fastening element for the fixed attachment of an object to a surface. The element comprises a base body which is capable of accommodating an element for holding the object and can be attached to the surface with the aid of a moisture-curable bonding and fixing agent. The base body is capable of acting at least in part as a water reservoir and/or of accommodating a water reservoir therein such that the agent can receive moisture for curing from the water reservoir. An installation system comprising the fastening element and a moisture-curable agent and a method of curing the agent are also disclosed. This Abstract is not intended to define the invention disclosed in the specification, nor intended to limit the scope of the invention in any way.Type: ApplicationFiled: August 7, 2009Publication date: February 11, 2010Applicant: NIE WIEDER BOHREN AGInventor: Frank BRAUN
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Patent number: 7645831Abstract: Reactive hot melt adhesives compositions with long open time and/or high green strength are prepared by the use of urethane diols. These results are achievable at moderate/low application viscosity or low application temperature.Type: GrantFiled: March 26, 2004Date of Patent: January 12, 2010Assignee: Henkel AG & Co. KGaAInventors: Andrew Slark, Neal Williams, Gavin Toovey
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Publication number: 20100003526Abstract: A one-component, moisture curing composition that has a) at least one polyurethane polymer P1, being liquid at room temperature and having isocyanate groups and b) at least one polyurethane polymer A of the formula (Ia) or (Ib), being solid at room temperature and having aldimine groups with a melting point in the range from 40° C. to 80° C., the composition 1) being capable of being applied warm; 2) having adjustable cure times and a good initial strength with suitable application properties; 3) curing under the influence of humidity without bubbles; and 4) having a good elasticity and mechanical rigidity after curing.Type: ApplicationFiled: October 31, 2007Publication date: January 7, 2010Applicant: SIKA TECHNOLOGY AGInventors: Urs Burckhardt, Michael Schlumpf
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Patent number: 7635738Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.Type: GrantFiled: July 9, 2007Date of Patent: December 22, 2009Assignee: Tyco Healthcare Group LPInventor: Mark S. Roby
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Patent number: 7629056Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.Type: GrantFiled: June 4, 2004Date of Patent: December 8, 2009Assignee: Hitachi Chemical Company, Ltd.Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
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Patent number: 7604868Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.Type: GrantFiled: September 16, 2005Date of Patent: October 20, 2009Assignee: Hitachi Chemical Company, Ltd.Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
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Publication number: 20090181259Abstract: A soft magnetic metal strip laminate that has high adhesion strength between metal strips, free from delamination, an excellent magnetic property, a high space factor, and a process for production thereof. A process for production of a soft magnetic metal strip laminate that includes plural soft magnetic metal strips laminated by using a polyamide acid solution includes the steps of applying the polyamide acid solution on the soft magnetic metal strip, performing semicuring heat treatment to obtain the degree of imidization of the polyamide acid solution which is in the range of 15 to 70%, laminating plural soft magnetic metal strips to each other through the polyamide acid solution, and performing the heat treatment of the heating and the hot pressing to obtain the degree of imidization of the polyamide acid solution which is more than 90%.Type: ApplicationFiled: April 5, 2007Publication date: July 16, 2009Inventors: Koichiro Kurihara, Yoshitsugu Furui
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Publication number: 20090165926Abstract: A method and system is described herein for using a polyimide adhesive to bond a first metal layer to a second metal layer used in a gas turbine engine. The polyimide adhesive may be a film or a paste and is able to withstand operating temperatures in excess of 600 degrees Fahrenheit (315 degrees Celsius). In an exemplary embodiment, the second metal layer is an outer face skin of an exhaust nozzle and the first metal layer is a metal doubler configured to cover a damaged portion of the outer face skin. In some embodiments, the first and second metal layers may be formed of titanium.Type: ApplicationFiled: October 24, 2007Publication date: July 2, 2009Applicant: United Technologies CorporationInventors: Daniel M. Stadtlander, William F. Bogue, Charles R. Watson
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Publication number: 20090159204Abstract: The invention relates to compositions which contain at least one isocyanate-containing polyurethane polymer P, which is produced from at least one polyisocyanate and at least one polyol, in addition to at least one aldimine-containing compound of formula (I). The compositions are stable during storage and harden quickly under the influence of moisture, are non-porous and do no not separate rich substances. Said compositions, the hardened compositions, and the resulting separated products are odour-less. The compositions can be used as an adhesive, sealant or coating which exhibit good mechanical properties and adhesion.Type: ApplicationFiled: September 29, 2006Publication date: June 25, 2009Inventor: Urs Burckhardt
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Patent number: 7537839Abstract: The present invention generally relates to anaerobically curable compositions of: (a) a cyanate ester compound having the structure of formula I: R1O—C?N)m??(I) ?wherein m is from 2 to 5 and R1 is an aromatic nucleus-containing residue; (b) a (meth)acrylate monomer; and (c) an anaerobic cure inducing composition comprising peroxide and saccharin, wherein said composition is free of added metallic catalyst.Type: GrantFiled: April 2, 2007Date of Patent: May 26, 2009Assignee: Henkel CorporationInventors: Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski
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Publication number: 20090101280Abstract: A method of producing a flexible single-sided polyimide copper-clad laminate having excellent flex properties. The method comprises: (A) forming a polyamic acid coating by applying a polyamic acid to the surface of a copper foil starting material, (B) forming a laminate by bonding a polyimide film to the polyamic acid coating, and (C) heat treating the laminate, wherein the copper foil starting material is a material for which, if the copper foil starting material is subjected to a heat treatment for 30 minutes at 200° C. in a non-oxidizing atmosphere and the intensity of the (200) plane determined by X-ray diffraction following this heat treatment is termed I, and if the intensity of the (200) plane determined by X-ray diffraction of a copper powder that has not been subjected to heat treatment is termed I0, I and I0 satisfy a relationship represented by a formula (I) shown below: I/I0>20 ??(I).Type: ApplicationFiled: October 17, 2008Publication date: April 23, 2009Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Jun ASAZUMA, Masahiro USUKI, Tadashi AMANO
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Patent number: 7507461Abstract: Core-skin bonding is improved between honeycomb and composite face sheets by applying a nylon-based (polyamide) adhesive to the edge of the honeycomb prior to bonding. Edge coating of honeycomb with polyamide adhesives is useful in further increasing the bond strength between honeycomb and prepreg face sheets, especially when the matrix resin of the prepreg is designed to adhere the prepreg to the honeycomb.Type: GrantFiled: September 1, 2004Date of Patent: March 24, 2009Assignee: Hexcel CorporationInventors: Yen-Seine Wang, Robert Morrison, Clark Smith
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Patent number: 7495059Abstract: Polyurethane-based pressure-sensitive adhesive, characterized in that the polyurethane is composed of the following starting materials which are reacted catalytically with one another in the stated proportions: a) at least one aliphatic or alicyclic polyisocyanate having a functionality of in each case less than or equal to three, b) a combination of at least one triol A based on polypropylene glycol and having an average number-averaged molecular weight Mn of less than or equal to 1000 and a triol B based on polypropylene glycol and having an average number-averaged molecular weight Mn of greater than or equal to 1000, preferably greater than or equal to 3000, the ratio of the number of hydroxyl groups of the triol component A to the number of hydroxyl groups of the triol component B being between greater than 0 and 12, the ratio of the number of isocyanate groups to the total number of hydroxyl groups being between 0.8 and 1.15, preferably between 0.95 and 1.Type: GrantFiled: June 23, 2006Date of Patent: February 24, 2009Assignee: tesa AGInventors: Uwe Schümann, Kirstin Weiland, Philippe Hesse
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Patent number: 7495035Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.Type: GrantFiled: August 10, 2004Date of Patent: February 24, 2009Assignee: Mitsui Chemicals, Inc.Inventors: Yugo Yamamoto, Yasushi Mizuta, Yuichi Ito
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Patent number: 7482064Abstract: Disclosed is a composite wood component having upper and lower surface layers and a core layer; a first glueline layer; a second glueline layer; and an overlay layer.Type: GrantFiled: August 8, 2005Date of Patent: January 27, 2009Assignee: Huber Engineered Woods LLCInventor: Brian Christopher Gerello
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Publication number: 20080311412Abstract: Adhesive polymers are formed when polyvalent azides and alkynes are assembled into crosslinked polymer networks by copper-catalyzed 1,3-dipolar cycloaddition. The condensation polymerization is efficiently promoted by Cu ions either leached from the metal surface or added to the monomer mixture, and strong interactions with metal surfaces are provided by the multiple triazole binding elements produced. The adhesive polymers may be formed either as adhesive polymer coatings or as adhesive polymer cement.Type: ApplicationFiled: July 22, 2005Publication date: December 18, 2008Applicant: THE SCRIPPS RESEARCH INSTITUTEInventors: Valery Fokin, M. G. Finn, K. Barry Sharpless
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Patent number: 7465778Abstract: A curable, alkoxysilane-functional polyether urethane composition formed by combining a) a first silane terminated polyurethane prepared by reacting i) a mono-functional compounds with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one or more reactive silane groups to form a moisture-curable, alkoxysilane-functional polyether urethane; and b) a second silane terminated polyurethane prepared by reacting i) an alkyl monofunctional alcohol, amine, and/or thiol, with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one more reactive silane groups. The urethane composition can be used in coating, sealant and/or adhesive compositions. The coating compositions are used to form a coated substrate.Type: GrantFiled: December 19, 2003Date of Patent: December 16, 2008Assignee: Bayer MaterialScience LLCInventors: Richard R. Roesler, Derek L. Crawford
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Patent number: 7462651Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.Type: GrantFiled: March 30, 2006Date of Patent: December 9, 2008Assignee: National Starch and Chemical Investment Holding CorporationInventors: Jie Cao, Donald E. Herr
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Patent number: 7459047Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.Type: GrantFiled: August 2, 2005Date of Patent: December 2, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
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Patent number: 7397045Abstract: An exposure apparatus includes a loading device, a first energy-producing device, and a second energy-producing device. The loading device comprises a plurality of supporting elements, supporting a panel. The first and second energy producing devices are disposed above and below the loading device, respectively.Type: GrantFiled: January 30, 2006Date of Patent: July 8, 2008Assignee: AU Optronics Corp.Inventor: Ying-Jyh Liao
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Publication number: 20080078502Abstract: The invention relates to a method for preparing a laminate comprising providing an aluminum foil inner layer, a paper middle layer, and an aluminum foil outer layer; laminating the inner aluminum foil layer to the middle layer by a process selected from the group consisting of adhesive lamination with polyurethane, polyvinyl acetate, and an acrylic-type adhesive, and extrusion lamination with polyethylene; curing the inner aluminum foil layer and middle paper layer; laminating the middle paper layer and the outer aluminum foil layer by a process selected from the group consisting of adhesive lamination with polyurethane, polyvinyl acetate, and an acrylic-type adhesive, and extrusion lamination with polyethylene; and curing the inner aluminum foil layer, the middle paper layer and the outer aluminum foil layer.Type: ApplicationFiled: October 2, 2006Publication date: April 3, 2008Inventors: Wilfred L. Castillo, Grace N. Mercado, Johnny D. Lee, Miling C. Fong, Calixto Y. Laureano
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Publication number: 20080053613Abstract: An amine organoborane polymerizable composition and uses for the composition are disclosed. Also disclosed are assemblies and methods of forming those assemblies using the polymerizable composition as an adhesive.Type: ApplicationFiled: August 21, 2007Publication date: March 6, 2008Inventors: Yee Y. Wang, Barbara J. Walter
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Publication number: 20070254152Abstract: Polyurethane-based pressure-sensitive adhesive, characterized in that the polyurethane is composed of the following starting materials which are reacted catalytically with one another in the stated proportions: a) at least one aliphatic or alicyclic polyisocyanate having a functionality of in each case less than or equal to three, b) a combination of at least one triol A based on polypropylene glycol and having an average number-averaged molecular weight Mn, of less than or equal to 1000 and a triol B based on polypropylene glycol and having an average number-averaged molecular weight Mn of greater than or equal to 1000, preferably greater than or equal to 3000, the ratio of the number of hydroxyl groups of the triol component A to the number of hydroxyl groups of the triol component B being between greater than 0 and 12, the ratio of the number of isocyanate groups to the total number of hydroxyl groups being between 0.8 and 1.15, preferably between 0.95 and 1.Type: ApplicationFiled: June 23, 2006Publication date: November 1, 2007Applicant: tesa AGInventors: Uwe Schumann, Kirstin Weiland, Philippe Hesse
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Patent number: 7271227Abstract: The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength on oily metal surfaces.Type: GrantFiled: April 20, 2004Date of Patent: September 18, 2007Assignee: Henkel CorporationInventors: Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski
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Patent number: 7267886Abstract: Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I wherein R1 is C1–C10 alkyl, R2, R3 and R4, which may be the same or different, are, C1–C10 alkyl or C3–C10 cycloalkyl, phenyl, or phenyl-substituted C1–C10 alkyl or C3–C10 cycloalkyl, provided that any two of R1–R4 may optionally be part of a carbocyclic ring, and M+ is a metal ion or a quaternary ammonium ion. Particular examples of initiator compounds include sodium tetraethyl borate and lithium tetraethyl borate, lithium phenyl triethyl borate and tetraethylammonium phenyl triethyl borate.Type: GrantFiled: December 3, 2004Date of Patent: September 11, 2007Assignee: Loctite (R&D) LimitedInventors: Brendan J. Kneafsey, Gerry Coughlan
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Patent number: 7268183Abstract: Reactive polyurethane hotmelts comprising crystallizing polyesterpolyols based on fumaric acid and 1,6-hexanediol. These hotmelts exhibit good pressure-sensitive adhesive (PSA) properties over a very broad temperature range. The reactive polyurethane hotmelts are prepared by mixing a polyol mixture containing at least on crystallizing polyesterpolyol with an excess of polyisocyanates.Type: GrantFiled: August 15, 2003Date of Patent: September 11, 2007Assignee: Bayer MaterialScience AGInventors: Matthias Wintermantel, Hermann Perrey, Christian Wamprecht, Walter Meckel, Jürgen Ramthun
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Patent number: 7250091Abstract: The present invention discloses a seating system that includes a seat back (20) with one or more plastic panels (22) that extend across a lateral distance of the seat back (20). The seat back (20) preferably includes one or more reinforcements (30) attached to the plastic panels (22).Type: GrantFiled: January 13, 2004Date of Patent: July 31, 2007Assignee: Dow Global Technologies IncInventors: Vikas Gupta, Hein J. Koelman, Eric Kurtycz
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Patent number: 7247388Abstract: A vulcanizable adhesive composition, which comprises 100 parts by weight of phenolxylylene resin or phenolbiphenyl resin, 10 to 1,000 parts by weight of resol-type phenol resin, 0 to 1,000 parts by weight of novolak-type phenol resin, 10 to 1,000 parts by weight of unvulcanized nitrile rubber and 10 to 500 parts by weight of chlorinated polyethylene, is effectively applied to (hydrogenated) nitrile rubber with a nitrile content of 18 to 48%, and has a suppression effect on a decrease in the adhesiveness even if exposed to dip in various cryogenic liquids such as flon gas, polyalkylene glycol, water, etc. for a long time.Type: GrantFiled: August 27, 2003Date of Patent: July 24, 2007Assignee: NOK CorporationInventors: Kiyofumi Fukasawa, Tomohiro Kaise
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Patent number: 7189457Abstract: The present invention is a laminate comprising at least one layer of an polyallylamine-based coating that is and in direct contact with at least one other polymeric layer.Type: GrantFiled: December 12, 2003Date of Patent: March 13, 2007Assignee: E. I. du Pont de Nemours and CompanyInventor: Jerrel C. Anderson
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Patent number: 7060759Abstract: A moisture-reactive hot-melt adhesive composition is provided. Particularly, a composition that includes a polyol, an anhydride-functional polymer, and a polyisocyanate. Also provided are a method for forming the adhesive composition and a method for bonding substrates using the adhesive.Type: GrantFiled: March 6, 2003Date of Patent: June 13, 2006Assignee: Rohm and Haas CompanyInventor: Larry Frank Brinkman
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Patent number: 7025853Abstract: A moisture-reactive hot-melt composition, useful as an adhesive, is provided that has improved balance of open time and green strength. In particular, the composition is made from a polyol, a polyisocyante, and an acrylic polymer. Also provided are a method for making such compositions and a method for using such compositions for bonding substrates.Type: GrantFiled: June 12, 2003Date of Patent: April 11, 2006Assignee: Rohm and Haas CompanyInventor: Mark Alan Kesselmayer
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Patent number: 7022804Abstract: The invention relates to a moisture-crosslinkable hot-melt adhesive which is composed of a polyurethane prepolymer obtained by polyaddition of at least one polyol to at least one isocyanate chosen from the group of diisocyanates trimerized as isocyanurates and reaction products of diisocyanates with water, the prepolymer having a content of free NCO group of between 1 and 25% by weight. The adhesive according to the invention may be used for the adhesive bonding of fixing components of the Velcro® type to articles intended for hygiene.Type: GrantFiled: June 4, 2003Date of Patent: April 4, 2006Assignee: Bostik SAInventors: Michel Miskovic, François Bauduin, Patrick Bouttefort, Jean-François Chartrel