Nitrogenous Resin Patents (Class 156/330.9)
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Patent number: 12152161Abstract: The present invention relates to a polyurea coating composition comprising (A) a polyisocyanate; (B) a polyaspartic ester; and (C) an aspartic ester. The polyaspartic ester (B) is represented by the structure below: where Z=a cycloalkyl, alkyl or aryl group, R1, R2=alkyl groups containing 1-10 carbon atoms; and n=2-4. The aspartic ester (C) is derived from a secondary heterocyclic amine in a 3-7 membered ring compound bearing at least one secondary amine functionality. This invention also relates to use of a polyurea coating composition comprising (A)-(C) for the preparation of a polyurea coating. This invention further relates to a process for preparing a polyaspartic/aspartic ester mixture in-situ by initially reacting an ester of fumaric acid or maleic acid with a polyamine and then reacting the unreacted ester of fumaric acid or maleic acid to completion with a secondary heterocyclic amine.Type: GrantFiled: April 24, 2019Date of Patent: November 26, 2024Assignee: Evonik Operations GmbHInventors: Gauri Sankar Lal, Shafiq Fazel, Stephen Michael Boyce
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Patent number: 12071572Abstract: [Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.Type: GrantFiled: December 18, 2020Date of Patent: August 27, 2024Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Hirofumi Iguchi, Toshiaki Nakamura
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Patent number: 12037445Abstract: The present disclosure relates to processes for the production of a polyurethane material, where (a) di- and/or polyisocyanates, (b) compounds which have hydrogen atoms reactive toward isocyanate groups and which do not include compounds having carbon-carbon double bonds, (c) compounds including at least one carbon-carbon double bond, (d) optionally catalyst that accelerates the urethane reaction, and (e) optionally other auxiliaries and additives are mixed to give a reaction mixture and the mixture is hardened at temperatures above 120° C. The present disclosure further relates to a polyurethane material obtainable by this process, and also to the use of the polyurethane material, in particular of a polyurethane fiber-composite material as structural components.Type: GrantFiled: February 11, 2019Date of Patent: July 16, 2024Assignee: BASF SEInventors: Andreas Emge, Andre Meyer, Berend Eling, Stefan Auffarth
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Patent number: 12036771Abstract: Provided is an adhesive comprising a reaction product of (A1) an aliphatic isocyanate having an NCO group content of 18 to 64 and (A2) a polyol or polyamine having a molecular weight of from 400 to 4000; and (B) a polyaspartate compound, wherein viscosity of the adhesive, as measured @ 23° C. according to ASTM D4212-16, remains below 60 seconds for after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23° C. according to ASTM D 1876-01 or substrate tear, in less than or equal to five days after the substrate is laminated with the adhesive. The adhesives are free of aromatic amines and may find use in multi-layered laminated films for the production of flexible packaging useful in a variety of industries, including the food processing, cosmetics, and detergents industries.Type: GrantFiled: June 27, 2023Date of Patent: July 16, 2024Assignee: Covestro LLCInventors: Karl W. Haider, Raymond Zeliznik, Philip Jones, Tina Kasardo
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Patent number: 12037520Abstract: Provided is an adhesive comprising a reaction product of (A) an aliphatic polyisocyanate having a molecular weight of from 132 to 700; and (B) a polyaspartate comprising a reaction product of (B1) a polyamine having a molecular weight of at least 240, and (B2) a Michael addition receptor, wherein viscosity @ 23° C. according to ASTM D1084-16, remains below 150 cps after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23° C. according to ASTM D 1876-01 or substrate tear, in less than five days after the substrate is laminated with the adhesive. The inventive flexible packaging adhesives are free of aromatic amines and may find use in multilayer laminates for a variety of industries, including the food processing, cosmetics, and detergents industries.Type: GrantFiled: June 15, 2023Date of Patent: July 16, 2024Assignee: Covestro LLCInventors: Karl W. Haider, Raymond Zeliznik, Philip Jones
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Patent number: 12012534Abstract: [Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.Type: GrantFiled: December 18, 2020Date of Patent: June 18, 2024Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Hirofumi Iguchi, Toshiaki Nakamura
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Patent number: 11401377Abstract: The present invention relates to a polymer comprising a repeating group having the structure of formula (I) wherein R, R1, R2, R3, R4, X, and s are as described herein and salt thereof. Also disclosed is a process of synthesizing such polymers.Type: GrantFiled: August 27, 2020Date of Patent: August 2, 2022Assignee: IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC.Inventors: Nacu Hernandez, Mengguo Yan, Eric William Cochran, John Edward Matthiesen, Jean-Philippe Tessonnier
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Patent number: 10607963Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.Type: GrantFiled: September 15, 2016Date of Patent: March 31, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
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Patent number: 9868865Abstract: Multi-part and one-part dry erase compositions are disclosed herein, including methods of using such compositions to form low/zero volatile organic compound (VOC) dry erasable coatings. The multi-part dry erase composition comprises a mixture of a first part and a second part, wherein the first part comprises a curable epoxy resin, such as an aromatic epoxide with diglycidyl epoxy functionality, and the second part comprises an amine curing agent, such as cycloaliphatic polyamine. The one-part compositions comprise monomers, oligomers, and polymers of an aliphatic or aromatic isocyanate, such as a diisocyanate, and an amine curing agent, such as morpholine and derivatives thereof. The dry erase compositions have a VOC content of less than about 25 g/L. Dry erasable coatings also include the abilities to dry erase additional markings in addition to dry erase markers, to include, but not limited to, regular marker, permanent marker, pen, highlighter, crayon, and spray paints.Type: GrantFiled: March 7, 2014Date of Patent: January 16, 2018Inventor: Michael Heiman
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Patent number: 9771318Abstract: Provided is a composition comprising one or more compound having the structure of formula II: wherein A is a residue of a polyisocyanate, L is a linking group formed by a reaction of an isocyanate group with an isocyanate-reactive group, n is 5 to 25, m is 0 to 100, and Z is methyl or ethyl or propyl, and wherein the ratio of the sum of the moles of isocyanate groups plus the moles of said L groups to the moles of said Z groups is 2:1 to 30:1. Also provided is an emulsion in which the particles comprise such a composition and further comprise one or more water-insoluble compound that does not have the structure A-NCO.Type: GrantFiled: October 28, 2013Date of Patent: September 26, 2017Assignees: Rohm and Haas Company, Dow Global Technologies LLCInventors: Yongchun Chen, Shiling Zhang, Ling Yuan, Guoling Hou
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Patent number: 9269623Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.Type: GrantFiled: October 22, 2013Date of Patent: February 23, 2016Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark S. Oliver, Michael K. Gallagher, Karen R. Brantl
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Publication number: 20150086783Abstract: The present invention is directed to compositions useful for sealing substrates and substrates coated therewith. Additionally, methods of sealing and improving sealing performance using such compositions are provided.Type: ApplicationFiled: December 1, 2014Publication date: March 26, 2015Inventors: Shabbir Attarwala, Viraj Kadam, Qinyan Zhu, Pradhyumna Ingle, Gregg Rossier
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Patent number: 8962134Abstract: A sealant article useful for sealing a substrate surface having a first surface and a second surface is provided. The first surface comprises a deformable composition that is capable of conforming to a substrate surface when subjected to heat and/or pressure. The second surface of the sealant article has been at least partially cured by exposing said surface to an amount of radiation effective to induce at least partial curing of the second surface of the sealant article. Prior to such curing, the second surface also is comprised of the deformable composition. Such at least partial curing is effective to render the second surface less deformable than the first surface.Type: GrantFiled: April 6, 2009Date of Patent: February 24, 2015Assignee: Henkel AG & Co. KGaAInventors: Jeffrey T. Pachl, Don K. Howard, Gradie C. Rorie, Gregory A. Ferguson
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Publication number: 20150027627Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.Type: ApplicationFiled: October 14, 2014Publication date: January 29, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je LEE, Jae Ho SHIN, Dek Gin YANG
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Patent number: 8940127Abstract: A high gloss laminated panel is manufactured by applying a layer of a resin composition on a substrate layer and applying elevated pressure at elevated temperature for a time sufficient to at least partially cure the resin preferably without back-cooling. The resin composition includes a melamine formaldehyde resin in water and further includes one or more additives chosen from the group of thiourea, 1-amino-2-thiourea, stabilized guanidine, thio-acetamide, or an additive.Type: GrantFiled: August 22, 2012Date of Patent: January 27, 2015Assignee: Metadynea Austria GmbHInventors: Robert Alexander Wagner, Adisa Cokovic, Harald Trachsler, Karin Lepedat
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Publication number: 20150020965Abstract: The present disclosure is concerned with improved curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first portion, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures. Improvements in the adhesive compositions that relate to increased shelf life are also presented.Type: ApplicationFiled: October 7, 2014Publication date: January 22, 2015Applicant: Simpson Strong-Tie Company. Inc.Inventor: Quentin Lewis Hibben
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Publication number: 20140352884Abstract: A method of joining two objects includes applying an adhesive composition between and in contact with a first object and a second object, and allowing the adhesive composition to harden to form an adhesive bond between the first and second objects, wherein the adhesive composition consists essentially of an optional stabilizer and a reversible polymer material that can reversibly transition between a liquid state and a solid state by reversible cycloaddition reactions, wherein upon cooling, the reversible polymer material transitions from a liquid state to a solid state by reversible cycloaddition reactions within a time period of less than about 2 minutes.Type: ApplicationFiled: May 30, 2013Publication date: December 4, 2014Inventor: James D. MAYO
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Publication number: 20140331627Abstract: A filter element has a filter body of at least one layer of a flat web-shaped filter medium, separating a raw side from a clean side of the filter element. A hot melt system is provided and the filter body is glued together by the hot melt system. The hot melt system has a hot melt mixture that is made up of 15-85% by weight of a first hot melt that is polyester-based and 15-85% by weight of a second hot melt that is polyamide-based. The first hot melt and the second hot melt together amount to 100% by weight of the hot melt mixture. The hot melt mixture constitutes a proportion of more than 75% by weight of the hot melt system. The remainder of the hot melt system is made up of fillers, pigments, tackiness-imparting resins, and hot melts based on a polycondensate.Type: ApplicationFiled: July 28, 2014Publication date: November 13, 2014Inventors: Tanja Majer, Gerhard Vilsmaier
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Publication number: 20140290854Abstract: The present invention relates to an adhesive composition comprising a component A and a component B, wherein said component A comprises bisphenol A resin; a hydrophilic solvent, preferably acetone or ethanol or mixtures thereof; and silica gel (SiO2) or alumina (Al2O3) and said component B comprises aliphatic or aromatic polyamines, preferably polyamidoamines; polythiol; a combination of primary and tertiary amines, preferably 1-(2-aminoethyl)piperazine and ethylenediamine; optionally a hydrophilic solvent and optionally silica (SiO2) or alumina (Al2O3) gel. Said composition has the advantage that it cures, in addition to under dry conditions, in the presence of water or humidity in a time of 30 minutes as much and is flexible. The present invention also relates to a process for obtaining said adhesive composition.Type: ApplicationFiled: October 24, 2012Publication date: October 2, 2014Inventors: Jorge Parellada Llobet, Jordi Arbusá Amorós, Salvador Borrós Gómez
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Patent number: 8845850Abstract: Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided.Type: GrantFiled: November 15, 2012Date of Patent: September 30, 2014Assignee: Henkel US IP LLCInventors: Jeremy Kostick, Loren Nauss, Alessandro Machado Jesus, Gary Patch, Gary Tremley, Kyle Zukauskas, Berryinne Decker
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Patent number: 8846809Abstract: A urethane adhesive composition includes a first liquid and a second liquid, the first liquid containing a prepolymer obtained by reacting a polyisocyanate and a high-molecular-weight polyol (I), and at least one filler selected from talc and calcium carbonate, and containing 20 parts by mass or more of talc, 0 to 40 parts by mass of calcium carbonate, and 10 parts by mass or more of zeolite based on 100 parts by mass of the polyisocyanate, the high-molecular-weight polyol (I), and the prepolymer in total, the second liquid containing a high-molecular-weight polyol (II) and a low-molecular-weight polyol, the ratio of the number of moles of hydroxyl groups derived from the low-molecular-weight polyol to the total number of moles of hydroxyl groups derived from the high-molecular-weight polyol (I) and the high-molecular-weight polyol (II) being four or more.Type: GrantFiled: September 10, 2008Date of Patent: September 30, 2014Assignee: Emulsion Technology Co., Ltd.Inventors: Yoshinori Igarashi, Koichiro Higasa
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Patent number: 8816037Abstract: The invention relates to moisture-curing compositions which comprise at least one aromatic isocyanate group-bearing polyisocyanate and at least one dialdimine of formula (I). The compositions according to the invention have a longer open time and at the same time a shorter curing time, they are storage-stable and cure without forming bubbles. They are especially suitable as adhesives, sealing agents, potting compounds or coating materials, the use as sealing agents being especially advantageous.Type: GrantFiled: March 27, 2008Date of Patent: August 26, 2014Assignee: Sika Technology AGInventor: Urs Burckhardt
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Publication number: 20140158286Abstract: Method for producing a cladding element. The method includes applying a resin to a visible surface and to a contact surface of a wood material base board, applying at least one non-resin impregnated paper ply to the visible surface and at least one non-resin impregnated paper ply to the contact surface of the wood material base board, and pressing the at least one non-resin impregnated paper ply onto the resin applied visible surface and the at least one non-resin impregnated paper ply onto the resin applied contact surface. In this manner, the at least one paper ply on the visible surface and at least one paper ply on the contact surface are fully impregnated.Type: ApplicationFiled: February 14, 2014Publication date: June 12, 2014Applicant: INTERGLARION LIMITEDInventor: Herbert RUHDORFER
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Patent number: 8735506Abstract: A process for making UV curable pressure sensitive adhesive compositions by derivatizing an acrylic polymer with a derivatizing agent prepared from a hydroxy-functional acrylate monomer and a diisocyanate. The derivatizing agent typically has a ratio of hydroxy-functional acrylate monomer to diisocyanate greater than about 1:1. Also disclosed are UV curable pressure sensitive adhesives made with the derivatizing agent and methods for adhering substrates with pressure sensitive adhesive compositions.Type: GrantFiled: March 31, 2010Date of Patent: May 27, 2014Assignee: Ashland Licensing and Intellectual Property LLCInventors: Terry E. Hammond, Xiaochuan Hu
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Patent number: 8734609Abstract: A process for continuous manufacturing of moisture-curable polyurethane formulations used as sealants and adhesives. The process is characterized by the fact that the reactive components are introduced independently, and without the need for a prepolymer, to a mixer. Solid or liquid raw materials can be either pre-blended or fed directly to the mixer, a twin-screw extruder, which provides the requisite energy to homogenously mix the raw materials and drive the chemical reaction. The process is designed so that the extruder barrel and screw allow variable feed addition and heat exchange down the length of the machine. This allows various operations to be performed at different points in the extruder, including reaction, dispersive mixing, distributive mixing and devolitization.Type: GrantFiled: December 24, 2008Date of Patent: May 27, 2014Assignee: Bostik, Inc.Inventor: Sean G. Duffy
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Patent number: 8716427Abstract: A two-component curable solventless adhesive which enables a laminated composite film comprising a barrier layer and a plastic film laminated with each other to maintain excellent appearance and adhesive strength for a long period even after a sterilization treatment at high temperature, and to appropriately adjust a reaction between a base resin and a curing agent during a production of the laminated composite film. The two-component curable solventless adhesive comprises a base resin and a curing agent, wherein the base resin contains a polyol having an acid group and a secondary or tertiary terminal hydroxyl group accounting for 30% or more of the entire terminal hydroxyl groups of the polyol, and the curing agent contains an isocyanate group-terminated urethane prepolymer containing at least an aralkyl polyisocyanate and/or a modified substance thereof as a raw polyisocyanate, and a content of a low molecular weight polyisocyanate is defined.Type: GrantFiled: February 4, 2005Date of Patent: May 6, 2014Assignee: Mitsui Chemicals, Inc.Inventors: Akihiro Imai, Kazuaki Imamura, Taiji Morimoto, Hiroshi Kawasaki, Mikio Matsufuji
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Patent number: 8685201Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.Type: GrantFiled: April 6, 2009Date of Patent: April 1, 2014Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on Behalf of Arizona State UniversityInventors: Shawn O'Rourke, Douglas Loy, Hanqing Jiang
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Patent number: 8652293Abstract: A moisture-curable and biodegradable adhesive that includes the reaction product of: (a) an isocyanate component having an average functionality of at least 2; (b) an active hydrogen component having an average functionality greater than 2.1; and (c) an ionic salt component having an average hydroxyl or amino functionality, or combination thereof, of at least 1.Type: GrantFiled: April 5, 2012Date of Patent: February 18, 2014Assignee: Cohera Medical, Inc.Inventors: Jason Smith, Eric Beckman
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Publication number: 20130319611Abstract: A composition for the protection of sheer hosiery comprising: a styrene polymer; an octylacrylamide/acrylates/butylaminoethyl methacrylate copolymer; a polyurethane-14 AMP-acrylates copolymer; and an AMP-100™ (amino methyl propanol) or triethanolamine emulsifier and surfactant; dissolved in a denatured alcohol/ethanol solvent and contained in a pump spray bottle. The composition to be sprayed on a detected imperfection and the surrounding area, and being allowed to dry, binding in a flexible, natural manner the elongated and broken fibers of the material to the surrounding weave thus preventing further damage to the hosiery.Type: ApplicationFiled: May 31, 2012Publication date: December 5, 2013Inventor: Yla M. Daly
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Patent number: 8598279Abstract: The present invention relates to novel polymer-bound adducts useful as cure components for anaerobic curable compositions. The compositions are particularly useful as adhesives and sealants.Type: GrantFiled: July 23, 2007Date of Patent: December 3, 2013Assignee: Henkel IP US LLCInventors: Andrew D. Messana, Anthony F. Jacobine
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Publication number: 20130288058Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.Type: ApplicationFiled: April 30, 2012Publication date: October 31, 2013Applicant: BREWER SCIENCE INC.Inventors: Wenbin Hong, Tony D. Flaim, Rama Puligadda, Susan Bailey
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Patent number: 8557346Abstract: A composition capable of radiation activated catalysis is provided. The composition comprises a metal compound, a mercapto compound and an olefinic compound. Radiation curable urethane compositions comprising the disclosed composition are also provided. The radiation curable urethane compositions comprise the disclosed composition, a hydroxyl compound and an isocyanate compound. Activation of the composition by radiation in a urethane formulation provides for an efficient method of curing the urethane composition. Coating and adhesive compositions comprising the radiation curable urethane compositions are also provided. In addition, methods for coating and bonding substrates are disclosed.Type: GrantFiled: November 16, 2012Date of Patent: October 15, 2013Assignee: Ashland Licensing and Intellectual Property LLCInventors: Raymond S. Harvey, Thomas M. Moy, Gary M. Carlson
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Publication number: 20130240121Abstract: A method for applying stones to metallic elements, particularly for the adhesive bonding of glass crystals to surfaces of tubular elements, which includes the steps of preparing an application surface (2) of a metallic element, spreading an adhesive medium (3) on the application surface (2) and making a single lateral face (4) of a first stone (5) to be applied adhere to the application surface (2). The axis of symmetry (10) of the first stone defines a first angle of intersection (8) with the application surface (2).Type: ApplicationFiled: November 17, 2011Publication date: September 19, 2013Inventors: Stefano Del Pia, Alfredo Del Pia, Giorgio Del Pia
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Patent number: 8524814Abstract: The present invention provides for compounds comprising at least one phosphonate or phosphinate moiety; and at least one moiety selected from an aromatic nitroso or an aromatic nitroso precursor and combinations thereof. Adhesive compositions comprising the compounds may find utility in bonding polymers to metal and or hydroxylated surfaces such as glass. Suitable polymers include natural and synthetic rubbers. The aromatic nitroso precursor may be a nitrosobenzene precursor such as at least one of a quinone dioxime or a quinone oxime.Type: GrantFiled: April 13, 2012Date of Patent: September 3, 2013Assignee: Henkel Ireland LimitedInventors: Nigel Fay, Eimear M. Fleming, Darren Nolan, Brendan J. Kneafsey
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Patent number: 8518208Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.Type: GrantFiled: August 26, 2010Date of Patent: August 27, 2013Assignee: Cytec Technology Corp.Inventor: Dalip Kohli
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Publication number: 20130206333Abstract: A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.Type: ApplicationFiled: July 26, 2011Publication date: August 15, 2013Applicant: ZEPHYROS, INC.Inventor: Michael Czaplicki
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Patent number: 8500947Abstract: The present disclosure provides compositions having reduced viscosity which may be used as adhesives or tissue sealants, and includes methods for speeding the cure rate of such compositions.Type: GrantFiled: October 27, 2008Date of Patent: August 6, 2013Assignee: Covidien LPInventor: Ferass Abuzaina
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Publication number: 20130177770Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.Type: ApplicationFiled: September 28, 2011Publication date: July 11, 2013Applicants: Sulfur Chemical Institute Incorporated, Kunio MoriInventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo
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Publication number: 20130171901Abstract: An adhesive compound for a hot-sealing insert is provided, as are an insert that contains this adhesive compound, and a method for fixing the insert. The adhesive compound has a thermoplastic hot-melt adhesive (A) that is not adhesive at room temperature and a pressure sensitive adhesive (B) that is adhesive at room temperature.Type: ApplicationFiled: July 21, 2011Publication date: July 4, 2013Applicant: CARL FREUDENBERG KGInventors: Heike Bartl, Cornelia Kinscherf, Oliver Staudenmayer, Ulrich Scherbel
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Publication number: 20130163255Abstract: An OLED device is discussed. The OLED device includes: a board assembly configured to include organic light emission elements; a plastic cover attached to the board assembly; and an adhesive layer filled between the board assembly and the plastic cover. The adhesive layer is formed from an adhesive composition which includes 50˜95 parts by weight of an acryl-based copolymer resin, 4.7˜44 parts by weight of an acryl monomer, 0.1˜2 parts by weight of a cross linking monomer, 0.1˜2 parts by weight of a visible light initiator, and 0.1˜2 parts by weight of an additive.Type: ApplicationFiled: December 21, 2012Publication date: June 27, 2013Applicant: LG Display Co., Ltd.Inventor: LG Display Co., Ltd.
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Publication number: 20130153146Abstract: There is provided a method of attaching an elongate strip to a door frame of the body of a vehicle comprising application of the elongate strip by means of a device comprising: i. a drive means; ii. an application head; iii. a stress control unit positioned between the drive means and application head and comprising one of more sensor units; iv. and a control unit for controlling the drive means, the elongate strip comprises an adhesive tape comprising a foam layer having first and second major sides and a pressure sensitive adhesive layer associated with one of the major sides of the foam layer, the pressure sensitive adhesive comprising a cross-linked rubber and the foam layer comprises an acrylic polymer of one or more alkyl acrylates having an average of 3 to 14 carbon atoms in the alkyl group, the foam layer having a density of at least 540 kg/m3.Type: ApplicationFiled: August 26, 2011Publication date: June 20, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Volker Paschmann, Siegfried K. Welke, Klaus Malecki, Detlef Richert
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Patent number: 8455608Abstract: The invention relates to a process for preparing a thermoplastic polyisocyanate polyaddition product based on polyisocyanate (i) and compounds which are reactive toward polyisocyanate, with or without the use of chain extenders, a first catalyst (iv) and/or auxiliaries and/or additives (v), wherein a second catalyst is initially vaporized and then applied to the polyisocyanate polyaddition product by condensation, and to the products prepared therefrom.Type: GrantFiled: February 25, 2011Date of Patent: June 4, 2013Assignee: BASF SEInventors: Torben Kaminsky, Dirk Kempfert
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Patent number: 8430989Abstract: A composition that includes aldimines of Formula (I). The composition can be a two-component polyurethane composition. The composition can have a long open time, but build up an early strength quickly, and in the cured state can have high tensile strength and a high modulus of elasticity. The composition can be odorless or at least low-odor before, during and after curing.Type: GrantFiled: May 16, 2011Date of Patent: April 30, 2013Assignee: Sika Technology AGInventors: Urs Burckhardt, Ursula Stadelmann
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Publication number: 20130095264Abstract: A composite intraluminal prosthesis which is preferably used as a vascular prothesis includes a layer of ePTFE and a layer of textile material which are secured together by an elastomeric bonding agent. The ePTFE layer includes a porous microstructure defined by nodes interconnected by fibrils. The adhesive bonding agent is preferably applied in solution so that the bonding agent enters the pores of the microstructure of the ePTFE. This helps secure the textile layer to the ePTFE layer.Type: ApplicationFiled: December 5, 2012Publication date: April 18, 2013Applicant: MAQUET CARDIOVASCULAR LLCInventor: MAQUET Cardiovascular LLC
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Patent number: 8409385Abstract: A transparent laminate is produced by preparing a pair of transparent substrates, forming a sealing portion along the periphery on one of the transparent substrates for sealing a curable resin composition, supplying the curable resin composition in a region on the transparent substrate surrounded by the sealing portion, overlaying the other transparent substrate on the supplied curable resin composition in a reduced pressure atmosphere so that the curable resin composition is sealed as it is sandwiched between the pair of transparent substrates, and subsequently curing the curable resin composition in an atmosphere having a higher pressure than the pressure of the atmosphere in which the composition is sandwiched, to produce the transparent laminate.Type: GrantFiled: June 24, 2009Date of Patent: April 2, 2013Assignee: Asahi Glass Company, LimitedInventors: Hiroshige Ito, Satoshi Niiyama, Satoshi Kikuchi
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Patent number: 8399102Abstract: The current invention relates to a moisture-hardening composition that contains, in addition to a silane-functional polymer with end groups of formula (I), a reaction product that can be manufactured from an amino silane with primary amino groups and an alkene that is free of silane groups. The compositions are characterized by improved expandability with concurrent high reactivity, good adhesion characteristics, and high tear strength and are suited especially for use as elastic bonding substance or sealant.Type: GrantFiled: April 26, 2007Date of Patent: March 19, 2013Assignee: Sika Technology AGInventors: Marcel Oertli, Barbara Jucker, Ueli Pfenninger, Pierre-André Bütikofer
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Publication number: 20130056152Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.Type: ApplicationFiled: November 2, 2012Publication date: March 7, 2013Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventor: HITACHI CHEMICAL COMPANY, LTD.
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Publication number: 20130034324Abstract: An optical fiber sensing apparatus includes: a substrate configured to deform in response to an environmental parameter; an optical fiber sensor including a core having at least one measurement location disposed therein and a protective coating surrounding the optical fiber sensor, the protective coating made from a polyimide material; and an adhesive configured to adhere the optical fiber sensor to the substrate, the adhesive made from the polyimide material.Type: ApplicationFiled: August 3, 2011Publication date: February 7, 2013Applicant: BAKER HUGHES INCORPORATEDInventors: Malcolm S. Laing, Daniel S. Homa, Robert M. Harman, Christopher H. Lambert
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Publication number: 20120325394Abstract: The invention relates to a single-ply protective film that is devoid of a supporting material and consists of a hot-melt adhesive. Said film can be rapidly and easily applied. The invention also relates to a method for applying said film and to a corresponding device.Type: ApplicationFiled: July 5, 2012Publication date: December 27, 2012Applicant: SIKA TECHNOLOGY AGInventor: Martin LINNENBRINK
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Publication number: 20120315462Abstract: Disclosed is a gas-barrier film laminate having at least two gas-barrier film layers laminated via an adhesive layer, wherein the gas-barrier film layer has a substrate film, and at least one constitutive unit layer comprising an anchor coat layer and an inorganic thin film layer formed on at least one surface of the substrate film in that order, and wherein the number of the bubbles having a diameter of at least 0.5 mm and the impurities having a diameter of at least 0.5 mm existing between the gas-barrier film layers is at most 3 in total per 100 cm2.Type: ApplicationFiled: August 24, 2012Publication date: December 13, 2012Applicant: MITSUBISHI PLASTICS, INC.Inventors: Tsutomu Matsui, Shigenobu Yoshida