With Particular Material Patents (Class 174/256)
  • Patent number: 11101188
    Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: August 24, 2021
    Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: Olivier Franiatte, Richard Rembert
  • Patent number: 11092853
    Abstract: The present disclosure relates to a display device, a liquid crystal display panel and a driving method for a liquid crystal display panel. The liquid crystal display panel includes: an array substrate including a plurality of sub-pixels having active display areas, each of the sub-pixels including a plurality of first electrodes, and a first slit being disposed between adjacent first electrodes; an opposite substrate facing the array substrate, wherein a first surface of the opposite substrate facing the array substrate includes at least a target area facing an edge area of the active display area; and a control electrode disposed in the target area and opposite to the first electrode, for generating an electric field in a target direction with the first electrode, so as to control liquid crystals between an edge area of the array substrate and the target area of the opposite substrate to be deflected.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: August 17, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yanli Zhao, Xiaoji Li, Keguo Liu, Xiuzhu Tang, Xiaolong Liu, He Sun
  • Patent number: 11062848
    Abstract: A multilayer ceramic electronic component includes a rectangular parallelepiped laminate body. An external electrode is provided at both end surfaces of the laminate body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The conductive resin layer includes a first layer on the base electrode layer, a second layer on the first layer, and a third layer on the second layer. With respect to porosity which is an area ratio of pores obtained from a binary image within a predetermined field of view, the first layer and the third layer have a porosity of equal to or less than about 5% and the second layer has a porosity equal to or more than about 6%. Thicknesses of the first, second, and third layers satisfy predetermined conditions.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: July 13, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Nakamoto
  • Patent number: 11054193
    Abstract: A vehicle such as an unmanned aerial vehicle (UAV) can include a heat-generating electronic device coupled with a heat exhaust element by a vibration isolating thermal connector. The thermal connector includes a first heat-conducting element configured to draw heat from the electronic device, a second heat-conducting element separated from the first heat-conducting element, and a flexible seal connected with the first and second heat-conducting elements and defining an enclosed cavity between the elements. The enclosed cavity contains a heat conducting liquid, and allows limited movement of the first and second heat conducting elements with respect to each other while maintaining thermal connection.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 6, 2021
    Assignee: Amazon Technologies, Inc.
    Inventor: Jonathan Barak Flowers
  • Patent number: 11034068
    Abstract: An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 15, 2021
    Assignee: RAYTHEON COMPANY
    Inventors: Paul A. Merems, Darin M. Gritters
  • Patent number: 11013127
    Abstract: A metal paste is suppled into a through hole of a ceramic substrate and heated to generate a metal porous body. A glass paste is applied on a main surface of the metal porous body while the glass paste is impregnated into open pores of the metal porous body. The glass paste is hardened by heating to form a glass layer on the main surface of the metal porous body and to make the glass paste impregnated into the open pores form glass phases. The glass layer is removed to obtain a connection substrate having a ceramic substrate and through conductors provided in through holes, respectively. The through conductor includes the metal porous body and glass phases.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: May 18, 2021
    Assignee: NGK INSULATORS, LTD.
    Inventors: Tatsuro Takagaki, Sugio Miyazawa, Akiyoshi Ide
  • Patent number: 11004819
    Abstract: A method of fabricating a connection structure is disclosed. The method includes providing a substrate that has a top surface and includes a set of pads for soldering, each of which has a pad surface exposed from the top surface of the substrate. The method also includes applying a surface treatment to a part of the top surface of the substrate close to the pads and the pad surface of each pad so as to make at least the part of the top surface and the pad surfaces of the pads rougher.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: May 11, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Risa Miyazawa, Takahito Watanabe, Hiroyuki Mori, Keishi Okamoto
  • Patent number: 10991674
    Abstract: Provided is an electronic assembly including (a) an interconnect carrier having an electrically insulating core and at least two electrically conducting layers formed at the electrically insulating core; (b) a first integrated circuit chip mounted at a first side of the interconnect carrier; (c) a second integrated circuit chip mounted at a second side of the interconnect carrier opposite to the first side; and (d) an interconnection structure electrically connecting the first integrated circuit chip with the second integrated circuit chip. The electric interconnection structure extends around the insulating core and includes at least one electric conductor path which is designed in such a manner that an impedance match between the first integrated circuit chip and the second integrated circuit chip is provided. Further, there is provided an electronic system comprising such an electronic assembly.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: April 27, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Gerald Weis
  • Patent number: 10990838
    Abstract: Various implementations include a vehicle occupant imaging system that is disposed within a vehicle. The system includes an automotive clock spring, at least one imaging unit, and a first processing unit. The automotive clock spring includes a rotor to which a rotatable portion of the steering wheel assembly is coupled, a stator coupled to a stationary portion of the vehicle, and a set of wires extending between the rotor and stator. The imaging unit is coupled to the rotatable portion of the steering wheel assembly. The first processing unit is disposed within the rotor and is configured for electrically receiving image signals captured by the imaging unit and selecting at least a portion of the image signals for communicating to a second processing unit disposed outside of the rotor. The selected image signals are electrically communicated to the second processing unit via the set of electrical wires.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: April 27, 2021
    Assignee: Joyson Safety Systems Acquisition LLC
    Inventors: Jason Carl Lisseman, Len Cech
  • Patent number: 10982093
    Abstract: The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: April 20, 2021
    Assignee: Arisawa Mfg. Co., Ltd.
    Inventors: Kazuo Yoshikawa, Makoto Tai, Nobuyuki Iwano
  • Patent number: 10957667
    Abstract: Embodiments are generally directed to indium solder metallurgy to control electro-migration. An embodiment of an electronic device includes a die; and a package substrate, wherein the die is bonded to the package substrate by an interconnection. The interconnection includes multiple interconnects, and wherein the interconnection includes a solder. The solder for the interconnection includes a combination of tin (Sn), copper (Cu), and indium (In).
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: March 23, 2021
    Assignee: Intel Corporation
    Inventors: Kyu Oh Lee, Yi Li, Yueli Liu
  • Patent number: 10939567
    Abstract: An electronic module includes a carrier element and a circuit board. The circuit board is attached in and/or to the carrier element via at least one connection site. The at least one connection site is formed by means of a hardenable medium.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: March 2, 2021
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Mike Duss, Martin Kaltenbrunner
  • Patent number: 10934617
    Abstract: A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of the substrate, the polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing the ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of the substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing the first metal on the second metal. Advantages include that materials sensitive to, for instance, low pH or solvents can be coated. Substrates including glass, SiO2 with very few or no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: March 2, 2021
    Assignee: CUPTRONIC TECHNOLOGY LTD.
    Inventors: Sven Göthe, Björn Atthoff, Karl-Gunnar Larsson
  • Patent number: 10892086
    Abstract: A coil electronic component includes a coil including upper and lower coils and a via electrically connecting the upper and lower coils to each other. The via is formed along at least a portion of a boundary surface of a through-hole penetrating upper and lower surfaces of a support member supporting the upper and lower coils.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Il Park, Young Sun Kim, HyeYeon Cha
  • Patent number: 10893603
    Abstract: A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: January 12, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
  • Patent number: 10847451
    Abstract: A device for mounting a semiconductor element includes a metal plate serving as a base, a roughened silver plating layer with acicular projections, formed on at least either of: (a) top faces; and (b) faces that form concavities or through holes between the top faces and bottom faces; of the metal plate, and a reinforcing plating layer covering, as an outermost plating layer, an outer surface of the acicular projections in the roughened silver plating layer. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. An outer surface of the reinforcing plating layer is shaped to have acicular projections with a surface area ratio of 1.30 or more and 6.00 or less to the corresponding smooth surface, as inheriting the shape of the acicular projections in the roughened silver plating layer.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 24, 2020
    Assignee: OHKUCHI MATERIALS CO., LTD.
    Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
  • Patent number: 10784642
    Abstract: A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal body having a columnar shape and fitted in a hole penetrating through the flexible insulating layer and the conductor layer such that the metal body is formed of a welding base material and has an end portion formed to be joined to an electrode of a battery by welding. The welding base material of the metal body of the flexible printed wiring board includes the same material as the electrode of the battery.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 22, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Takahisa Hirasawa, Takayuki Furuno
  • Patent number: 10770386
    Abstract: A wiring board includes: an insulating layer that includes a first surface over which an electronic component is mounted and a second surface opposite to the first surface; a conductive layer that is disposed on the second surface; a via that is provided inside a first through-hole that penetrates a portion between the first surface and the second surface of the insulating layer; an electrode that is disposed on the first surface and connected to the via; and a glass plate that is not contact with the conductive layer and is disposed on the first surface and includes a second through-hole through which the electrode is disposed.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: September 8, 2020
    Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Toshiki Iwai, Daisuke Mizutani
  • Patent number: 10741521
    Abstract: A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 11, 2020
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik Choi, Jin Won Jeong, Do Young Kim, Hye Ji Lee, Byeung Soo Song
  • Patent number: 10734316
    Abstract: A wiring board includes: an insulating layer that includes a first surface over which an electronic component is mounted and a second surface opposite to the first surface; a conductive layer that is disposed on the second surface; a via that is provided inside a first through-hole that penetrates a portion between the first surface and the second surface of the insulating layer; an electrode that is disposed on the first surface and connected to the via; and a glass plate that is not contact with the conductive layer and is disposed on the first surface and includes a second through-hole through which the electrode is disposed.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: August 4, 2020
    Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Toshiki Iwai, Daisuke Mizutani
  • Patent number: 10716222
    Abstract: Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: July 14, 2020
    Assignee: INTEL CORPORATION
    Inventors: Makoto Fujimura, Youhei Tateishi
  • Patent number: 10701806
    Abstract: A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong-Ho Baek, Jung-Hyun Cho, Seung-Yeop Kook
  • Patent number: 10667709
    Abstract: An implantable device is provided. The implantable device includes a flexible polymeric substrate that extends through an aperture in an electrically conductive material to form an anchor that partially covers the electrically conductive material. Methods for fabricating the implantable device are also provided.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 2, 2020
    Assignees: Board of Trustees of Michigan State University, Fraunhofer USA
    Inventors: Wen Li, Bin Fan, Robert Rechenberg, Michael Becker, Cory Rusinek
  • Patent number: 10652996
    Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: May 12, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Chun-Ming Chiu, Wei-Yu Chen, I-Liang Lee
  • Patent number: 10614328
    Abstract: Various implementations include a vehicle occupant imaging system that is disposed within a vehicle. The system includes an automotive clock spring, at least one imaging unit, and a first processing unit. The automotive clock spring includes a rotor to which a rotatable portion of the steering wheel assembly is coupled, a stator coupled to a stationary portion of the vehicle, and a set of wires extending between the rotor and stator. The imaging unit is coupled to the rotatable portion of the steering wheel assembly. The first processing unit is disposed within the rotor and is configured for electrically receiving image signals captured by the imaging unit and selecting at least a portion of the image signals for communicating to a second processing unit disposed outside of the rotor. The selected image signals are electrically communicated to the second processing unit via the set of electrical wires.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: April 7, 2020
    Assignee: Joyson Safety Acquisition LLC
    Inventors: Jason Carl Lisseman, Len Cech
  • Patent number: 10607956
    Abstract: A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: March 31, 2020
    Assignee: International Business Machines Corporation
    Inventors: Toyohiro Aoki, Takashi Hisada, Eiji I. Nakamura
  • Patent number: 10568201
    Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: February 18, 2020
    Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Hiroaki Takahashi, Tomoyuki Aoki, Kiyotaka Komori, Jun Tochihira, Ryu Harada
  • Patent number: 10559409
    Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: February 11, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Dallas J. Rensel, Brian P. Hohl, Jonathan Calamel, Xiaohong Tang, Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Jason Woods, Richard L. Brendel
  • Patent number: 10531578
    Abstract: A method for manufacturing a flexible circuit board with resistor which is buried in the board includes steps of providing a composite board, the composite board comprising a substrate, and a physical development core layer formed on the substrate. A silver halide emulsion layer is formed on the physical development core layer and the silver halide emulsion layer is exposed. A developing solution is applied to the halide emulsion layer and washed to form a silver layer on the substrate. A conductive layer is formed on the silver layer and the conductive layer is etched, forming at least one opening. Such opening exposes a portion of the silver layer which contains a buried resistor. Different processes and materials applied in the above procedure serve to increase or decrease the resistance of the resistor as desired.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: January 7, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Mei Yang, Yan Liu
  • Patent number: 10522382
    Abstract: A system and method for a semiconductor wafer carrier is disclosed. An embodiment comprises a semiconductor wafer carrier wherein conductive dopants are implanted into the carrier in order to amplify the coulombic forces between an electrostatic chuck and the carrier to compensate for reduced forces that result from thinner semiconductor wafers. Another embodiment forms conductive layers and vias within the carrier instead of implanting conductive dopants.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: December 31, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Jean Lu, Ming-Fa Chen, Chen-Shien Chen, Jao Sheng Huang
  • Patent number: 10512126
    Abstract: A number of variations may include a method that may include providing a glass substrate that may include a first surface and a second surface; disposing a ceramic frit that may include at least one bus bar and at least one grid line on the first surface to form a window assembly; bathing the window assembly in a first bath solution; and drying the window assembly.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: December 17, 2019
    Assignee: GM Global Technology Operations LLC
    Inventors: David T. Renke, Thomas D. Hagen, John M. Moote
  • Patent number: 10495840
    Abstract: The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: December 3, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Kenta Tsujie
  • Patent number: 10485098
    Abstract: An electronic component device includes: a wiring board including an insulating layer, and a plurality of pads exposed from the insulating layer; an electronic component module including: an insulating base material; an electronic component embedded in the insulating base material; and a plurality of connection terminals each connected to a corresponding one of the pads; and a sealing resin provided between the whole of a lower surface of the electronic component module id the wiring board. A content rate of filler contained in the sealing resin is higher than that of filler contained in the insulating layer and that of filler contained in the insulating base material.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: November 19, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Shota Miki
  • Patent number: 10481496
    Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 19, 2019
    Assignee: International Business Machines Corporation
    Inventors: Gerald Bartley, Matthew Doyle, Darryl Becker, Mark Jeanson
  • Patent number: 10485118
    Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: November 19, 2019
    Assignee: MC10, Inc.
    Inventors: Brian Elolampi, David G. Garlock, Harold Gaudette, Steven Fastert, Adam Standley, Yung-Yu Hsu
  • Patent number: 10426029
    Abstract: A micro-pad array to conductive wire flexible attachment assembly includes a micro-pad geometry formed on a flexible printed circuit and a method for connecting a conductive wire, thread or fiber to the micro-pad geometry.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: September 24, 2019
    Assignee: Flex Ltd.
    Inventors: Michael James Glickman, Nicholas LeClerc
  • Patent number: 10410991
    Abstract: A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: September 10, 2019
    Assignee: IMMUNOLIGHT, LLC
    Inventors: Zakaryae Fathi, Frederic A. Bourke, Jr., Harold Walder
  • Patent number: 10412840
    Abstract: Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: September 10, 2019
    Assignee: DOTSLAM, INC.
    Inventors: Lewis James Marggraff, Nelson G. Publicover, Blake Marggraff, Edward D. Krent, Marc M. Thomas
  • Patent number: 10363602
    Abstract: Metal nanoparticles according to the present invention have at least a bimodal size distribution in which the ratio obtained by dividing the area of a first peak, which has the smallest median size on the basis of the median size of peaks in the size distribution of the metal nanoparticles, by the total area of all peaks constituting the size distribution meets 0.4-0.8, and are capped with a capping layer containing an organic acid.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: July 30, 2019
    Assignee: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Young Min Choi, Eun Jung Lee, Sun Ho Jeong, Yeong Hui Seo, Beyong Hwan Ryu, Su Yeon Lee
  • Patent number: 10356916
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: July 16, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Sang Yul Ha, Sung Han Kim, Kyung Ho Lee, Seok Hwan Ahn, Myung Sam Kang
  • Patent number: 10342129
    Abstract: A substrate includes an insulation layer including a glass cloth impregnated with a resin, and a through hole having a hole included in the insulation layer and plating formed in an inner surface of the hole, where a location, intersecting with the glass cloth, of an outer circumferential portion of the through hole has a recessed portion recessed toward an outside of the hole.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: July 2, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Shigeo Iriguchi, Takahiro Kitagawa, Mitsunori Abe, Shigeru Sugino, Nobuo Taketomi, Kiyoyuki Hatanaka, Ryo Kanai
  • Patent number: 10300700
    Abstract: An inkjet printhead includes: a rigid elongate carrier having an ink supply channel and a lower surface having a plurality of printhead chips mounted thereon; a rigid PCB attached to the lower surface of the carrier, the PCB extending a length of the carrier and projecting laterally beyond a sidewall of the carrier; a lead retainer attached to the sidewall of the carrier; and a plurality of leads extending upwardly from contact pads positioned along a longitudinal edge portion of the PCB, each lead being secured to the sidewall of the carrier via the lead retainer. The PCB supplies power and data to the printhead chips via electrical connections between the PCB and the printhead chips.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: May 28, 2019
    Assignee: Memjet Technology Limited
    Inventors: Jason Thelander, David Burke, Andrew Thomas
  • Patent number: 10297937
    Abstract: A composite flexible printed wiring board includes a first flexible printed wiring board having an insulating layer, conductor layers and a first metal block fitted in a hole penetrating through the conductor layers and insulating layer, and a second flexible printed wiring board having an insulating layer, conductor layers and a second metal block fitted in a hole penetrating through the conductor layers and insulating layer. The first flexible printed wiring board and the second flexible printed wiring board have a welded portion formed by welding the first metal block and the second metal block and joining the first metal block and the second metal block such that the welded portion is joining the first flexible printed wiring board and the second flexible printed wiring board.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: May 21, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takahisa Hirasawa, Takayuki Furuno
  • Patent number: 10297564
    Abstract: A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: May 21, 2019
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Georg Meyer-Berg
  • Patent number: 10279055
    Abstract: Power supply unit, in particular for a sterilization device, comprising at least one electric component, wherein, at least one of the electric components is at least partly covered with a solid insulation layer, wherein the solid insulation layer is adapted to provide an electric insulation.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: May 7, 2019
    Assignee: TETRA LAVAL HOLDINGS & FINANCE S.A.
    Inventor: Iosif Izrailit
  • Patent number: 10278289
    Abstract: A resin circuit board includes a multilayer body, mounting land conductors, and second components. The multilayer body includes thermoplastic resin layers laminated together. The mounting land conductors are provided on a front surface of the multilayer body, and terminal conductors of a first component are bonded to the mounting land conductors by a thermal bonding method. The second components are disposed in the multilayer body and each has a modulus of elasticity greater than that of the multilayer body. When the multilayer body is seen in plan view, the second components are arranged such that a straight line connecting the second components passes through the center of gravity of the first component and such that the second components are superposed with the mounting land conductors.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: April 30, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Shigeru Tago, Masaki Kawata
  • Patent number: 10264672
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: April 16, 2019
    Assignee: AGC Inc.
    Inventors: Shigetoshi Mori, Motoshi Ono, Mamoru Isobe, Kohei Horiuchi
  • Patent number: 10209619
    Abstract: A semiconductor device production composition comprises a product obtained by mixing a metal compound and a compound represented by Formula (1) in a first organic solvent, and a second organic solvent. R and R? each independently represent a hydrogen atom, a linear or cyclic alkyl group having a carbon number of 2 to 20, a linear or cyclic alkylcarbonyl group having a carbon number of 2 to 20, an aryl group having a carbon number of 6 to 20, or an aryloxy group having a carbon number of 6 to 20, and part of the hydrogen atoms in the cyclic alkyl, cyclic alkylcarbonyl, aryl, or aryloxy group are substituted or unsubstituted.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: February 19, 2019
    Assignee: JSR CORPORATION
    Inventors: Hisashi Nakagawa, Ryuichi Saitou, Shunsuke Kurita, Tatsuya Sakai
  • Patent number: 10194537
    Abstract: A printed circuit board and method of manufacturing same, the printed circuit board comprising a stack of layers. The stack of layers being comprised of alternating circuit layers and insulating layers that are laminated together. The stack of layers includes an area with resin cured to a degree. The area has a coefficient of thermal expansion that is dependent, at least in part, on the degree of curing of the resin.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: January 29, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bruce J. Chamberlin, Joseph Kuczynski, Paula M. Nixa
  • Patent number: 10188005
    Abstract: A control unit device for a motor vehicle includes a circuit board, on which a plurality of electronic components are disposed. The electronic components are electrically coupled to one another by conductor tracks on the circuit board. A substantially gas-impermeable cover is materially joined or bonded to the circuit board in such a way that the cover, together with the circuit board, forms a closed cavity in which the electronic components and the associated conductor tracks are located. A method for producing the control unit device is also provided.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: January 22, 2019
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Andreas Albert, Gerhard Bauer, Juergen Henniger, Matthias Keuten, Michael Novak, Bernhard Schuch, Matthias Wieczorek