Abstract: A method of producing an optical element having a multiple-level step-like structure includes a first process for providing a first mask pattern at a position corresponding to a predetermined boundary among boundaries at steps of the multiple-level step-like structure of a substrate, the first mask pattern having a width narrower than that of a single step, a second process for providing a second mask pattern upon the substrate having the first mask pattern formed thereon, the second mask pattern having a width corresponding to a single step or plural steps of the multiple-level step-like structure and a third process for processing the substrate by use of the first and second mask patterns and thereafter for removing the second mask pattern while leaving the first mask pattern there. After repeating the second and third processes plural times of a predetermined number, the first mask pattern is removed.

Abstract: A technique for fabricating the required surface shapes for micro optical elements, such as curved micro mirrors and lenses, starts with a simple, binary for example, approximation to the desired surface shape. Then polishing, e.g., chemical mechanical polishing (CMP), is used to form the smooth optical surface. Specifically, starting with a mesa or blind hole, with a mesa profile, a smooth mirror or lens structure is fabricated.

Abstract: A method of forming three-dimensional structures on a substrate by a single reactive ion each run whereby a mask is formed on said substrate before a series of iterations are carried out, each iteration including a mask etch and a substrate etch, so that successive iterations give life to reduction in the mask area and exposure of further areas of substrate.

Abstract: A method of manufacturing a phase grating image sensor is disclosed. The method uses conventional photolithography and etching methods to form a plurality of phase grating lenses into the conventional flattening layer on which the conventional micro-lens is formed. The invention thus utilizes phase gratings to replace the conventional micro-lens.

Abstract: The back surface of a BOE (binary optical element) having a binary optical structure formed thereon is coated with a resist film. Chromium is then deposited on the BOE by means of electron beam evaporation so as to form an island structure with an island size of about 50 nm and an island-to-island distance of about 80 nm. The BOE is then etched with an etchant to a depth of 55 nm using the island structure as a mask thereby forming a pillar-shaped microstructure. The island structure used as the mask is removed by means of wet etching using an etchant, and the resist film on the back surface of the BOE is removed using a resist remover. Thus, a microstructure is obtained which has antireflection capability allowing suppression of reflection to a level of 1% or less for a wavelength of 248 nm.

Abstract: A micro lens, or an array of micro lenses, can be formed without requiring the etching of a mesa into the substrate by deposited directly on the substrate, without any mesa each of the individual portions of the substance to be melted. The whole substrate and the portions are then conformally coated with a very thin layer of a substance, typically an adhesion promoter, e.g., hexamethyldisilazane (HMDS). The entire coated wafer is then subject to conditions which cause each of the individual substance portions to flow into a lens shape. A lens shape is achieved without requiring a mesa because the layer of adhesion promoter prevents the flowing substance from spilling in an undesired manner over the surface of the substrate.

Abstract: A method and apparatus are described for reducing stiction in a MEMS device having a movable element and a substrate. The method generally comprises providing the substrate with an anti-stiction member and interposing the anti-stiction member between the moveable element and the substrate. The apparatus generally comprises an anti-stiction member that is interposable between the moveable element and the substrate. Another embodiment of the invention of the invention is directed to a MEMS device, comprising: a substrate, a moveable element moveably coupled to the substrate, and an anti-stiction member that is interposable between the moveable element and the substrate. A further embodiment of the invention is directed to an optical switch having one or more moveable elements moveably coupled to a substrate, and an anti-stiction member that is interposable between at least one of the moveable elements and the substrate.

Abstract: The present invention provides a fabrication process for making an integrated micro spherical lens for an optical switch. Through a semiconductor micro imaging process and a wet-etching process of micro electromechanical working, a plurality of V-shape grooves and mesas are formed on the surface of a base. A further micro imaging process, an etching process and a heat tempering process are used to form a micro spherical lens on the mesa, so that an integrated micro spherical lens and fiber array can be precisely arranged.

Abstract: In a semiconductor device having a front surface where circuits are formed and a back surface, a hemishperical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.

Abstract: There can be provided a method for producing a pattern film-coated article which has excellent film formability, can remove unexposed portions of a film completely in the development step after exposing the film to light. and has excellent pattern accuracy; and a photosensitive composition.

Abstract: A microlens substrate 1 includes a transparent substrate 2 provided with a plurality of concavities 3 having concave surfaces, an outer layer 8 bonded to the transparent substrate 2 at a surface thereof provided with the concavities 3 via a resin layer 9, and spacers 5 for regulating the thickness of the resin layer 9. The resin layer 9 includes microlenses 4 formed with a resin filling the concavities 3. The spacers 5 include globular particles. The standard deviation of particle-size distribution of the spacers 5 is preferably not greater than 20% of an average particle size of the spacers 5. The density of the spacers 5 is preferably in the order of 0.5 to 2.0 g/cm3. A value &rgr;1/&rgr;2 is preferably in the order of 0.6 to 1.4, in which &rgr;1 denotes the density (g/cm3) of the spacers 5, and &rgr;2 denotes the density (g/cm3) of a resin forming the resin layer 9.

Abstract: An optical system for injecting laser radiation emitted from a semiconductor laser into an optical conductor, in which a convergent lens is configured between the semiconductor laser and the optical conductor. A diaphragm for masking out a portion of the laser radiation emitted from the semiconductor laser is applied to the convergent lens.

Abstract: A manufacturing method of a microlens array includes the step of forming second light transmitting layers 36 on a first light transmitting layer 26. The first light transmitting layer 26 has a plurality of recessed parts 28 and partitions 32 for delimiting the recessed parts 28, wherein at least a portion of the inner surface of each recessed part 28 is a lens surface 30. The second light transmitting layers 36 are formed in the respective recessed parts 28 in such a manner that the second light transmitting layers 36 avoid the partitions 32 of the first light transmitting layer 26. The second light transmitting layers 36 are formed in such a manner that the surfaces of the second light transmitting layers 36 form lens surfaces 38 for the respective recessed parts 28.

Abstract: A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.

Abstract: Process for the formation of at least one concave relief (124, 145) in a substrate comprising the following steps:

Abstract: Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

Abstract: A microoptomechanical structure produced by defining a microoptical structure in a single-crystal silicon layer separated by an insulator layer from a handle wafer, such as a SOI wafer, selectively etching the single crystal silicon layer, depositing a sacrificial oxide layer on the etched single crystal silicon layer, depositing and etching a polysilicon layer on the sacrificial oxide layer, with remaining polysilcon forming hinge elements, and releasing formed microoptical structures. Embodiments use an oxide as an insulator, and other embodiments provide for wafer bonding of the silicon layer to the insulator layer.

Abstract: Physical vapor deposition processes provide optical materials with controlled and uniform refractive index that meet the requirements for active and passive planar optical devices. All processes use radio frequency (RF) sputtering with a wide area target, larger in area than the substrate on which material is deposited, and uniform plasma conditions which provide uniform target erosion. In addition, a second RF frequency can be applied to the sputtering target and RF power can be applied to the substrate producing substrate bias. Multiple approaches for controlling refractive index are provided. The present RF sputtering methods for material deposition and refractive index control are combined with processes commonly used in semiconductor fabrication to produce planar optical devices such surface ridge devices, buried ridge devices and buried trench devices. A method for forming composite wide area targets from multiple tiles is also provided.

Abstract: Glass surfaces are produced having a highly polished surface by polishing with a glass polishing liquid having a pH approximating the pH of the glass being polished. The method provides highly polished, smooth, highly accurate glass surfaces suitable for use optical filters and solid camera devices and solid image sensors. Phosphate and fluorophosphate glass filters and the like so formed have hair-like surface flaws, if any, of a width of 7 &mgr;m or less.

Abstract: A method of fabricating a refractive silicon microlens by using micro-machining technology. The method of fabricating a refractive silicon microlens according to the present invention comprises the steps of forming a boron-doped region on a silicon substrate, and selectively removing regions of the substrate except for the boron-doped region to form a lens comprised of only the boron-doped region. With the method of the present invention, it is possible to fabricate a two-dimensional infrared silicon microlens array. By using such a two-dimensional infrared silicon microlens array in an infrared sensor, the detectivity of the infrared sensor can be increased by 3.4 times, which is the refraction index of silicon. In addition, the two-dimensional infrared silicon microlens array of the present invention can be used with commercial infrared telecommunication devices.

Abstract: The making and use of color microlenses in color image sensors and color display devices is described and claimed. The color microlenses combine the function of a colorless microlens and a color filter into a single structure simplifying the fabrication of, and increasing the reliability of display devices and image sensors using the described color microlenses.

Abstract: A diffuser master is provided which is manufactured mechanically instead of holographically. The master can be made from a suitable substrate including relatively hard materials such as plastic, glass or metal. A substrate having a first side is worked to form a diffuser surface relief structure thereon. The substrate can be buffed using a buffing agent of a selected grit in order to form surface scratches in the first side of the substrate. The substrate can also be blasted with shot particles in order to form indentations and depressions in the first side. The substrate can alternatively be acid or alkali etched in order to form surface irregularities in the first side. The scratches, depressions or irregularities can be formed in order to create a desired surface relief and hence desired diffuser output characteristics.

Abstract: An acoustic lens array fabrication process includes the formation of a microlens array mold stamper through the melting of a photoresist resin deposited on formed pedestals of a substrate. Heating of the resin causes formation of semi-spherical photoresist mounds. A further processing step, such as reactive ion etching, is used to transfer the geometry of the photoresist mounds to the substrate material, thereby forming a microlens mold stamper with convex mounds. The microlens mold stamper is then pressed into an upper surface of a acoustic ink print head substrate heated to a predetermined temperature, allowing the convex mounds to form concave impressions in the acoustic ink print head substrate, thereby forming the microlens array.

Abstract: A method for processing a plurality of mirror assemblies formed together from a silicon wafer. The method includes the steps of exposing the mirror assemblies to an acid release etch to produce released mirror assemblies and rinsing the released mirror assemblies to produce washed mirror assemblies. The washed mirror assemblies are dried to produce dried mirror assemblies and the dried mirror assemblies are mounted onto a mounting tape to produce mounted mirror assemblies. The mounted mirror assemblies are diced or scribed to produce a plurality of separated mirror assemblies, which are separated from the mounting tape so as to produce a plurality of discrete mirror assemblies.

Abstract: A method of fabrication is provided for multi-step microlithographic structures including Fresnel lenses whereby the process includes the formation of intermediate etch stop layers that are embedded with the structure material. This is accomplished in one aspect of the invention by depositing Fresnel lens material using known techniques and the selectively altering the chemistry of the material being deposited to form the intermediate etch stop layers at suitable positions without interrupting the deposition process. In another aspect, etch stop layers are patterned on layers of the lens material and embedded between such layers. The structure, or lens, is then formed using masking, patterning and etching techniques.

Abstract: Fabrication techniques to from a multi-structured monolithic cavity that generates a single axial mode of laser operation are described. These simple techniques improve laser performance and reliability while minimizing the number of process steps. Mass production of high performance lasers will become possible by using these techniques.

Abstract: A method of fabricating a lens comprising providing a photosoluble substrate having opposed first and second surfaces; exposing one of the surfaces of the substrate to a photoactive etchant; and exposing said etchant to patterned light such that a convex or concave, generally semi-spherical bulge or recess is formed in said substrate.

Abstract: In one embodiment, the present invention provides a microlens having very small focal length. The present invention also provides a non-planar microstructure having a covering layer which is slowly oxidizing or substantially free of oxygen. The present invention also provides methods for forming such microlenses and microstructures. In addition, the present invention provides a VCSEL which includes one or more non-planar microstructures of the present invention.

Abstract: A method of forming a layer of silicon on a surface comprises the steps of depositing silicon on the surface by a physical deposition process such as electron beam evaporation and, during said deposition process, subjecting the forming film to ionic bombardment. The resultant silicon film has stresses which are considerably reduced compared to a film produced by an ordinary physical deposition process. This method is particularly well adapted to the formation of relatively thick silicon layers (.gtoreq.1 .mu.m) on a layer (or stack of layers) of silica, to serve as an etching mask in a subsequent deep etching of the silica by reactive ion etching.

Abstract: An improved method and apparatus for forming microlenses is described. The method involves defocusing light from a mask during semiconductor processing to control the curvature of microlenses being formed.

Abstract: A method of manufacturing a micromachined reflector antenna onto a substrate firstly etches a reflector aperture surface defining a dish cavity in an oxide layer and secondly rotates a hinge over the reflector aperture surface with the hinge being used as the reflector central feed. The micromachined reflector can be made into an array of reflector antennas and integrated onto a single substrate with front end receiver circuits operating as a high frequency receiver on a chip reduced in size and cost and operating at hundreds of GHz.

Abstract: Describes a process for improving the adhesion of polymeric coatings to organic polymeric substrates and photochromic polymeric substrates. The process comprises irradiating the surface of a polymeric substrate prepared from or coated with a monomer composition having acrylic functionality in an oxygen containing environment with ultraviolet light; etching the treated surface; and applying to the etched surface a polymer-forming coating composition. Further described are articles and photochromic articles comprising in combination a polymeric substrate having on at least one surface thereof an adherent coating or photochromic coating prepared by the aforedescribed process.

Abstract: A method for forming lenslets of a solid-state imager, includes providing a first etch-stop layer on a spacer layer formed on a substrate or layer(s) on a substrate; providing a patterned first photosensitive resin layer to form a first mask pattern; performing an etch transfer of the first mask pattern to the first photosensitive resin layer to form a first etch-stop mask pattern, and removing the first photosensitive resin layer; providing a transparent lenslet-forming layer on the spacer layer.

Abstract: A method for precision polishing non-planar, aspherical surfaces in substrates having variations in figure which are within an order of about ten wavelengths (10 .lambda.) is performed by coating the non-planar, aspherical surface with a thin, uniform layer of material, single-point-diamond turning the layer to achieve a layer surface with an excellent surface figure, and etching the layer surface down into the substrate to completely remove the layer thereby transferring the excellent surface figure to the substrate.

Abstract: A process is described for forming a microlens, either directly on a substrate or as part of a process to manufacture an optical imaging array. The process starts with the deposition of a layer of silicon oxide over the substrate, said layer being the determinant of the lens to substrate distance. This is followed by layers of polysilicon and silicon nitride. The latter is patterned to form a mask which protects the poly, except for a small circular opening, during its oxidation (under the same conditions as used for LOCOS). The oxide body that is formed is lens shaped, extending above the poly surface by about the same amount as below it, and just contacting the oxide layer. After the silicon nitride and all poly have been removed, the result is a biconvex microlens. In a second embodiment, a coating of SOG is provided that has a thickness equal to half the microlens thickness, thereby converting the latter to a plano-convex lens.

Abstract: A resist having a three-dimensional shape of a microlens array and a material layer of the microlens array are simultaneously etched under a condition by which planar patterns transferred from the resist to the material layer are larger than planar patterns of the resist. The spacing between microlenses can be made narrower than the spacing between the planar patterns of the resist. Even when the planar shape of the microlens is an ellipse, the curvatures can be optimized in both the row and column directions by making the heights in these directions different from each other. It is possible to provide a microlens array having a small non-focusing region and a solid-state image pickup device having a high sensitivity and little smear.

Abstract: A resist having a three-dimensional shape of a microlens array and a material layer of the microlens array are simultaneously etched under a condition by which planar patterns transferred from the resist to the material layer are larger than planar patterns of the resist. The spacing between microlenses can be made narrower than the spacing between the planar patterns of the resist. Even when the planar shape of the microlens is an ellipse, the curvatures can be optimized in both the row and column directions by making the heights in these directions different from each other. It is possible to provide a microlens array having a small non-focusing region and a solid-state image pickup device having a high sensitivity and little smear.

Abstract: A method for forming lensed ends on waveguides to within very fine tolerances is applicable to many types of waveguides, including single fibers and POWs. The method uses photolithographic materials and techniques, but uses the waveguides themselves to provide the exposing radiation. Thus a method for forming a lens on the end of a waveguide having a waveguiding region and a cladding region includes the step of coating a first end of the waveguide with a photoresist material having sensitivity to at least light in a particular wavelength range. Light in that particular wavelength range is then injected into a second end of the waveguide so that the light within the waveguiding region preferentially exposes the photoresist that covers the waveguiding region at the first end of the waveguide. The method can be carried out with either positive photoresist (where only the exposed portion is removed by development) or negative photoresist (where only the exposed portion remains after development).

Abstract: Preferential etching techniques are used to form a mold which can then be used to mold a microlens array. A mask (4.sub.i) made of a material which is resistant to a chemical composition for etching the plate is formed on a substrate, so that the mask is in the form of a grid with generally polygonal meshes each centered over one of the desired cells. The sides of each cell of the mask has outgrowths (5.sub.j) extending towards the center of desired cells. The substrate is subjected to the etching composition.

Abstract: A method of forming refractive microlenses which includes the steps of depositing or growing a first transparent layer on a substrate; depositing or growing a second transparent layer on the first transparent layer; forming a columnar structure in the second transparent layer; forming a pillar in the first transparent layer using the columnar structure as a mask, whereby the pillar is self-aligned under the columnar structure and the pillar has a cross-sectional area smaller than or equal to the cross-sectional area of the columnar structure; thereafter reflowing the second transparent layer of the columnar structure while the pillar remains essentially unaltered, whereby a structure is formed on top of the pillar, the structure having a ground plane with an area smaller than or equal to the original cross-sectional area of the columnar structure; and solidifying said structure.

Abstract: Three process flows for manufacturing the micro-lens array substrates are disclosed. The process flows consist of two main parts. The first part of the process flows involves fabrication of a master mold. The first two process flows utilize photolithography means to print and dry etch the micro-lens array pattern on the substrate, which is covered by a oxidation or a wet etch stopping layer. The desired surface curvature corresponding to the desired size, shape, and pattern of the micro-lens array is created by either oxidizing the exposed silicon layer (in the first process flow) or to wet-etch the exposed SiO2 by using HF solutions (in the second process flow). The third process flow creates damaged areas by using a focused laser light at first. Then, the damaged areas are preferably etched by solutions, leaving the desired surface curvature.

Abstract: This invention relates to a method of making fiber optic interferometers. First, a plurality of optical fibers are bundled and placed into a sleeve. The bundle is then encased in the sleeve and the fiber ends are cut and polished. An area of cladding is stripped back from the polished fiber ends and layers of material are deposited on the fiber ends. These layers of material have varying indexes of refraction and form a grating. The bundle of optical fibers is then removed from encasing in the sleeve.

Abstract: The invention relates to a method for fabricating III-V semiconductor micro-optical lenses for hybrid integration with micro-optical devices, where a micro-optical lens is formed from a semiconductor wafer by selectively etching a surface of the semiconductor wafer and a lens arm is formed from the semiconductor wafer on a surface opposite the surface by selectively etching the surface of the semiconductor wafer. The lens and lens arm are then cleaved from the substrate wafer and directly mounted to a micro-optical device. As a result of using III-V semiconductor material to form micro-optical lenses for hybrid integration to micro-optical devices of the same semiconductor material, thermal expansion stability is increased and efficient transfer of light between micro-optical lenses and micro-optical devices is achieved.

Abstract: Methods of manufacturing optical elements such as diffraction type lenses, aspherical lenses and diffraction gratings are disclosed. Deposited on a glass substrate is a workpiece film made of a material which can be machined much more easily than the substrate. Then the workpiece film is machined to form a predetermined shape or contour therein. After forming the predetermined shape or contour in the workpiece film, the workpiece film and substrate are subjected to etching to duplicate the predetermined shape or contour formed in the workpiece film into the substrate.

Abstract: A method of making an imager including the steps of providing a semiconductor substrate; forming a plurality of spaced image pixels in the substrate; depositing a dielectric layer over the image pixels and making this layer optically planar by chemical mechanical polishing, thereby forming an optically flat surface. The method further includes forming a plurality of depressions in the optically flat surface; uniformly depositing a lens material on the optically flat surface, entirely filling the depressions; and forming the lens material.

Abstract: A method and system for forming microlens (78) on an optical fiber (60) include optical fiber lensing device (10) having lowering mechanism (18) for inserting optical fiber (60) at a predetermined and controlled speed to a predetermined depth in oil-acid bath having oil layer (62), acid layer (64), and boundary (68) between oil layer (62) and acid layer (64). The next step is to etch optical fiber (60) at boundary (68) by forming meniscus (66) around optical fiber (60) to selectively and controllably form on optical fiber (60) a microlens (78) having a predetermined shape, preferably a hyperbolic shape. The etching includes the steps of first tapering optical fiber (60) to a shape determined by the distance that optical fiber (60) is first inserted into acid layer (64). The etch step further chemically mills microlens (78) on optical fiber (60) to the predetermined shape by controlling the etch time and position of optical fiber (60) relative to boundary (68) for etching optical fiber (60) at boundary (68).

Abstract: An aspherical lens, which is to be used as an objective lens for an optical pickup of an optical disc apparatus, has at least one optical functional surface of the lens formed to be rotationally asymmetric so as to generate astigmatism of axial wavefront aberration for cancelling off-axis astigmatism. The lens is manufactured by press molding an optical material such as glass or resin. At least one of the dies is formed by etching a rotationally symmetric surface of a base material, unevenly. Thereby, the etched surface becomes rotationally asymmetrically aspherical in shape.

Abstract: A method for etching a tapered edge on a cladding layer 10 of an integrated optical waveguide by simultaneously etching a cured droplet of photoresist 16 and the core cladding material to translate the profile of the droplet to the cladding to provide a larger cladding thickness at the interface to the optical fiber 20 and a taper to the cladding thickness needed to control the performance of the integrated optic device. Advantages include selective thinning of the core cladding while maintaining a low loss coupling of the optical fiber to the waveguide core on the integrated device, and higher yield in production during edge polishing.

Abstract: At least one convex (or concave) arcuate face is formed by photolithography on a photoresist film formed on a surface of an optical device made of an optical material. The surface of the optical device and the photoresist film are etched to form, on the surface of the optical device, at least one convex (or concave) arcuate face similar to the convex (or concave) arcuate face formed on the photoresist film. After the surface of the optical material is mirror face polished, a photoresist film is formed on the polished surface, and the polished surface and the photoresist film are etched uniformly. An optical device obtained in this manner is used for a laser oscillator, a monolithic laser system, a nonlinear optical device, a microlens, a ring laser and so forth. Further, a plurality of reflecting portions are provided on a pair of opposing surfaces of a light transmitting optical material. At least one of the opposing surfaces is formed on the convex arcuate face.

Abstract: In a method for forming lenslets which collect light and focus it onto photosensitive elements of an electronic imager includes providing a transparent lenslet-forming layer on a substrate or on layers on the substrate,(a) providing a transparent polyester lenslet-forming layer on a substrate or on layer(s) on the substrate, the polyester containing repeat units, in part, having the structure ##STR1## wherein: n is 2 or greater;x is selected from the group consisting of H, CH.sub.3, Br and Cl; andZ is selected from the group consisting of nil, O, S, CH.sub.2, C.dbd.O, SO, SO.sub.2, CH--CH.sub.3, CH.sub.3 --C--CH.sub.3, CF.sub.3 --C--CF.sub.3, CH.sub.3 --C--CH.sub.2 CH.sub.