Abstract: An electronic device capable of efficiently cooling an integrated circuit element provided in such a way as to enable a heat exchange on a cold plate. The electronic device contains a circuit board mounted with an integrated circuit element requiring measures against heat generation in a single case, comprising: a cold plate mounted on the integrated circuit element in such a way as to enable a heat transfer from the integrated circuit element; a heat exchanger for cooling brine heated by the cold plate by circulating the brine; a fan casing forming an air way from a blower fan at an opening on a surface of the case to the heat exchanger; a reserve tank and a pump provided in order in a brine flow from the heat exchanger to the cold plate; and a linear brine passage formed in the cold plate and having at least one pair of back and forth channels.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: A bubble cycling heat exchanger is disclosed. A closed fluid loop is in contact with a heat absorbing source through a heat conducting block; the loop has a bubble generator, an expanding area for generating bubbles is installed at loop; the loop is also formed with a guide region from which bubbles is easily separable and a radiator; a heat conducting block of the closed loop is connected to a heat absorbing source; since the overheat of the heat absorbing source will cause the loop to generate bubble; by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the heat absorbing source so that the liquid in the loop flows for transferring heat so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source, the loop operates continuously until a heat equilibrium is achieved.

Abstract: A liquid cooled radiation module for servers is installed in a server to directly dissipate heat from a central processing unit through a liquid cooling fashion. The module includes a body which has a housing compartment to house a liquid tube and a radiator. The radiator has an air sucking section to draw heated air in the housing compartment and an air discharge section to discharge heat through an air vent. The liquid tube has a water delivery device driven magnetically by the radiator to form liquid circulation to continuously disperse heat from the CPU. The module thus made is compact and adaptable to servers of 1U or 2U specifications.

Abstract: A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.

Abstract: A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die.

Abstract: A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die.

Abstract: The present invention provides a hydronic pump type heat radiator, which comprises an outer ring heat spreader, a plurality of outer heat-radiating fins, a plurality of inner heat-radiating fins, a cavity, and a pump. The outer ring heat spreader has an annular wall. The inside of the annular wall has a receiving space. The outer heat-radiating fins are disposed outside the outer ring heat spreader. The inner heat-radiating fins are disposed inside the receiving space of the outer ring heat spreader. The cavity is disposed between the inner heat-radiating fins and the outer ring heat spreader. The cavity is used to receive cooling liquid therein. The pump is properly connected to the cavity, and can drive the cooling liquid in the cavity to make circulative flow so as to quickly transfer heat source and have the heat-radiating function of compulsory flow of liquid.

Abstract: A heat pipe for transferring heat from a heat source to a heat dissipater. The heat pipe includes a tube encasing a low viscosity working fluid and at least one radially segmented disk to restrict the flow of the working fluid to a single direction around the interior of closed loop of the tube. The tube additionally has a first surface adapted to contact at least a portion of a heat source, and a second surface adapted to contact at least a portion of a heat dissipater. The heat source vaporizes the working fluid, pressure forcing the fluid to circulate throughout the enclosed loop of the tube, the vapor being cooled and re-condensed while near the heat dissipater. Each radially segmented disk includes a plurality of segments designed to introduce turbulence into the fluid flow to increase heat transfer rates.

Abstract: A compact, lightweight, and efficient evaporative spray cooling system is provided for removing high heat fluxes from surfaces of devices such as micro-electronic chips, metal, mirrors, and lasers. The system uses expanding metastable two-phase flow and a method of controlling the spray for optimum heat flux removal. Control includes spray atomization, fluid-phase, mass flow, and spray temperature.

Abstract: A cooling system for use in conjunction with electronic devices (such as a computer) is disclosed. The cooling system is composed of several segments that comprise a continuous thermal path from the heat producing electronic component to a primary fluid circuit. The system transfers the heat to a secondary fluid circuit. The primary circuit is sealed and allows the transfer of heat to the secondary circuit without the requirements of the secondary fluid being directly connected through hoses or other means to the electronic device.

Abstract: The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed channel formed in the base for carrying fluid into the cooling well; a drain channel formed in the base for carrying cooling fluid away from the cooling well; cooling well inlets and outlets formed in the cooling well and in communication with the feed channel and drain channels, respectively. The feed and drain channels are sufficiently large relative to the size and flow characteristics of the well and cooling well inlets and outlets such that when the cooling fluid flows through the device, the pressure drop across the feed channel is substantially less than the pressure drop across the well.

Abstract: A heat sink apparatus for gathering and dissipating heat from a heat source having a heat source housing includes an impeller chamber having a chamber interior containing a heat transfer fluid and comprising a heat transfer wall for transferring heat from the heat source into the chamber; a heat transfer fluid within the chamber; a fluid circulation path including the chamber interior; a fluid propelling mechanism for propelling the fluid through the circulation path and across the heat transfer wall so that the fluid absorbs heat at the heat transfer wall and flows to a heat discharge region remote from the heat transfer wall where the heat is dissipated into the surrounding environment; where the fluid propelling mechanism includes a mechanical fluid driving structure including blades within the chamber rotatably secured to the apparatus with a blade mounting structure to move adjacent to and along the heat transfer wall and within the flow layer of the fluid adjacent to the heat transfer wall to mechanical

Abstract: A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.

Abstract: An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.