Abstract: In one embodiment, an aperture for inspecting a multi-beam allows passage of one beam among multi-beams applied in a multi-beam writing apparatus. The aperture includes a scattering layer that is provided with a through-hole through which the one beam passes, and by which the other beams are scattered, and an absorbing layer that is provided with an opening having a diameter greater than the diameter of the through-hole and that absorbs at least some of the beams entering it.

Abstract: A field mapping optical system and method for converting a light beam having a known spatially coherent first optical field to a second optical field with a required intensity distribution and flat wavefront at a desired distance from the system, by creating an intermediate optical field, between the first and second optical fields, the intermediate optical field being derived from the inverse Fourier transform of the second optical field. The optical system provides a compact and simplified field mapper.

Abstract: A method for coating a cylinder wall of an internal combustion engine, in which the cylinder wall is roughened prior to coating, such that the cylinder wall is compressed prior to roughening by plastic deformation.

Abstract: Laser processing device and method that stores characterization information representing specifics of a specific laser used for processing a material and forms a model to control the laser based on the laser performance specifics. This control sets a spacing between leading edges of sequential pulses of optical energy output by the laser, that when output by the laser, creates a laser power output with a consistent amount of pulse overlap between the sequential pulses, e.g., 50% overlap. This control is specific to the specific laser and creates a very consistent processing using the laser, e.g., a cut.

Abstract: A method for producing a multi-layer electrode system includes providing a carrier substrate having a recess in a top side of the carrier substrate. At least one wall of the recess is inclined in relation to a bottom side of the carrier substrate, which is opposite to the top side. The method also includes applying a multi-layer stack, which includes at least a first electrode layer, a second electrode layer, and a piezoelectric layer arranged between the first electrode layer and the second electrode layer, to the top side of the carrier substrate. At least the wall and a bottom of the recess are covered by at least a portion of the multi-layer stack.

Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.

Abstract: A method for advancing a rigidizable medical device may include rigidizing a portion of an outer element of the device, and while the portion of the outer element is rigidized, advancing an inner element of the device relative to the outer element of the device by a first preestablished length of advancement. The method may also include, after advancing the inner element, relaxing the portion of the outer element of the device. The method may further include, after relaxing the portion of the outer element, advancing the outer element of the device relative to the inner element of the device by a second preestablished length of advancement.

Abstract: An integrated optical assembly includes an optics mount. The optics mount has disposed thereon a light source for providing a beam of light and a lens configured to focus the beam of light. The integrated optical assembly includes a photonic integrated circuit (PIC) mechanically coupled to the optics mount. The PIC has disposed thereon a grating coupler for receiving the beam of light and coupling the beam of light into a waveguide. The integrated optical assembly includes a microelectromechanical systems (MEMS) mirror configured to receive the beam of light from the lens and redirect it towards the grating coupler. A position of a reflective portion of the MEMS mirror is adjustable to affect an angle of incidence of the beam of light on the grating coupler.

Abstract: A method of patterning holes includes placing a substrate on a stage of a laser system, the substrate having a graphene layer on a surface thereof, generating a pulse laser from the laser system, and forming a plurality of hole patterns spaced apart from each other on the graphene layer by irradiating the pulse laser while the graphene layer is in motion.

Abstract: The laser processing device comprises a laser light source emitting a laser light, a converging optical system converging the laser light at an object to be processed, and an aberration providing part for imparting an aberration to the laser light converged at the object by the converging optical system. In an optical axis direction of the laser light, letting a reference aberration range be a range of a converging-induced aberration as an aberration occurring at a position where the laser light is converged as a result of converging the laser light at the object, the aberration providing part imparts a first aberration to the laser light such that the laser light has an elongated range longer than the reference aberration range in the optical axis direction as an aberration range and an intensity distribution in the optical axis direction with a continuous undulation in the elongated range.

Abstract: A system and method for manufacturing a strip or label used to place a substantially invisible identifying mark is disclosed. A strip is treated by removing at least one area of a liner element, a film layer and an adhesive layer. Each one of the removed areas is substantially congruent with the other removed areas. A laser or other ablating device is used to remove the areas through vaporization. The strip element is peeled away from the liner element, exposing the adhesive layer. The adhesive layer is thereafter pressed against a substantially flat metal surface. The laminate top coat and the film layer are removed from the object, leaving the adhesive layer in place. The adhesive material is impregnated with a UV sensitive material, but is otherwise invisible.

Abstract: A laser-based coating removal apparatus to remove a coating from a surface without damaging the surface. The apparatus comprises a laser source to provide a laser light, a routing element coupled to the laser source and configured to direct the laser light onto a target region of the surface thereby removing the coating from the target region, and a detection element to detect the coating as the coating separates from the target region of the surface. The detection element is able to prevent the surface from being damaged by limiting or eliminating the laser light directed onto the target region after all the coating has been removed. The detection element is able to detect the separation of the coating from the target region by detecting incandescence, acoustic signature, motion, fluorescence and/or chemical properties produced by the separation of the coating from the surface.

Abstract: A method of manufacturing a flexible display is disclosed. In one aspect, the method includes attaching a protective film to a flexible display panel. The flexible display panel includes a bending region along which the flexible display panel is configured to be bent. The method also includes removing a portion of the protective film that corresponds to the bending region and bending the flexible display panel along the bending region.

Abstract: Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

Abstract: A conductive grid formation system, apparatus, and related methods may include a drum having a conductive surface, an insulation layer coating said surface, and a grid pattern formed in the insulation layer to expose portions of the conductive surface. The drum surface may be rotated into and out of a chemical bath, such that a metallic grid is electrodeposited in the exposed portions of the conductive surface. A polymer sheet may be laminated to the surface of the drum and then removed, such that the metallic grid attaches to the polymer sheet and is removed with the polymer sheet. Heat, pressure, and/or adhesive may be utilized in various steps of the process, to facilitate preferential adhesion of the metallic grid to the polymer sheet.

Abstract: A system for non-contact color harmony analysis is provided. The system may include an image acquisition system and an image analysis system. One or more cameras may take images of two regions of an object (e.g., a vehicle). The images may be transferred to the image analysis system, which may compare color values from each region and determine a color value difference. The color value difference may be compared to a predetermined threshold value to identify a possible color mismatch. The system may be used to analyze color harmony of adjacent vehicle components, for example, a front fascia and a fender or a rear fascia and a quarter panel.

Abstract: A semiconductor structure containing at least two metal resistor structures having different resistivities is provided and includes a first metal resistor structure located on a portion of a dielectric-containing substrate. The first metal resistor structure includes, from bottom to top, a first nitridized dielectric surface layer portion having a first nitrogen content, a first metal layer portion and a first nitridized metal surface layer. A second metal resistor structure is located on a second portion of the dielectric-containing substrate and spaced apart from the first metal resistor structure. The second metal resistor structure includes, from bottom to top, a second nitridized dielectric surface layer portion having a second nitrogen content, a second metal layer portion and a second nitridized metal surface layer. The second nitrogen content of the second nitridized dielectric surface layer portion differs from the first nitrogen content of the first nitridized dielectric surface layer portion.

Abstract: This disclosure relates to methods and apparatuses for marking a data matrix code in the form of an n*m cell matrix of light and dark cells, which respectively consist of a light or dark s*t pixel matrix, on a workpiece by a laser beam, wherein a laser processing unit directs the laser beam onto the workpiece, scans, pixel row by pixel row, the workpiece region to be marked, respectively with a constant marking speed and alternately in opposite directions, and wherein the light pixels and/or the dark pixels are marked on the workpiece during the scan by temporarily switching on the laser beam, wherein the laser processing unit is guided from an already scanned pixel row along a curve having a diameter of which is at least two times the pixel row spacing, to the next pixel row to be scanned.

Abstract: A wafer having an off angle ? is produced from a hexagonal single crystal ingot having an upper surface, a c-plane exposed to the upper surface, and a c-axis perpendicular to the c-plane. The ingot is supported by a wedge member having a wedge angle ? equal to the off angle ?, thereby inclining the upper surface of the ingot by the off angle ? with respect to a horizontal plane. A modified layer is formed by setting the focal point of a laser beam inside the ingot and next applying it to the upper surface, thereby linearly forming a modified layer inside the ingot and cracks extending from the modified layer along the c-plane. The focal point is moved in the second direction to index the focal point by a predetermined amount.

Abstract: A semiconductor structure containing at least two metal resistor structures having different amounts of nitrogen on the resistor surface is provided. The resulted resistances (and hence resisitivty) of the two metal resistors can be either the same or different. The semiconductor structure may include a first metal resistor structure located on a portion of a dielectric-containing substrate. The first metal resistor structure includes, from bottom to top, a first metal layer portion and a first nitridized metal surface layer having a first nitrogen content. The semiconductor structure further includes a second metal resistor structure located on a second portion of the dielectric-containing substrate and spaced apart from the first metal resistor structure. The second metal resistor structure includes, from bottom to top, a second metal layer portion and a second nitridized metal surface layer having a second nitrogen content that differs from the first nitrogen content.

Abstract: A semiconductor structure is provided that includes a first metal resistor structure located on a portion of a dielectric-containing substrate. The first metal resistor structure includes, from bottom to top, a first nitridized dielectric surface layer portion having a first nitrogen content, a first metal portion, and a first dielectric capping layer portion. The semiconductor structure of the present application further includes a second metal resistor structure located on a second portion of the dielectric-containing substrate and spaced apart from the first metal resistor structure. The second metal resistor structure includes, from bottom to top, a second nitridized dielectric surface layer portion having a second nitrogen content that differs from the first nitrogen content, a second metal portion, and a second dielectric capping layer portion.

Abstract: An improved technique for calibrating the location of an individualized marking includes marking both a grid and an image on a calibration object. The technique uses the marked grid to measure the distance in two orthogonal directions from the current image location to the desired image location by counting the number of grids between the current image location to the desired image location.

Abstract: The present invention relates to microspheres and to their use, preferably as laser absorbing additive, and to a process for their production.

Abstract: A shunt resistor according to the present invention includes a pair of electrode plates spaced apart from each other in a plate surface direction and a resistive alloy plate that connects the pair of electrode plates and that has a predetermined set resistance value. A surface of the resistive alloy plate is provided with a visually recognizable character string pattern that is formed by laser processing and that indicates the set resistance value of the resistive alloy plate, and a surface area and a carving depth of the character string pattern are set in such a manner that the resistive alloy plate has the set resistance value.

Abstract: An apparatus and method for manipulating images is disclosed. In one embodiment according to the invention, a method for manipulating images comprises: displaying for manipulation at a browser-based user interface a graphical representation of at least a portion of an image held at a remote image store; providing an internet communications link coupling the user interface to a remote image processor; transferring information about manipulations applied to the graphical representation between the user interface and the remote image processor; and causing the remote image processor to access the remote image store and apply, to at least a portion of the image held in the store, manipulations emulating those applied to the graphical representation. In another embodiment according to the invention, there is disclosed a method for applying a personalized image to a financial account access means corresponding to a financial account of a customer.

Abstract: A processes of manufacturing wrenches is provided with preparing a cylinder of raw material; cutting the cylinder of raw material into cylindrical first half-finished products; increasing volumes of two one ends of each first half-finished product 10-18% by compressing to form a second half-finished product having two spheres at two ends respectively; pressing each sphere to form top and bottom flats on the ends of the second half-finished product respectively; sintering the second half-finished product; placing the second half-finished product in a die; forging the second half-finished product to form a third half-finished product; and punching the third half-finished product to form a finished wrench having an open end and a box end.

Abstract: The disclosure relates to a process for treating a structure, the structure comprising, from its back side to its front side, a carrier substrate, an insulating layer and a useful layer, the useful layer having a free surface, the structure being placed in an atmosphere containing chemical species, the chemical species being capable of reacting chemically with the useful layer. This treatment process is noteworthy in that the useful layer is heated by a pulsed laser beam, the beam sweeping the free surface, the wavelength of the beam differing by, at most, plus or minus 15 nm from a central wavelength, the central wavelength being chosen so that the sensitivity of the reflectivity of the structure relative to the insulating layer is zero.

Abstract: Through-silicon vias (TSVs) are tested using a modified integrated circuit test probe array, an electron beam generation device, a beam direction control device and an electron beam detection device. The TSV extends through a silicon substrate with end portions exposed or accessible by contacts disposed on opposing upper and lower surfaces of the substrate. The test probe array includes a test probe that accesses the lower TSV end portion and applies an AC test signal. An electron beam is directed by the beam direction control device onto the upper substrate surface such that a beam portion reflected from the upper TSV end portion is captured by the electron beam detection device. Reflected beam data is then analyzed to verify the TSV is properly formed. Various scan patterns, different test signal frequencies and an optional resistive coating are used to enhance the TSV testing process.

Abstract: Methods and systems for welding are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser; coupling the electromagnetic radiation from the ultrashort pulse laser to a scanner comprising a scanning and focus range, wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort laser and to scan and focus the electromagnetic radiation onto a joining interface of one or more materials; using a computer to adjust the pulse repetition rate and the average power of the ultrashort pulse laser; using one or more stages to position the joining interface; using a dichroic filter positioned between the scanner and the one or more materials; and focusing an imager and processor through the dichroic filter and onto the joining interface to monitor the joining interface of the one or more materials within the scanning and focus range of the electromagnetic radiation. Other embodiments are described and claimed.

Abstract: In pulsed-laser apparatus for filamentary cutting a glass-sheet, a laser-beam is focused by a plano-convex focusing lens into the glass-sheet through a first surface of the sheet to a point close to a second surface of the sheet. Pulses from the laser are delivered in repeated bursts. The laser-beam fills the clear-aperture of the lens such that uncorrected spherical aberration in the focusing lens causes radial modulation of the beam between the lens and the focus point. This provides that each burst of pulses generates a filament extending between the first and second surfaces of the sheet.

Abstract: A method for precise working of material, particularly organic tissue, comprises the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked. Apparatus, in accordance with the invention, for precise working of material, particularly organic tissue comprising a pulsed laser, wherein the laser has a pulse length between 50 fs and 1 ps and with a pulse frequency of from 50 kHz to 1 MHz is also described.

Abstract: An ink jet head includes a base member having a plurality of openings, a diaphragm formed on a surface of the base member covering each of the openings, a pressure chamber being formed at each of the openings, and a plurality of piezoelectric elements formed at locations on the diaphragm corresponding to the pressure chambers, each of the piezoelectric elements being configured to eject liquid from a corresponding pressure chamber by causing deformation of the diaphragm. The diaphragm includes a plurality of stress release portions that reduces compressive residual stress in the diaphragm, each of the stress release portions corresponding to one of the piezoelectric elements.

Abstract: A method of forming an optical surface on an end portion of an optical fiber inserting the optical fiber through a ferrule bore of a ferrule so that the end portion extends past an end face on the ferrule. At least one laser beam is emitted from at least one laser and directed to the end face of the ferrule at a location spaced from the ferrule bore. The at least one laser beam is also directed at an angle relative to the end face of the ferrule so as to be incident on the end portion of the optical fiber after reflecting off the end face of the ferrule. The at least one laser is operated to cleave the end portion of the optical fiber, and the end face on the ferrule does not crack due to thermal expansion when the at least one laser is operated.

Abstract: A manufacturing method of a substrate, the method includes a crack forming process of forming a crack along an interface between a first portion of a processing object and a second portion of the processing object, the crack-forming process forming the crack in a manner that an ultrashort-pulse laser light is irradiated so that a focus point thereof is positioned at the interface or in a vicinity thereof, and a separating process of separating the processing object at the crack, wherein an impurity concentration of the first portion and an impurity concentration of the second portion are different from each other or material of the first portion and material of the second portion are different from each other.

Abstract: A heating device which has power-supply electrodes concentratedly arranged in one longitudinal end of a substrate. The substrate is disposed in a manner contained in a fixing film. An inner heating resistor formed by at least one heating resistor disposed in a manner substantially symmetrical with respect to a reference position in a lateral direction of the substrate, and an outer heating resistor formed by a plurality of heating resistors disposed farther from the reference position in the lateral direction of the substrate than the inner heating resistor is and arranged in a manner substantially symmetrical with respect to the reference position. Power-supply electrodes connected to the inner heating resistor and power-supply electrodes connected to the outer heating resistor are all disposed in the one longitudinal end of the substrate.

Abstract: When fixing a glass layer 3 to a glass member 4 by gasifying a binder and melting a glass fit 2, the glass layer 3 is irradiated with laser light L1 along a region to be fused R from an irradiation start position A in the region to be fused R to the irradiation start position A and then continuously again along an unstable region from the irradiation start position A to a stable region start position B in the region to be fused R, so as to re-melt the glass layer 3 in the unstable region, thereby removing the binder, thus turning the unstable region into a stable region, whereupon the glass layer 3 is fixed to the glass member 4.

Abstract: Systems and methods deform the surface of the material with a probe, such as a mechanical device or a gas/liquid jet, while optically recording in detail the three-dimensional (3D) topography of the resulting surface deformation. The probe effectively applies a forcing function to the material, the attributes of which are known by performing calibrations prior to use or by direct measurement while it is applied. The topography is effectively the system output that is measured as indicative of the underlying mechanical properties of the material. In one application, systems and methods that apply a pressure in-vivo to human tissue and analyze a three-dimensional topography of the resulting surface deformation to identify localized inhomogeneities and anomalies in the human tissue.

Abstract: Methods and systems for drilling precise orifices in a wall of non-uniform thickness are provided. In one aspect, a thickness profile of at least a portion of the wall is created and the wall is irradiated with at least one laser beam to ablate a portion of the wall to thereby form an orifice in the wall. During the irradiation, one or more parameters of the least one laser beam are adjusted one or more times in accordance with the thickness profile to compensate for the non-uniform thickness of the wall.

Abstract: A laser dicing device includes a laser light source, an AF light source, a light path of the processing laser light and a light path of the AF laser light being partially shared with each other, a condenser lens arranged on the shared light path between the first laser light and the second laser light, an AF signal processing unit that generates a focus error signal based on reflected light of the AF laser light reflected by the surface of the wafer, a controller that moves the condenser lens such that a distance between the condenser lens and the surface of the wafer is made constant based on the focus error signal, and a focus lens group that adjusts the position of the condensing point of the AF laser light in a state where the position of the condensing point of the processing laser light is fixed.

Abstract: A manufacturing method of a metal mask including a plurality of pattern openings includes forming a first depression portion by radiating a first laser beam focused on a plane beyond a subject under processing, and then forming the plurality of pattern openings at a bottom part of the first depression portion by radiating a second laser beam focused on the bottom part of the first depression portion. Because the energy of the second laser beam is less than the first laser beam, manufacturing time of the mask is reduced while the sidewalls of the pattern opening are smooth and may be inclined, to allow for a better deposition of organic emission material onto a large display.

Abstract: Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

Abstract: A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

Abstract: Fabrication of a touch sensor panel using laser ablation is disclosed. The fabricated touch sensor panel can have its touch sensors formed from conductive layers disposed on a surface such as an undersurface of the panel's cover substrate. A fabrication method can include ablating a first conductive layer to define the first part of the touch sensors and then ablating a second conductive layer proximate to the first conductive layer to define the second part of the touch sensors. The touch sensor panel can be incorporated into a mobile telephone, a digital media player, or a personal computer.

Abstract: Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

Abstract: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

Abstract: A measurement tool for measuring an electrical parameter of a metal film deposited on a front side of a workpiece includes an electrical sensor connected to a workpiece contact point, an energy beam source with a beam impact location on the front side, a holder and a translation mechanism capable of translating the holder relative to the workpiece support, the beam source supported on the holder, and a computer programmed to sense a behavior of an electrical parameter sensed by the sensor.

Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Abstract: A method of scribing a substrate along a scribeline includes causing a laser beam to impinge on the major surface, the point of impingement of the beam constituting a light spot, the substrate being positioned with respect to the laser beam such that the light spot is disposed proximal to the scribeline. The substrate and laser beam are moved relative to one another, such that the light spot is caused to translate substantially along the scribeline, whereby localized energy is transferred from the laser beam to the substrate along the course of the scribeline. The positioning of the light spot with respect to the scribeline is monitored by imaging a flash of light produced during the relative motion. Image recognition software is used to analyze the image and determine momentary position information. The momentary position information is used to regulate a laser beam position setpoint.

Abstract: A method for structuring at least one sliding surface (4) of a machine element (1), wherein the at least one sliding surface (4) is provided by a first structuring method with a first microstructure (5) for holding lubricant. To be able to now realize the best possible sliding properties for the sliding surface, during the course of a second structuring method, recesses are formed in the at least one sliding surface (4), by which a second microstructure (6) is defined with less depth in comparison with the first microstructure.

Abstract: Methods for manufacturing strain sensors on turbine components include providing a turbine component comprising an exterior surface, and, depositing a ceramic material onto a portion of the exterior surface to form a strain sensor comprising at least two reference points.