Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: A fluid heat transfer device includes a multi-pipe arrangement for transporting fluids of temperature difference in counter flow directions on same end sides of a first transfer pipe and second transfer pipe having a parallel arrangement.

Abstract: A heat exchanger structure including multiple fluid circuits, through which respective streams of a first fluid pass from a stream inlet to a stream outlet to transfer heat to or from a second medium. The fluid circuits are arranged into at least a first group and a second group, at least the first group consisting essentially of only fluid circuits that perform substantially similarly according to at least one selected performance criterion. A control sensor for at least the first group generates a signal representative of a parameter of the first fluid in the associated group. A valve for at least the first group is in fluid communication with of all the streams of the associated group so as to be able to control the flow of fluid through the streams of the associated group in parallel.

Abstract: An electronic system includes an electronic device and a heat exchanger for exchanging heat with the device. The heat exchanger includes a flow duct for receiving a fluid, at least a portion of the flow duct being arranged in thermal communication with the device. The system further includes a pump associated with the flow duct and a Venturi tube for reducing the pressure of the fluid in the portion of the flow duct to a value less than the pressure external to the duct, to minimize any leakage of the fluid onto the device in the event the portion of the flow duct develops a leak.

Abstract: A heat transfer system includes a primary evaporator, a condenser to the primary evaporator by a liquid line and a vapor line, a secondary evaporator connected to the primary evaporator through a sweepage line, and a reservoir system. The reservoir system includes a reservoir, a first flow directional device that restricts fluid from flowing into the reservoir from the primary evaporator, and a second flow directional device that restricts fluid from flowing out of the reservoir through at least one output of the reservoir.

Abstract: A cooling system and method for cooling electronic components. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and is pumped through interstices defined by and between the strands of the mesh. Flow dividers can define interconnected channels within the cavity.

Abstract: The invention provides a process and apparatus for the recovery of heat energy from wastewater. Wastewater, for example grey water from a domestic residence, is introduced to a detention chamber, which provides effective decoupling between the introduction of new wastewater and the demand for heat energy from its ultimate application. A heat exchange surface, in contact with the wastewater on one side and a working fluid on the other, extracts heat from the detention chamber through thermal conduction and the working fluid is transferred, via a heat pump, to a second heat exchange surface. The second heat exchange surface, in contact with the working fluid on one side and heat energy storage media on the other, transfers heat energy to the storage media through conduction. Heat energy can then be extracted from the storage media for applications including heating of potable water, or provision of building heating.

Abstract: An assisted heat pipe comprises an evaporator section, a condenser section, and a blower. The evaporator section converts a fluid from a liquid form to a vapor form, and the condenser section converts the fluid from a vapor form to back to a liquid form. The blower is encapsulated within the assisted heat pipe and resides between the evaporator section and the condenser section. The blower rotates and assists the vapor to travel from the evaporator section to the condenser section.

Abstract: A temperature regulating member for avoiding a deterioration in heat radiating output efficiency and deterioration in buffering occurring due to a non-uniform heat distribution within the heat storage material. Heat non-uniformities within the heat storage material are eliminated by inserting one or multiple agitating tools inside the heat storage material by generating an agitating current occurring due to use of agitator tools whose relative positions change within the heat storage material during shipping.

Abstract: A thermosiphon cooling system is presented. One embodiment of the thermosiphon cooling system includes a reservoir having a first portion configured to store a liquid coolant. The thermosiphon cooling system also includes a tubing unit coupled to the reservoir and disposed adjacent to at least one superconducting unit to be cooled and configured to receive the liquid coolant from the first portion of the reservoir, and circulate the received liquid coolant within the tubing unit to dissipate heat generated by the at least one superconducting unit. The received liquid coolant is circulated within the tubing unit by varying a density of the received liquid coolant at different portions of the tubing unit.

Abstract: A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.

Abstract: A light emitting diode cooling device and method are disclosed for passively removing heat from the LED using liquid convection to cool the LED. The liquid convection cooling device operates to cool the LED by circulating a liquid cooling medium without consuming external power to move the medium.

Abstract: A heat exchanger which is hollow and contains a plurality of small flow paths includes: a plurality of partition walls disposed in parallel with one another in the width direction of the heat exchanger to form the plural small flow paths; and an inlet unit and an outlet unit configured to communicate with the inside and the outside of the heat exchanger, and allow cooling liquid to flow into and out of the heat exchanger through the inlet unit and the outlet unit, the inlet unit and the outlet unit extend in directions opposite to each other along the width direction from a pair of center positions located approximately at the centers of inner side surfaces of the heat exchanger in the width direction and opposed to each other, and penetrate outer side surfaces of the heat exchanger.

Abstract: A heat transfer system includes a primary evaporator, a condenser to the primary evaporator by a liquid line and a vapor line, a secondary evaporator connected to the primary evaporator through a sweepage line, and a reservoir system. The reservoir system includes a reservoir, a first flow directional device that restricts fluid from flowing into the reservoir from the primary evaporator, and a second flow directional device that restricts fluid from flowing out of the reservoir through at least one output of the reservoir.

Abstract: The present invention relates to a cooling apparatus for an electronic device. In the present invention, a coolant passing through a condenser 10 is introduced into and s filled in a compensator 15. The coolant passing through the compensator 15 is introduced into a vaporizer 20 and vaporized through heat exchange with an auxiliary heat source H2 provided outside of the vaporizer. In addition, a vaporizing unit 22 made of a porous material is provided in the vaporizer 20. The coolant passing through the vaporizer 20 and a liquid coolant supplied from the condenser 10 are mixed in a vortex generating unit 30 to form a coolant spray, and the coolant spray moves along a spiral trajectory to be formed into a vortex. Meanwhile, the coolant spray of a vortex is injected to be in close contact with the inner wall of an evaporator 50 to be heat-exchanged with a main heat source H1 positioned outside of the evaporator, thereby cooling the main heat source H1.

Abstract: An apparatus provides a high efficiency for refrigerator operation. The inclusion of a separate external evaporator and condenser that draws heat away from the common refrigerator condenser allows an increase in the intensity of the cooling process of the cooling agent, thereby diminishing electrical consumption, and decreasing the size and noise of the condenser. This is achieved by structuring the refrigerator condenser with the one tube for the cooling agent of the common refrigerator and another volume for evaporating the cooling substance of the external evaporator and condenser. Moreover, external system of natural cooling has a condenser that is located in the open air and connected to the evaporator with the help of vapor lines and condensed vapor lines.

Abstract: An apparatus includes a computer chassis and a motherboard. The motherboard defines a mounting aperture and a securing hole. The mounting aperture includes a large hole and a small hole communicating with the large hole. The computer chassis includes a bottom plate which defines a screw hole therein. A first convex projection is formed on the bottom plate. A hollow pillar is formed on the first convex projection. The pillar defines a through hole extending through the pillar and the first convex projection. A blind rivet is mounted in the through hole. The blind rivet includes a cap located above the pillar. The cap has an area larger than the small hole. The motherboard is slidable between a first position and a second position. In the first position the motherboard is located on the first convex projection, the pillar extends in the large hole of the motherboard and the cap is positioned above the motherboard.

Abstract: This application discloses a heat driven liquid self-circulating device, system and method, means the liquid system formed by said devices according to said method can be circulated automatically to transfer the heat without external pump power. In one aspect, a heat driven self-circulating device for heated liquid which used with a liquid heat collector is disclosed.

Abstract: A hermetic Rankine cycle in a sealed casing powers an internal centrifugal condensate pump with an internal vapor turbine during forced convective heat transfer between a heat source and a heat sink. No work is imported into the cycle during operation. A centrifugal pumping disk shears the working fluid against a heating surface, sweeping evolving vapor into radial vortices which provide sink flow conduits to a vapor space at the center of the cylindrical turbine. Convective mass flow through the vapor space to the condensing end of the casing spins the turbine and the centrifugal pumping disk which is connected to it. Vapor is continuously swept from the heating surface, so bubbles do not form and superheat while blocking heat flux into liquid working fluid. Vapor is sucked through the radial vortices into the central vapor space and into the condensing end of the casing along the low pressure gradients in vortex cores established by cooling power.

Abstract: A dispenser of cooled or heated liquid which in one embodiment is a server cart for an aircraft. To avoid the need for a pump, the reservoir has a cooling or heating heat exchanger that helically coils around the main reservoir, which cools from the top down or heats from the bottom up, forming a counter current. The reservoir is connected to at least two conduits, one near the cooler top of the reservoir and one near the relatively warmer bottom of the reservoir. The two conduits connect to one another at a distance from the reservoir forming a dispensing passage, thereby allowing fluid to constantly circulate through the dispensing passage due to difference in the specific gravity in the fluid caused by the temperature difference. The elimination of the pump device is especially desirable for weight sensitive environments such as an aircraft.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plurality of spacers disposed between a first flexible substrate and a second flexible substrate to form a plurality of heat transfer regions each having a plurality of capillary pumping regions, a two-phase fluid disposed between at least one pair of adjacent spacers, and a plurality of electronic components coupled to a mounting surface of the first flexible substrate.

Abstract: A heat exchanger system includes a first fluid layer defining a first flowpath for a gas, a second fluid layer defining a second flowpath for a liquid, a first vapor cycle layer located between the first fluid layer and the second fluid layer for enabling heat transfer between the first and second fluid layers, a first boundary wall defining a shared boundary between the first fluid layer and the first vapor cycle layer, and a second boundary wall defining a shared boundary between the second fluid layer and the first vapor cycle layer. The first vapor cycle layer includes a working medium configured to transfer heat through an evaporation and condensation cycle, and the working medium of the first vapor cycle layer is sealed between the first and second boundary walls.

Abstract: An exemplary system includes a first heat exchanger immediately after the compressor that provides direct, conduction-based cooling with condensate recovered from the evaporator. A second heat exchanger cools the forced air that passes over the condenser by evaporating recovered condensate, rainwater, and/or city water into the air as it passes through a breathable water-retaining medium. Finally, a third heat exchanger is described that utilizes recovered condensate, rainwater, and/or city water within an insulated enclosure to obtain additional cooling before the condensed refrigerant enters the expansion valve. Various alternative embodiments are described that include variations of each of these heat exchangers. Additionally, several alternative placements of the heat exchangers are disclosed.

Abstract: Solar collectors heat and self pump heat transfer fluid at reduced system pressure without mechanical intervention for heat exchange with hot water in a storage tank. Slugs of hot fluid are pumped by steam bubbles formed in solar collector tubes through an upper manifold and an exit-tube into an upper hot fluid reservoir. Hot fluid flows downward through a heat exchanger at the tank. Cold fluid returns to a lower reservoir. Vapor flows from the upper reservoir and is condensed by cooler water and walls of the lower reservoir. The cool fluid returns from the lower reservoir to a lower manifold supplying the collector tubes. Below ambient pressure is automatically established in the system. When heat build-up increases pressure in the system, fluid flows to a third closed variable volume reservoir. A float valve in the bottom of the third reservoir allows liquid to return to the system when it cools.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using a hookup clip to secure the top or bottom crossbar of the cold row encapsulation structure with the top or bottom crossbar of the server rack.

Abstract: A heat dissipating device includes a flat evaporator, a vapor pipe, a liquid pipe, and a condenser. The flat evaporator consists of a bottom plate, a porous material, and a top lid. The porous material is located on the bottom plate and provided with vapor flow passages. The vapor pipe and liquid pipe are communicably connected at respective one end to a vapor port and a liquid port on the evaporator, and at the other end to two sides of the condenser. The evaporator has simple structure and low manufacturing cost, and can fully effectively bear on an electronic chip to enable reduced room needed for installing the evaporator and reduced thermal resistance during heat dissipation. The heat dissipating device can be used to dissipate heat produced by computer chips, and to cool LED illuminating devices, chips for communication devices, high-power heat-producing elements in military, medical, aerial, and aerospace apparatuses.

Abstract: A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.

Abstract: An electronic device includes a cabinet, a first heat generating member, a second heat generating member, a fan unit, a first heat pipe and a second heat pipe. The first and second heat pipes are each formed by sealing an operation fluid which shifts its phase between gas and liquid into a pipe-like main body. In the second position, the first end portion of the first heat pipe is located at a position lower than that of the second end portion and the one end portion of the second heat pipe is located at a position higher than that of the other end portion. The second heat pipe includes a conveying mechanism that conveys the operation fluid in liquid phase from the other end portion to the one end portion.

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: A system is provided and includes a first condenser configured to fluidly receive a first steam supply and tower water and to output a first water supply, a second condenser configured to fluidly receive a first portion of a second steam supply and the first water supply and to output a second water supply, and a vapor-absorption-machine (VAM) configured to fluidly receive a second portion of the second steam supply and the second water supply by which a refrigeration cycle is conducted to thereby cool at least one of the tower water and a third water supply used to cool the tower water.

Abstract: A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of the evaporation portion. A refrigerant liquid film is formed on the inner surface of the evaporation portion. Since the fluid refrigerant is uniformly applied to an inner surface of the evaporation portion to form a liquid film, the heat dissipating ability of the heat pipe heat dissipating device is improved, and the heat dissipating uniformity of the heat pipe heat dissipating device is enhanced. A heat dissipating method is also provided.

Abstract: The present invention relates to a method for vaporizing a liquid stream, the method at least comprising the steps of: a) feeding a heat transfer fluid to a first heat transfer zone (2), the heat transfer fluid being cycled in a closed circuit (4); b) feeding a liquid stream (20) to be vaporized to the first heat transfer zone (2); c) providing heat from the heat transfer fluid to the liquid stream across a heat transfer surface in the first heat transfer zone (2) thereby vaporizing the liquid stream and at least partially condensing the heat transfer fluid; d) removing the vaporized liquid stream (30); e) removing the at least partially condensed heat transfer fluid and passing it to a second heat transfer zone (3); f) providing heat from ambient air to the at least partially condensed heat transfer fluid across a heat transfer surface in the second heat transfer zone (3) thereby vaporizing the heat transfer fluid; g) recycling the vaporized heat transfer fluid to the first heat transfer zone (2); wherein th

Abstract: An aero-engine nose cone anti-icing system (10) using a rotating heat pipe (12) is provided to replace the current method of blowing hot compressor bleed air over the nose cone surface. Heat is transferred from a hot source (36) within the engine (22) to the nose cone (18) through a rotating heat pipe (12) along the central shaft (16). A condenser (20) and evaporator (14) are provided which are adapted to the heat transfer requirements and space constraints in the engine (22).

Abstract: A method for fabricating a multi-layer wick structure of a heat pipe includes providing a first and a second weaving meshes, overlaying and winding the first and the second weaving meshes to form an open circular structure with the first weaving mesh encircling the second weaving mesh, inserting the open circular structure into a tubular member of the heat pipe, pressing the tubular member towards an central axis thereof such that the open circuit structure is forced into a close circular wick structure, and melting the first waving mesh to be attached on an interior surface of the tubular member.

Abstract: The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure inside a shell. In certain preferred embodiments, the wick structure is composed of a mass of expanded graphite. In a another embodiment, the shell of the device includes flexible graphite and an optional wick structure. In certain preferred embodiments, the flexible graphite shell is fluid impermeable. The invention further includes methods of making the aforementioned thermal management devices.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.

Abstract: A compact heat exchanger assembly for use in hybrid liquid-air cooling system adapted to provide a liquid cooling mechanism for components or adapter boards in a personal computer system. The heat exchanger assembly consists of a heat exchanger chamber, though which the thermal transfer liquid flows. An air pump injects air bubbles into the heat exchanger chamber through a porous material. The air bubbles rise up through the thermal transfer liquid and exit at the top of the heat exchanger chamber through a semi-permeable membrane which inhibits loss of the thermal transfer fluid. As the air bubbles pass through the thermal transfer liquid, heat is exchanged directly between the thermal transfer liquid and the contained air. The heat is then removed from the system as the heated air is expelled from the heat exchanger chamber. A valve assembly prevents the thermal transfer liquid from entering the air pump in the event air flow through the heat exchanger chamber is stopped.

Abstract: The present invention relates to a heat pipe for long distance and, in particular, to a heat pipe constituted by an evaporating unit for evaporating working fluid to form vapor, a condensing unit spaced at a long distant from the evaporating unit and discharging heat from a transferred vapor to the outside, and a transferring unit formed as a connecting tube of a general form having a single function connecting the evaporating unit and the condensing unit to transfer only the evaporated fluid vapor, wherein a working fluid supplier is formed in the evaporating unit in order to supplement the evaporated working fluid from the outside and a condensation liquid discharging unit is formed in the condensing unit in order to discharge condensation liquid generated by condensing the vapor to the outside.

Abstract: A transpiration cooled heat sink, a self contained coolant supply and a method of using a transpiration cooled heat sink and a self contained coolant supply is provided and includes a heat sink base structure, the heat sink base structure having a coolant inlet for receiving a coolant and a coolant outlet for distributing a coolant, wherein the heat sink base structure defines at least one coolant channel disposed so as to be communicated with the coolant inlet and the coolant outlet and a coolant distribution structure, wherein the coolant distribution structure defines at least one distribution cavity and includes at least one distribution inlet communicated with the distribution cavity and wherein the coolant distribution structure is disposed relative to the heat sink base structure such that the distribution inlet is communicated with the coolant outlet.

Abstract: A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump; and a guide part disposed in the opening of the heat sink, communicated to the pump and having an outer surface, a through hole and a guide passage formed on the outer surface. The pump drives a working fluid in the liquid-cooled heat dissipation module to pass through the through hole, the pump and the guide passage to circularly dissipate heat.

Abstract: An open loop heat pipe radiator comprises a radiator tube and a free-piston. The radiator tube has a first end, a second end, and a tube wall, and the tube wall has an inner surface and an outer surface. The free-piston is enclosed within the radiator tube and is capable of movement within the radiator tube between the first and second ends. The free-piston defines a first space between the free-piston, the first end, and the tube wall, and further defines a second space between the free-piston, the second end, and the tube wall. A gaseous-state working fluid, which was evaporated to remove waste heat, alternately enters the first and second spaces, and the free-piston wipes condensed working fluid from the inner surface of the tube wall as the free-piston alternately moves between the first and second ends. The condensed working fluid is then pumped back to the heat source.

Abstract: Various embodiments of air conditioning systems are disclosed. The systems may include an air conditioner whose energy source is provided by heating of a first fluid. The first fluid may be in a liquid state contained in a reservoir hydraulically connected to a first chamber. The first chamber may be configured to receive thermal energy utilized to convert the first fluid into a vapor. The system may also include a second chamber hydraulically connected to the first chamber to receive the vaporized fluid from the first chamber. The second chamber may be configured to condense the vaporized first fluid, causing depressurization in the second chamber. The system may be configured such that the depressurization of the second chamber may drive an external fluid through an expanding valve in addition to an energy converter (e.g. Turbine Generator) overall able to convert the first fluid condensing energy into cooling and mechanical or electrical energy.

Abstract: A reactor including a bundle of catalyst tubes through which a reaction mixture is passed, and wherein a heat exchange medium is passed through a space surrounding the catalyst tubes and including ring lines at both reactor ends with jacket orifices for feeding in and removing the heat exchange medium by at least one pump. The heat exchange medium is fed to the upper ring line and is sucked in via the lower ring line by the at least one pump having at least one vertical pump shaft mounted and operated at its upper end. The at least one pump includes a diagonal rotor and a restrictor gap in the longitudinal direction of the at least one pump shaft, within the heat exchange medium, on the pressure side of the at least one pump for sealing and mounting the at least one pump shaft and reducing axial shear of the diagonal rotor.

Abstract: An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.

Abstract: A phase-change heat dissipating device includes a hollow tube and a driving member connected to the tube. The tube has a vaporizing portion and a condensing portion and contains working fluid therein. The driving member includes a number of shrinkable chambers serially connected together to drive the working fluid to flow.

Abstract: A polymerization reactor for exothermic liquid phase reactions comprises a reaction zone which is divided into a plurality of channels by thermally conductive heat transfer fins which are conductively mounted on one or more heat pipes for the removal of heat of reaction from reactants and reaction products flowing between the heat transfer fins. The reactor of the invention is capable of maintaining essentially isothermal conditions without the use of complicated and maintenance intensive agitators. The reactor is particularly useful when viscosity of the reactants and/or reaction products is high, when the reaction conducted has a fast reaction rate and when consistent polymer properties are desired.

Abstract: A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.

Abstract: A device and method for removing heat from an object by spraying a cooling agent is disclosed. A cooling casing or a heat sink is mounted to the object. A spray nozzle is arranged to spray the cooling agent onto the cooling casing or the heat sink from a reservoir. The temperature of the object is detected. A controller receives the temperature and issues a signal to drive the spray nozzle when the detected temperature exceeds a predetermined upper temperature limit. The cooling agent is sprayed onto the cooling casing or the heat sink and evaporates by absorbing heat from the cooling casing or the heat sink thereby removing heat from the object. A fan is selectively provided for generating air flows to expel the evaporated cooling agent and thus enhancing heat removal from the object.