Abstract: A single, controlled etch step can be used to form a sharp tip feature along a sidewall of an etch feature. An etch process is used that is selective to a layer of tip material relative to the substrate upon which the layer is deposited. A lag can be created in the etch, such that the etch rate is slower near the sidewall. The sharp tip feature is formed from the same layer of material used to create the etch feature. The sharp tip feature can be used to decrease the minimum critical dimension of an etch process, such as may be due to the minimum resolution of a photolithographic process. The novel tip feature also can be used for other applications, such as to create a microaperture for a photosensitive device, or to create a micromold that can be used to form objects such as microlenses.

Abstract: A method of manufacturing a substrate 5 with a plurality of concave portions 3 according to the invention includes the steps of forming a mask 6 on the substrate 5, forming a plurality of initial holes 61 on the mask 6 by means of a physical method such as blast processing or irradiation with laser beams, and forming the plurality of concave portions in the substrate 5 by subjecting the mask 6 with the plurality of initial holes 61 to an etching process. In case of carrying out the blast processing, glass beads whose average diameter is in the range of 50 to 100 ?m are used as blast media.

Abstract: A positive resist layer formed on a translucent substrate is subjected to exposure and development to form circular resist patterns disposed near each other at a predetermined distance. The exposure pattern has an opening of a plurality of circular ring shape surrounding the plurality of resist patterns. The opening may have a width equal to the predetermined distance. Since the width of the opening is constant over the whole outer periphery of each resist pattern, uniform exposure can be realized at all positions along the periphery to form a perfect circle shape. After a convex lens shape is given to each resist pattern by heating and reflow process, the convex lens shape is transferred to the substrate by dry etching process using the resist patterns as a mask to form a microlens array with convex lenses.

Abstract: A process for fabricating a micro-optical lens comprises forming a wall post structure on a substrate, coating with a polymeric film on the wall post, then making it adhering over both sides of the wall post structure by a transverse etching on the substrate around the base of posts. After an isolating process and a proper heating treatment, said polymeric film cohering to form a plano-convex lens. By controlling the respective amount of the polymeric film on both sides of said wall post structure, the polymeric film can combine with the wall post structure to form a composite material biconvex micro-lens, plano-convex micro-lens and the like. Alternatively, a single material micro-lens can be formed by imaging the profile of the polymeric micro-lens on the wall post structure via an etching process.

Abstract: Disclosed herein is a method for manufacturing a microlens substrate which is excellent in chemical resistance and light fastness to intense light irradiation, and is capable of forming a microlens substrate of a high accuracy of form. The method includes the steps of: forming a lens-shaped curve at a surface side of a transparent substrate; forming an inorganic material film on the transparent substrate so as to bury the curve therewith; and planarizing the surface of the inorganic material film to provide a microlens where the curve is buried with the inorganic material film.

Abstract: A semi-conductor based imager includes a microlens array having microlenses with modified focal characteristics. The microlenses are made of a microlens material, the melting properties of which are selectively modified to obtain different shapes after a reflow process. Selected microlenses, or portions of each microlens, are modified, by exposure to ultraviolet light, for example, to control the microlens shape produced by reflow melting. Controlling the microlens shape allows for modification of the focal characteristics of selected microlenses in the microlens array.

Abstract: The method includes the step of forming a solid epoxy member on a substrate, the epoxy member having an upper surface of desired configuration. A first metal layer is deposited on the epoxy member with the upper surface thereof conforming to the desired configuration. A layer of epoxy is deposited on the first metal layer and epoxy material from the epoxy layer is removed to create a well, exposing the metal layer on the epoxy member. A metal impression layer is then deposited in the well. The metal impression layer is then removed from the well and affixed to a mounting member as a mold component for injection molding of small structures.

Abstract: A method for manufacturing an optical micro-mirror including a fixed part and a moveable part, with a reflection device connected to the fixed part by an articulation mechanism. This method realizes a stack including a mechanical substrate, a first layer of thermal oxidation material, and at least one second layer of material for forming the moveable part, realizes the articulation mechanism, realizes the reflection device on the second layer, realizes the moveable part by etching of at least the second layer of material, and eliminates the thermal oxidation layer to liberate the moveable part. Such an optical micro-mirror may find possible applications to optical routing or image projection systems.

Abstract: A planar lens capable of compensating for chromatic aberration and which is easy to manufacture and enables easy assembling of optical pickups and a method for fabricating the planar lens are provided. The planar lens includes a transparent substrate with a lens cavity in a surface of the transparent substrate, and a lens element formed in the lens cavity with a first refracting surface in contact with the bottom of the lens cavity and a second diffracting surface having a diffraction grating opposite to the first refracting surface.

Abstract: A method for manufacturing hemi-cylindrical and hemi-spherical micro structures is provided. A pattern is formed onto a substrate, and a layer of material is subsequently grown onto the substrate. Due to growth characteristics, the layer will form radially symmetric features when grown to an appropriate thickness.

Abstract: A method for forming a diffractive lens includes forming an etch stop layer on a first surface of a silicon substrate, forming a diffractive optical element above the etch stop layer, forming a planarization layer covering the diffractive optical element, planarizing the planarization layer, forming a bonding layer on the planarization layer, bonding a transparent substrate on the bonding layer, and etching a second surface of the silicon substrate to the etch stop layer to remove a portion of the silicon substrate opposite the diffractive optical element, wherein the remaining portion of the silicon substrate forms a bonding ring.

Abstract: A method and system of imagewise etching the surface of a substrate, such as thin glass, in a parallel process. The substrate surface is placed in contact with an etchant solution which increases in etch rate with temperature. A local thermal gradient is then generated in each of a plurality of selected local regions of a boundary layer of the etchant solution to imagewise etch the substrate surface in a parallel process. In one embodiment, the local thermal gradient is a local heating gradient produced at selected addresses chosen from an indexed array of addresses. The activation of each of the selected addresses is independently controlled by a computer processor so as to imagewise etch the substrate surface at region-specific etch rates. Moreover, etching progress is preferably concurrently monitored in real time over the entire surface area by an interferometer so as to deterministically control the computer processor to image-wise figure the substrate surface where needed.

Abstract: Diffractive optical elements and methods of making the same are described. In one aspect, a diffractive optical element is made by forming a multilayer structure comprising multiple amorphous silicon phase shift layers having respective thicknesses selected so that the diffractive optical element is operable to phase shift infrared light within an operative wavelength range. The amorphous silicon phase shift layers are separated by respective silicon dioxide etch stop layers having respective thicknesses of about 5 nm or less. Layers of the multilayer structure are serially masked and etched to form a multi-step optical structure. In another aspect, a diffractive optical element is made by forming a multilayer structure comprising multiple etch layers separated by respective etch stop layers selectively etchable with respect to the etch layers. One or more of the etch and etch stop layers are substantially opaque to light within an operative wavelength range.

Abstract: An optical lens whose focal length is different on first and second planes perpendicular to each other is provided. The optical lens is configured such that a convex element, which is formed integrally with a substrate having a flat face, has a convex curved face that functions as an optical lens and is shaped such that the curvature on a first cross section and the curvature on a second cross section perpendicular to and intersecting with the first cross section are different from each other, whereby the focal lengths on the first and second cross sections are different from each other. A groove of a substantially elliptical shape or a substantially rectangular shape is formed along the boundary between the substrate and the convex element. The optical lens is used to produce a focus error signal or is incorporated into an optical pickup apparatus.

Abstract: A method for forming many microlenses comparatively easily and effectively is provided. On one end of an optical substrate is formed a plurality of lens planes at regular intervals. Lens areas containing the lens planes are partially covered by an etching mask and etching processing is performed on areas being exposed outside the etching mask to remove the areas to a specified depth. While the lens planes formed on one surface of the optical substrate are being held by a support substrate, polishing processing is performed on another end face of the optical substrate and each microlens formed in the lens areas is separated from the support substrate.

Abstract: A mold apparatus is arranged to produce molded optical elements. The apparatus includes a first mold unit for defining mold cavities and flow passageways, and a second mold unit having a patterned surface for sealing against the first unit. The patterned mold surface may be formed with a plurality of optical patterns, and mold pins may be used to complete the mold cavities. The patterned surface may be formed on a flat metal puck. The puck may be replaced by another puck insert so that the apparatus can be used to produce products having different optical characteristics. Other parts of the apparatus may be changed out to produce molded optical elements of various sizes and shapes. A variety of techniques are described for forming micro-refractive, diffractive and/or other patterns in the metal puck surface.

Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: A manufacturing method of a microlens array includes the step of forming second light transmitting layers 36 on a first light transmitting layer 26. The first light transmitting layer 26 has a plurality of recessed parts 28 and partitions 32 for delimiting the recessed parts 28, wherein at least a portion of the inner surface of each recessed part 28 is a lens surface 30. The second light transmitting layers 36 are formed in the respective recessed parts 28 in such a manner that the second light transmitting layers 36 avoid the partitions 32 of the first light transmitting layer 26. The second light transmitting layers 36 are formed in such a manner that the surfaces of the second light transmitting layers 36 form lens surfaces 38 for the respective recessed parts 28.

Abstract: In order to produce aspherical lenses on a semiconductor material, it is proposed to transfer the structure of a photoresist spherical cap to the underlying semiconductor substrate with the aid of a reactive ion etching method. In this case, use is made of a gas component which etches the photoresist and a further gas component which etches the underlying semiconductor substrate. The ratio of the gas flows is varied during the etching operation. The result is an aspherical lens whose measured cross-sectional profile (12) has only small errors (14) from an ideal curve (13).

Abstract: A method for manufacturing reflective spatial light modulator mirror devices is disclosed. In the method, a portion of a mirror layer and a first sacrificial layer beneath the portion of the mirror layer are removed simultaneously to expose the substrate while defining a pattern of the mirror layer. Then, a second sacrificial layer is deposited conformally, and substrate contact openings and a mirror layer contact opening are defined in the second sacrificial layer at the same time. Subsequently, a support material layer is deposited conformally and etched back, so as to form supporting posts of the mirror layer in the substrate contact openings. Before the support material layer is etched back, the substrate contact openings can be filled with a photoresist material first, so as to maintain the support material layer in the substrate contact openings and increase the structural intensity of the supporting posts.

Abstract: A method of manufacturing a mirror having high verticality and less surface roughness, comprising forming a mask material to the surface of a silicon substrate, applying anisotropic dry etching and anisotropic wet etching, thereby anisotropically dry etching the surface substantially parallel with the crystal face in perpendicular to the surface of the substrate and then forming a reflection surface by the anisotropic wet etching step.

Abstract: Disclosed herein is a method for manufacturing a microlens substrate which is excellent in chemical resistance and light fastness to intense light irradiation, and is capable of forming a microlens substrate of a high accuracy of form. The method includes the steps of: forming a lens-shaped curve at a surface side of a transparent substrate; forming an inorganic material film on the transparent substrate so as to bury the curve therewith; and planarizing the surface of the inorganic material film to provide a microlens where the curve is buried with the inorganic material film.

Abstract: A method of manufacturing a substrate 5 with a plurality of concave portions 3 according to the invention includes the steps of forming a mask 6 on the substrate 5, forming a plurality of initial holes 61 on the mask 6 by means of a physical method such as blast processing or irradiation with laser beams, and forming the plurality of concave portions in the substrate 5 by subjecting the mask 6 with the plurality of initial holes 61 to an etching process. In case of carrying out the blast processing, glass beads whose average diameter is in the range of 50 to 100 &mgr;m are used as blast media.

Abstract: A processing technique of a semiconductor substrate which can improve a capability of a solid immersion lens in case of processing the semiconductor substrate and forming the solid immersion lens on its surface is provided.

Abstract: A method for forming many microlenses comparatively easily and effectively is provided. On one end of an optical substrate is formed a plurality of lens planes at regular intervals. Lens areas containing the lens planes are partially covered by an etching mask and etching processing is performed on areas being exposed outside the etching mask to remove the areas to a specified depth. While the lens planes formed on one surface of the optical substrate are being held by a support substrate, polishing processing is performed on another end face of the optical substrate and each microlens formed in the lens areas is separated from the support substrate.

Abstract: A method of manufacturing a microlens includes: forming on a transparent substrate a first film which has an etching rate higher than the transparent substrate, forming on the first film a mask in which a pit is provided at a position corresponding to a center of the microlens to-be-formed, and wet-etching the first film and the transparent substrate through the mask, to thereby excavate in the transparent substrate a non-spherical recess which defines a curved surface of the microlens.

Abstract: The method includes the step of forming a solid epoxy member on a substrate, the epoxy member having an upper surface of desired configuration. A first metal layer is deposited on the epoxy member with the upper surface thereof conforming to the desired configuration. A layer of epoxy is deposited on the first metal layer and epoxy material from the epoxy layer is removed to create a well, exposing the metal layer on the epoxy member. A metal impression layer is then deposited in the well. The metal impression layer is then removed from the well and affixed to a mounting member as a mold component for injection molding of small structures.

Abstract: The same mask pattern is used as an etching mask in defining the horizontal location of micro-machined (etched) features at the substrate surface of an optical device relative to the waveguide cores also at the substrate surface of the optical device. Exemplary micro-machined features include grooves, recesses and inclined surfaces formed in the substrate surface for any of a variety of purposes. The accurate horizontal positioning of these features relative to the integrated waveguide cores fosters accurate optical coupling between the integrated waveguide cores and external and/or internal components.

Abstract: Provided is a method of manufacturing a microlens substrate capable of facilitating optical axis alignment and simplifying manufacturing processes by patterning a lens shape of a second microlens array using a first microlens array. The lens shape of the cylindrical second microlens array is patterned by irradiating the first microlens array with ultraviolet rays. Light emitted from a linear light source which is variable in its position is imaged on a focal surface of the first microlens array by a collimator lens and the first microlens array, and a resist layer formed by being coated on the focal surface is exposed. By performing exposure while changing the position of the linear light source, a resist pattern of a desired cylindrical shape can be obtained. Thereafter, etching is performed to transfer the shape of the resist pattern onto an intermediate glass layer, and recesses are buried with a high refractive index UV curable resin.

Abstract: A fiber optic chip having one or more fiber-retaining channels and a respective number of lenslets disposed in registry with the channels is provided. The fiber optic chip includes a substrate having a first surface and an etch stop layer disposed proximate the first surface of the substrate. A fiber retaining channel is disposed within the substrate. The fiber channel has an end disposed proximate the first surface of the substrate and has a longitudinal axis extending along the channel. A lenslet is disposed on the etch stop layer and has an optical axis substantially aligned with the longitudinal axis of the channel. In addition, a process is provided for creating a fiber optic chip. The process utilizes the channels as an exposure mask to mark the locations of the lenslets relative to the channels to ensure that the lenslets are accurately registered relative to the respective channels.

Abstract: A manufacturing method of manufacturing a liquid jet head which has a plurality of piezoelectric vibrators, each having, at least in part, a laminate structure of electrodes and at least one layer of piezoelectric material. An ejection characteristic measurement step applies a similar drive signal to all of the piezoelectric vibrators to eject liquid from the nozzle openings. The liquid ejection characteristics are measured in a one-by-one basis of the nozzle openings. An ejection characteristic adjustment step sets a treatment condition for at least one of the piezoelectric vibrators based on a result of measurement by the ejection characteristic measurement step. At least one piezoelectric vibrator is subjected to a displacement amount adjustment based on the set treatment condition by trimming away a portion of an external electrode, thereby making the liquid ejection characteristic associated with the nozzle openings uniform.

Abstract: An optical unit includes a first optical element and a second optical element, wherein the first optical element has a protrusion while the second optical element has a recess. The relative alignment between the first and second optical elements is accomplished by engagement of the protrusion and the recess.

Abstract: There can be provided a method for producing a pattern film-coated article which has excellent film formability, can remove unexposed portions of a film completely in the development step after exposing the film to light. and has excellent pattern accuracy; and a photosensitive composition. The method for producing a pattern film-coated article comprises the steps of coating a photosensitive composition comprising an organometallic or organosilicon compound having photosensitivity and a hydrolyzable metal or silicon alkoxide on a substrate, irradiating the coated film on the substrate with light to polymerize the exposed portions of the coated film and then dissolving unexposed portions to remove them, wherein a pattern film-coated article is produced from an allyl group-containing metal or silicon alkoxide as the organometallic or organosilicon compound.

Abstract: A method is disclosed for making shaped optical moems components with stressed thin films. In particular, stressed thin films are used to make mirror structures.

Abstract: A method of forming three-dimensional structures on a substrate by a single reactive ion each run whereby a mask is formed on said substrate before a series of iterations are carried out, each iteration including a mask etch and a substrate etch, so that successive iterations give life to reduction in the mask area and exposure of further areas of substrate.

Abstract: A method of fabricating a refractive silicon microlens by using micro-machining technology. The method of fabricating a refractive silicon microlens according to the present invention comprises the steps of forming a boron-doped region on a silicon substrate, and selectively removing regions of the substrate except for the boron-doped region to form a lens comprised of only the boron-doped region. With the method of the present invention, it is possible to fabricate a two-dimensional infrared silicon microlens array. By using such a two-dimensional infrared silicon microlens array in an infrared sensor, the detectivity of the infrared sensor can be increased by 3.4 times, which is the refraction index of silicon. In addition, the two-dimensional infrared silicon microlens array of the present invention can be used with commercial infrared telecommunication devices.

Abstract: Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements.

Abstract: A method is proposed for producing three-dimensional structures, especially microlenses, in a substrate using an etching process, at least one original shape having a known original surface shape being present initially on the substrate in a plurality of places. The etching process has at least one first etching removal rate a1 and a second etching removal rate a2 which are material-dependent, and of which at least one is changeable as a function of time. The original shape is converted to a target shape by the etching process, the original surface shape of the original shape and the target surface shape of the target shape to be reached being known before the beginning of the etching process. In order to achieve the target surface shape, at least one of the etching rates a2 or a1 is set by a change of at least one etching parameter calculated before the beginning of the etching process as a function of the etching time.

Abstract: In a semiconductor device having a front surface where circuits are formed and a back surface, a hemispherical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.

Abstract: A process method of using excimer laser for forming micro spherical and non-spherical polymeric structure array includes a photomask which has a selected curved pattern formed thereon. The curved pattern has non-constant widths along a straight line direction. An excimer laser beam source is deployed to project through the photomask on a substrate coated with a polymeric material while the substrate is moving in a direction normal to the straight line direction for the polymeric material to receive laser beam projection with different time period. The polymeric material thus may be etched to different depth to form a three dimensional pattern desired. By projecting and etching the polymeric material two times at different directions or through different photomask patterns, a sphere like or non-sphere like surface of micro array structure may be obtained.

Abstract: An optical element which controls both the phase and irradiance distribution, thereby completely specifying the E-field, of light, allowing completely arbitrary control of the light at any plane. Such an optical element includes a portion that controls the phase and a portion that controls the irradiance. The portion that controls the irradiance is an apodized irradiance mask having its transmission varying with position in a controlled fashion. This apodized irradiance mask is preferably a pattern of metal. In order to insure a smoothly varying pattern of metal with minimized diffraction effects, a very thin mask spaced from a substrate is used to provide the metal on the substrate. The apodized irradiance mask may be placed directly on the phase control portion, or may be on an opposite side of a substrate of the phase controlled portion.

Abstract: Problems caused by a nonuniform processing profile are avoided by altering the area to be processed so as to compensate for the processing profile. More specifically, with regard to etching, problems caused by a nonuniform etch profile can be avoided by altering the mask employed in specifying the etch area so as to compensate for the etch profile. Nonuniform parameters of interest of structures which result from a nonuniform etch profile during the etching of a mask in which all the structures were identical can be avoided for by altering the mask employed in specifying the etch area so as to compensate for the etch profile. The mask is changed in a manner that is inversely proportional to the etch profile for each particular structure characteristic that determines the parameter of interest for which uniformity is desired.

Abstract: Process for the formation of at least one concave relief (124, 145) in a substrate comprising forming at least one embossment of material subject to creep (100) on the substrate (120), —heating of the material subject to creep to a temperature sufficiently high to cause creep of the said material, and—etching of the substrate and the crept material to form relief in the substrate. According to the invention, the crept material is solidified in a state in which it has a concave relief.

Abstract: A method wherein an array of optical elements is formed by forming a mount, including a plurality of element receiving bores therethrough arranged in a predetermined array; placing the mount on a lower mold surface of a lower mold, inserting a glass preform in each of the plurality of element receiving bores, each glass preform extending through a respective element receiving bore, each glass preform extending beyond a top surface of the mount; heating at least the glass preforms to at least a glass transition temperature thereof, aligning an upper mold having an upper mold surface with a plurality of desired optical features formed therein with the predetermined array- and pressing the glass preforms between the upper mold surface and the lower mold surface to mold the glass preforms into the array of optical elements permanently retained in the mount, the pressing of the glass preforms causing glass from each glass preform to flow generally radially outward therefrom across the top surface of the mount ther

Abstract: A optic is produced for operation at the fundamental Nd:YAG laser wavelength of 1.06 micrometers through the tripled Nd:YAG laser wavelength of 355 nanometers by the method of reducing or eliminating the growth of laser damage sites in the optics by processing the optics to stop damage in the optics from growing to a predetermined critical size. A system is provided of mitigating the growth of laser-induced damage in optics by virtue of very localized removal of glass and absorbing material.

Abstract: In a semiconductor device having a front surface where circuits are formed and a back surface, a hemispherical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.

Abstract: Methods for fabricating a variety of microlens array structures on substrates using chemical mechanical polishing techniques.

Abstract: An etching mask with at least one etching window is applied on a glass object consisting substantially of boron silicate glass. Subsequently, the glass object is etched through the etching window by using, for instance, HF, thereby producing trapezoidal trenches or truncated pyramidal grooves in its cross-section.

Abstract: An optical device including a semiconductor-based substrate having a photosensitive circuit including a photosensitive area a portion of which is covered by color filter array material, a contact area surrounding the photosensitive area, and a microlens material overlying the portion of the photosensitive area and a portion of a contact area.