Abstract: The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: The present invention is a method of forming a phosphate chemical treatment film which is efficient and allows a high-quality chemical film to be obtained, by which a substance to be treated is subjected to electrolytic treatment while removing the sludge, which consists of impurities other than the unavoidable impurities in the phosphate chemical treatment bath. According to this method, an adequate phosphate chemical treatment film may be formed onto any type of metal material, to provide phosphate chemical treatment films having thicknesses not obtainable by the prior art.

Abstract: This invention relates to the use of spray mist inhibitors in basic electrolysis bath processes.

Abstract: A process for manufacturing an iridium and palladium oxides-coated titanium electrode comprises preparing a titanium substrate having a surface, applying iridium and palladium to be formed on the surface of the titanium substrate, and heat-treating the iridium and palladium oxides-applied titanium substrate to obtain an iridium and palladium oxides-coated titanium electrode. This invention provides a process for obtaining a coated titanium electrode having therein a good adhesion between the coating material and the titanium electrode, and having an excellent electrochemical stability and a superior catalytic activity in an acidic environment.

Abstract: The present invention is directed to an expert control system for controlling plating bath parameters. The system uses both feed-forward and feed-backward control to determine the amount and timing of replenisher additions of bath constituents to maintain optimum bath efficiency.

Abstract: A real-time measurement is made of the proportions of solid matter and pigment contained in an electrodeposition coating material in an electrodeposition coating material tank. The attenuation of an ultrasonic wave through the electrodeposition coating material and the density and temperature of the electrodeposition coating material are measured, and a real-time measurement is made of the proportions of the solid matter and pigment by means of calculating these proportions on the basis of the measured ultrasonic-wave attenuation, density and temperature. Furthermore, the composition of the electrodeposition coating material is controlled on the basis of the results of said measurement.

Abstract: A process and apparatus are disclosed for controlling the flow of operations in electroplating plants with horizontal throughflow in which the parts to be electroplated, in particular plate-shaped parts, pass through the plant in succession and are electroplated by means of currents applied by anodes. In order to prevent undesirable, increased precipitation on the front faces or edges of parts to be electroplated which follow each other at undesirable distances apart, or at least to reduce this precipitation to an acceptable level, the position of the parts which pass through the plant in succession and/or the distances between these parts are detected and the application of the electroplating currents is controlled as a function of these positions and/or distances by switching the anodes on and off, in such a manner that the flux density is approximately the same in all regions of the parts.

Abstract: A process for electrodespositing a conductive material on a substrate is disclosed which comprises movably mounting the substrate in a first conductive liquid electroplating bath which contains the conductive material, maintaining substantially constant conditions of temperature and liquid circulation in the first bath, passing an electric current through the substrate and the first bath so as to deposit the conductive material on the substrate, periodically transferring the substrate to a second liquid bath, the second bath containing a liquid of the same composition or lower concentrations of dissolved ingredients as compared to the first bath, weighing the substrate when immersed in the second bath and calculating therefrom the weight in air of conductive material deposited, returning the substrate to the first bath, and continuing the plating in a series of stages of plating, weighing in liquid and plating until the desired deposit is built up.Apparatus for carrying on the method is also disclosed.