Abstract: A method for adjusting a performance parameter of a head suspension for positioning a read/write head in a disk drive. The suspension includes a beam and flexible element for carrying a read/write head extending from the beam. The flexible element has one or more adjustment portions. The beam has one or more openings adjacent to the adjustment portions of the flexible element to provide access to the adjustment portions through the beam. The method comprises acting upon one or more adjustment portions of the flexible element through one or more of the openings in the beam to change a performance parameter of the head suspension. A laser beam is used to irradiate the adjustment portions of the flexible element in one embodiment of the invention.

Abstract: Methods for forming write heads. One method includes forming a mask layer above a pole tip layer; forming a layer of resist above the mask layer; patterning the resist; removing portions of the mask layer not covered by the patterned resist; shaping a pole tip from the pole tip layer; depositing a layer of dielectric material above the pole tip and flux shaping layer, wherein the layer of dielectric material extends about adjacent to the mask layer; depositing a stop layer over the dielectric material, the stop layer abutting the mask layer; and polishing for forming a substantially planar upper surface comprising the mask layer and stop layer. Another method includes depositing a layer of dielectric material at least adjacent the pole tip, wherein the layer of dielectric material extends about adjacent to the mask layer. A further method includes forming dishing in the pole tip.

Abstract: A method of fabrication of a magnetic head including a read head sensor includes providing a read sensor stack having a front edge, a rear edge, a right side edge and a left side edge, and at least one pinning layer. The left side edge, right side edge, front edge and rear edge of the sensor stack are milled. The read sensor stack is annealed in a magnetic field to set the final orientation of the pinning layer, and the read sensor stack is encapsulated in overcoat material having a front surface. A projected final ABS boundary is established which lies within the overcoat material. A trim range is established relative to the projected final ABS boundary. The front surface of the overcoat material is lapped until the overcoat front surface is within the trim range. Residual overcoat material is then removed by ion beam etching.

Abstract: A method for measuring recession in a wafer undergoing an asymmetrical ion mill process. The method includes the formation of first and second reference features and possibly a dummy feature. The reference features are constructed such that the location of the midpoint between them is unaffected by the asymmetrical ion mill. By measuring the distance between a portion of the dummy feature and the midpoint between the reference features, the amount of recession of the dummy feature can be measured. The measurement can be used to calculate the relative location of the flare to the read sensor rear edge through overlay information. By keeping the angles of the sides of the features steep (ie. nearly parallel with the direction in which the ion mill is asymmetrical) the amount of material consumed on each of the reference features is substantially equal and the midpoint between the reference features is substantially stationary.

Abstract: A method for the selective removal of one or more layers from a power unit component, e.g., a turbine blade of a heavy-duty turbine, using high-energy radiation of such a wavelength that the supplied energy is so strongly absorbed by the layer to be removed in each case that the removal threshold of the specific material of the layer to be removed is exceeded, while this removal threshold is not reached in the subsurface to be preserved, a spectrometer connected to a control unit via a light-conducting fiber cable such that the method-specific characteristic values are determinable by spectroscopic methods during the removal of the respective layer and are used for the self-regulating process limitation.

Abstract: Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a narrow conductor directly above the free layer. The resistivity of the latter is made to be relatively high so the sensing current diverges very little as it passes through it. This makes it possible to use abutted hard magnets for longitudinal bias with virtually no loss of sensing current due to shunting by the magnets.

Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.

Abstract: A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.

Abstract: A panel assembly, and method of making it, that includes a substrate and a coating proximate at least one edge of the substrate for defining a coated edge portion, the coating including one or more film forming resins having at least one functional group capable of polymerization; an initiator for causing the formation of free radicals or cations; and one or more compounds, which are reactive with the film forming resin and which also contain at least one acidic moiety. A plastic is bonded onto the coated edge portion of the substrate.

Abstract: A CPP thin-film magnetic head includes a bottom shield layer; a top shield layer, the bottom shield layer and the top shield layer being disposed at a predetermined interval; a thin-film magnetic head element between the bottom shield layer and the top shield layer; an insulating layer behind the thin-film magnetic head element in the height direction and disposed between the bottom shield layer and the top shield layer; and a metal layer in the insulating layer, the top shield layer including a first top shield sublayer on the thin-film magnetic head element; and a second top shield sublayer behind the first top shield sublayer in the height direction, the second top shield sublayer and the bottom shield layer being conductively connected through the metal layer, wherein a current flows in the direction orthogonal to a surface of a layer constituting the thin-film magnetic head element.

Abstract: A method for manufacturing sliders from a bar has: a radiating step which includes radiating an electromagnetic wave on at least a part of each space on a second surface of said bar, wherein said second surface is a back surface of a first surface of said bar, said first surface being formed into an air bearing surface of said slider, wherein said space is sandwiched between said elements, and wherein said electromagnetic wave is radiated such that an entire portion of said bar forms a curved shape such that said first surface forms a convex surface; a lapping step of lapping said first surface while pressing said bar against a lapping surface such that said first surface of each element forms a concave shape; and a dicing step of dicing said bar along said spaces to separate said bar into said sliders.

Abstract: A method for fabricating a magnetic recording head writer. The writer includes a bottom magnetic pole and a write gap formed over the bottom pole and a coil trench formed in the bottom pole. A top magnetic pole is provided as two layers with the first layer including front and back tips with spaced apart walls positioned adjacent the trench bottom defining trench sides. A pole cover layer is included that is made up of a thin layer of insulating material deposited to cover sides and bottom of the coil trench. A bottom coil is formed on the pole cover layer in the bottom of the coil trench and coil insulation is provided between coil elements and adjacent trench walls and covemg the coil. A top coil with insulation is formed over the planarized bottom coil insulation and the top pole second layer is formed over the top coil.

Abstract: In a method of fabricating a giant magnetoresistive (GMR) device a plurality of magnetoresistive device layers is deposited on a first silicon nitride layer formed on a silicon oxide layer. An etch stop is formed on the magnetoresistive device layers, and a second layer of silicon nitride is formed on the etch stop. The magnetoresistive device layers are patterned to define a plurality of magnetic bits having sidewalls. The second silicon nitride layer is patterned to define electrical contact portions on the etch stop in each magnetic bit. The sidewalls of the magnetic bits are covered with a photoresist layer. A reactive ion etch (RIE) process is used to etch into the first silicon nitride and silicon oxide layers to expose electrical contacts. The photoresist layer and silicon nitride layers protect the magnetoresistive layers from exposure to oxygen during the etching into the silicon oxide layer.

Abstract: This invention relates to a method for manufacturing an implantable medical device, having a surface covered with a coating that can include a desired amount of a biologically active material, using an ultraviolet (UV) laser. The invention also pertains to a method for manufacturing an implantable medical device having a surface covered with a coating having more than one layer wherein a desired portion of the top layer is ablated with an ultraviolet (UV) laser. Also, the invention relates to a method for measuring a thickness of a coating applied to an implantable medical device. Furthermore, the invention is directed to a method for manufacturing an implantable medical device having a surface covered with a coating free of webbing or cracking.

Abstract: Methods for repairing patterned structure of electronic devices. A first substrate with a patterned structure thereon is provided, wherein the patterned structure includes at least one defect. The defect corresponds to a defect region while the patterned structure corresponds to a main region. A first surface treatment is performed on the defect region such that the surface characteristics on the defect region are different from those on the main region. The defect region is repaired by inkjet printing. A second surface treatment is performed on the defect region such that the surface characteristics on the defect region are the same as those on the main region.

Abstract: A magnetoresistive sensor having a hard bias layer with an engineered magnetic anisotropy in a direction substantially parallel with the medium facing surface. The hard bias layer may be constructed of CoPt, CoPtCr or some other magnetic material and is deposited over an underlayer that has been ion beam etched. The ion beam etch has been performed at an angle with respect to normal in order to induce anisotropic roughness on its surface for example in form of oriented ripples or facets. The anisotropic roughness induces a uniaxial magnetic anisotropy substantially parallel to the medium facing surface in the hard magnetic bias layers deposited there over.

Abstract: A magnetoresistive sensor having a hard magnetic pinning layer with an engineered magnetic anisotropy in a direction substantially perpendicular to the medium facing surface. The hard magnetic pinning layer may be constructed of CoPt, CoPtCr, or some other magnetic material and is deposited over an underlayer that has been ion beam etched. The ion beam etch has been performed at an angle with respect to normal in order to induce anisotropic roughness for example in form of oriented ripples or facets oriented along a direction parallel to the medium facing surface. The anisotropic roughness induces a strong uniaxial magnetic anisotropy substantially perpendicular to the medium facing surface in the hard magnetic pinning layer deposited there over.

Abstract: A magnetoresistive sensor having an in stack bias layer with an engineered magnetic anisotropy in a direction parallel with the medium facing surface. The in-stack bias layer may be constructed of CoPt, CoPtCr or some other magnetic material and is deposited over an underlayer that has been ion beam etched. The ion beam etch has been performed at an angle with respect to normal in order to form anisotropic roughness in form of oriented ripples or facets. The anisotropic roughness induces a uniaxial magnetic anisotropy substantially parallel to the medium facing surface in the hard magnetic in-stack bias layer deposited thereover.

Abstract: A contact lithography apparatus and a method use one or both of spacers and a mesa to facilitate pattern transfer. The apparatus and the method include one or both of a spacer that provides a spaced apart orientation of lithographic elements, such as a patterning tool and a substrate, when in mutual contact with the spacer and a mesa between the patterning tool and the substrate. The mesa supports a contact surface of one or both of the mold and the substrate. One or both of the spacers and the mesa may be non-uniform. One or more of the patterning tool, the substrate and the spacer is deformable, such that deformation thereof facilitates the pattern transfer.

Abstract: A method is provided for forming a CPP MTJ or GMR read sensor in which the free layer is self-stabilized by a magnetization in a circumferential vortex configuration. This magnetization permits the pinned layer to be magnetized in a direction parallel to the ABS plane, which thereby makes the pinned layer directionally more stable as well. The lack of lateral horizontal bias layers or in-stack biasing allows the formation of closely configured shields, thereby providing protection against side-reading. The vortex magnetization is accomplished by first magnetizing the free layer in a uniform vertical field, then applying a vertical current while the field is still present.

Abstract: The present invention provides a system and method for producing a groove with a required shape in a substrate, wherein the groove has at least one facet for folding a beam of light. The system includes a drilling laser beam for producing the groove, the laser beam passable through an aperture to affect the shape of the groove, wherein at least one facet of said groove intersects a path of the beam of light.

Abstract: A method is provided for preparing high surface-area texturing of a substrate using methods by which material from a substrate is subtracted from or added to the surface of the substrate. In one embodiment, the method is a subtractive lithographic method that involves exposing a laser-ablatable substrate, such as a polymeric or ceramic substrate, to laser light. A mask may be used to define the pattern of light incident on the substrate. High surface-area textured substrates, in particular, miniaturized planar analysis devices having high surface-area textured features, prepared by the methods disclosed herein, are also provided. A method by which the high surface-area textured substrate or the miniaturized planar analysis device is used as a master from which replicate copies thereof may be made is also provided.

Abstract: In one particular example, a plurality of CPP type sensor layers are formed over a wafer and a mask without undercuts is formed over the plurality of CPP type sensor layers in a central region. With the mask without undercuts in place, an ion milling process is started to remove CPP type sensor layer materials left exposed by the mask without undercuts in end regions which surround the central region. The ion milling process is stopped at or near a spacer layer of the CPP type sensor layers. Insulator materials are then deposited in the end regions where the CPP type sensor layer materials were removed, followed by hard bias materials over the insulator materials. The mask without undercuts is then removed through use of a chemical-mechanical polishing (CMP) assisted lift-off process, which also planarizes the top surface.

Abstract: The invention relates to a method for machining a material with high-power density electromagnetic radiation. The radiation has its wavelength selected material-specifically, such that the radiation penetrates inside the material without substantial surface absorption. The radiation is focused on a spot inside the material and/or in the proximity of a penetration surface and this spot is moved along a desired machining path. The electromagnetic radiation can be provided by laser light and the focusing can be effected by means of optics. The method is particularly useful in cutting glass and the method offers benefits, including only slight heating of the machined workpiece, smoothness of the fracture plane and no vaporization of harmful alloying elements.

Abstract: A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A portion of the conductive layer is removed to form an interim side wall in the conductive layer. A layer of patternable material is formed on the substantially planar upper surface and on the interim side wall. A portion of the layer of patternable material on the conductive layer is removed to expose the interim side wall. A portion of the substantially planar upper surface is removed to form a side wall in the layer of patternable material. Portions of the interim side wall in the conductive layer are removed to form a second side wall and a bottom wall defined by the upper surface of the substrate. The second side wall is substantially perpendicular to the bottom wall.

Abstract: A magnetic write head and method for bulk fabrication of the same are provided. A trench is formed in a nonmagnetic substrate. A first magnetically permeable layer is deposited in the trench of the substrate. An optional first insulating layer is deposited in the trench. A conducting circuit is defined in the trench. The conducting circuit creates the magnetic flux. An optional second insulating layer is deposited in the trench. Writer gaps are patterned and then a second magnetic layer is added over the second insulating layer. The substrate is divided to form individual write heads.

Abstract: Methods for creating a ground path between a stainless steel suspension and a copper trace layer in an integrated lead assembly of a disk drive suspension. The invention prevents electrostatic discharge (ESD) damage by providing a means for grounding a lead to a controlled ground potential. Although the lead and suspension are generally separated by an insulating layer such as a polymide layer, connection between the lead and suspension can be made by, for example, creating an opening in the insulation layer and depositing a conductive material such an electrically conductive glue, solder or some other material through the opening to connect the two electrically conductive layers. A rivet may also be used to connect the two electrically conductive layers through a through hole that extends through both electrically conductive layers and the electrically insulating layer.

Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Abstract: Capsules and similar objects are made from materials having diamond (sp3) lattice structures, including diamond materials in synthetic crystalline, polycrystalline (ordered or disordered), nanocrystalline and amorphous forms. The capsules generally include a hollow shell made of a diamond material that defines an interior region that may be empty or that may contain a fluid or solid material. Some of the capsules include access ports that can be used to fill the capsule with a fluid. Capsules and similar structures can be manufactured by growing diamond on suitably shaped substrates. In some of these methods, diamond shell sections are grown on substrates, then joined together. In other methods, a nearly complete diamond shell is grown around a form substrate, and the substrate can be removed through a relatively small opening in the shell.

Abstract: A first magnetic layer is formed on a first magnetic layer formation surface, and then a first material layer-forming layer is deposited on the first magnetic layer formation surface and on the sides and the top of the first magnetic layer and is etched to form first material layers so that the width dimension of each first material layer in the track width direction gradually decreases in the upward direction. Then, a second material layer is formed over the first material layer formation surface, the first material layers, and the first magnetic layer. Then, the first material layers, the second material layer, and the first magnetic layer are polished to expose the upper surface of the first magnetic layer and form the upper surfaces of the second material layer and the first magnetic layer as the same planarized surface.

Abstract: A method for forming a hard bias structure in a magnetoresistive sensor is disclosed. A magnetoresistive sensor having a soft magnetic bias layer, spacer layer, and a magnetoresistive layer, is formed over a substrate having a gap layer. A mask is formed over a portion of the magnetoresistive sensor structure to define a central region. The masked structure is ion milled to remove portions not shielded by the mask, to form the central region with sloped sides, and to expose a region of the gap layer laterally adjacent the sloped sides. A first underlayer is deposited onto at least the sloped sides at a high deposition angle. A second underlayer is deposited to at least partially overlap the first underlayer, and at a first lower deposition angle. A hard bias layer is deposited over at least a portion of the second underlayer, and at a second lower deposition angle.

Abstract: A method of applying a universal coating for a medical device comprising a medical device component, the medical device component having an outer surface and an inner surface, the universal coating applied to at least the outer surface or the inner surface of the medical device component, wherein the coating is made from a material selected from the group consisting of diamond, diamond-like, borosilicate glass, carbides and nitrides. The medical device can further be a smart medical device by incorporating a sensor placed capable of measuring chemical and/or electrical conditions. A method of applying the coating inside complicated 3D structures without the need for bonding diamond to diamond or DLC to DLC layers is also provided.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: The invention proposes a method of locally colouring a part made of ceramic material of the metallic oxide type mainly including the following steps: taking a support for the part and a laser, able to move relative to each other in an XY plane, Performing a plasma treatment of the part using a gas containing one element selected from among nitrogen an carbon, so as to convert a surface layer of metallic oxide, into a substantially stoichiometric ceramic chosen from among metal nitrides and carloides. locally illuminating the part with the laser beam so as to provide sufficient energy to cause a local change in colour by altering the stoichiometry of the surface layer, and scanning the surface of the part using the laser beam so as to form a determined pattern.

Abstract: An improved damascene method of forming a write coil of a magnetic head. The method includes the steps of forming a hard mask layer over an insulator layer; forming a photoresist layer over the hard mask layer; performing an image patterning process to produce a write coil pattern in the photoresist layer; etching to remove portions of the hard mask layer in accordance with the write coil pattern; etching to remove portions of the insulator layer in accordance with the write coil pattern; etching to remove the remaining portion of the etched hard mask layer; after removing the etched hard mask layer, electroplating a material within the etched portion of the insulator material; and performing a chemical-mechanical polishing (CMP) process over the electroplated material. By removing the remainder of the hard mask material before the CMP, the quality of the CMP is improved.

Abstract: The present invention relates to an apparatus for cutting and/or marking products by means of laser beams. The apparatus comprises at least one laser light emitter moveable in a first direction (X) along a cross-bar, the cross-bar being in turn moveable above a working plan in a second direction (Y) transversal to said first direction (X), and at least two motors for moving the laser light emitter and the cross-bar. The laser light source is positioned to direct a laser light beam onto said working plan. Advantageously the two motors are positioned fixed and are coupled together and both to the laser light source, and to the cross-bar, by means of a transmission belt.

Abstract: In one illustrative example disclosed, a method for use in making a magnetic head involves forming a thermal-assist heater for the magnetic head; forming a plurality of coil layers of a write coil using a damascene process; and simultaneously forming an electrical connection to the thermal-assist heater in the same damascene process used to form the write coil. Advantageously, fabrication steps are reduced using a parallel process that provides for relatively small dimensions and reduces the possibility of electrical shorting. The method may be alternatively used to form an electrical connection to any other suitable electrical device for the magnetic head, such as an electrical lapping guide (ELG) or other component.

Abstract: A method and system for high-speed, precise, laser-based modification of at least one electrical element made of a target material is provided. The system includes a laser subsystem that generates a pulsed laser output wherein each laser pulse has a pulse energy, a laser wavelength within a range of ablation sensitivity of the target material, and a pulse duration short enough to substantially reduce ablation threshold energy density of the target material. The system further includes a beam positioner that selectively irradiates the at least one electrical element with the one or more laser pulses focused into at least one spot so as to cause the one or more laser pulses to selectively ablate a portion of the target material from the at least one element while avoiding both substantial spurious opto-electric effects and undesirable damage to the non-target material.

Abstract: A method for fabricating a multi-track thin-film magnetoresistive tape head with precisely-aligned read/write track-pairs fabricated on a monolithic substrate wafer is provided. The wafer is fabricated using modified standard thin-film processes for fabricating direct access storage device heads and modified substrate lapping procedures. Gap-to-gap separation within each read/write track-pair is reduced to nearly the thickness of the substrate wafer. Fabricating on both sides of the wafer, may enable hundreds or thousands of head elements to be aligned in one step of the fabrication process while reducing the number of pieces in the completed head assembly.

Abstract: A substrate processing method is provided including: shaping a laser beam emitted from a laser beam source into a beam having a focal depth larger than the maximum value of a variation in thickness of a processing area portion of a processed substrate and the maximum value of a variation in bend thereof by making the laser beam pass through an diffractive optical element; forming plural etching holes by irradiating the shaped beam onto a film formed on the substrate to remove the film; and forming plural recessed portions by etching the substrate through the plural etching holes.

Abstract: Methods for fabricating pole piece tips for a magnetic transducer are disclosed. The ion-milling operations for trimming P2 and notching P1 are controlled using feed-forward and feedback. The preferred method of the invention includes steps for setting four time values used in different phases of the ion-milling process based on feed-forward and feedback of measured values including the P2 width measured in the mask, multiple P2B measurements and measurement of the notch depth.

Abstract: A decorative surface treatment of hardenable metals to achieve a three dimensional textured surface with the appearance of mokume gane or Damascus steel. The annealed surface of the metal is selectively hardened by a laser in zones next to unhardened areas. The unhardened areas are selectively eaten away by abrasives in a way that allows deep texture relief.

Abstract: Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a narrow conductor directly above the free layer. The resistivity of the latter is made to be relatively high so the sensing current diverges very little as it passes through it. This makes it possible to use abutted hard magnets for longitudinal bias with virtually no loss of sensing current due to shunting by the magnets.

Abstract: A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is selected to be resistant to the CMP process can be rhodium (Rh), platinum (Pt), chromium (Cr), vanadium (V), etc. The additional CMP resistance of the refill layer structure provides a much larger processing window which results in higher yields. A CPP head according to the invention has a metal layer according to the invention above the hard bias structures on the sides of the sensor which define the track width.

Abstract: A method of making a magnetic head having an air bearing surface (ABS) composed of a flat and smooth worked surface and having a reduced step produced between a rail portion on the ABS and an element portion. Steps of the method include forming an electromagnetic transducing element including an insulating layer on a board, and then removing only a specific plane of the board opposed to a magnetic recording medium up to a first predetermined depth. Forming an insulating film composed of the same material as that of the element insulating layer on the surface of the board after the removal. Polishing the surface of the element portion and then the insulating film is polished by a chemical mechanical polishing method till the element is exposed. Then forming a recessed portion having a second predetermined depth on the insulating film.

Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface-irradiation and removal step.

Abstract: A laser device has a substrate and at least one GaN-based layer upon a first surface of the substrate, and the laser device is cleaved by cutting linear grooves into a second surface of the substrate such that the grooves are in alignment with vertical planes of the substrate. The substrate and the at least one GaN-based layer are cleaved along the vertical planes. The cutting is performed using a laser beam from an external laser source.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: Embodiments include a slider having a silicon body and at least one carbide pad structure embedded therein. At least one head structure for reading and/or writing data is located on the silicon body. The silicon body includes an air bearing surface on which the head is located. The air bearing surface also includes at least a portion of the carbide pad structure thereon. In one aspect, the metal carbide structure may be made from a material such as titanium carbide, zirconium carbide, vanadium carbide, tungsten carbide, or molybdenum carbide. In another aspect, the head may be located on the air bearing surface between carbide pad structures.