Tin Patents (Class 205/300)
  • Patent number: 5262040
    Abstract: A metal surface is now described having enhanced adhesion of subsequently applied coatings. The substrate metal of the article, such as a valve metal as represented by titanium, is provided with a highly desirable surface characteristic for subsequent coating application. This can be initiated by selection of a metal of desirable metallurgy and heat history, including prior heat treatment to provide surface grain boundaries which may be most readily etched. In subsequent etching operation, the surface is made to exhibit well defined, three dimensional grains with deep grain boundaries. Subsequently applied coatings, by penetrating into the etched intergranular valleys, are desirably locked onto the metal substrate surface and provide enhanced lifetime even in rugged commercial environments.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: November 16, 1993
    Assignee: ELTECH Systems Corporation
    Inventors: Kenneth L. Hardee, Lynne M. Ernes, Richard C. Carlson
  • Patent number: 5194141
    Abstract: A method for the electrolytic pin plating of a steel plate using an insoluble anode, said anode being an insoluble electrode comprising a corrosion-resistant metal substrate having provided thereon a coating containing a platinum group metal or an oxide thereof, said anode being enclosed with a diaphragm.
    Type: Grant
    Filed: April 25, 1991
    Date of Patent: March 16, 1993
    Assignee: Permelec Electrode Ltd.
    Inventors: Yoshiaki Suganuma, Yasuo Nakajima, Yukiei Matsumoto