Abstract: A method of removing coating from a substrate may include contacting at least a portion of a surface of a substrate to an electrolytic substance, where at least a portion of the surface includes cadmium; connecting a power source to the substrate and to an anode material; applying a current and a voltage; and removing at least a portion of coating from the substrate.

Abstract: Textured surface having micro recesses such that the outer surface overhangs the micro recesses. Embodiments of the textured surface include sharp edges for promoting bone deposition and growth within the micro recesses, protrusions of varying depth from the surface that include overhangs, and micro recesses that are at least partially defined by complex ellipsoids.

Abstract: The present invention pertains to the use of an additive selected from the group consisting of amorphous silica, graphite powder, and a mixture thereof in a process to electroplate or electropolish a metal on a substrate using an ionic liquid as the electrolyte to increase metal layer thickness. It furthermore pertains to a method to electroplate or electropolish a metal on a metal substrate wherein an ionic liquid is employed as electrolyte, wherein a metal salt added to said ionic liquid or a metal anode is employed as metal source, and wherein said ionic liquid comprises said additive.

Abstract: A composition for use in polishing a wafer is disclosed. The composition includes an aqueous solution of initial components substantially free of loose abrasive particles and having a pH in the range of about 2 to 7, the aqueous solution including at least one polyelectrolyte and a surfactant. In certain embodiments, the wafer polishing composition can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive Chemical Mechanical Polishing (CMP) process. Also disclosed is a CMP method and a process for polishing a wafer using the polishing composition.

Abstract: The electrolyte composition and electropolishing method for electropolishing surfaces of metals and their alloys, in particular surfaces of niobium, niobium containing alloys, tantalum, tantalum containing alloys is disclosed. The electrolyte composition comprises methanesulfonic acid and hydrofluoric acid. Said electrolyte composition make possible to electropolish niobium, niobium containing alloys, tantalum and tantalum containing alloys to the best quality ever by eliminating problems of hydrogen absorption and sulfur contamination o the workpieces.

Abstract: Plasma-electrolytic polishing (PEP) of titanium alloy and other metals where plasma effect takes place when voltage does not exceed 80V DC.

Abstract: Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidized and transferred into positively charged copper ions while the first component is reduced from its first state to its second state.

Abstract: A method for making a lithographic printing plate support is disclosed comprising the steps of: (i) providing an aluminum support; (ii) treating said support in an aqueous solution; (iii) graining said treated support in an electrolyte solution by applying an alternating voltage thereby inducing a local current density J; characterized in that said local current density J at time t fulfills the following equation: J(t)??+bQ(t) for t=o to t=tf and wherein Q(t) is the integrated value of the absolute value of the local current density at time t:(I)—a is equal to 5—b is equal to 10—and tf is the time necessary to obtain a value of Q(t) equal to 50 C/dm2.

Abstract: A method for stripping a component, in particular a gas turbine component, to completely or partially remove a multilayer or sandwich antiwear coating from the surface of the component, the antiwear coating including at least one relatively hard ceramic layer and at least one relatively soft metallic layer is disclosed. According to the present invention, in order to remove the multilayer or sandwich antiwear coating, the component is placed in a bath of an alkaline electrolyte, the component placed in the electrolyte being stripped at a current density of between 1 A/dm2 and 20 A/dm2.

Abstract: The invention relates to a method for the electrochemical removal of a metal coating from a component. According to said method, the component is immersed in an electrolyte solution and a current is passed through the component and a secondary electrode that is in contact with the electrolyte. The current is pulsed with a routine that has a duty cycle >10 to <90%, two current densities between 5 mA/cm2 to 1000 mA/cm2 and a frequency of 5 Hz to 1000 Hz.

Abstract: The invention relates to the defoaming of ionic liquids and also to compositions comprising at least one ionic liquid and at least one antifoam and, if appropriate, a solvent and/or further auxiliaries or additives.

Abstract: A surface treatment method for housings, comprising: providing a substrate made of damascus steel; and chemically etching the substrate using inorganic acid solution or inorganic salts solution to give the substrate a patterned appearance.

Abstract: The present invention relates to an apparatus and a method of electrochemical mechanical polishing (ECMP) for microelectronics applications. The apparatus and method of electrochemical mechanical polishing can be used planarize NiP substrate for a magnetic storage medium and for a process which allows polishing with a controlled surface finish, and a set of corresponding polishing electrolytes and slurry.

Abstract: A machining electrode includes: a base substance including an electrolytic portion faced to a workpiece on one end face in an axial direction and having conductivity; an insulating unit provided on a face in a direction generally orthogonal to the axial direction of the base substance and having insulation; and a shielding unit provided on a face opposite to the base substance of the insulating unit.

Abstract: A method and apparatus separates recoverable components (210) from conductive matrix composites (200) for further use or reuse. In an embodiment, the process uses an electrochemical apparatus that includes a cathode (220) and an anode. The conductive composite is electrically connected to the anode, and a non-acidic electrolyte (250) is supplied to an inter-electrode gap between the cathode and the anode.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: The invention provides a simple and convenient strategy for reducing the dimensions of organic micro- and nanostructures on metal surfaces. By varying electrochemical desorption conditions, organic structures patterned by Dip-Pen Nanolithography or any of the micro-contact printing procedures can be gradually desorbed in a controlled fashion. The electrochemical desorption is initiated at the exterior of the feature and moves inward as a function of time. The desorption process and adsorbate desorption are modified and controlled as a function of substrate morphology, adsorbate head and tail groups, and electrolyte solvent and salt. Different nanostructures made of different adsorbates can be miniaturized based upon judicious selection of adsorbate and supporting electrolyte.

Abstract: The present invention relates to a method to electroplate or electropolish a metal on a substrate wherein an ionic liquid selected from the group of N+R1R2R3R4X? or N+R5R6R7R8Y? is employed as electrolyte, and a metal salt added to the ionic liquid is employed as the metal source or a metal anode is used as the metal source, wherein any one of R1 to R8 independently represents a hydrogen, alkyl, cycloalkyl, aryl, or aralkyl group that may be substituted with a group selected from OH, Cl, Br, F, I, phenyl, NH2, CN, NO2, COOR9, CHO, COR9, or OR9, at least one of R5 to R8 is a fatty alkyl chain, and one or more of R5 to R8 can be a (poly)oxyalkylene group wherein the alkylene is a C1 to C4 alkylene and the total number of oxyalkylene units can be from 1 to 50 oxyalkylene units, and at least one of R1 to R8 is a C1 to C4 alkyl chain, R9 is an alkyl or cycloalkyl group, X- is an anion having an N-acyl sulphonylimide anion (—CO—N?—SO2—) functionality, Y? is an anion compatible with the N+R5R6R7R8 ammonium cation, s

Abstract: A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composite fine particles, forming the composite fine particles into an aerosol, jetting the aerosol to the metal foil in an atmosphere under a reduced pressure, depositing the composite fine particles onto the metal foil to form a aerosol deposition layer, and removing selectively the resin from the aerosol deposition layer to form the valve metal layer.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.

Abstract: We propose to shape the leaf by the use of electro-chemical machining (ECM). ECM is a technique by which a blank is suspended within a mould, with a small gap therebetween. A conductive fluid is caused to flow through the gap, and a large electrical current is passed from the mould to the blank. The blank steadily erodes, dissolving into the fluid. The fluid should not provoke a reaction from the material of the blank, such as a surface oxide. Sodium Chloride solution is a common choice. The current that is passed can, if desired, be controlled to a profile that will affect the manner of erosion. Thus, the current profile can be a steady on/off current, or it can be pulsed. One known arrangement is for the current to rise to a peak, then fall to zero, followed by a brief reverse flow.

Abstract: Disclosed is an electrolyte for electrochemical machining of a metal product, which can reduce a defect of an electro-chemical machining product, increase a lifespan of an electrolyte and an electrode, and improve efficiency of the electrochemical machining. The electrolyte includes an inorganic salt and at least one of a complexing agent and a reducing agent in a solvent.

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: A semiconductor substrate is anodized to be shaped into an optical lens. Prior to being anodized, the substrate is finished with an anode pattern on its bottom surface so as to be consolidated into a unitary structure in which the anode pattern is precisely reproduced on the substrate. The anodization utilizes an electrolytic solution which etches out oxidized portion as soon as it is formed as a result of the anodization, to thereby develop a porous layer in a pattern in match with the anode pattern. The anode pattern brings about an in-plane distribution of varying electric field intensity by which the porous layer develops into a shape complementary to a desired lens profile. Upon completion of the anodization, the semiconductor substrate is shaped into the lens by etching out the porous layer and the anode pattern from the substrate.

Abstract: A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from which a coating is to be removed.

Abstract: There is provided a method for manufacturing a printed wiring board that allows molten scattered Cu and an overhang to be selectively removed while scarcely decreasing a thickness of wires, and an electrolytic etching solution suitably used in the method. In the method for manufacturing a printed wiring board in which a via that reaches from a surface copper layer to an inner-layer copper layer of a multilayer board in which copper layers and insulating layers are alternately layered is machined by means of a laser, a process of machining the via including steps of forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board, irradiating the laser, performing an electrolytic etching and removing the laser absorbing layer is carried out in this order.

Abstract: The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and glycerol, and the acid solution comprises phosphoric acid. The volumetric ratio of glycerol to phosphoric acid is between 1:50 and 1:200, and is preferably 1:100. The volumetric ratio is between 1:100 and 1:150 for methanol to phosphoric acid, and between 1:100 and 1:150 for ethanol to phosphoric acid. In addition, the acid solution further comprises an organic acid selected from the group consisting of acetic acid and citric acid. The concentration is between 10000 and 12000 ppm for the acetic acid, and between 500 and 1000 ppm for citric acid.

Abstract: The present invention relates to a method of electrochemical polishing of surfaces of cobalt or cobalt alloys. It employs an electrolyte comprising glycolic acid and at least one alkane-sulfonic acid with an alkyl residue that has 1 to 3 carbon atoms. This electrolyte is also one aspect of the present invention. In one embodiment, at least one alkane-sulfonic acid comprises methane-sulfonic acid. The electrolyte and the method using this electrolyte are suitable in particular for surfaces of cobalt or cobalt alloys, including cobalt-chromium alloys such as stellite.

Abstract: A method for surface roughening a metal work piece includes disposing the work piece proximate to a counter electrode. The work piece and the counter electrode are disposed in an electrolyte. An electric potential with current flow is applied between the work piece and the counter electrode to roughen the metal surface to a desired roughness.

Abstract: The invention concerns a process for the polishing of metallic dental prostheses, such as frames. In order to reproducibly obtain a defined surface roughness with no need for additional finishing, it is proposed for the dental prosthesis to be polished by means of plasma polishing.

Abstract: The present invention relates to a method of electrochemical polishing of surfaces of titanium or titanium-containing alloys, such as Nitinol. An electrolyte is used that comprises methanesulfonic acid and one or more alkanediphosphonic acids. These alkanediphosphonic acids can optionally be substituted with hydroxy and/or amino groups. A further aspect of the present invention relates to the use of said electrolyte for the electropolishing of titanium or titanium-containing alloys.

Abstract: Methods and compositions have been provided for removing barrier layer material from a work piece during an electrochemical mechanical polishing process while protecting a metallization layer of the work piece. The electrochemical planarization composition includes at least one complexing agent capable of complexing with the barrier layer material when exposed to a pH outside of a pH range of greater than about pH 2 and less than about pH 10, a corrosion inhibitor, abrasive particles, and a pH adjuster.

Abstract: A method of making an organic memory cell which comprises two electrodes with a controllably conductive media between the two electrodes is disclosed. The present invention involves providing a dielectric layer having formed therein one or more first electrode pads; removing a portion of the first electrode pad to form a recessed area on top of the pads and in the dielectric layer using reverse electroplating; forming a controllably conductive media over the first electrode pad in the recessed area; and forming a second electrode over the conductive media. The controllably conductive media contains an organic semiconductor layer and a passive layer.

Abstract: Medical devices, such as endoprostheses, and methods of making the devices are described. In some implementations, a stent has a surface region of magnesium with a protective surface layer of magnesium hydride obtained by hydrogen surface modification through an H-EIR process, offering enhanced corrosion resistance.

Abstract: The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More particularly, the electropolishing process of the invention is particularly suited for use on implantable medical devices, such as stents, due to the biocompatibility of cobalt-chromium alloys. The invention is directed to an improved stent formed from a cobalt-chromium alloy, that possesses an ultrasmooth shiny surface. This invention is also directed to a method of electropolishing such a stent using an acidic electrolytic solution comprising a mixture of 6 parts of about 98% sulfuric acid (H2SO4), 1 part of about 37% hydrochloric acid (HCl) and 1 part by of about 85% concentrated phosphoric acid (H3PO4) to produce an exceptionally smooth surface.

Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.

Abstract: A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanoparticles and a metal oxide matrix. The nanoparticles are then isolated from the composite material by etching at least a portion of the metal oxide matrix to release the metal nanoparticles. In accordance with the embodiments of the invention, the nanoparticles are treated with surfactants and wetting agents either while etching or after etching, are isolated from the etchant and dispersed in a solvent medium and/or are otherwise treated or modified for use in a nanoparticle inks. A layer of the metal nanoparticle ink can then be used to form doped, undoped, patterned and unpatterned device layers or structures in micro-devices.

Abstract: A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanoparticles and a metal oxide matrix. The nanoparticles are then isolated from the composite material by etching at least a portion of the metal oxide matrix to release the metal nanoparticles. In accordance with the embodiments of the invention, the nanoparticles are treated with surfactants and wetting agents either while etching or after etching, are isolated from the etchant and dispersed in a solvent medium and/or are otherwise treated or modified for use in a nanoparticle inks. A layer of the metal nanoparticle ink can then be used to form doped, undoped, patterned and unpatterned device layers or structures in micro-devices.

Abstract: Embodiments of the present invention include a method for quantitatively detecting embedded particles of a disk spacer ring comprising. The method includes dissolving a layer of a disk spacer ring into a liquid solution, the disk spacer ring layer comprising embedded particles. The method further includes filtering the solution to capture the embedded particles. The method further includes counting the particles.

Abstract: An aqueous thiourea-free gold etching bath for electrolytically etching gold from a microelectronic workpiece. One embodiment of the aqueous thiourea-free bath contains: (a) about 0.5–1.5 M iodide; (b) about 0.1–0.3 M sulfite; and (c) about 1.0–3.0 g/L wetting agent. The bath is useful in a process for electrolytically etching gold from a microelectronic workpiece. A tool system in which the baths and processes of the present invention may be used is also described.

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

Abstract: An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductive surface to be planarized is placed in the high resistance phase and adjacent a phase interface between the high resistance phase and the etching solution phase. A wiper is used to mechanically move the thin high resistance phase covering the conductive surface so that the raised regions of the non-planar conductive surface is briefly exposed to etching solution phase. The mechanical action of the wiper does not disturb the high resistivity phase filling the rescessed regions of the surface. As the raised surface locations are exposed, the etching solution phase contacts and electroetch the exposed regions of the raised regions until the surface planarized.

Abstract: A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface of the conductive material. The corner can be blunted or rounded, for example, by applying a voltage to an electrode in fluid communication with an electrolytic fluid disposed adjacent to the corner. Electrical current flowing through the corner from the electrode can oxidize the conductive material at the corner, and the oxidized material can be removed with a chemical etch process.

Abstract: A method of manufacture for optical spectral filters with omnidirectional properties in the visible, near IR, mid IR and/or far IR (infrared) spectral ranges is based on the formation of large arrays of coherently modulated waveguides by electrochemical etching of a semiconductor wafer to form a pore array. Further processing of said porous semiconductor wafer optimizes the filtering properties of such a material. The method of filter manufacturing is large scale compatible and economically favorable. The resulting exemplary non-limiting illustrative filters are stable, do not degrade over time, do not exhibit material delamination problems and offer superior transmittance for use as bandpass, band blocking and narrow-bandpass filters. Such filters are useful for a wide variety of applications including but not limited to spectroscopy, optical communications, astronomy and sensing.

Abstract: In a method for photo-electrochemical etching of a semiconductor sample, the semiconductor sample is brought in contact with an electrolyte liquid. The contact area formed thereby is illuminated through the electrolyte liquid with UV light. The photo-current created by UV light irradiation at the contact area is measured. To increase the etching quality, a jet of fresh electrolyte liquid is repeatedly applied to the contact area. A device for carrying out the method includes a container to be filled with an electrolyte liquid, a UV source for illuminating the semiconductor sample with UV light through the electrolyte liquid, and a measuring instrument for measuring the photo-current created during UV light irradiation of the contact area. Further provided are an inlet for supplying fresh electrolyte liquid, directed towards the semiconductor sample, and a device attached to the inlet for repeated production of electrolyte fluid jets, directed towards the semiconductor sample.

Abstract: An electrochemical process for selectively stripping at least one coating from the surface of a substrate is disclosed. The substrate (often a turbine engine component) is immersed in a composition through which electrical current flows. The composition includes a halide salt, such as sodium chloride, ammonium chloride, and potassium chloride. In preferred embodiments, the electrical current is direct current (DC). The process is especially useful for selectively removing portions of diffusion aluminide coatings. For example, the additive layer can efficiently be removed, without substantially affecting the underlying diffusion layer or substrate. Related stripping compositions and apparatuses are also described.

Abstract: A profiled tube (50b) comprising a high carbon content alloy (greater than 0.3%), superalloy or other high creep strength material, has a fluted bore with internal fins (52b) and intervening valleys or troughs (56b). Such a tube is made by centrifugal casting and subsequent electrochemical machining by drawing of an electrode (104) along the tube while at the same time passing electrolyte along the tube and around the electrode and also applying an electrical current between the tube and electrode, so that material of the tube passes into solution in the electrolyte. The electrode (104) has the same profile as the end-profile required in the tube (80) but has an inclined working face (124). An electrode rod (92) drives the electrode from one end mounting means (82) to another (84), each of which support the tube (80) and supply/exhaust electrolytic solution. The electrolyte is preferably sodium nitrate, although an acid based system is feasible.

Abstract: An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 and about 10 which is environmentally friendly and does not present hazardous operation concerns. The composition may further comprise one or more additives selected from a group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid.

Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.