Abstract: A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Monomer is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.

Abstract: A large electrode bump is generated on a substrate such as a circuit board. A small electrode bump is then formed on the large bump. Preferably a barrier layer is deposited over the large bump prior to formation of the small bump. In this case the small bump is formed on the barrier layer over the large bump. In one embodiment, the small bump is formed by applying a sacrificial layer on the large bump. A window is created in the sacrificial layer. A spring may optionally be inserted in the window. The window is then filled with a conductive material. Finally, the sacrificial layer is removed to reveal the small bump. In another embodiment, a small bump is formed on a semiconductor die and a larger bump is formed on a substrate. The semiconductor die is mounted on the substrate such that the bump on the die contacts the larger bump.

Abstract: A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

Abstract: A compliant element (23, 25) is provided between an integrated circuit (11) and a substrate (19) which are bonded and interconnected by an anisotropic conductive adhesive (20) comprising conductive particles (21) in a polymer matrix (22). In one embodiment, one set of bonding pads (12, FIG. 2) is coated with a layer (23) of a metal that is significantly softer than the metal from which the conductive particles are made, which permits an oversized conductive particle (21a) to indent into the soft metal layer (23). In another embodiment, one of the sets of bonding pads (15, FIG. 3) is arranged on a relatively thick layer of adhesive (25) which is sufficiently viscous at the temperature at which contact is made to permit the bonding pad (15) to pivot in response to pressure from an oversized conductive particle (21d).

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a titanate and/or zirconate and the ceramic has a volume % fraction of between about 45-50.

Abstract: The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates.

Abstract: An adhesive having a content of a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule, optionally in combination with at least one curable epoxy compound, is used for bonding polyimide films to films of the same kind or to other substrates, particularly metal foils. Such bondings are highly heat-resistant and have an excellent peeling resistance. Therefore, they are suitable for the manufacture of printed circuit boards having high thermal stability and peeling resistance.

Abstract: Disclosed herein is a flexible printed circuit board and coverlay film and a method for producing the same. The board and coverlay film have metal foil or parting paper adhered to a polyimide film using a two-layer thermosetting adhesive. The first layer of adhesive on the polyimide film is about 5 .mu.m thick or less. The circuit board and coverlay film produced according to this invention have excellent bonding strength, thermal, chemical and weather resistance, as well as good insulating properties.

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

Abstract: A circuit board comprising a base having a substantially flat surface and an insulative layer made of a heat-resisting synthetic resin formed on the flat surface of the base. The insulative layer is provided with grooves for forming conductive parts, and each of the groove is defined by a bottom surface formed by the base and side walls formed by the insulative layer. A conductive adhesive layer having a good adhesion characteristic with respect to the base, such as Cr, is formed on the bottom surface of the grooves, and a conductive layer is formed on the conductive adhesive layer so that a surface defined by the insulative layer and the conductive parts including the conductive layer and conductive adhesive layer is substantially flat.

Abstract: A method of bonding copper and resin comprising the steps of:a) forming a layer of copper oxide on a surface of copper by oxidation of copper;b) reducing the layer of copper oxide thus formed to metallic copper with a reducing solution with the addition of an alkaline solution and a stabilizer at a controlled temperature under a circulated condition within a controlled period of time to modify its morphology; andc) forming a layer of copper oxide on a surface of the metallic copper by baking; andd) bonding the surface of the copper oxide formed by the baking and a resin together by heat-pressing.

Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

Abstract: A fused high density multi-layered integrated circuit module for integrating infrared detector arrays to signal conditioning circuits is disclosed. The module comprises a plurality of thin film substrate layers disposed in substantially overlapping registry to form a non-conductive supporting body, a plurality of the layers have electronic devices mounted thereon. A plurality of detector element connectors are formed along a first edge portion of the body. Conductive conduits are formed upon a plurality of the layers. The conductive conduits have first portions which interconnect the detector element connectors to the electronic devices disposed upon the layers of the body. The conductive conduits also have second portions formed upon the surface of said layers and extending to the second edge portion thereof for communicating signals between the electronic devices and external electronics. A glass binding material adhesively attaches adjacent substrate layers together.

Abstract: In manufacturing multilayer printed wiring boards with a cavity for mounting an electronic device, a rubber or composite rubber sheet is mounted in the cavity to prevent a prepreg resin from flowing into the cavity. The rubber sheet or composite rubber sheet is removed after applying pressure and temperature to an assembly consisting of boards to be bonded and the prepreg between them. This eliminates poor bonding which can result when resin flows into the cavity.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method comprises steps of providing a substrate for the printed circuit board, forming circuit patterns on one or both sides of the substrate, and shielding the whole or a required part of the circuit patterns by using a shield layer in such a manner that the shield layer and a grounding circuit of the circuit patterns are connected through a resistor. This method of manufacturing a printed circuit board is improved so that adhesion between the shield layer and the junction land of the grounding circuit is enhanced by the joining of the shield layer to the junction land of the grounding circuit through the resistor, and that the noise preventive action of the shield layer is improved by the attenuating of electromagnetic-wave energy received by the shield layer which is to be discharged as electrical current to the grounding circuit.

Abstract: A multilayer wiring substrate which includes a glass ceramic section, a wiring layer section having a plurality of wiring layers electrically insulated from each other by a polyimide material, and an intermediate layer made of an inorganic material and arranged between the ceramic section and the wiring layer section.

Abstract: Disclosed herein is a flexible printed circuit board and coverlay film and a method for producing the same. The board and coverlay film have metal foil or parting paper adhered to a polyimide film using a two-layer thermosetting adhesive. The first layer of adhesive on the polyimide film is about 5 .mu.m thick or less. The circuit board and coverlay film produced according to this invention have excellent bonding strength, thermal, chemical and weather resistance, as well as good insulating properties.

Abstract: This is a printed circuit comprising multiple layers and rigid and flexible portions and including a sheet of flexible substrate material extending over the entirety of the rigid and flexible portions and paths of conductive material carried by at least one side of the sheet of flexible substrate material. This invention comprises, a sheet of flexible over-layer material extending over at least the entirety of all the flexible portions; a flexible adhesive material adhesively attaching the sheet of flexible over-layer material to the entirety of all the flexible portions; sheets of a rigid substrate material extending over the entirety of all the rigid portions; and, a rigid adhesive material adhesively attaching the sheets of a rigid substrate material to the entirety of all the rigid portions. The rigid adhesive attaching the sheets of rigid substrate to the rigid portions may extend out over the edge of the rigid portions onto the flexible portions to form a protective edge.

Abstract: An electrical conductor element in the form of a flexible or rigid sheet is provided for detecting attempts to break into a space where valuables or money are being stored, such as a strongroom or the coin container of a slot machine. The base material of the element is in the form of a woven or non-woven material or of plastic sheeting, and the electrical conductor is in the form of wire such as enameled copper wire for electrical connection with an alarm system. The conductor is secured in place by stitching, that is to say the wire is either formed into penetrating stitches by being fed from the needle or shuttle of a sewing machine or it is fed from a stationary part of the sewing machine so as to be fixed in place by stitches or conventional textile yarn or thread. When the conductor is interrupted by drilling, sawing or the like the alarm system is activated.

Abstract: A method of manufacturing a mutilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.

Abstract: A tantalum thin film circuit which is formed on an insulator or semiconductor substrate through an adhesive layer, a part or the entire surface of said tantalum thin film circuit being coated with a metal selected from among palladium, gold, platinum and rhodium or an alloy thereof. In addition, a conductive film circuit is formed on the thus formed tantalum thin film circuit by forming an interlayer insulating film having an adhesive layer on each of the upper and lower sides thereof, and forming a circuit using a metal selected from among tantalum, palladium, gold, platinum and rhodium or an alloy thereof.

Abstract: On the printed circuit board onto which are mounted parts requiring planarization, dummy patterns which are not electrically wired are made into a shape on which the mounting parts are easily mounted, and one or several thereof are disposed in the base of the printed circuit board. In addition, a hollow portion to which an adhesive is applied is provided in the center of the dummy pattern. The above-described mounting parts are mounted on the dummy pattern, and the mounting parts are bonded by means of the adhesive applied to the hollow portion.

Abstract: A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.

Abstract: This invention relates to a mounting substrate onto which components such as an IC chip are to be mounted, its production method, and a printed wiring board having a connector function suitable for a fine pitch and its connection method. Metal nodules are formed on conductors of connection portions by electrodeposition, or the like. Connection is made by fixing connection portions by an adhesive. Good conduction can be secured through the metal nodules and good insulation can be held between adjacent conductors.

Abstract: A process for producing a cheap carrier tape of a two layer structure having a superior heat resistance, difficultly susceptible of effect of impurities and having a superior flexibility is provided, which process comprising the following steps: coating a polyimide varnish onto a continuous, electrically-conductive metal foil and baking it; punching the resulting tape of a two layer structure of the metal foil and the polyimide film to form sprocket holes; cutting and removing the polyimide film to form a device hole; coating a resist onto the metal foil surface; light-exposing the resulting resist by the medium of a mask for separating a circuit pattern and a circuit from the sprocket parts; developing the resulting resist and etching the metal foil by the medium of a mask of the resist; removing the resist; and plating the metal foil.

Abstract: An electronic device which includes a circuit sheet having a conductive path thereon. An adhesive is deposited on the conductive path, the adhesive including a nonconductive base incorporating randomly spaced conductive particles. A circuit component is forced through the adhesive, the conductive path and the circuit sheet carrying a portion of the adhesive therewith between the circuit component and the conductive path. The carried portion of the adhesive is compressed for establishing contact between the conductive particles and thereby conductivity between the circuit component and the conductive path leaving the adhesive other than that portion in a nonconductive state.

Abstract: A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, wherein the median surface roughness (R.sub.a) of the outer surface of the copper sheet is not greater than 3 .mu.m, and the maximum surface roughness (R.sub.max) of the outer surface of the copper sheet is not greater than 18 .mu.m. The invention improves the manufacturing reliability of various electronic devices such as semiconductor modules.

Abstract: A mounting structure for a semiconductor device which is mounted onto a metallic wiring layer formed on a surface portion of a metal printed circuit board, in which bonding portions defined by substantially square etched holes are formed in a portion of the metallic wiring layer contacting a bonding material interposed between the metallic wiring layer and the body of the semiconductor device.

Abstract: A quick-cure laminating process for multi-lamp photoflash arrays includes the application of a curable adhesive to a metallic printed circuit, the positioning of the adhesive-covered printed circuit adjacent a deformable rubber material and a circuit board and the printed circuit and circuit board intermediate a pair of surfaces movable with respect to one another and the moving of said surfaces to exert a compressive force on said printed circuit and circuit board while being heated to a temperature and for a time sufficient to effect attachment of the printed circuit to the circuit board. In another aspect, the circuit board may be of a deformable material, placed in contact with an adhesive-covered printed circuit, compressed and heated to effect attachment of the printed circuit to the circuit board.

Abstract: According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, vacuum furnace is not employed.

Abstract: Terminations (10, 40, 70, 90) for flexible printed circuitry comprises thermosetting epoxy or polyimide prepreg sheets (36, 56, 64, 88, 102) in the rigid portion, instead of thermoplastic acrylic adhesive, partial coverlays (20, 50, 84, 94) instead of full coverlays and, as desired, rigidized members of epoxy or polyimide glass (16, 52, 54, 86) or prepreg internally as well as externally of the terminations. Anchor pads 34 secured to plated-through holes (38) minimize z-axis expansion of the terminations.

Abstract: An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process.