Abstract: A ceramic multilayer substrate includes a ceramic substrate including a plurality of ceramic layers and electrodes (surface electrodes and internal electrodes) disposed on or in the ceramic layers, which are stacked on each other. A recessed portion is defined on a principal surface of any of the ceramic layers by the electrode and the surrounding ceramic layer. The electrodes (surface electrodes and internal electrodes) are buried or embedded in the ceramic layers. A peripheral portion of the surface electrode is preferably covered with a covering ceramic layer so as to prevent short-circuiting between adjacent electrodes even if surface electrodes and internal electrodes are disposed at narrow intervals and at high density.

Abstract: There is provided a multilayered-type inductor including: a body in which a plurality of sheets are multilayered; and a plurality of internal electrode patterns formed on respective sheets and connected to each other by a conductive via, wherein the plurality of internal electrode patterns include first and second internal electrode patterns having different internal diameters such that they do not overlap each other on respective sheets in a thickness direction of the body, and alternately disposed in the thickness direction of the body.

Abstract: A ceramic conversion element includes an active ceramic layer that converts electromagnetic radiation in a first wavelength range into electromagnetic radiation in a second wavelength range, which is different from the first wavelength range, and a carrier layer transmissive to radiation in the first wavelength range and/or radiation in the second wavelength range, wherein an inhibitor layer is arranged between the active layer and the carrier layer, the inhibitor layer reducing diffusion of activator ions from the active layer into the carrier layer.

Abstract: A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication.

Abstract: There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component manufactured by using the same, and a manufacturing method thereof. The non-magnetic composition for a ceramic electronic component includes a compound represented by ZnCuTiO4 such that the inductance decreasing rate at the high current and the capacitance rate of change of the magnetic body after the application of current according to the temperature change are insensitive, whereby the stable operational characteristics of the ceramic electronic component may be secured.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic capacitor having the same, and a fabrication method thereof. The conductive paste composition for an internal electrode includes a binder, a solvent, and metal powder for an internal electrode, including a nickel particle coated with a nickel nitride.

Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is 10 to 85%.

Abstract: A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the first ceramic green layer of the composite sheet by an ink jet method. Subsequently, a plurality of second ceramic green layers are stacked with the composite sheet such that the shrinkage-retardant layer of the composite sheet defines an outermost layer, thus forming a multilayer composite including an unfired multilayer ceramic substrate and the shrinkage-retardant layer. Then, the multilayer composite is fired, and the shrinkage-retardant layer is removed to obtain a sintered multilayer ceramic substrate.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic electronic component including the same, and a method of manufacturing the same, the conductive paste composition including: a metal powder; and an additive including at least one selected from glutamic acid, amino acids, thiols, and hydrocarbons.

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: A laminated semiconductor ceramic capacitor with a varistor function includes a component body having a plurality of semiconductor ceramic layers formed of a SrTiO3-based grain boundary insulated semiconductor ceramic and a plurality of internal electrode layers predominantly composed of Ni, and external electrodes on both ends of the component body. The external electrodes are electrically connected to the internal electrode layers. A thickness of each of the semiconductor ceramic layers, excluding the outermost semiconductor ceramic layers, is 20 ?m or more, and an average grain diameter of crystal grains in the semiconductor ceramic layers is 1.5 ?m or less. When a central part or the vicinity of the central part in a laminating direction of the semiconductor ceramic layer is analyzed by a WDX method, a ratio x/y of the intensity x of the Ni element to the intensity y of the Ti element is 0.06 or less.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

Abstract: An ESD protection device is provided which experiences only small increases in discharge start voltage and discharge protection voltage and relatively free of scorching or peeling at the ends of the discharge electrodes thereof even if a discharge repeatedly occurs. The ESD protection device has an insulating substrate with a cavity, and in the cavity first and second discharge electrodes are so disposed that the ends thereof face each other with a gap therebetween. A first outer electrode is on the outer surface of the insulating substrate and electrically connected to the first discharge electrode, and a second outer electrode is on the outer surface of the insulating substrate and electrically connected to the second discharge electrode. The ends of the first and second discharge electrodes are thicker than any other portion of the first and second discharge electrodes.

Abstract: A multi-layer electronic component that can be repetitively operated under high voltage, high temperature and high humidity is provided. The multi-layer electronic component comprises a plurality of dielectric material layers made of a sintered material having perovskite structure that includes Pb; and a plurality of internal electrodes, the dielectric material layers and the internal electrodes being stacked alternately one on another, wherein lead compound that remains in the crystal grain boundaries of the dielectric material layers is controlled so that the number of grains of the lead compound not smaller than 0.01 ?m are 2 or less per 100 ?m2 on average.

Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO2, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu—Ba—Si based glass with a thickness of about 1 ?m to about 5 ?m is formed between the metal substrate and the low-temperature sintering ceramic layer.

Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Abstract: A method for fabricating a hermetically sealed electrical feedthrough. The method provides a ceramic sheet and forming at least one via hole in the ceramic sheet, inserting a conductive thickfilm paste into the via hole, laminating the ceramic sheet that has a paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form an integral ceramic substrate, firing the laminated ceramic substrate to sinter the ceramic substrate and cause the paste filled via hole to form a metalized via while the laminated ceramic substrate form a hermetic seal around the metalized via. The upper ceramic sheet and the lower ceramic sheet are removed from the fired ceramic substrate to expose the upper and lower surface of the metalized via.

Abstract: The manufacturing method of the honeycomb structure includes a step of coating a surface of each of releasing sheets with a paste for an electrode, to prepare electrode forming sheets in which the releasing sheets are provided with electrode paste films; a formed honeycomb body with the electrode forming sheets forming step of attaching the electrode forming sheets to a side surface of a tubular formed ceramic honeycomb body which is the curved surface to prepare a formed honeycomb body with the electrode forming sheets; and a honeycomb structure forming step of firing the formed honeycomb body, or removing releasing sheets from the formed honeycomb body to form the formed honeycomb body with the pastes for the electrodes, and then firing the formed honeycomb body with the pastes for the electrodes, to obtain a honeycomb structure having a side surface provided with the electrodes.

Abstract: The device includes a first ceramic layer; a second ceramic layer on the first ceramic layer and having a light emitting element mounting area; a reflective layer so formed on a surface of the second ceramic layer that the reflective layer covers at least the mounting area; a protective layer which covers the reflective layer; a semiconductor light emitting element mounted on the protective layer positioned above the element mounting area; and at least one heat dissipation via passing through the first ceramic layer. The heat dissipation via is disposed in a position that does not overlap with the element mounting area in a direction in which the ceramic layers are stacked.

Abstract: There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component using the same, and a method of manufacturing the same. The non-magnetic composition includes a compound represented by Chemical Formula Zn1-xCuxMn2O4. Therefore, DC bias characteristics of the ceramic electronic component may be improved by employing the non-magnetic composition having no magnetic characteristics.

Abstract: There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.

Abstract: Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic element including a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes formed on dielectric layers positioned in a middle portion of the ceramic element and alternately exposed from both ends of the ceramic element; a plurality of dummy electrodes formed on dielectric layers positioned in upper and lower portions of the ceramic element, respectively; and first and second external electrodes formed on both ends of the ceramic element and electrically connected to the exposed portions of the first and second internal electrodes, wherein the length of each of the dummy electrodes is longer than that of the first and second external electrodes covering the ceramic element.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Td and the thickness of the internal electrode is denoted by Te, 0.5?Te/Td?2.0, and when the thickness of a central portion of the ceramic body is denoted by Tm and the thickness of each of side portions of the ceramic body is denoted by Ta, 0.9?Ta/Tm?0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained.

Abstract: As a dielectric ceramic constituting dielectric layers of a laminated ceramic capacitor, a dielectric ceramic is used which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002?m?1.100 in terms of parts by mol, the Si content n meets 0.5?n?10 in terms of parts by mol, the Mn content u meets 0.5?u?10 in terms of parts by mol, and the Al content w meets 0.02?w?4 in terms of parts by mol, m and n satisfying ?0.4?100(m?1)?n?3.9.

Abstract: To provide a multi-layer piezoelectric element which is easy to be fabricated and which exhibits excellent durability, even when it is driven continuously for a long time under high electric field and high pressure. The multi-layer piezoelectric element comprising a stacked body wherein a plurality of piezoelectric layers and a plurality of metal layers are stacked alternately one on another and it is driven by applying a voltage to adjacent and opposing metal layers, wherein an average grain size of the piezoelectric crystal grains in a side face of the stacked body is larger than an average grain size of the piezoelectric crystal grains in the piezoelectric layer which is sandwiched between the adjacent and opposing metal layers.

Abstract: An electrode device of an electrosurgical instrument is known, comprising at least one electrically conductive electrode section and an electrically insulating carrier section, wherein both the electrode section and the carrier section are made from a ceramic material. In order to improve the mechanical and electrical properties and in order to simplify the production, a green body of the carrier section and a green body of the electrode section are connected to each other, in particular materially, to form a single composite green body and are jointly sintered.

Abstract: A laminated ceramic capacitor that includes a laminated body including dielectric ceramic layers having crystal grains and crystal grain boundaries, and including internal electrode layers. An external electrode is formed on a surface of the laminated body, and is electrically connected to the internal electrode layers exposed at the surface of the laminated body. The laminated body has a composition including a calcium zirconate based perovskite-type compound as a main constituent, and further including Mn, Sr, and Si. When the laminated body is dissolved, the Si contained therein is 0.1 parts by mol or more and 10 parts by mol or less with respect to 100 parts by mol of Zr, and the molar ratio of Mn to Sr is 0.3 or more and 3.2 or less.

Abstract: In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.

Abstract: A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer.

Abstract: A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 ?m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5?|T1/Tc|?1.0 is satisfied.

Abstract: A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.

Abstract: Provided is a technique to secure compositional or microstructural uniformity of a ceramic sintered body while increasing the area of the ceramic sintered boy, thus improving basic performance including non-linearity, maximum withstand energy and aging characteristics. A plurality of small varistor pieces 11 and insulating resin are kneaded and extruded for shaping, whereby a sheet-form varistor layer 13 can be formed where a plurality of small varistor pieces 11 are spaced from one another and are aligned on the same plane, and the adjacent small varistor pieces 11 are bonded via insulating resin.

Abstract: In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state.

Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.

Abstract: A method of making a solid oxide fuel cell (SOFC) includes forming a first sublayer of a first electrode on a first side of a planar solid oxide electrolyte and drying the first sublayer of the first electrode. The method also includes forming a second sublayer of the first electrode on the dried first sublayer of the first electrode prior to firing the first sublayer of the first electrode, firing the first and second sublayers of the first electrode during the same first firing step, and forming a second electrode on a second side of the solid oxide electrolyte.

Abstract: A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion.

Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 ?m.

Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%.

Abstract: A ceramic multi-layered interconnection substrate can be manufactured by using a stack including a plurality of ceramic layers with division grooves in the uppermost layer, at least one intermediate layer, and the lowermost layer. The substrate can be manufactured by forming division grooves in respective green sheets other than the uppermost and lowermost ones at adjacent package boundaries, pressing them to be stacked, forming division grooves in the uppermost and lowermost sheets at the adjacent package boundaries, firing them to be ceramic layers, and breaking the ceramic layers along the division grooves to separate individual packages, thus preventing failure and preventing the generation of burrs, chips, and the like.

Abstract: There is provided a method of manufacturing a multilayer ceramic capacitor including: laminating ceramic green sheets having internal electrodes printed thereon to form a ceramic laminated body; cutting the ceramic laminated body; applying slurry including a ceramic powder to the ceramic laminated body; and drying the slurry applied to the ceramic laminated body. According to an embodiment of the present invention, cracks generated in a manufacturing process of the multilayer ceramic capacitor may be removed, such that the multilayer ceramic capacitor may have excellent reliability.

Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Abstract: A housing includes a substrate, a base ceramic layer formed on a surface of the substrate, a transparent ceramic layer formed on the base ceramic layer, and a pattern layer formed between the base ceramic layer and the transparent ceramic layer, the pattern layer is a ceramic layer embedded in the base ceramic layer. The housing has an attracting appearance.

Abstract: A multilayered ceramic electronic component includes: a ceramic element having a plurality of dielectric layers laminated therein; first inner electrodes formed on the dielectric layers disposed in upper and lower portions in the ceramic element, the width of a portion of each of the first inner electrodes exposed from one end face of the ceramic element being less than that of a portion thereof disposed within the ceramic element; and second inner electrodes formed on the dielectric layers disposed in the middle portion in the ceramic element, the width of a portion of each of the second inner electrodes exposed from one end face of the ceramic element being equal to that of a portion thereof disposed within the ceramic element.

Abstract: A method for manufacturing a honeycomb structure includes the steps of: producing triangular segments as cut quadrangular prism honeycomb fired bodies in double by cutting half, forming a pseudo quadrangular segment by fitting a hollow auxiliary member whose outer peripheral shape is triangular on a cut triangular segment, disposing the honeycomb fired bodies and the pseudo quadrangular segments to form an assembly, bonding the assembly by applying a bonding material, and then applying pressure to thus bonded assembly to obtain a honeycomb block body with the hallow auxiliary members, drying the applied bonding material and then detaching the hollow auxiliary members to obtain a honeycomb block body, and grinding an outer peripheral portion of a resultant honeycomb block body to obtain a honeycomb structure.

Abstract: This disclosure provides a ferrite ceramic composition, a ceramic electronic component including the ceramic composition, and a process of producing a ceramic electronic component including the ferrite ceramic composition, of which the insulation performance can be secured even when fired simultaneously with a metal wire material containing Cu as the main component, and which can have good electric properties. The ferrite ceramic composition includes an Ni—Mn—Zn-based ferrite having a molar content of CuO of 5 mol % or less and in which, when the molar content (x) of Fe2O3 and the molar content (y) of Mn2O3 are expressed by a coordinate point (x,y), the coordinate point (x,y) is located in an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5).

Abstract: A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56?A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.

Abstract: Disclosed herein are a magnetic substrate, a common mode filter, a method for manufacturing a magnetic substrate, and a method for manufacturing a common mode filter. The common mode filter includes: a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part, wherein the magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.