Abstract: High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.

Abstract: A tray is provided for transporting components, such as electronic components. The tray includes a frame and an insert that is releasably secured to the frame. The insert has a plurality of pockets formed therein for storing the components. Inserts having a variety of pocket sizes and arrangements may be secured to frames of a standard size.

Abstract: An IC carrier has a retainer. This retainer is brought into engagement with an IC package body when an IC package is received in an IC receiving portion of the IC carrier, so that the IC package is assuredly retained by the IC carrier. A plurality of IC leads projecting sidewards from the IC package are fully accommodated within a lead-loosely-inserting space in a non-contacting state relative to the IC carrier.

Abstract: A flexible carrier tape for storage and delivery of electronic components by an advancement mechanism comprises: (a) a strip portion having a top surface, a bottom surface opposite the top surface, and means for engagingly receiving the advancement mechanism; and (b) a plurality of aligned pockets for carrying the electronic components. The pockets are spaced along the strip portion and open through the top surface. The means for engagingly receiving the advancement mechanism comprises a plurality of hollow protuberances that are spaced equally along the strip portion, open through the strip portion, and extend outwardly from the strip portion. The protuberances are adapted to receive the advancement mechanism within the hollow portion. Methods for manufacturing such carrier tapes are also disclosed.

Abstract: An embossed carrier tape system includes a carrier tape having formed therein a number of pockets spaced at equal intervals longitudinally of the carrier tape for accommodating surface mountable electronic parts. A cover tape extends along the length of the carrier tape in superposition thereover on the side where the pocket opening is provided. The cover tape is provided with an engagement wall adapted to be in contact engagement with the inner walls of the corresponding pockets, and is further provided with a buffer (8) expandable longitudinally of the cover tape and extending transversely of the length of the cover tape at locations over the web portions of the carrier tape between adjacent pockets, whereby the need for adhesively bonding the cover tape and the carrier tape is eliminated.

Abstract: An IC carrier includes a movable corner ruler for restricting a first angular portion of an IC, and a reference corner ruler for restricting a second angular portion of the IC, the second angular portion of the IC being in a diagonal relation to the first angular portion of the IC. The movable corner ruler is resiliently supported by a spring structure such that the first angular portion is resiliently pushed toward the reference corner ruler. The movable ruler includes a pair of ruler elements for pushing those two sides of the IC which define the first angular portion of the IC, the movable corner ruler being movably resiliently supported by the spring structure for movement along such two sides of the IC.

Abstract: A carrying case for a portable hard disk drive. The carrying case is particularly adapted to hold a hard disk drive that complies with the PCMCIA specifications. The case includes a cover that is pivotally connected to a base, so that the cover can be rotated between open and closed positions. Within the base portion of the case is an elastic insert which contains a slot that can receive a drive unit. The elastic insert is constructed to significantly dampen any shock load that is applied to the case and prevent damage to the drive unit.

Abstract: A packing device for semiconductor devices with lead terminals includes a packing box, partitions for separating a space in the packing box, and a cover. A conductive sponge used as a cushioned packing material is attached to the back surface of the cover. The semiconductor devices are placed in the packing box 3 with the lead terminals 2 facing upwardly. In this packed state, the conductive sponge is pressed against the lead terminals to collectively hold the semiconductor devices securely in the box. Thus, short-circuitting of the lead terminals is made to prevent gate of the semiconductor devices from breaking down as a result of electrostatic voltage.

Abstract: An IC carrier comprising first and second blocks, the second block is relatively movably engaged in the second block; first and second side regulation portions formed on the first and second blocks, respectively, and adapted to pressure contact opposite side faces of an IC in the sense of a lateral direction of the IC, respectively; a bottom regulation portion formed on at least one of the first and second side regulation portions and adapted to support a bottom face of the IC captured between the first and second side regulation portions; and a spring disposed between the first and second blocks such that the first and second blocks are normally biased and relatively slid, by a resilient force of the spring, in a direction reducing a distance between the first and second side regulation portions, so that the first and second side regulation portions are brought into pressure contact with the opposite side faces of the IC when the IC is inserted into the carrier.

Abstract: A set of sheets for producing a packaging assembly for products of small thickness, such as LCD panels, which comprises a first sheet (101) to fold into a product holding element (201), a second sheet (102) to fold into a base structure (202), and a third sheet (103) to fold into a cover member (203). Corrugated paper can be conveniently used for the sheets. No styrene foam is necessary.