Abstract: This disclosure provides a ceramic composition, a ceramic electronic component, and process for producing a ceramic electronic component in which a ferrite ceramic composition includes CuO at a molar content of 5 mol % or less and Fe2O3 and Mn2O3 are contained at such molar contents (represented by x and y, respectively) that, when x and y are expressed by a coordinate point (x,y), the coordinate point (x,y) is located within an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5).

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and first and second internal electrodes provided on upper and lower surfaces of the dielectric layer and formed of a thin film including graphene. The multilayer ceramic electronic component includes internal electrodes formed of a thin film including graphene, thereby having increased capacitance and improved thermal stability and withstand voltage characteristics.

Abstract: There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 ?m or less, and including anon-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.

Abstract: A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.

Abstract: In a method for producing a multilayer ceramic substrate by a non-shrinkage process, even when a total area of surface electrodes on a first principal surface side is smaller than that on a second principal surface side, a favorable balance in terms of a time period from softening to crystallization of glass is achieved between the first principal surface side and the second principal surface side, thereby allowing all base material layers to be densified and prevented from causing cracks or warpage, even when the crystallization temperature is lowered to prevent production of a reaction layer. The crystallization temperature of a glass material included in a second base material layer defining a second principal surface with a larger total area of surface electrodes is less than that of a glass material included in a first base material layer defining a first principal surface.

Abstract: A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.

Abstract: A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a mounting surface of the IC body, and the circuit substrate includes a substrate including a recess formed by recessing a portion of a mounting surface of the substrate on which the IC is to be mounted, and a terminal protruding from the mounting surface of the substrate. The terminal is to be electrically connected to the solder bump.

Abstract: Disclosed herein are a multilayer type inductor including a magnetic layer composition including NiZn ferrite, a multilayer type coil component including a magnetic layer prepared therefrom, and a method for manufacturing the same. According to the present invention, a copper electrode can be used as an internal electrode of a multilayer type coil product, by including NiZn ferrite in the magnetic layer. As copper is used for the internal electrode, material costs can be significantly reduced. Furthermore, the present invention can improve the maximum saturation magnetization value against the NiCuZn ferrite by about 10%, due to exclusion of Cu having weak magnetism, and can be more desirably used in a product employing high current.

Abstract: A method for joining multiple ceramic components together is disclosed in one embodiment of the invention as including providing multiple ceramic components, each having a mating surface. A slip containing a mixture of alumina powder and a phosphate-containing reagent is applied to one or more of the mating surfaces. The mean particle size of the alumina powder is tailored to provide improved strength to the bond. Once the slip is applied, the ceramic components may be joined together at their mating surfaces. The joint may then be sintered to react the constituents in the mixture and thereby generate a bond between the ceramic components.

Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.

Abstract: A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate.

Abstract: In a multilayer capacitor, a first dielectric layered product including a first body principal face is formed to be thicker than a second dielectric layered product including a second body principal face in a stacking direction thereof. A first external electrode and a second external electrode extend only to the first body principal face from a first body end face and a second body end face. Alternatively, the first external electrode and the second external electrode extend at least to the first body principal face from the first body end face and the second body end face and extend also to at least one of the second body principal face, a first body lateral face, and a second body lateral face.

Abstract: A mother substrate structure includes a mother substrate, a cover plate, a sealant and a spacer structure. The mother substrate has light emitting units thereon. The cover plate is disposed above the mother substrate and has unit regions, each unit region corresponding to one of the light emitting unit. The cover plate has a cutting line around each unit region, sealant regions between the cutting line and each of the unit regions, and spacer disposing regions between the cutting line and each of the sealant regions, wherein a distance between the cutting line and each of the spacer disposing region is 0˜100 um. The sealant is disposed in the sealant regions to bond the mother substrate and the cover plate. The spacer structure is disposed in the spacer disposing regions and surrounds each of the light emitting units, and materials of the spacer structure and the sealant include a glass fit.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: To provide a substrate for mounting a light-emitting element with a reduced gap to achieve insulation between a reflection film and electrical wiring conductors formed on a LTCC substrate for mounting a light-emitting element, its production process and a light-emitting device. A substrate for mounting a light-emitting element, which comprises a substrate main body having a mounting surface for a light-emitting element; electrical wiring conductors to be connected to an electrode of the light-emitting element, arranged at a stepped portion provided on the mounting surface of the substrate main body; a reflection film formed on the mounting surface excluding the stepped portion and the vicinity of its periphery; and an overcoat glass film provided on the mounting surface so as to cover the entire reflection film including its edge and so as to exclude the stepped portion and the vicinity of its periphery.

Abstract: In a method for producing a multilayer ceramic substrate by a non-shrinkage process, even when a total area of surface electrodes on a first principal surface side is smaller than that on a second principal surface side, a favorable balance in terms of a time period from softening to crystallization of glass is achieved between the first principal surface side and the second principal surface side, thereby allowing all base material layers to be densified and prevented from causing cracks or warpage, even when the crystallization temperature is lowered to prevent production of a reaction layer. The crystallization temperature of a glass material included in a second base material layer defining a second principal surface with a larger total area of surface electrodes is less than that of a glass material included in a first base material layer defining a first principal surface.

Abstract: A method for making glass ceramic composite structures, wherein a first and at least a second glass component, with an intermediate layer of a joining solder consisting of glass placed between them, are assembled to form a raw composite structure, wherein the joining solder has a radiation absorption capacity higher than the components to be joined, and wherein the raw composite structure is irradiated with energy, for example IR energy, at least in the area of the joining solder until the joining solder has softened sufficiently to bond together the components and the joining solder to produce a composite glassy structure. Thereafter a ceramization treatment is performed.

Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.

Abstract: A method for producing a ceramic material is disclosed. A ceramic raw material mixture is produced by comminuting and mixing starting materials containing Pb, Zr, Ti, Nd and oxygen. Nickel or an nickel compound is introduced. The raw material mixture is calcined and a ceramic is sintered.

Abstract: In the method for allowing a work object (15) to be sucked onto a suction unit (14) and the method for manufacturing a ceramic capacitor according to the present invention, a resin sheet (11) that has air permeability in a thickness direction is used as a suction sheet. In the resin sheet (11), air permeability is more enhanced than that of a conventional resin sheet while the diameter (opening diameter) of holes for ensuring air permeability serving as air passages is kept small. The resin sheet (11) is a non-porous sheet in which two or more through holes extending in a thickness direction of the non-porous sheet are formed. The through holes are straight holes extending linearly through the resin sheet. The through holes have a diameter of 20 ?m or less. The resin sheet has an air permeance, in the thickness direction, of 10 seconds/100 mL or less in terms of Gurley number measured in accordance with JIS P8117.

Abstract: A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent, and a gelling agent, gelatinizing the ceramic slurry in the molding die, and removing the molding die to obtain first and second ceramic molded bodies; (b) drying, debinding, and calcining the first and second molded bodies to obtain first and second ceramic calcined bodies; (c) printing an electrostatic electrode paste on a surface of one of the first and second ceramic calcined bodies to form an electrostatic electrode while assuming the first ceramic calcined body is to form a dielectric layer of an electrostatic chuck; and (d) superposing the first and second ceramic calcined bodies on each other to sandwich the electrostatic electrode and subjecting the first and second calcined bodies to hot-press firing.

Abstract: A method for producing an electrostatic chuck 10 includes the steps of (a) pouring a ceramic slurry containing a ceramic powder, a solvent, a dispersant, and a gelling agent into a first molding die 31 in which an electrostatic electrode precursor 24 is removably attached to an inner surface of the first molding die 31, gelatinizing the ceramic slurry by causing a chemical reaction of the gelling agent, and then removing the first molding die 31 to prepare an embedded-electrode-containing ceramic molded body 41X in which the electrostatic electrode precursor 24 is embedded in a first ceramic molded body 41; (b) preparing a second ceramic molded body 42; and (c) preparing a stacked calcined body 50 using the embedded-electrode-containing ceramic molded body 41X and the second ceramic molded body 42, and conducting hot-press firing of the stacked calcined body 50.

Abstract: An ESD protection device includes a ceramic base material including a glass component, a first opposed electrode on one side of the ceramic base material and a second opposed electrode on the other side of the ceramic base material, which are arranged so as to include ends that are opposed to each other on the surface of the ceramic base material, and a discharge auxiliary electrode disposed between the first and second opposed electrodes, which is connected to each of the first and second opposed electrodes, and arranged so as to provide a bridge from the first opposed electrode to the second opposed electrode, and a sealing layer to prevent the ingress of the glass component from the ceramic base material into the discharge auxiliary electrode is provided between the discharge auxiliary electrode and the ceramic base material.

Abstract: A multilayer ceramic electronic component includes dummy conductor patterns on a ceramic green sheet laminated in an earlier stage of the lamination and sheet-by-sheet crimping process that have widths that are less than the widths of dummy conductor patterns on a ceramic green sheet laminated in a later stage of the lamination and sheet-by-sheet crimping process.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

Abstract: A multilayer ceramic substrate includes an inner layer portion and surface portions that sandwich the inner layer portion in the stacking direction and have an increased transverse strength because of the surface layer portion having a thermal expansion coefficient less than that of the inner layer portion. At least one of the surface portions covers peripheries of main-surface conductive films arranged on a main surface of an inner portion so as to leave central portions of the main-surface conductive films exposed, so that the main-surface conductive films function as via conductors, thereby eliminating the need to provide a via conductor in the surface portions.

Abstract: An acoustic mirror of alternately arranged layers of high and low acoustic impedances is manufactured in that a basic material having a first layer of the layer sequence is initially provided, on which a second layer of the layer sequence is created on the first layer such that the second layer of the layer sequence partially covers the first layer. Subsequently, a planarization layer is applied onto the layer sequence, and the planarization layer is removed in an area which in the common layer plane projects laterally beyond the second layer so as to result in a residual planarization layer. Finally, a termination layer is applied onto the layer sequence and the residual planarization layer.

Abstract: A method is provided which includes a reaction step of reacting at least titanium oxide, a calcium compound, and barium hydroxide in a slurry solution so as to produce a perovskite-type composite oxide. The perovskite-type composite oxide is represented by (Ba1-xCax)mTiO3, and x is within a range of 0<x?0.125. In addition, the method provides a perovskite-type composite oxide in which a water-soluble calcium compound is used as the calcium compound, and when the perovskite-type composite oxide is represented by (Ba1-xCax)mTiO3, x is within a range of 0<x?0.20.

Abstract: A laminated body includes, in sequence, a base layer mainly composed of a ceramic material and a glass material, a first constraining layer that is primarily made of a ceramic material that is not sintered at a temperature at which the base layer is sintered, a second constraining layer primarily made of a ceramic material and a glass material that are sintered at the temperature at which the base layer is sintered, and a third constraining layer primarily made of a ceramic material that is not sintered at the temperature at which the base layer is sintered. The laminated body is subsequently fired at the temperature at which the base layer is sintered. The first, second, and third constraining layers are removed from the fired laminated body to provide a ceramic body that is a sinter of the base layer. After the firing, adhesion between the base layer and the first constraining layer and adhesion between the second constraining layer and the first constraining layer are different from each other.

Abstract: The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself.

Abstract: Provided are a method of manufacturing a multi-layer ceramic substrate. The method includes preparing a non-sintered ceramic laminated structure formed of a plurality of ceramic green sheets; preparing one or more constraining green sheets comprising a first constraining layer formed of a first inorganic powder having a first particle diameter and a second constraining layer formed of a second inorganic powder having a second particle diameter larger than the first particle diameter; disposing the constraining green sheets on the top and the bottom of the ceramic laminated structure; and firing the ceramic laminated structure at a predetermined firing temperature.

Abstract: One aspect relates to a housing for an active implantable medical device, whereby the housing, at least parts thereof, includes an electrically insulating ceramic material, and has at least one electrically conductive conducting element, whereby the at least one conducting element is set up to establish at least one electrically conductive connection between an internal space of the housing and an external space. One aspect provides the at least one conducting element to include at least one cermet, whereby the housing and the at least one conducting element are connected in a firmly bonded manner.

Abstract: A low temperature co-fired ceramic material includes a SiO2—BaO—Al2O3-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of Fe2O3 and 0.30 to 0.55 parts by weight of zirconium in terms of ZrO2 relative to 100 parts by weight of the SiO2—BaO—Al2O3-based primary component. The SiO2—BaO—Al2O3-based primary component preferably includes 47% to 60% by weight of SiO2, 20% to 42% by weight of BaO, and 5% to 30% by weight of Al2O3.

Abstract: The present invention provides a Ti3SiC2 based material that exhibits excellent arc resistance, an electrode, a spark plug, and methods of manufacturing the same. A Ti3SiC2 based material according to the present invention includes Ti3SiC2 as a main phase, the Ti3SiC2 based material having a TiC content of 0.5 mass % or less and an open porosity of 0.5% or less. It may be preferable that 0 to 30 mol % of Si contained in the main phase Ti3SiC2 be substituted with Al. A spark plug according to the present invention includes an electrode formed using the Ti3SiC2 based material.

Abstract: A method of forming a laminated body includes a first lamination step of forming a preceding lamination sheet which is substantially treated as one green sheet initially by laminating and bonding at least two green sheets together out of a plurality of green sheets; a printing step of printing a predetermined pattern on the preceding lamination sheet and at least one non-preceding lamination sheet which is a not used for forming the preceding lamination sheet; and a second lamination step of laminating and bonding the preceding lamination sheet and non-preceding lamination sheet, on which the predetermined pattern is printed in the printing step, in a predetermined order.

Abstract: There is provided is a laminated inductor, including: a ceramic main body in which a plurality of ceramic layers are stacked; a plurality of inner electrodes formed on the plurality of ceramic layers and having a contact area with the ceramic layer that is 10% or less than that of the entire area of the ceramic layer; and via electrodes having a coil structure by connecting the plurality of inner electrodes.

Abstract: An ESD protection device includes opposed electrodes in a ceramic base material and a discharge auxiliary electrode in contact with each of the opposed electrodes which is arranged so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side, the discharge auxiliary electrode includes metallic particles, semiconductor particles, and a vitreous material, and bonding is provided through the vitreous material between the metallic particles, between the semiconductor particles, and between the metallic particles and the semiconductor particles. The metallic particles have an average particle diameter X of about 1.0 ?m or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average particle diameter X of the metallic particles satisfies about 0.5?Y/X? about 3.

Abstract: An ESD protection device includes a ceramic base material including a glass component; opposed electrodes including an opposed electrode on one side and an opposed electrode on the other side, which are arranged to have portions opposed to each other at a predetermined distance in the ceramic base material; and a discharge auxiliary electrode between the opposed electrodes, which is connected to each of the opposed electrode on the one side and the opposed electrode on the other side, and arranged to provide a bridge from the opposed electrode on the one side to the opposed electrode on the other side. A sealing layer to prevent ingress of the glass component from the ceramic base material into the discharge auxiliary electrode is provided between the discharge auxiliary electrode and the ceramic base material.

Abstract: A multi-layer rod shaped ceramic igniter includes an elongated tapered electrode having a central core of resistant material and two annular segments. One of the segments in on one side of the core and the other on an opposite side and connected to two slightly converging facets extending along the core. The multi-layered rod shaped ceramic igniters disclosed herein may be manufactured by slip-casting, injection molding or extruding a green annular body and removing material from opposite sides of the green body to form two almost parallel but slightly converging facets that extend over the heater igniter between the back surface and the tip of the igniter. After removing material between the annular segments the igniter is air dried and then heated in a vacuum at atmospheric pressure to approximately 900° C. in order to burn off the organic binder. The ceramic is then held in an inert atmosphere and heated to a temperature of 1600° C.

Abstract: There are provided a ceramic paste composition for a multilayer ceramic capacitor (MLCC), a multilayer ceramic capacitor comprising the same, and methods of manufacturing the same. The ceramic paste composition for the MLCC includes: a ceramic powder, a first phosphate ester-based dispersant and a second dispersant salt-bonded by a fatty acid and an alkyl amine; a binder including polyvinyl butyral and ethyl cellulose; and a solvent. The ceramic paste composition ceramic powder has a small average particle-diameter and the ceramic powder in the paste has excellent dispersibility.

Abstract: According to one embodiment of the invention a fuel cell device array monolith comprises at least three planar electrolyte sheets having two sides. The electrolyte sheets are situated adjacent to one another. At least one of the electrolyte sheets is supporting a plurality of anodes situated on one side of the electrolyte sheet; and plurality of cathodes situated on the other side of the electrolyte sheet. The electrolyte sheets are arranged such that the electrolyte sheets with a plurality of cathodes and anodes is situated between the other electrolyte sheets. The at least three electrolyte sheets are joined together by sintered fit, with no metal frames or bipolar plates situated therebetween.

Abstract: Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.

Abstract: A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar heater zone includes one or more heater elements made of an insulator-conductor composite. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic sheets having planar heater zones, power supply lines, power return lines and vias.

Abstract: A composite ceramic green sheet comprising: a first sheet portion comprising a first sheet material; a second sheet portion comprising a second sheet material, said second sheet portion differing in firing behavior from said first sheet portion; and a mixed portion provided between said first and second sheet portions, comprising a mixture of said first and second sheet materials, and having a width at least twice as large as a thickness of the composite ceramic green sheet, wherein said first and second sheet portions are integrated with each other thorough said mixed portion in a spread direction.

Abstract: A ceramic multi-layered interconnection substrate can be manufactured by using a stack including a plurality of ceramic layers with division grooves in the uppermost layer, at least one intermediate layer, and the lowermost layer. The substrate can be manufactured by forming division grooves in respective green sheets other than the uppermost and lowermost ones at adjacent package boundaries, pressing them to be stacked, forming division grooves in the uppermost and lowermost sheets at the adjacent package boundaries, firing them to be ceramic layers, and breaking the ceramic layers along the division grooves to separate individual packages, thus preventing failure and preventing the generation of burrs, chips, and the like.

Abstract: There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.

Abstract: In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.

Abstract: Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.

Abstract: There are provided a method of manufacturing a ceramic paste for multilayer ceramic electronic components and a method of manufacturing multilayer ceramic electronic components having the same. According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a ceramic paste for multilayer ceramic electronic components, including: manufacturing a primary mixture in a slurry state by deagglomerating a primary mixture including a ceramic powder and a first solvent; forming the primary mixture into a wet cake state by volatilizing the first solvent; and forming a secondary mixture in a paste state by mixing and dispersing a second solvent having a higher viscosity than that of the first solvent in the primary mixture in the wet cake state.

Abstract: A shrinkage suppression layer used in the production of a ceramic substrate according to a non-shrinkage process provides favorable removal performance while sufficiently ensuring the restraining performance of the shrinkage suppression layer. Resin beads, which disappear at a temperature lower than the sintering temperature of a low-temperature sintering ceramic material of a base material layer to form open bores in a shrinkage suppression layer, are added to the shrinkage suppression layer and dispersed uniformly at least in a principal surface direction. The shrinkage suppression layer provides sufficient restraining performance to the base material layer in the step of firing, and after the firing, forms open bores, thereby improving the removal performance of the shrinkage suppression layer.