Etchant Contains Acid Patents (Class 216/108)
  • Patent number: 10991683
    Abstract: A method of manufacturing an optoelectronic component includes: A) providing a substrate, B) providing a metallic liquid arranged in a structured manner and in direct mechanical contact on the substrate and including at least one first metal, C) providing semiconductor chips each having a metallic termination layer on their rear side, the metallic termination layer including at least one second metal different from the first metal, and D) self-organized arranging the semiconductor chips on the metallic liquid so that the first metal and the second metal form at least one intermetallic compound having a higher re-melting temperature than the melting temperature of the metallic liquid, wherein the intermetallic compound is a connecting layer between the substrate and the semiconductor chips.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 27, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Norwin von Malm, Andreas Plössl
  • Patent number: 10937758
    Abstract: Provided is a bonding method for directly bonding an electrode part of a chip component to a bonding part provided on a substrate that is a bonding target, the method comprising: a step for placing the substrate on a stage inside a liquid vessel; a step for injecting liquid into the liquid vessel; and a step for bonding the electrode part of the chip component to the bonding part (electrode part) of the bonding target by superimposing the chip component held by a bonding head in the liquid stored in the liquid vessel over the bonding target and then applying pressure thereto.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 2, 2021
    Assignees: SHINKAWA LTD., TOHOKU UNIVERSITY
    Inventors: Tomonori Nakamura, Takehito Shimatsu, Miyuki Uomoto
  • Patent number: 10834823
    Abstract: After a copper plate 14 is bonded to at least one surface of a ceramic substrate 10 via an active metal containing brazing filler metal 12 which contains silver, the unnecessary portion of the copper plat 14 and active metal containing brazing filler metal 12 is removed, and thereafter, an unnecessary portion of the copper plate 14 is removed by chemical polishing so as to cause the active metal containing brazing filler metal 12 to protrude from the side face portion of the copper plate 14, and then, a silver layer 18 adhered to the surface of the copper plate 14 by the chemical polishing is removed.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: November 10, 2020
    Assignee: Dowa Metaltech Co., Ltd.
    Inventors: Takashi Ideno, Ayumu Ozaki, Koji Kobayashi
  • Patent number: 10821058
    Abstract: The present invention is directed to a composition for the conditioning of a dental mineralized surface and/or a dental implant and/or for increasing the hydrophilicity of a dental implant having a metal containing surface. The composition comprises EDTA in a concentration of about 21-55% by weight and hydrogen peroxide at a concentration of about 2-4% by weight. The composition of the invention may be used for the conditioning of mineralized dental surfaces and dental implant surfaces in order to remove e.g. biofilm, debris, bacteria, bacterial toxins etc and/or for increasing the hydrophilicity of an implant having a metal containing surface. The invention is also directed to a kit comprising the composition of the invention and a device to apply the composition to a surface in need of conditioning.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 3, 2020
    Assignee: Straumann Holding AG
    Inventor: Daniel Fehr
  • Patent number: 10788464
    Abstract: A heater assembly used in chromatography includes a thermally conductive base having a chamber extending fully through the base with an opening at a first side of the base and at a second side of the base, and a cavity with an opening at the second side of the base. A heater is disposed within the cavity in thermal communication with the base. A thermistor assembly, having a thermistor within a thermally conductive body is disposed within the chamber. The body has a head region with a planar surface. The planar surface of the head region is exposed at the opening of the chamber at the first side of the base for making thermally conductive contact therewith. The thermistor assembly is thermally isolated from the base.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: September 29, 2020
    Assignee: WATERS TECHNOLOGIES CORPORATION
    Inventors: Joshua A. Shreve, Greg Kheyfets, Paul Keenan, Paul E. Linderson
  • Patent number: 10614943
    Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: April 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
  • Patent number: 10428429
    Abstract: There is a formulation and a method for inhibiting carbon-based deposits on metal substrate. The method comprises the use of a formulation comprising at least one oxidizing agent and at least one etchant capable of forming free metal ions from the metal substrate, at least one sequestering agent having a ligand capable of forming a complex with the free metal ions and at least one chelating agent having a ligand capable of complexing with at least one surface metal atom.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 1, 2019
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Liang Hong, Yuanhuan Zheng, Siok Wei Tay
  • Patent number: 10363631
    Abstract: The invention is a process of repairing cracked or microstructurally damaged portions of irradiated materials, such as nuclear reactor pressure vessels and shrouds. A damaged portion of the irradiated substrate is first removed, such as by electrical discharge machining (EDM). After removing the damaged portion, the recast layer inherent in the EDM process is then removed. Once the repair area substrate material has been removed to a calculated depth, the created cavity is then filled without releasing transmutated elements within the irradiated material. A chamber may be placed on the irradiated material surrounding the repair area to create an isolated work space.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: July 30, 2019
    Assignee: Framatome Inc.
    Inventors: Jeffrey A. Enneking, Brian W. Ring
  • Patent number: 10333177
    Abstract: Metal hydride batteries comprising an electrolyte composition which comprises an aqueous solution comprising potassium hydroxide (KOH) and one or more halide and/or oxyacid salts exhibit reduced degradation of the anode material during operation. The salts are for instance alkali metal salts. Anode materials exhibit for instance <100 % of the degradation of the same anode material in the same battery when replacing the electrolyte composition with 30 weight percent (wt %) aqueous KOH and the conductivity of the electrolyte composition is for instance ?85 % of 30 wt % aqueous KOH. Anode materials are for example ABx high capacity hydrogen storage alloys comprising Mg where x is from about 0.5 to about 5 and which has a discharge capacity of ?400 mAh/g.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: June 25, 2019
    Assignee: BASF Corporation
    Inventors: Kwo Young, Shuli Yan, Simon K. Y. Ng
  • Patent number: 10287689
    Abstract: There is provided a method for producing a metal-plated stainless material, the method including performing an acid treatment of treating a stainless steel material with an acidic solution; performing an etching of treating the stainless steel material after the acid treatment with an etching treatment agent; and a modifying the surface of the stainless steel material after the etching into a state suitable for a metal plating process.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: May 14, 2019
    Assignee: TOYO KOHAN CO., LTD.
    Inventors: Takahiro Yoshida, Tomoyuki Tsuruda
  • Patent number: 9944565
    Abstract: After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than ?50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 ?m, a ten-point average roughness Rz of 0.7 to 1.1 ?m and a maximum height Ry of 0.9 to 1.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 17, 2018
    Assignees: DOWA METALTECH CO., LTD., TOKUYAMA CORPORATION
    Inventors: Hideyo Osanai, Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda
  • Patent number: 9925397
    Abstract: The present invention is directed to a composition for the conditioning of a dental mineralized surface and/or a dental implant and/or for increasing the hydrophilicity of a dental implant having a metal containing surface. The composition comprises EDTA in a concentration of 21-55% by weight and having a pH of 9.0 or above. The high pH of the composition allows more EDTA to be dissolved and the composition is useful for the conditioning of mineralized dental surfaces and/or surfaces of dental implants. The composition of the invention may thus be used for the conditioning of mineralized dental surfaces and dental implant surfaces in order to remove e.g. biofilm, debris, bacteria, bacterial toxins etc and/or for increasing the hydrophilicity of an implant having a metallic surface. The invention is also directed to a kit comprising the composition of the invention and a device to apply the composition to a surface in need of conditioning.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: March 27, 2018
    Assignee: Straumann Holding AG
    Inventor: Daniel Fehr
  • Patent number: 9896765
    Abstract: The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating. The process comprises the steps i) providing such a substrate, ii) activating of the copper features with noble metal ions; iii) removing excessive noble metal ions or precipitates formed thereof with an aqueous pre-treatment composition comprising an acid, a source for halide ions and an additive selected from the group consisting of thiourea, thiourea derivatives and polymers comprising thiourea groups, and iv) electroless plating of a metal or metal alloy layer.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: February 20, 2018
    Assignee: Atotech Deutschland GmbH
    Inventors: Boris Alexander Janssen, Donny Lautan
  • Patent number: 9754791
    Abstract: Methods for selectively depositing different materials at different locations on a substrate are provided. A selective deposition process may form different materials on different surfaces, e.g., different portions of the substrate, depending on the material properties of the underlying layer being deposited on. Ion implantation processes may be used to modify materials disposed on the substrate. The ions modify surface properties of the substrate to enable the subsequent selective deposition process. A substrate having a mask disposed thereon may be subjected to an on implantation process to modify the mask and surfaces of the substrate exposed by the mask. The mask may be removed which results in a substrate having regions of implanted and non-implanted materials. A subsequent deposition process may be performed to selectively deposit on either the implanted or non-implanted regions of the substrate.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: September 5, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ludovic Godet, Yin Fan, Ellie Y. Yieh, Srinivas D. Nemani
  • Patent number: 9620433
    Abstract: System and method for thermal management in a multi-chip packaged device. A microelectronic unit is disclosed, and includes a semiconductor element having atop surface and a bottom surface remote from the top surface. A semiconductor device including active elements is located adjacent to the top surface. Operation of the semiconductor device generates heat. Additionally, one or more first blind vias extend from the bottom surface and partially into a thickness of the semiconductor element. In that manner, the blind via does not contact or extend to the semiconductor device (defined as active regions of the semiconductor element, and moreover, is electrically isolated from the semiconductor device. A thermally conductive material fills the one or more first blind vias for heat dissipation.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: April 11, 2017
    Assignee: Tessera, Inc.
    Inventor: David Edward Fisch
  • Patent number: 9545740
    Abstract: It is an object to manufacture a composite of a metal part and a resin composition part, which is improved so as to securely join and integrate stainless steel and a resin. A stainless steel part whose surface has been suitably roughened by chemical etching or the like can be used. An integrated product is obtained by inserting a stainless steel piece 1 with its surface treated into a cavity formed by a movable-side mold plate 2 and a fixed-side mold plate 3 of a metallic mold for injection molding 10 and injecting a specific resin. PBT, PPS or an aromatic polyamide resin can be used as the main resin component of a resin composition 4 that is used. High injection joining strength is obtained if the resin composition contains, as an auxiliary component, PET and/or a polyolefin resin in the case of PBT, a polyolefin resin in the case of PPS and an aliphatic polyamide resin in the case of an aromatic polyamide resin.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: January 17, 2017
    Assignee: TAISEI PLAS CO., LTD.
    Inventors: Masanori Naritomi, Naoki Andoh
  • Patent number: 9504144
    Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: November 22, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu
  • Patent number: 9365934
    Abstract: The present invention provides a liquid composition used for etching a copper- and titanium-containing multilayer film, a method for etching a copper- and titanium-containing multilayer film by using said liquid composition, a method for manufacturing multilayer-film wiring according to said etching method, and a substrate provided with multilayer-film wiring manufactured according to said manufacturing method. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source and (C) a fluoride ion source and having the pH value of 0-7 is used.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: June 14, 2016
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Tomoyuki Adaniya, Kunio Yube, Satoshi Tamai
  • Patent number: 9339849
    Abstract: The invention relates to a method for the processing of metal scrap, in particular steel scrap, wherein the metal scrap material is treated with at least one fluid with a view to removing surface coatings before a spectroscopic analysis of the metal scrap composition is performed. On the basis of this composition the metal scrap can then be sorted and further processed in a purposeful manner. Moreover, the fluid used for the removal of the surface coatings can be suitably treated to recover the metal constituents contained therein. On the one hand, a resource-conserving and economic recovery of metals, in particular zinc, contained in surface coatings is achieved by means of the inventive method and, what is more, the method also enables a purposeful sorting of metal scrap material to be performed for a variety of uses in the iron and steel producing industry.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: May 17, 2016
    Assignee: ProASSORT GmbH
    Inventor: Hans-Bernd Pillkahn
  • Patent number: 9332652
    Abstract: A process for etching excess tin or tin alloy deposits including the steps of providing a substrate having recessed structures filled with tin or a tin alloy and an excess layer of tin or tin alloy, providing an aqueous etching solution consisting of a source of hydroxide ions and a nitro-substituted aromatic sulfonic acid and having a pH value greater than 7, and contacting said substrate with said aqueous etching solution for removing said excess tin or tin alloy layer on top of the recessed structures filled with tin or a tin alloy.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: May 3, 2016
    Assignee: Atotech Deutschland GmbH
    Inventors: Neal Wood, Dirk Tews
  • Patent number: 9324668
    Abstract: A package includes a package component and a second package component. A first elongated bond pad is at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length. A second elongated bond pad is at a surface of the second package component. The second elongated bond pad is bonded to the first elongated bond pad. The second elongated bond pad has a second length in a second longitudinal direction, and a second width smaller than the second width. The second longitudinal direction is un-parallel to the first longitudinal direction.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: April 26, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Luan C. Tran, Yeur-Luen Tu, Ching-Chun Wang
  • Patent number: 9206499
    Abstract: An airfoil for use in a gas turbine engine is provided, the airfoil having a hole therein. A ceramic plug is inserted in the hole so that the plug extends above a depth of a thermal barrier coating, such as a ceramic, to be placed on the airfoil. The airfoil is then coated by non-line of sight vapor deposition and the plugs are then removed.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: December 8, 2015
    Assignee: United Technologies Corporation
    Inventor: Benjamin Joseph Zimmerman
  • Patent number: 9150998
    Abstract: A method to produce a fabric applique includes the steps of providing a piece of steel, removing oxide layers from the steel, and forming a pattern on the steel. The steel is etched and coded. A die cutting laminate including the coded steel is prepared and compressed to cut fabric.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: October 6, 2015
    Inventor: J. Michael Dywan
  • Publication number: 20150136738
    Abstract: A method of processing a polycrystalline diamond (PCD) material having a non-diamond phase comprising a diamond catalyst/solvent and/or one or more metal carbides, comprises leaching an amount of the diamond catalyst/solvent and/or one or more metal carbides from the PCD material by exposing at least a portion of the PCD material to a leaching solution. The leaching solution comprises nitric acid diluted in water, wherein the nitric acid is between around 2 to 5 wt % in the nitric acid and water mixture, and one or more additional mineral acids.
    Type: Application
    Filed: December 20, 2012
    Publication date: May 21, 2015
    Applicant: Element Six Abrasives S.A.
    Inventors: Nokuthula Princess Ndlovu, Humphrey Lungisani Sithebe
  • Publication number: 20150129547
    Abstract: Coated film is removed at an outer peripheral edge of a substrate before heat-treating in CSD method by spraying or dropping liquid for removing CSD coated film including water and organic solvent mixed in a weight ratio of 50:50 to 0:100, in which the organic solvent is one or more selected from the group consisting of ?-diketones, ?-ketoesters, polyhydric alcohol, carboxylic acids, alkanolamines, ?-hydroxy carboxylic acid, ?-hydroxy carbonyl derivatives, and hydrazone derivatives.
    Type: Application
    Filed: January 16, 2015
    Publication date: May 14, 2015
    Inventors: Nobuyuki Soyama, Toshiaki Watanabe, Hideaki Sakurai
  • Patent number: 9023220
    Abstract: A method of manufacturing a graphene monolayer on insulating substrates from CVD graphene synthesis, comprising: applying a thermal release adhesive tape to the bottom graphene layer deposited at the bottom of the metal foil in the CVD graphene synthesis, detaching the thermal release adhesive tape and the bottom graphene layer from the metal foil via the application of heat, from 1° C. up to 5° C. higher than the release temperature of the thermal release adhesive tape so that the thermal release adhesive tape with the bottom graphene layer can be removed, obtaining a metal foil with a top graphene layer sample, and transferring the top graphene layer onto a substrate via a sacrificial protective layer.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 5, 2015
    Assignee: Graphenea, S.A.
    Inventors: Amaia Zurutuza Elorza, Alba Centeno Perez, Beatriz Alonso Rodriguez, Amaia Pesquera Rodriguez
  • Patent number: 9017569
    Abstract: A method for preparing a copper alloy given a certain special surface shape yields tremendous bonding strength through compatibility with an epoxy resin adhesive. With a composite part in which this technology is utilized to integrate a copper alloy member as a cover material with a CFRP, it is possible to take advantage of the characteristics of both the copper alloy and the FRP due to the tremendous bonding strength. In a step in which an FRP prepreg is put into a mold and heated and cured, usually the mold is first coated with a release agent to facilitate release from the mold, but with high-technology CFRP, bleeding of the release agent often diminishes the properties. A copper alloy sheet 21 is used as a cover material, and a CFRP 22 is cured.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: April 28, 2015
    Assignee: Taisei Plas Co., Ltd.
    Inventors: Masanori Naritomi, Naoki Andoh
  • Patent number: 8968583
    Abstract: A method for cleaning a dielectric and metal structure within a microelectronic structure uses an oxygen containing plasma treatment, followed by an alcohol treatment, in turn followed by an aqueous organic acid treatment. Another method for cleaning a dielectric and metal structure within a microelectronic structure uses an aqueous surfactant treatment followed by an alcohol treatment and finally followed by an aqueous organic acid treatment. The former method may be used to clean a plasma etch residue from a dual damascene aperture. The second method may be used to clean a chemical mechanical polish planarizing residue from a dual damascene structure. The two methods may be used sequentially, absent any intervening or subsequent sputtering method, to provide a dual damascene structure within a microelectronic structure.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: March 3, 2015
    Assignee: International Business Machines Corporation
    Inventors: Mary Beth Rothwell, Roy Rongqing Yu
  • Patent number: 8969218
    Abstract: Disclosed is a technique for attaining high etching selectivity of a silicon nitride film to a silicon oxide film. The etching method includes a step of supplying a silylating agent to a substrate having a silicon nitride film and a silicon oxide film exposed on the surface thereof to thereby form a silylated film as a protective film over the surface of the silicon oxide film. After this step, an etching solution is supplied to the substrate. It is thus possible to selectively etch only the silicon nitride film.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: March 3, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Tsukasa Watanabe, Keisuke Egashira, Miyako Kaneko, Takehiko Orii
  • Publication number: 20150045885
    Abstract: A water dispersible, biocompatible, non-toxic, seedless Group IV nanowire having an etched surface and surface oxide is provided. Also provided is a method of forming water dispersible seedless Group IV nanowires, comprising the steps of providing pristine seedless Group IV nanowires, and reacting the nanowires with a solution of an acidic amino acid to etch the nanowires and promote the formation of a water dispersible oxide layer through the formation of etched nanowires.
    Type: Application
    Filed: August 6, 2014
    Publication date: February 12, 2015
    Applicant: UNIVERSITY OF LIMERICK
    Inventors: Patrick Kiely, Kevin Ryan, Michael Bezuidenhout
  • Patent number: 8932476
    Abstract: Apparatuses and methods are provided where porous metal is deposited on a substrate, a mask is provided on the porous metal and then an etching is performed.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: January 13, 2015
    Assignee: Infineon Technologies AG
    Inventors: Thomas Kunstmann, Stefan Willkofer, Anja Gissibl, Johann Strasser, Matthias Mueller, Eva-Maria Hess
  • Patent number: 8927069
    Abstract: A method and apparatus for modifying low emissivity (low-E) coated glass, so that windows using the processed glass allow uninterrupted use of RF devices within commercial or residential buildings. Glass processed in the manner described herein will not significantly diminish the energy conserving properties of the low-E coated glass. This method and apparatus disrupts the conductivity of the coating in small regions. In an embodiment, the method and apparatus ablates the low-E coating along narrow contiguous paths, such that electrical conductivity can no longer occur across the paths. The paths may take the form of intersecting curves and/or lines, so that the remaining coating consists of electrically isolated areas. The method and apparatus are applicable both to treating glass panels at the factory as well as treating windows in-situ after installation.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: January 6, 2015
    Assignee: Eritek, Inc.
    Inventors: Eugenio Estinto, Robert Winsor
  • Patent number: 8921230
    Abstract: An etchant composition includes about 25 percent by weight to about 35 percent by weight of phosphoric acid, about 3 percent by weight to about 9 percent by weight of nitric acid, about 10 percent by weight to about 20 percent by weight of acetic acid, about 5 percent by weight to about 10 percent by weight of a nitrate, about 6 percent by weight to about 15 percent by weight of a sulfonic acid, about 1 percent by weight to about 5 percent by weight of an amine compound including a carboxyl group, about 0.1 percent by weight to about 1 percent by weight of a water-soluble amino acid, about 0.01 percent by weight to about 1 percent by weight of an azole compound, and water.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: December 30, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hong-Sick Park, Young-Jun Kim, Young-Woo Park, Wang-Woo Lee, Won-Guk Seo, Sam-Young Cho, Seung-Yeon Han, Gyu-Po Kim, Hyun-Cheol Shin, Ki-Beom Lee
  • Publication number: 20140370461
    Abstract: A method of increasing the hydrophilicity of an implant to be implanted into living bone. The method comprises the act of depositing non-toxic salt residuals on the surface of the implant by exposing the surface to a solution including the non-toxic salts. The method further comprises the act of drying the implant.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 18, 2014
    Inventors: Jacqueline K. Marks, Robert L. Mayfield, Ross W. Towse
  • Patent number: 8894877
    Abstract: A liquid composition for wet etching has improved selectivity for polysilicon over silicon dioxide, even when the polysilicon is heavily doped and/or the silicon dioxide is a low temperature oxide. The composition comprises 0.05-0.4 percent by weight hydrofluoric acid, 15-40 percent by weight nitric acid, 55-85 percent by weight sulfuric acid and 2-20 percent by weight water. A method and apparatus for wet etching using the composition are also disclosed.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: November 25, 2014
    Assignee: Lam Research AG
    Inventor: Stefan Detterbeck
  • Publication number: 20140342316
    Abstract: Process for providing structures for an improved protein adherence on the surface of a body including the steps of a) providing a basic body made of titanium or a titanium alloy, b) acid-etching the basic body, c) storing the acid-etched basic body in an aqueous solution, whereby nanostructures are formed on the surface of the basic body, and d) drying the basic body with the nanostructures formed on its surface.
    Type: Application
    Filed: October 19, 2012
    Publication date: November 20, 2014
    Inventors: Simon Berner, Ann Elisabeth Wennerberg
  • Patent number: 8865013
    Abstract: A method for chemical mechanical polishing of a substrate comprising tungsten using a nonselective chemical mechanical polishing composition.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: October 21, 2014
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Yi Guo, Jerry Lee, Raymond L. Lavoie, Jr., Guangyun Zhang
  • Patent number: 8828258
    Abstract: A method for surface treatment of a stainless steel separator for a fuel cell comprises preparing a stainless steel sheet containing nickel, chrome and iron, and having a passive film on a surface of the stainless steel sheet, and dipping the stainless steel sheet into a mixed etching solution of nitric acid (HNO3) and sulfuric acid (H2SO4) at a temperature of 50-70° C. for 30 seconds to 30 minutes to selectively lower an amount of Fe in the passive film formed on the surface of the stainless steel sheet.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: September 9, 2014
    Assignee: Hyundai Hysco
    Inventors: Yoo Taek Jeon, Yeon Soo Jeong
  • Patent number: 8790521
    Abstract: A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: July 29, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Rachel Dianne McConnell, Ann Marie Hurst
  • Patent number: 8790532
    Abstract: A method of reducing defect heights of iron mound defects on a mill glass coated electrical steel, comprises contacting at least a portion of a surface of a mill glass coated electrical steel with an acidic solution for a contacting time sufficient to reduce an average height of iron defects on the surface to a an average height in a range of 0 percent to 150 percent of the thickness of the mill glass coating, without effectively removing the mill glass coating. After contacting, the acid contacted mill glass coated electrical steel is rinsed with water and dried.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: July 29, 2014
    Assignee: ATI Properties, Inc.
    Inventor: James M. Rakowski
  • Patent number: 8764996
    Abstract: A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and etching the first material from the polymeric substrate selectively from the unfunctionalized recessed region.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: July 1, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew H. Frey, Khanh P. Nguyen
  • Patent number: 8641829
    Abstract: Disclosed is a substrate processing system, including: a processing chamber to process a substrate; a vaporizing unit to vaporize a material of liquid; a supply system to supply the processing chamber with gas of the material vaporized by the vaporizing unit; an exhaust system to exhaust an atmosphere in the processing chamber; and a cleaning liquid supply system to supply the vaporizing unit with cleaning liquid for cleaning a product deposited in the vaporizing unit, wherein the cleaning liquid supply system supplies at least two kinds of cleaning liquids into the vaporizing unit so that the product can be removed from the vaporizing unit by action of the two kinds of cleaning liquids on the product.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: February 4, 2014
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Tomoki Horita, Kazuhiro Hirahara, Hironobu Miya, Atsuhiko Suda, Hirohisa Yamazaki
  • Patent number: 8632692
    Abstract: An improved composition and method for cleaning a surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k dielectric material such as silicon dioxide, a photoresist layer overlying a low-k dielectric layer, or both layers from the surface of the wafer. The composition is formulated according to the invention to provide a desired removal rate of the low-k dielectric and/or photoresist from the surface of the wafer. By varying a fluorine ion component, and the amounts of the fluorine ion component and an acid component, and controlling the pH, a composition can be formulated in order to achieve a desired low-k dielectric removal rate that ranges from slow and controlled at about 50 to about 1000 angstroms per minute, to a relatively rapid removal of low-k dielectric material at greater than about 1000 angstroms per minute.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: January 21, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Donald L. Yates
  • Patent number: 8632836
    Abstract: The invention relates to a method for modification of a biocompatible component comprising the steps of a) providing a biocompatible component at least partly covered by metallic oxide; and b) treating at least a part of said component, which part is covered by said metallic oxide, with an aqueous composition comprising oxalic acid; whereby a modified metallic oxide is obtained. The invention also relates to a biocompatible component comprising a substrate having a surface comprising a) a microstructure comprising pits separated by plateus and/or ridges; and b) a primary nanostructure being superimposed on said microstructure, said primary nanostructure comprising depressions arranged in a wave-like formation.
    Type: Grant
    Filed: July 8, 2008
    Date of Patent: January 21, 2014
    Assignee: Astra Tech AB
    Inventors: Anette Fredriksson, Ingela Petersson
  • Patent number: 8623236
    Abstract: A titanium nitride-stripping liquid for stripping a titanium nitride coating film, the titanium nitride-stripping liquid being capable of stripping a titanium nitride coating film even in a semiconductor multilayer laminate having particularly a layer that includes tungsten or a tungsten alloy, without corrosion of this layer is provided, and furthermore, a titanium nitride-stripping liquid which can strip a titanium nitride coating film without affecting an insulating layer is provided. A titanium nitride-stripping liquid including hydrofluoric acid, hydrogen peroxide and water, and further including an inorganic acid other than hydrofluoric acid.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: January 7, 2014
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akira Kumazawa, Takahiro Eto, Takayuki Haraguchi
  • Patent number: 8617418
    Abstract: Disclosed is an agent for removing a conductive film, which contains: an acid having a boiling point of 80° C. or higher, a base having a boiling point of 80° C. or higher, or a compound which generates an acid or a base by external energy in combination with a solvent, a resin, and a leveling agent. Also disclosed is a method for removing a conducting film, which uses the agent for removing a conductive film. The agent for removing a conductive film and the method for removing a conductive film are capable of in-place uniformity removing a desired portion of a conductive film.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: December 31, 2013
    Assignee: Toray Industries, Inc.
    Inventors: Hiroki Sekiguchi, Junji Mata
  • Patent number: 8580127
    Abstract: An RFID based thermal bubble type accelerometer includes a flexible substrate, an embedded system on chip (SOC) unit, an RFID antenna formed on the substrate and coupled to a modulation/demodulation module in the SOC unit, a cavity formed on the flexible substrate, and a plurality of sensing assemblies, including a heater and two temperature-sensing elements, disposed along the x-axis direction and suspended over the cavity. The two temperature-sensing elements, serially connected, are separately disposed at two opposite sides and at substantially equal distances from the heater. Two sets of sensing assemblies can be connected in differential Wheatstone bridge. The series-connecting points of the sensing assemblies are coupled to the SOC unit such that an x-axis acceleration can be obtained by a voltage difference between the connecting points. The x-axis acceleration can be sent by the RFID antenna to a reader after it is is modulated and encoded by the modulation/demodulation module.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: November 12, 2013
    Assignee: Chung Hua University
    Inventor: Jium Ming Lin
  • Patent number: 8535507
    Abstract: A process for creating porous anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes electrochemical drilling a plurality of etched metal foils in sequence one after the other in a bath containing electrochemical drilling (ECD) solution initially having a pH of less than 5. Alternatively, an etched foil sheet may be passed through the bath in a substantially continuous manner such that a portion of said etched foil sheet is in contact with the ECD solution is electrochemically drilled to generate pores. Electrochemical drilling is achieved when a current is passed to the foil or portion of the foil sheet in solution.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: September 17, 2013
    Assignee: Pacesetter, Inc.
    Inventors: Ralph Jason Hemphill, Thomas F. Strange
  • Patent number: 8497215
    Abstract: The present invention relates to a method for the wet-chemical edge deletion of solar cells. An etching paste is applied to the edge of a solar cell substrate surface and after the reaction is complete, the paste residue is removed. Optionally, the substrate surface is cleaned and dried. The etching paste comprises 85% H3PO4, NH4HF2 and 65% HNO3 in a ratio in the range from 7:1:1.5 to 10:1:3.5, based on the weight.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: July 30, 2013
    Assignee: Merck Patent GmbH
    Inventors: Oliver Doll, Ingo Koehler
  • Patent number: 8491809
    Abstract: A process for producing an aluminum wheel includes a cleaning step, in which the surface of the aluminum wheel is chemically etched with an alkali cleaning liquid which contains an alkali builder, an organic builder, and a chelating agent to such an extent that the Si atomic ratio of metal Si to oxide Si is from 0.01 to 9, and a shot blast treatment step can be omitted for cleaning the surface of the aluminum wheel.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: July 23, 2013
    Assignees: Central Motor Wheel Co., Ltd., Nihon Parkerizing Co., Ltd.
    Inventors: Takeshi Yamada, Yoshitomo Fujii, Hiroyuki Sato, Soichi Nomoto