Synthetic Resin Substrate Patents (Class 205/164)
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Patent number: 5759378Abstract: The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.Type: GrantFiled: February 26, 1997Date of Patent: June 2, 1998Assignee: MacDermid, IncorporatedInventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
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Patent number: 5725807Abstract: A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.Type: GrantFiled: June 7, 1995Date of Patent: March 10, 1998Assignee: Electrochemicals Inc.Inventors: Charles Edwin Thorn, Frank Polakovic, Charles A. Mosolf
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Patent number: 5702584Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.Type: GrantFiled: July 1, 1996Date of Patent: December 30, 1997Assignee: Ford Motor CompanyInventors: Lakhi N. Goenka, Michael G. Todd, Andrew Z. Glovatsky
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Patent number: 5690805Abstract: A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.Type: GrantFiled: June 7, 1995Date of Patent: November 25, 1997Assignee: Electrochemicals Inc.Inventors: Charles Edwin Thorn, Frank Polakovic, Charles A. Mosolf
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Patent number: 5681444Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.Type: GrantFiled: July 3, 1996Date of Patent: October 28, 1997Assignee: David Sarnoff Research Center, Inc.Inventors: Thomas Peter Azzaro, Barry Jay Thaler, Edward James Conlon, Ananda Hosakere Kumar
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Patent number: 5679234Abstract: A mask layer is formed on a conductive layer covering not only a central area assigned to integrated circuits but also a vacant peripheral area of a semiconductor wafer, and an electroplating system allows metallic miniature patterns to grow on the conductive layer over the vacant peripheral area as well as extremely small areas of the conductive layer over the central area so as to make current fluctuation negligible.Type: GrantFiled: September 19, 1995Date of Patent: October 21, 1997Assignee: NEC CorporationInventor: Takafumi Imamura
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Patent number: 5674373Abstract: A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9).Type: GrantFiled: April 12, 1996Date of Patent: October 7, 1997Assignee: TrefimetauxInventors: Marcel Negrerie, Guy de Hollain, Van Huu N'Guyen, Serge Insenga
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Patent number: 5632927Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.Type: GrantFiled: February 21, 1996Date of Patent: May 27, 1997Assignee: MacDermid, IncorporatedInventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
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Patent number: 5630928Abstract: A resin product has a body made of a resin. The body has an outer surface including an ornamental surface and an unornamental surface, a first area defined on the outer surface, and a chemical plating layer and an electroplating layer respectively formed on the first area. A process for producing the resin product comprises the step of making a first boundary along a contour of the first area located on the ornamental surface, and the step of making a second boundary along a contour of the first area located on the unornamental surface. The step of making the second boundary includes forming a resist layer on the unornamental surface. The resist layer has a resistivity to a chemical plating solution for making the chemical plating layer.Type: GrantFiled: March 9, 1995Date of Patent: May 20, 1997Assignee: Toyoda Gosei Co., Ltd.Inventors: Yasuhiko Ogisu, Shigeyuki Takahashi, Mamoru Kato
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Patent number: 5629062Abstract: A fiber reinforced plastic pipe comprising a cylindrical inner layer formed by winding a prepreg sheet containing a thermosetting resin as a matrix and an outer layer formed by winding a thermoplastic resin sheet or tape around the inner layer, said inner and outer layers being heat cured and thermocompression bonded in one united body; and a process for manufacturing the fiber reinforced plastic pipe. When the fiber reinforced plastic pipe is manufactured, the thermosetting resin is used for forming the inner layer and the thermoplastic resin is used for forming the outer layer. Moreover, a metal coat can be firmly bonded to the surface of the outer layer. Hence, a fiber reinforced plastic pipe prominently improved in impact resistance, abrasion resistance and lightweight properties can be provided.Type: GrantFiled: January 3, 1996Date of Patent: May 13, 1997Assignee: Petoca, Ltd.Inventors: Hiroshi Ejiri, Hideyuki Nakajima
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Patent number: 5618400Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.Type: GrantFiled: September 19, 1995Date of Patent: April 8, 1997Assignee: Shipley Company, L.L.C.Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
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Patent number: 5616230Abstract: A process for plating an electrically nonconductive substrate by the following sequence of steps:(1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent;(2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant;(3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives;(4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and(5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4).Type: GrantFiled: January 20, 1995Date of Patent: April 1, 1997Assignee: Okuno Chemical Industries Co., Ltd.Inventors: Kuniaki Otsuka, Kazue Yamamoto, Satoshi Konishi, Shigeru Yamato
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Patent number: 5597471Abstract: A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.Type: GrantFiled: April 11, 1995Date of Patent: January 28, 1997Assignee: Atotech Deutschland GmbHInventors: Andrea Ragge, Heinrich Meyer, Gonzalo Urrutia Desmaison
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Patent number: 5575898Abstract: Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a microemulsion of a monomeric thiophene of the formula (I) is used to form the conductive polythiophene layer, ##STR1## in which X denotes oxygen or a single bond,R.sub.1 and R.sub.2 mutually independently denote hydrogen or a C.sub.1 -C.sub.4 alkyl group or together form an optionally substituted C.sub.1 -C.sub.4 alkylene residue or a 1,2-cyclohexylene residue,and in that the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive base.Type: GrantFiled: September 20, 1995Date of Patent: November 19, 1996Assignee: Bayer AGInventors: Gerhard-Dieter Wolf, Friedrich Jonas, Reinhard Schomacker
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Patent number: 5569493Abstract: A method is provided for preparing the surface of a cured cyanate ester resin or composite for metal plating. The composite may comprise graphite fibers embedded in a cured cyanate ester resin matrix The surface is treated with a preheated solution containing an alkali metal salt of an alkoxide. Preferred alkoxides are methoxide, ethoxide, propoxide, isopropoxide, butoxide, tert-butoxide, sec-tutoxide, 2- methyl-2-butoxide, pentoxide and hexoxide. The method of the invention operates to improve adhesion between the treated surface and a subsequently plated metal, such that the resulting cured cyanate ester resin or composite may replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.Type: GrantFiled: November 14, 1994Date of Patent: October 29, 1996Assignee: Hughes Aircraft CompanyInventors: Diana D. Granger, Leroy J. Miller
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Patent number: 5547559Abstract: The invention described provides a process for direct electroplating on activated surfaces substantially without the formation of a smut layer and thereby improving the adhesion of the plated deposit to the surface. The use of divalent or tetravalent sulfur compounds and/or cathodic electrocleaning is proposed between activation of the surface and electroplating of the surface.Type: GrantFiled: July 10, 1995Date of Patent: August 20, 1996Assignee: MacDermid, IncorporatedInventors: Peter Kukanskis, Ernest Yakobson, Lev Taytsas
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Patent number: 5547558Abstract: The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.Type: GrantFiled: March 15, 1995Date of Patent: August 20, 1996Assignee: MEC Co., Ltd.Inventors: Yoshihiro Sakamoto, Toshio Tanimura
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Patent number: 5545308Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.Type: GrantFiled: June 19, 1995Date of Patent: August 13, 1996Assignee: Lynntech, Inc.Inventors: Oliver J. Murphy, G. Duncan Hitchens, Dalibor Hodko, Eric T. Clarke, David L. Miller, Donald L. Parker
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Patent number: 5536386Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.Type: GrantFiled: February 10, 1995Date of Patent: July 16, 1996Assignee: MacDermid, IncorporatedInventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
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Patent number: 5503732Abstract: A method for manufacturing a substrate useful as a color filter for LCD and having window-shaped coating films and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, which comprises the steps of:(a) forming a functional coating film on a transparent substrate having electrically conductive circuits on a surface thereof,(b) superposing a photomask having a predetermined pattern on the surface of the coating film formed in step (a), and exposing the thus masked coating film to light,(c) subjecting the intermediate product to developing to leave a frame-shaped coating film, and(d) subjecting the resulting substrate formed through steps (a) to (c) to electro-deposition to form electro-deposition coating films on the electrically conductive circuits, enables production of coating films of fine pattern with improved precision.Type: GrantFiled: July 12, 1994Date of Patent: April 2, 1996Assignee: Shinto Paint Co., Ltd.Inventors: Susumu Miyazaki, Tsuyoshi Nakano, Yoshikatsu Okada, Yasuhiko Teshima, Miki Matsumura
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Patent number: 5484516Abstract: Contoured step sections and contoured grooves along the step sections are formed on a grille body. The grille body is subjected to chemical plating. Since the grooves have narrow bottoms, the bottoms remain unplated, so that a chemical plating layer is formed on the entire surface of the grille body except for the bottoms. The grille body having the chemical plating layer formed thereon is then subjected to an electroplating step having a plurality of steps. An undercoat plating layer is formed on the chemical plating layer formed on the portions where decorative plating is to be applied. The chemical plating layer formed on the portions where no decorative plating is to be applied is dissolved with a predetermined solution. Subsequently, a general electroplating layer is formed on the undercoat plating layer. Thus, the chemical plating layer and the electroplating layers are formed only on the to-be-plated portions.Type: GrantFiled: April 8, 1994Date of Patent: January 16, 1996Assignee: Toyoda Gosei Co., Ltd.Inventors: Toshikazu Funahashi, Yasuhiko Ogisu, Mamoru Kato, Shigeyuki Takahashi, Toshiya Uemura
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Patent number: 5476580Abstract: A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.Type: GrantFiled: May 3, 1994Date of Patent: December 19, 1995Assignee: Electrochemicals Inc.Inventors: Charles E. Thorn, Frank Polakovic, Charles A. Mosolf
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Patent number: 5462771Abstract: The present invention provides a method of manufacturing an electromagnetic wave shielding plastic molding, which comprises the step of, without prior washing and without providing a primer layer, or after providing a water-soluble primer layer, forming a conductive layer comprising at least one selected from the group consisting of Al, Cu, Ni, Cr and Sn and alloys thereof by high-frequency excited plasma. The electromagnetic wave shielding plastic molding thus-produced has excellent in electromagnetic wave shielding effects, adhering strength, humidity resistance and hardness, has economic advantages, and hence is useful as an electromagnetic wave shield for a plastic molding, such as the housing for a portable telephone.Type: GrantFiled: November 9, 1993Date of Patent: October 31, 1995Inventors: Akira Motoki, Yoichi Murayama
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Patent number: 5454930Abstract: An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.Type: GrantFiled: July 28, 1994Date of Patent: October 3, 1995Assignee: Learonal Japan Inc.Inventors: Takeshi Miura, Masaru Seita
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Patent number: 5423956Abstract: A process is provided to prepare flexible composite polymer fibers by electrochemically forming a coating of a conductive organic polymer on the outer surface of a polymeric fiber.Type: GrantFiled: July 1, 1993Date of Patent: June 13, 1995Assignee: Regents of the University of MinnesotaInventors: Henry S. White, Christopher W. Macosko, Shulong Li
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Patent number: 5422246Abstract: An electrode is composed of a membrane, provided with open pores running through said membrane, the walls of the pores having an electrically conducting polymer coating, containing a redox enzyme bound thereto. In these type of electrodes a direct electron transfer is possible between the redox enzyme, e.g. glucose oxidase, and the electrically conducting polymer, e.g. polypyrrole. Such an electrode, which can be produced in a simple manner, has extensive application possibilities such as, for example, in a biosensor or in a production installation for the preparation of specific chemicals. As starting materials for the electrodes of the invention, use can be made of marketed porous membrane materials as well as of latex particles. The walls of the pores of porous membrane and the interstices of the latex particles respectively are provided with a thin layer of the electrically conducting polymer which in turn is provided with a redox enzyme suitable for the pursued aim.Type: GrantFiled: June 14, 1993Date of Patent: June 6, 1995Assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TnoInventors: Cornelis G. J. Koopal, Richardus B. M. Schasfoort, Roeland J. M. Nolte
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Patent number: 5415762Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.Type: GrantFiled: August 18, 1993Date of Patent: May 16, 1995Assignee: Shipley Company Inc.Inventors: George R. Allardyce, Kevin Bass, John E. Graves, James G. Shelnut
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Patent number: 5413694Abstract: A method of improving the electromagnetic (EM) shielding performance of a mposite material is provided. The composite material has conductive and semi-conductive filler particles suspended in a non-conductive resin. The filler particles can be up to 40 weight percent of the composite material. The composite material is electroplated with a conductive material onto a portion of its surface to improve the electrical connection between the conductive material and a portion of the filler particles. EM shielding performance can be further enhanced by injecting an exponentially decaying electromagnetic pulse through the composite material that has been electroplated.Type: GrantFiled: July 30, 1993Date of Patent: May 9, 1995Assignee: The United States of America as represented by the Secretary of the NavyInventors: David S. Dixon, Michael D. Obara, James V. Masi, William G. Bradley
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Patent number: 5387332Abstract: A method for the direct metallization of non-conductors and printed circuit boards is disclosed wherein the non-conductive substrate or printed circuit board is treated with an aqueous cleaner/conditioner composition comprising a cationic surfactant, said surfactant is a quaternary ammonium ion having a molecular weight of below 1,000, thereby rendering the substrate of a printed circuit board receptive to the uniform adherence and adsorption of the noble metal catalyst deposited thereafter, which catalysts are used, directly or indirectly, as the sites of direct electroplating without the need of using electroless plating. The cleaner/conditioner is particularly useful because it does not require the use of chelating agent(s) which are commonly used in the art and thereby eliminates waste treatment problems prevalent in the industry.Type: GrantFiled: July 14, 1993Date of Patent: February 7, 1995Inventor: Martin Straus
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Patent number: 5362374Abstract: The method for making a decorative sticker includes the steps of (a) providing a polyester (trade name: Tetoron) base film which has a top surface and a bottom surface, (b) applying a metal coating on the polyester base film by electroplating so that the top and bottom surfaces of the polyester base film can sparkle in the presence of bright light, (c) applying a hot-melt adhesive layer on the bottom surface of the polyester base film, (d) attaching a release paper to the hot-melt adhesive layer, (e) applying a binder layer with a predetermined figure on a predetermined part of the top surface of the polyester base film, (f) printing a first desired pattern on the remaining part of the top surface of the polyester base film by pressing the remaining part with ink, (g) printing a second desired pattern on the remaining part of the top surface of the polyester base film by pressing the remaining part with gold foil, (h) die-cutting the polyester base film on the top surface thereof so as to form a predeterminedType: GrantFiled: August 27, 1993Date of Patent: November 8, 1994Inventor: Jung-Ming Chang
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Patent number: 5300208Abstract: A process for fabricating a printed circuit board concerns the use of a soluble, air-stable conducting polymer applied to plated through holes, blind holes or vias or to a predetermined portion of the printed circuit board surface for selectively metal plating on the polymer without the necessity of either an electroless plating bath or the use of precious metal seeds. A preferred conducting polymer is polyaniline. A preferred metal plating is preferably copper or a noble metal such as palladium or silver.Type: GrantFiled: August 14, 1989Date of Patent: April 5, 1994Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Wu-Song Huang, Jae M. Park, James R. White
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Patent number: 5234715Abstract: An article comprising a non-conductive substrate having a sub-micron thickness of an oxidizable conductive first metal coating thereon, and a second (promoter) metal which is galvanically effective to promote the corrosion of the first metal, discontinuously coated on the first metal coating. Optionally, the second metal-doped, first metal-coated substrate may be further coated with a salt, to accelerate the galvanic corrosion reaction by which the conductive first metal coating is oxidized. Also disclosed is a related method of forming such articles, comprising chemical vapor depositing the first metal on the substrate and chemical vapor depositing the second metal on the applied first metal coating, and of optionally applying a salt by salt solution contacting of the second metal-doped, first metal-coated substrate. When utilized in a form comprising fine-diameter substrate elements such as glass or ceramic filaments, the resulting product may be usefully employed as an evanescent chaff.Type: GrantFiled: August 7, 1991Date of Patent: August 10, 1993Assignee: Advanced Technology Materials, Inc.Inventors: Ward C. Stevens, Edward A. Sturm, Delwyn F. Cummings
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Patent number: 5198096Abstract: Method of modifying a polycarbonate surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface is first rendered hydrophilic by an exposure to actinic light such as ultraviolet light. The surface is then impregnated with a diffuser such as hydrochloric acid. The surface after impregnation is etched with a base such as potassium hydroxide and cleaned by oxidizing it with a solution of an oxidizing agent such as potassium permanganate. The cleaned surface is then neutralized by contacting it with a mild reducing agent. The chemically and physically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained.Type: GrantFiled: November 28, 1990Date of Patent: March 30, 1993Assignee: General Electric CompanyInventors: Donald F. Foust, Lewis A. Bernstein
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Patent number: 5176811Abstract: Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, modified by the addition of an effective amount of NH.sub.4.sup.+.Type: GrantFiled: February 1, 1991Date of Patent: January 5, 1993Assignee: International Business Machines CorporationInventors: Leann G. Keim, Ralph S. Paonessa, Daniel C. Van Hart
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Patent number: 5106462Abstract: Process for producing a copper plated resin article by forming a uniform copper coating having excellent adhesive strength on a fiber-reinforced or unreinforced thermoplastic or thermosetting resin article having a heat deformation temperature higher than 165.degree. C. The resin article is heated along with a source of copper formate under a reduced pressure or in a non-oxidative atmosphere to a temperature in the range above 165.degree. C. but lower than the heat deformation temperature of the resin article. The process makes it possible to produce a resin article having formed thereon a copper layer having an excellent adhesive strength by a very simple manner, and the resin article thus obtained can be used in various industrial fields.Type: GrantFiled: November 7, 1989Date of Patent: April 21, 1992Assignee: Mitsubishi Gas Chemical Co., Inc.Inventors: Takamasa Kawakami, Rieko Nakano, Kazuhiro Ando, Ryuji Fujiura
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Patent number: 5106473Abstract: A process is provided for metallizing the hole-wall surface of a through-hole provided in a printed circuit board precursor. In an initial step, the hole-wall surface is pre-treated with an oxidizing agent which micro-roughens it. An electro-conductive polymer film is then formed on the micro-roughened surface by oxidatively polymerizing in situ an acidic solution of an organic monomer with an oxidizing agent previously adsorbed on the board. The polymer film includes dopant anions which are acquired from the monomer solution. Finally, a metal layer is electroplated on the electro-conductive polymer film.Type: GrantFiled: May 3, 1991Date of Patent: April 21, 1992Assignee: LeaRonal, Inc.Inventors: Keith J. Whitlaw, Mark Goodenough
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Patent number: 5071519Abstract: A method of plating a flexible plastic part is disclosed where serrations are provided on a flexible beam where the serrations are sinuous in shape. After molding the serrations onto the flexible beam, the component is electrically dipped to plate the component. The flexible beam can now be flexed without concern of cracking the plating along the length of the beam where the beam is flexed. A second embodiment shows an outlet box including two latch members along the sides which are bow shaped and have grounding surfaces thereon, which latch the outlet box in place to a panel, and simultaneously ground the box to the panel.Type: GrantFiled: February 6, 1990Date of Patent: December 10, 1991Assignee: AMP IncorporatedInventors: Jess B. Ferrill, Randy G. Simmons