Abstract: The present invention provides several manufacturing processes for surface treatment in order to improve conventional electroplating, coating, sputtering processes. Through the surface treatment of the present invention, a brilliant modern pattern/mark can be achieved. Pearl luster lacquer coating, non-pearl luster lacquer coating and laser-marking are the characteristics of the present invention.

Abstract: Process for coating plastics with metals, wherein the plastics are pretreated with a composition comprising at least one salt having a melting point of less than 100° C. at 1 bar (hereinafter referred to as ionic liquid).

Abstract: There is provided a manufacturing method of an aluminum structure, including a conductive treatment process of forming an electrically conductive layer on a surface of a resin molded body, the electrically conductive layer being made of one or more metals selected from the group consisting of gold, silver, platinum, rhodium, ruthenium, palladium, nickel, copper, cobalt, iron, and aluminum, and a plating process of plating the resin molded body subjected to the conductive treatment process with aluminum in a molten salt bath. The manufacturing method of an aluminum structure allows aluminum plating on the surface of even a porous resin molded body having a three-dimensional network structure. In particular, there is also provided a manufacturing method of an aluminum structure that can form porous aluminum having a large area.

Abstract: A porous resin article having a three-dimensional network structure is used. A resin molded body at least the surface of which has been subjected to conductive treatment is plated with aluminum in a molten salt bath to form an aluminum structure, thus forming a porous aluminum that includes an aluminum layer having a thickness in the range of 1 to 100 ?m, has an aluminum purity of 98.0% or more and a carbon content of 1.0% or more and 2% or less, and contains inevitable impurities as the balance. Even with a porous resin molded body having a three-dimensional network structure, this allows the surface of the porous resin molded body to be plated with aluminum, thus forming a high-purity aluminum structure having a uniform thick film.

Abstract: A method of making colloidal sphere templates and the sphere-templated porous materials made from the templates. The templated porous materials or thin films comprise micron and submicron-scaled spheres in ordered, disordered, or partially ordered arrays. The invention is useful in the synthesis of submicron porous, metallic tin-based and other high capacity anode materials with controlled pore structures for application in rechargeable lithium-ion batteries. The expected benefits of the resulting nanostructured metal films include a large increase in lithium storage capacity, rate capability, and improved stability with electrochemical cycling.

Abstract: A method of fabricating a membrane having a tapered pore, a polymeric membrane having a tapered pore, and uses of such polymeric membrane are disclosed. The membrane includes apertures of increasing diameter which are aligned with each other to form the tapered pore.

Abstract: Disclosed is a negative electrode active material for a lithium ion secondary battery, which is capable of further improving the charge/discharge cycle characteristics. Also disclosed is a lithium ion secondary battery which uses the negative electrode active material for a lithium ion secondary battery. The negative electrode active material for a lithium ion secondary battery is composed of composite particles each of which has a core/shell structure configured of a core part that is formed from a polymer and a shell part that is formed of a metal layer. The metal layer of the shell part is formed by metal plating. Preferably, the metal layer comprises at least a metal layer (a1) that is formed by electroless plating and a metal layer (a2) that is formed by electrolytic plating, in this order from the core part side.

Abstract: The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is possible.

Abstract: According to an example embodiment a method of plating resin using a graphene thin layer includes forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer fog on the resin substrate.

Abstract: The present invention discloses a method for metallizing a plastic surface. The method may comprise the steps of: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, the present invention discloses a method for preparing a plastic article and a plastic article as manufactured by the method as described.

Abstract: A process for fabricating oleophobic surface coatings to be deposited on a metal surface, such as the front-face or aperture plate of piezoelectric print heads and transfix rolls. The surface coatings are applied to the surface by electrochemical polymerization.

Abstract: A plating catalyst liquid which places little burden on the environment, which does not roughen the surface of a plating target, which can be easily controlled for the amount of plating catalyst applied and which is at low risk of inflammation and is highly safe, and a plating method using the plating catalyst are provided. The plating catalyst liquid includes a palladium compound, water, and a water-soluble combustible liquid serving as a combustible liquid ingredient, has a flash point of 40° C. or more and contains the water-soluble combustible liquid in an amount of 0.1 to 40 wt %.

Abstract: A surface treatment process which enables a substrate (polymer) to be given specific physical properties, especially surface nanoporosity, for example with a view to electroless metallizing it, and which completely replaces surface treatment by sulfo-chromic pickling. The surface treatment includes a hybrid UV/corona treatment of the substrate surface followed by non-electrolytic metallization. A device for implementing these processes is also disclosed.

Abstract: Novel, simple methods are presented directed to the synthesis of aligned nanofibers of polyaniline and substituted derivatives on a substrate. The production of these fibers is achieved via various methods by controlling the concentration of aniline monomer or substituted aniline derivatives or an oxidant in the reaction medium and maintaining said concentration at a level much lower than conventional polyaniline synthesis methods. Methods are disclosed relating to the use of a permeable membrane to control the release of a monomer and/or oxidant as well as a bulk polymerization method.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: Provided is a method for preparing an epoxy substrate having a nanopattern, including: (a) forming a titanium oxide film by anodizing a titanium substrate; (b) obtaining a titanium substrate having a concave shape formed on the surface by removing the titanium oxide film from the titanium substrate on which the titanium oxide film has been formed; (c) coating an epoxy resin onto the titanium substrate on which the concave shape has been formed; and (d) obtaining an epoxy substrate having a nanopattern of convex surfaces by removing the titanium substrate. According to the presently disclosed method, an epoxy substrate having a nanopattern of convex surfaces is prepared by anodizing a titanium substrate, coating an epoxy resin onto a nanopattern formed with a concave shape on the surface of the titanium substrate, and removing the titanium substrate.

Abstract: This invention provides a transparent electrically conductive film, which, while maintaining the light transparency of a transparent film, has excellent electrical conductivity, can be utilized for electromagnetic wave shielding, and does not cause inclusion of air bubbles in the lamination onto other base material, and a process for producing the same. The production process comprises the steps of forming a large number of concaves and convexes having an average height of not more than 0.1 ?m on both sides or one side of a transparent film, forming a resist layer having a pattern shape opposite to the electrically conductive part in the electrically conductive film on the transparent film on its concave-convex side, applying a catalyst for plating onto the resist layer-formed face, separating the resist layer, forming a metal layer by plating, and blackening the metal layer, the metal layer satisfying 1?W/T?500 wherein W represents the width of the metal layer and T represents the height of the metal layer.

Abstract: The process for the application of a metal layer on a substrate by deposition of a metal from a metal salt solution comprises the presence of exfoliated graphite in the substrate surface.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the coefficient of linear thermal expansion (CLTE) of the metallic layer and the substrate are mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: Metal-coated polymer articles containing structural substantially porosity-free, fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein on polymer substrates, are disclosed. The substantially porosity-free metallic coatings/layers/patches are applied to polymer or polymer composite substrates to provide, enhance or restore vacuum/pressure integrity and fluid sealing functions. Due to the excellent adhesion between the metallic coating and the polymer article satisfactory thermal cycling performance is achieved. The invention can also be employed as a repair/refurbishment technique. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, aerospace and automotive parts and other components exposed to thermal cycling and stress created by erosion and impact damage.

Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.

Abstract: There is provided a polymer containing a unit represented by the following Formula (1), and a unit represented by following Formula (2). In Formula (1) and Formula (2), R1 to R5 each independently represent a hydrogen atom, a substituted or unsubstituted alkyl group; R6 represents an unsubstituted alkyl group, alkenyl group, alkynyl group or an aryl group; V and Z each independently represent a single bond, a substituted or unsubstituted divalent organic group, an ester group, an amide group or an ether group, and L1 and L2 each independently represent a substituted or unsubstituted divalent organic group.

Abstract: Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.

Abstract: Described is an improved process for the simultaneous conditioning and etching of a thermoplastic substrate for metal plating using sulfuric acid dissolved in a solvent.

Abstract: The present invention provides a method of forming a nanostructured surface (NSS) on a polymer electrolyte membrane (PEM) of a membrane electrode assembly (MEA) for a fuel cell, in which a nanostructured surface is suitably formed on a polymer electrolyte membrane by plasma treatment by plasma-assisted chemical vapor deposition (PACVD), where catalyst particles or a catalyst layer are directly deposited on the surface of the polymer electrolyte membrane having the nanostructured surface.

Abstract: Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m2 to 50 mg/m2 and a tin layer having a thickness by weight of 5 mg/m2 to 40 mg/m2 in this order, and the silane coupling agent layer is provided on the rust-proofing treatment layer is employed.

Abstract: A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper.

Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.

Abstract: A fuel cell separator, comprising carbonic electro-conductive graphite, and non-carbonic epoxy resin, hardening agent and hardening expediter, which are all made into powder, and formed into the fuel cell separator, wherein the fuel cell separator is plated with nickel by plating with nickel the surface of the fuel cell separator made through the process described above.

Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.

Abstract: A method of manufacturing a flexible film is disclosed. The method includes (a) forming at least one hole on an insulating film, (b) after the step (a), forming a first metal layer on a first surface corresponding to an inner circumferential surface of the hole, and at least one of a second surface corresponding to an upper surface of the insulating film and a third surface corresponding to a lower surface of the insulating film, and (c) forming a second metal layer on the first metal layer. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract: A method for manufacturing a plated film by bringing a film having a conductive surface into electrical contact with a cathode roll with a liquid film interposed between the film and the cathode and forming a metal plating on the conductive surface of the film, characterized in that the relation E0>[(I/Cs)×d]/? where E0 is the reduction potential of the metal forming the plating, I is the value of the current flowing through the cathode roll for plating, Cs is the area of the conductive surface of the film in electrical contact with the cathode roll with a liquid film interposed therebetween, d is the thickness of the gap between the cathode roll and the conductive film, and ? is the conductivity of the liquid forming the liquid film present in the gap. A cathode roll having a surface roughness Rmax of 1 ?m or less is also disclosed. Further a cathode roll having a Vickers hardness of the surface of 200 or more is disclosed.

Abstract: Thermoplastic compositions containing certain salts of fluorinated sulfonic acids adhere especially well to coatings (paints) applied to the surface(s) of that composition. Useful parts that can be made include painted automotive body parts, appliance cases, and other parts with painted aesthetically pleasing surfaces.

Abstract: The invention relates to a process for the electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid comprising at least one tetraalkylammonium, tetraalkylphosphonium, 1,1-dialkylpyrrolidinium, 1-hydroxyalkyl-1-alkylpyrrolidinium, 1-hydroxyalkyl-3-alkylimidazolium or 1,3-bis(hydroxyalkyl)imidazolium cation, where the alkyl groups or the alkylene chain of the hydroxyalkyl group may each, independently of one another, have 1 to 10 C atoms.

Abstract: A surface modification liquid for plastic that in pretreatment for metallization of a plastic surface by metal plating, solves the problems of etching treatment with the use of conventional etching liquid containing chromic acid, etc. There is provided a surface modification liquid for plastic characterized by containing permanganic acid, phosphoric acid and nitric acid.

Abstract: Partially aromatic polyamide compositions containing an aliphatic polyamide and an alkaline earth metal carbonate have excellent adhesion to metal coatings which are produced by electroless and/or electrolytic plating. Also described is a process for the electroless and/or electrolytic coating of these compositions. The resulting articles are useful as parts in automotive and industrial applications.

Abstract: The present invention provides a method for manufacturing plated resin molded article having strong adhesion of plating and giving beautiful appearance. Specifically, it provides a method for manufacturing plated resin molded article having the steps of: contact-treating a thermoplastic resin molded article using an acid or base free from heavy metal; treating the contact-treated thermoplastic resin molded article by a catalyst imparting liquid; forming an electrically conductive layer on the surface of the thermoplastic resin molded article using a direct plating method; and applying electroplating to the electrically conductive layer; without applying the step of etching by an acid which contains heavy metal.

Abstract: A device, in particular a vehicle interior component, includes a base body (10) made of a first plastic material which is suitable for injection molding and for coating with chromium. The device furthermore includes at least one elastic partial body (16, 18) molded to the base body (10), which is made of a second plastic material which is suitable for injection molding, but not for coating with chromium. A method for manufacturing such a device with a base body (10) coated with chromium comprises the following steps: injection molding a base body (10) of the first plastic material; injection molding the partial body (16, 18) of the second plastic material to the base body (10); electroplating a chromium coating onto the base body (10), wherein the base body (10) passes through a chrome-plating bath together with the integrally molded partial body (16, 18).

Abstract: Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: A plastic part is provided with decorative metallized surfaces as well as overmolded thermoplasticelastomer grip portions. The plastic part is overmolded with the TPE prior to metallizing the remaining exposed surfaces of the part. A TPE compound with saturated midblocks is used which is stable in the acid environment and elevated temperatures of the plating.

Abstract: A plated film having superior uniformity and adhesiveness is provided without requiring a surface roughening process of the resin by a permanganate treatment and a tin-containing catalyst adhering treatment. The material to be plated is treated by a pre-treatment solution including anionic surfactant, organic solvent, and alkaline components, then treated by a solution including anionic surfactant and precious metal ions, and plated by electroless plating.

Abstract: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a conformal coating formed on the tin layer to impede tin whisker growth. The conformal coating includes a polymer matrix, and particles that are dispersed about the matrix. The particles are either significantly harder than the polymer matrix, or are significantly softer than the polymer matrix.

Abstract: This invention relates to increasing the electrocatalytic activity of conducting polymers so that the same may be useful for electro-oxidation of methanol which is important for fuel-cell technology. Conventional catalysts used for this process are based on Pt, Ru or Pd complexes which are incorporated in carbon/graphite based electrodes. However, these are not only expensive but difficult to fabricate in different shapes. Conducting polymer based electrodes have advantage of ease of fabrication but their activity has been found in the past to be not very high. The present invention provides a process for preparation of conducting polymer based electrodes which have very high catalytic activity (8 to 10 times higher) for electro-oxidation of methanol.

Abstract: A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particles. The mixture of carbon blacks provides optimum dispersion and electroplating properties.

Abstract: A method of manufacturing an electrode for an alkaline storage battery, including a process of manufacturing a porous metal plate. A method of manufacturing this porous metal plate includes adding a predetermined organic substance to a urethane sponge or coating a foamed urethane sponge with polyethylene terephthalate. Furthermore, the method includes grinding the urethane sponge or rolling the urethane sponge using a roll press.

Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.

Abstract: The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.

Abstract: A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.