Abstract: An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.

Abstract: A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type used to deposit or thicken copper seed layers on silicon wafers. Standard addition of an excess of a strong complexing agent (EDTA, for example) and back-titration with the copper ion titrant yields the bath copper ion concentration, and continued titration to a second endpoint, preferably after addition of hydroxide to adjust the pH of the analysis solution, yields the total concentration of bath complexing agent. Based on these analyzes, the concentration of free bath complexing agent may be calculated. The method also provides direct determination of the free bath complexing agent concentration via standard addition of excess bath complexing agent to a sample of the plating bath and titration with the copper ion titrant.

Abstract: Certain example embodiments of this invention relate to improved electroplating techniques. More particularly, certain example embodiments of this invention relate to electroplating techniques that incorporate a homogenization unit to help maintain an emulsion within an electrolyte solution (e.g., a nickel electrolyte solution) used in creating a finish (e.g., a satin nickel finish) in an electroplating process. By varying the operational characteristics of the unit (including, for example, pressure, velocity, pore size, ultrasound wave frequency, sonication time, etc.), it becomes possible to control the emulsion particle size distribution so as, for example, increase or decrease the diameter of such particles and thereby resulting in a deposit with a desired surface topography. It will be appreciated that the variations in size will cause variation in surface topography which, in turn, will change the surface appearance.

Abstract: Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings.

Abstract: An auxiliary leveler additive that cannot be analyzed by conventional CVS methods for acid copper plating baths is analyzed by cyclic voltammetry at a platinum rotating disk electrode from its effect on the anodic current at very positive potentials.

Abstract: A process for selecting a surrogate part for metallic plating, the metallic plating of the surrogate part predicting results for the metallic plating of a new or predetermined part is disclosed. The process can include providing a reinforcement learning system having a memory circuitry and a processing circuitry. The memory circuitry can have a database with data associated with a plurality of surrogate parts and data associated with the predetermined part can be entered into the data input module. The processing circuitry can compare the data associated with each of the plurality of surrogate parts and the data associated with the predetermined part and select a surrogate part that affords predicting a plating result of the predetermined part.

Abstract: A method for analyzing a metal material includes electrolyzing a metal sample in an electrolytic solution, immersing a remaining portion of the metal sample taken out of the electrolytic solution in a dispersible solution to separate at least one substance selected from the group consisting of precipitates and inclusions attached to the remaining portion of the metal sample, filtering the dispersible solution containing the at least one separated substance through filters having straight pores and a porosity of 4% or more to obtain residues trapped on the filters and filtrates, and analyzing at least one of the residues and the filtrates.

Abstract: Device and method suitable for the electrochemical processing of an object. The device is provided at least with a chamber for accommodating an electrolyte, means for supporting the object to be processed in this chamber, electrodes arranged in this chamber, and control means for applying an electric current between the object to be processed and the electrodes.

Abstract: An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first conductive pattern for detecting an alignment error in response to a position of the conductive via.

Abstract: When a controller turns on a relay, a closed circuit constituted by a power supply device, a wire, a resistance, a relay and wires is formed. This causes a current to flow through the closed circuit. The power supply device performs constant current control. The controller compares a measured voltage value output from a voltage detecting circuit with a preset reference voltage value. In the case of no connection failure of the wire, the measured voltage value substantially equals to the reference voltage value. In the case of connection failure of the wire, the measured voltage value is larger than the reference voltage value.

Abstract: A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.

Abstract: A monitoring method of the invention is for monitoring electrodeposition coating of an object to be coated in which a conveying mechanism that conveys the object to be coated while the object is immersed in an electrodeposition paint in an electrodeposition bath, and a plurality of electrodes arranged along a conveying direction in which the object to be coated is conveyed by the conveying mechanism are used, the method including: acquiring present position data of the object in the conveying direction; when the acquired present position data has a value corresponding to a predetermined determination position, acquiring an electric current value corresponding to a predetermined one, associated with the determination position, of the electrodes; and determining the occurrence of the abnormality for the object to be coated that is positioned at the determination position, based on whether the acquired electric current value is within a predetermined range.

Abstract: A method of rejuvenating a Ru plating seed layer during write pole fabrication in a PMR head is disclosed that involves forming an opening in a mold forming layer. A Ru seed layer is deposited by CVD within the opening and on a top surface of the mold forming layer. The substrate with the Ru seed layer is immersed in an acidic solution and an electric potential is applied for 1 to 2 minutes such that hydrogen is generated to reduce ruthenium oxides to Ru metal on the seed layer surface in an activation step. One or more surfactants are used to improve wettability of the Ru layer. The substrate is transferred directly to an electroplating solution without drying following the activation step to minimize exposure to oxygen that could regenerate oxides on the surface of the Ru layer. As a result, write pole voids and delamination are significantly reduced.

Abstract: A zinc or zinc alloy plated steel sheet expressing a performance provided with both corrosion resistance and surface conductivity is provided. The zinc or zinc alloy plated steel sheet of the present invention is a zinc or zinc alloy plated steel sheet having an arithmetic average roughness Ra of a zinc-plated layer surface defined by JIS B 0601, obtained by a stylus-type surface roughness meter defined by JIS B 0651, of 0.3 ?m to 2.0 ?m and a maximum peak height Rp of 4.0 ?m to 20.0 ?m, wherein the arithmetic average roughness Ra (peak) obtained by measuring a range of evaluation length of 20 ?m of peak parts of 80% or more of the Rp by an electron beam 3D roughness analyzer is 70% or more of the arithmetic average roughness Ra (average) obtained by measuring a range of evaluation length of 20 ?m of parts of a height of ±20% about an average line, obtained by a stylus-type surface roughness meter, by an electron beam 3D roughness analyzer.

Abstract: An additive breakdown product in an acid copper plating bath sample is detected by performing a voltammetric analysis for the leveler additive in two measurement solutions comprising different volume fractions of the copper plating bath sample in a background electrolyte. When the plating bath sample contains a substantial concentration of the additive breakdown product, the analyses for the first and second measurement solutions indicate different concentrations for the leveler additive in the plating bath sample. A comparison of the leveler additive concentrations indicated by the two analyses provides a measure of the concentration of the additive breakdown product.

Abstract: Aspects of the present invention include methods and apparatuses that may be used for monitoring and adjusting plasma in a substrate processing system by using a plasma data monitoring assembly. In one embodiment, an apparatus for monitoring a plasma in a substrate processing system is provided. The apparatus includes a plasma chamber having a plurality of walls, at least one of the plurality of walls having a dielectric ceiling, at least one inner coil element and at least one outer coil element disposed outside the chamber, a current sensor coupled to one of the inner coil element or the outer coil element, the current sensor adapted to detect current from an inductively coupled plasma generated in the plasma chamber, an RF power source, and one or more adjustable capacitors coupled to each of the one or more coil elements.

Abstract: An initial pulse current cycle is supplied to at least one through-hole via. The pulse current cycle includes a forward pulse current. The magnitude of the forward pulse current is lower than the magnitude of the reverse pulse current. A corresponding forward and reverse current density is generated across the via causing conductive material to be deposited within the via, thereby reducing the effective aspect ratio of the via. At least one subsequent pulse current cycle is supplied. The magnitudes of the forward and reverse pulse currents of the subsequent pulse current cycle are determined in relation to the reduced effective aspect ratio. A subsequent corresponding forward and reverse current density is generated across the through-hole via causing conductive material to be deposited within the via, thereby further reducing the effective aspect ratio of the via.

Abstract: The present invention provides an alloy film of Mn or its Fe—Mn is depositable on a metalized alumina ceramic (Al2O3-SiO3) substrate for hermetically sealed glass-metal fusion used for aircraft switch assemblies. The coefficient of thermal expansion of Fe—Mn alloys appear to be fairly low, nearer to that of glass. Fe—Mn alloy film is an alternative to Fe64—Ni36 alloy films (Invar) normally used for glass to glass fusion purposes. Fe—Mn alloy films is also depositable directly on bare Alumina (Al2O3) substrate with or without zincating pretreatment. Similarly bright, smooth coherent film of Mn—Au or Fe—Mn—Ni Au alloys is depositable from an aqueous solution of simple salt bath or on Cu substrate without the use of cyanide without bridging with zincate processes.

Abstract: A continuous micro anode guided electroplating device and a method thereof are revealed. By real-time image monitoring and capillary action of the micro/nanoscale tube, a three-dimensional microstructure is deposited on a workpiece at the cathode. The deposit is growing smoothly under the real-time image monitoring. Moreover, the workpiece is not immersed in an electrolyte so that contaminations of the workpiece caused by electrolyte are reduced.

Abstract: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. The time-dependent potential change curve within a predetermined period of time after the start of electrolysis is approximated according to the Boltzmann's function, and the potential change speed dx and the potential convergent point A2 are obtained to judge the fillability with a plating solution.

Abstract: Described herein are methods for electrodepositing a variety of different polymers on metal substrates. The polymers are strongly adhered to the substrates. The substrates produced herein can be used in a number of different applications such as, for example, medical devices and biosensors. For example, the biosensors can be composed of one or more electrodes, where the electrodes have the same or different polymers electrochemically deposited on them. Finally, the methods described herein permit the evaluation of the electrodeposition process as well as monitor the ability of biomolecules to bind to the electrodeposited polymers.

Abstract: There is described a method for detecting anomalies in a set of signals that normally exhibit analogous behaviour. The method comprises: acquiring a set of signals from at least one measurement source; designating a reference signal Sref from the acquired set of signals; computing a deviation Devi between the reference signal Sref at a reference point in time tref (Sref(tref)) and at least one of the acquired signals Si over time; and generating a deviation alarm trigger when the deviation meets a given deviation criteria.

Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.

Abstract: A method for analyzing a metallic material includes the steps of electrolyzing a metal sample in an electrolyte; removing the electrolyzed metal sample from the electrolyte; immersing the metal sample removed from the electrolyte into a dispersive solution that is different from the electrolyte to separate at least one selected from the group consisting of a precipitate and an inclusion deposited on the metal sample; and analyzing the at least one selected from the group consisting of a precipitate and an inclusion extracted into the dispersive solution.

Abstract: Laminated steel sheet for a container material with a small environmental load container material and coating pre-coated steel sheet for a container material characterized by comprising steel sheet having on it a tin layer or iron-tin alloy layer which has on it a tin oxide layer of a thickness measured by an electric stripping method of 0 mC/cm2 to 3.5 mC/cm2 and has further formed on that a foundation layer including a zirconium compound not including fluorine or nitrate nitrogen, having an amount of coating converted to zirconium of 1 mg/m2 to 30 mg/m2, and having an amount of sulfuric acid radicals (SO42?) of 0 mg/m2 to 7 mg/m2.

Abstract: A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.

Abstract: A process for repairing components includes the steps of providing a component having an affected area on a surface of a component to be repaired; depositing a repair material over the affected area on the surface of the component so that the repair material plastically deforms without melting and bonds to the affected area upon impact with the affected area and thereby covers the affected area; providing a sulfuric acid based anodizing solution; anodizing a deposited repair material on the surface of said component in the sulfuric acid based anodizing solution; consuming only a portion of the deposited repair material to form a hard anodized coating layer upon the deposited repair material to form a hard anodized coated component; providing a corrosion resistant sealant solution; and contacting a hard anodized coated component with the corrosion resistant sealant solution to form a corrosion resistant sealant coating on the hard anodized coated component.

Abstract: A method of verifying performance of a coated part includes calculating a deflection value as a function of a predetermined strain threshold value and a total thickness of a test coupon that comprises a coating on a substrate. The coating of the test coupon is co-deposited in a deposition process for producing a coated part. The test coupon is bent in an amount equal to the calculated deflection value and then evaluated as an indication of whether a mechanical characteristic of the coated part meets a specified level.

Abstract: Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

Abstract: A method of forming an insulator that passes through a metal substrate (302) comprising: anodizing a region (312a, 312b, 314,316a, 316b, 318, 320a, 320b, 322, 324a, 324b) of the substrate to form the insulator; illuminating the region with light (330); and determining if the light passes through the substrate at the region to determine if the insulator passes completely through the substrate.

Abstract: An improved method of stabilizing wet chemical baths is disclosed. Typically such baths are used in processes for treating workpieces, for example, plating processes for plating metal onto substrates. In particular, the present invention relates to copper plating baths. More particularly, the present invention relates to the stability of copper plating baths. More particularly, the present invention relates to prevention of void formation by monitoring the accumulation of deleterious by-products in copper plating baths.

Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Abstract: Techniques for manufacturing carbon nanotube network-based nano-composites are provided. In some embodiments, a nano-composite manufacturing method includes forming a carbon nanotube (CNT) network, immersing the CNT network into an electroplating solution, applying electrical energy, and relaying the electrical energy flow to produce a nano-composite having uniform conductive bridges on the CNT network.

Abstract: A microscopic metallic structure is produced by creating or exposing a patterned region of increased conductivity and then forming a conductor on the region using electrodeposition. In some embodiments, a microscopic metallic structure is formed on a substrate, and then the substrate is etched to remove the structure from the substrate. In some embodiments, a focused beam of gallium ion without a deposition precursor gas scans a pattern on a silicon substrate, to produce a conductive pattern on which a copper structure is then formed by electrochemical deposition of one or more metals. The structure can be freed from the substrate by etching, or can used in place. A beam can be used to access an active layer of a transistor, and then a conductor can be electrodeposited to provide a lead for sensing or modifying the transistor operation while it is functioning.

Abstract: The present invention provides a method of fabricating a micro hollow tube, more specifically, a method of fabricating a micro hollow tube by template-free localized electrochemical deposition, in which the micro hollow tube is fabricated by the accurate control of the distribution of the electric field strength during deposition with precise interplay of the applied voltage and the distance between the microelectrode and the grown structure.

Abstract: A method for treating or preparing a fuel rod cladding tube in such a way that an influence of iron oxide deposits on its surface can be studied and assessed precisely under virtually operational conditions with as little risk as possible, includes at least partially coating the fuel rod cladding tube with an iron oxide layer by immersing it in an aqueous electrolyte medium which contains iron oxide particles. The iron oxide particles are produced by anodic oxidation of an iron-containing working electrode. A test body and a device for pretreating a fuel rod cladding tube with an electrochemical three-electrode configuration, are also provided.

Abstract: A device for detecting an anodic oxide film during an anodic oxidation treatment includes a container receiving an electrolyte therein, an aluminum sheet immersed in the electrolyte, a power source supplying a current to the aluminum sheet to form an anodic oxide film on the aluminum sheet, a data acquisition unit measuring a potential of the anodic oxide film at a time, a data processor unit calculating a differential value of the potential, and a display unit displaying a differential curve generated according to the differential values of the potentials at different times. The quality of the anodic oxide film can be judged by reading the shape of the differential curve.

Abstract: A semiconductor device production method of the present invention first collects data including an initial volume of plating solution, volume of replenished solution, number of wafers processed, value of current applied and volume of waste solution in a step of filling a metal plating film in a via hole or a trench formed in an insulating film on a semiconductor substrate. Then, a cumulative charge during the plating is calculated based on the obtained current value. Also, a total volume of plating solution is calculated. Furthermore, an amount of decomposition products of suppressors contained in the plating solution based on the calculated total volume of plating solution, the volume of waste solution and the calculated cumulative charge. The semiconductor substrate is plated only when the amount of decomposition products is equal to or smaller than a predetermined threshold.

Abstract: An electrolytic processing apparatus can detect the end point of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus includes: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss. The sensor is disposed not in contact with (or separately) by an insulator from the processing electrode and/or the feeding electrode.

Abstract: A sampling head, and/or an array including same for use in electrochemical deposition of various metal(s) on wafers or other substrates suitable for use in microelectronic devices or components thereof.

Abstract: There is described a method wherein through holes of a wall are treated on a inside, and wherein one respective pole electrode is assigned to each through hole that is to be processed.

Abstract: An electrochemical sensing and data analysis system (and apparatus and methods) adapted for control of electroplating of various metal(s) on a wafer or other suitable substrate. Components of the system utilize multi-variate analysis (MVA) and galvanostatic, potentiodynamic or other electrical measurements (or combinations thereof) to predict, adjust or control plating parameters, e.g., to achieve improved yield of plated substrates with acceptable levels of defects (or lack thereof).

Abstract: A corrosion detection method detects galvanic corrosion occurring in a heterogeneous metal layer using a forming step and an observing step. The forming step is the step of forming the heterogeneous metal layer and a monitoring pattern by electrolytic plating a plurality of types of metal layers on a substrate. The observing step is the step of observing a surface of the monitoring pattern from above. The monitoring pattern has an identical structure of the heterogeneous metal layer. The monitoring pattern is in an area different from an area in which the heterogeneous layer is formed on the substrate.

Abstract: A plating analyzing method is disclosed for analyzing an electroplating system having an anode, a cathode and plating liquid, based on a Laplace's equation. The method comprises the steps of making the Laplace's equation discrete by Finite Volume Method; forming simultaneous equations based on the discrete Laplace's equation; and calculating potential distribution using the simultaneous equations. A plating analyzing apparatus is also disclosed, which comprises a unit for making the Laplace's equation discrete by Finite Volume Method and dividing the system into a plurality of elements; potential calculating unit for forming simultaneous equations based on the discrete Laplace's equation, and calculating potential distribution using the simultaneous equations; and current density calculating unit for calculating current density distribution based on the potential distribution.

Abstract: An anodizing system for forming a anodized coating on at least a portion of a substrate thereby creating an anodized substrate is disclosed. The anodizing system includes a bath, a coating thickness monitor, at least one probe and at least one controller. The coating thickness monitor includes at least one radiation source directed at at least a portion of the anodized substrate; at least one probe for capturing at least a portion of the radiation reflected and refracted by the anodized coating on the anodized substrate, the captured radiation being at least a portion of the radiation directed the anodized substrate from the radiation source; and at least one detector in communication with the at least one probe, the at least one detector capable of processing the captured radiation to allow a determination of at least the thickness.

Abstract: An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or conditioning operations are varied between layers or between different portions of a layer such that different surface qualities are obtained. In other embodiments varying surface quality may be obtained without varying removal or conditioning operations but instead by relying on differential interaction between removal or conditioning operations and different materials encountered by these operations.

Abstract: Provided is a method for managing manufacturing apparatuses used in a managed production line including a plurality of manufacturing processes for manufacturing an electronic device, each of the apparatuses being used in each of the processes, the method including: acquiring a property of a reference device manufactured in a predetermined reference production line including the manufacturing processes to be performed; performing at least one of the manufacturing processes in the managed production line, performing the other manufacturing processes in the reference production line, and manufacturing a comparison device; measuring a property of the comparison device; comparing the measured properties between the reference and the comparison devices; and judging whether the manufacturing apparatus used in the at least one manufacturing process is defective or not, based on a property difference between the reference and the comparison devices.

Abstract: An electro chemical deposition system is described for forming a feature on a semiconductor wafer. The electro chemical deposition is performed by powering electrodes that includes a cathode, an anode and a plurality of electrically independent auxiliary electrodes.

Abstract: The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurement is made directly on the undiluted plating bath so that the chloride measurement is fast and no waste stream is generated.

Abstract: A method for providing a two dimensional spatially varying surface potential on a surface of a conductive substrate and use thereof. The method comprises providing a conductive substrate having a first conductive surface and comprising an array of“n” electrical potential contact points spatially arranged in two dimensions on the first conductive surface, wherein “n” is at least 3. An electrical potential is then applied to each of the “n” electrical contact points, wherein the electrical potentials applied to at least two of the “n” electrical potential contact points are different. Also disclosed are methods and applications for use of the methods disclosed herein.