Abstract: A method and related device for machining a workpiece is provided, wherein material of the workpiece is removed in a machining region by a non-contact removal process. The workpiece is excited by means of an excitation oscillation having a natural resonant frequency of the workpiece, or a composite comprising the workpiece and a coupling element that is rigidly coupled to the workpiece is excited by means of an excitation oscillation having a joint natural resonant frequency of the workpiece and the coupling element. The natural resonant frequency is selected such that in the machining region an oscillation occurs that has a maximum oscillation amplitude in relation to the excitation amplitude of the excitation oscillation.

Abstract: Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed along at least one path at a predetermined speed, the apparatus comprising, at least first and second lasers positioned adjacent one or more paths configured to direct a laser beam onto the objects to mark the same with indicia as the objects pass through the marking station, with each of the first and second lasers marking alternate following objects as they pass through the marking station.

Abstract: A method and apparatus is disclosed for producing precision marks for a metrological scale in the form of a stainless steel ribbon. A laser is used to produce ultra-short pulses which have a fluence at the ribbon such that ablation takes place. The laser light can be scanned via scanner and the pitch of the marks can be controlled. The ablative technique causes little thermal input and improves the accuracy of the scale.

Abstract: Surface energy of a substrate is changed without the need for any template, mask, or additional coating medium applied to the substrate. At least one beam of energy directly ablates a substrate surface to form a predefined topographical pattern at the surface. Each beam of energy has a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules. Features in the topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers.

Abstract: The invention relates to a method for machining surfaces of the bearing seats of main and pin bearings on crankshafts made of cast steel following the machining of surfaces with an undefined cutting edge by grinding or finishing. The problem of improving the quality of the running surfaces of the bearings of hardened or unhardened crankshafts is solved. This is achieved by irradiating the surfaces with a laser beam.

Abstract: In a method for re-imaging a printing form that has been used for printing in a prior printing process a substrate of the printing form is cleaned globally of ink or varnish and the substrate is treated abrasively globally in order to erase a preceding printing image. The substrate to be imaged with a new printing image is treated locally in image regions with a pulsed laser beam and, in the process, a nanoscopic and hydrophobic surface structure is produced locally. The substrate is treated globally with a hydrophilicity intensifier, as a result of which the substrate becomes hydrophilic locally in the previously hydrophobic image regions. An apparatus has a corresponding erasing unit and an imaging unit with a femtosecond laser.

Abstract: Disclosed is a resin composition for laser engraving, comprising (Component A) a hydrocarbon-based plastomer and (Component B) a polyester resin.

Abstract: The invention relates to methods and an apparatus for cutting planar substrates charged with pharmaceutically active agents. In particular, the planar substrates comprise transdermal systems or orally dissolvable films.

Abstract: A grain-oriented magnetic steel sheet includes grooves each of which extends in a direction intersecting a transportation direction, the grooves being formed at predetermined pitches PL in the transportation direction by laser beam irradiation, in which a relationship between a standard deviation value D and the pitch PL satisfies the following expression (1), the standard deviation value D being a standard deviation of distances between a linear approximation line, which is obtained from a center line of each of the grooves in a groove width direction by a least-squares method, and respective positions on the center line, and an average angle formed between tangent lines of the respective positions on the center line and a direction perpendicular to the transportation direction is more than 0° to 30°. [Expression 1] 0.

Abstract: A resin composition for laser engraving that comprises (Component A) a resin that is a plastomer at 20° C., (Component B) a polymerizable compound, and (Component C) a polymerization initiator, wherein Component A has a constitutional repeating unit having an acid group, and the content of the constitutional repeating unit having an acid group is 0.01 to 15 mass % relative to a total mass of Component A. A flexographic printing plate precursor that has a relief-forming layer formed of the resin composition for laser engraving on a support, and a flexographic printing plate precursor that has a crosslinked relief-forming layer obtained by crosslinking a relief-forming layer formed of the resin composition for laser engraving by heat and/or light.

Abstract: Disclosed is a resin composition for laser engraving comprising (Component A) a polymer having a monomer unit derived from a conjugated diene-based hydrocarbon, (Component B) a compound having an acid group and an ethylenically unsaturated bond; and (Component C) a polymerization initiator.

Abstract: In the method for manufacturing embossing rollers for a device for embossing packaging materials that comprises a set of at least two embossing rollers of which one is driven, and whereby the embossing roller set comprises a male roller having a male surface structure including structural elements and/or logo structures and a female roller having a female surface structure that is associated to the surface structure of the male roller for the common embossing operation with the male roller, the female surface structure is produced independently of a previously produced or physically pre-existing associated male surface structure. Along with a high embossing accuracy, this allows creating a very large variety of embossing structures, on one hand, and using a very large number of the most diverse materials, on the other hand, as well as reducing transverse tensions in the embossed material.

Abstract: A method and apparatus for the laser machining of an unfinished object into a cutting tool with a cutting edge and a free surface. A laser generates laser beam impulses which are directed by a redirecting arrangement onto a surface of the unfinished object. An impulse reaches an impact location on the surface of the unfinished object under an inclination angle between the laser beam direction (R) of the impulse and the surface to be formed. The redirecting arrangement is controlled so that the laser beam impulses impact at adjacent impact locations and form a pulse zone. With a positioning arrangement a relative movement between the pulse zone and the unfinished object of predetermined speed is established so that the pulse zone formed by the impact locations moves along the surface of the unfinished object and an ablation layer of a layer thickness (dS) is removed with each contour pass.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: Articles and methods of making them, the methods comprising providing a conductive film comprising a first region exhibiting a first conductivity and a second region exhibiting a second conductivity, the first region and the second region each comprising a plurality of conductors, forming a first pattern in the conductive film by exposing the first region of the conductive film to at least a first beam of radiation along a first path having at least one first shape comprising at least one curve, where, after irradiating the first region of the conductive film, the first region of the conductive film exhibits a third conductivity that is less than the second conductivity.

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

Abstract: Method for engraving a component (1; 3) involving application to the component of a laser beam (5) the pulses of which each last less than one picosecond, so as to machine or remove material from the component and achieve coloration of the surface (6) in the bottom of the machining

Abstract: A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.

Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.

Abstract: Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.

Abstract: A rotary tool (21) working surface (23) includes a plurality of cutting bodies (24). The rotary tool (21) can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface (23) is ascertained by an optical measuring arrangement (29). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (23). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (29), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies (24a, 24b) are machined and/or removed by a laser device (35).

Abstract: Methods of creating various laser-defined control structures on pressure relief devices are provided that utilize a laser having a field of view that is smaller than the overall dimensions of the laser-defined structure to be milled into the pressure relief device. The methods generally involve partitioning the working surface of the device into a plurality of tiles within which a particular segment of the control structure will be milled. Upon milling of a control structure segment in one tile, the pressure relief device and/or laser is repositioned so that a control structure segment in another tile may be created.

Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.

Abstract: Various techniques are disclosed for an apparatus and a method to remove a layer from a substrate having a pattern formed on the layer. In one example, the apparatus comprises a stage configured to receive and hold the substrate. The apparatus may further comprise an irradiating device comprising a projection lens and configured to irradiate the surface of the substrate with pulses of laser light having a selected fluence to remove an interstitial portion of the layer between the pattern without removing the pattern for corresponding irradiated areas of the substrate. The pulses of laser light may be focused through the projection lens, and the stage and the projection lens may be configured to move continuously relative each other to irradiate a plurality of areas of the substrate with the pulses of laser light.

Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.

Abstract: There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.

Abstract: A method and apparatus for modifying low emissivity (low-E) coated glass, so that windows using the processed glass allow uninterrupted use of RF devices within commercial or residential buildings. Glass processed in the manner described herein will not significantly diminish the energy conserving properties of the low-E coated glass. This method and apparatus disrupts the conductivity of the coating in small regions. In an embodiment, the method and apparatus ablates the low-E coating along narrow contiguous paths, such that electrical conductivity can no longer occur across the paths. The paths may take the form of intersecting curves and/or lines, so that the remaining coating consists of electrically isolated areas. The method and apparatus are applicable both to treating glass panels at the factory as well as treating windows in-situ after installation.

Abstract: A method of manufacturing a circuit carrier and the use of said method are proposed, said method comprising, after providing a printed circuit board (a), coating the circuit board on at least one side thereof with a dielectric (b), structuring the dielectric for producing trenches and vias therein using laser ablation (c) are performed. Next, a primer layer is deposited onto the dielectric, either onto the entire surface thereof or into the produced trenches and vias only (d). A metal layer is deposited onto the primer layer, with the trenches and vias being completely filled with metal for forming conductor structures therein (e). Finally, the excess metal and the primer layer are removed until the dielectric is exposed if the primer layer was deposited onto the entire surface thereof, with the conductor structures remaining intact (f).

Abstract: In one form a maintenance device includes a flexible member with an inspection end sized to be inserted through an inspection port of a workpiece such as a gas turbine engine or a blade of a gas turbine engine. The maintenance device includes a directed energy member that in one form is configured to produce a double pulse laser with an interval time between a first one of the pulses and a second one of the pulses greater than the time of either the first one of the pulses or the second one of the pulses. The first one of the pulses is sufficiently powerful to produce a quantity of debris upon irradiation of the workpiece. The debris produced from the first one of the pulses can be evaporated by the second one of the pulses to eliminate and/or reduce a recast layer on the workpiece.

Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Abstract: A method of bonding a conductive material to stainless steel includes: a first step of applying a conductive paste to a surface of a base plate made of the stainless steel; and a second step of removing, in an area located within the surface of the base plate and covered with the conductive paste, a part of a passivation film on a surface of the stainless steel without allowing a base material of the stainless steel of the base plate to come into contact with air. The removing of the passivation film is achieved, for example, by irradiation of laser light.

Abstract: A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of first micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of second micro-grooves overlaid on the first micro-grooves, each of the second micro-grooves having an average depth greater than the average depth of the first micro-grooves. Some embodiments can also have a plurality of textured surface treatment regions superimposed on the overlaid first and second micro-grooves so as to at least partially intersect the micro-grooves.

Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Abstract: Gradient-index (GRIN) lens fabrication employing laser pulse width duration control, and related components, systems, and methods are disclosed. GRIN lenses can be fabricated from GRIN rods by controlling the pulse width emission duration of a laser beam emitted by a laser to laser cut the GRIN rod, as the GRIN rod is disposed in rotational relation to the laser beam. Controlling laser pulse width emission duration can prevent or reduce heat accumulation in the GRIN rod during GRIN lens fabrication. It is desired that the end faces of GRIN lenses are planar to facilitate light collimation, easy bonding or fusing of the GRIN lens to optical fibers to reduce optical losses, polishing to avoid spherical aberrations, and/or cleaning the end faces when disposed in a fiber optic connector, as non-limiting examples.

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings may be precisely formed using a laser. Processing may be used to increase reflectivity of the markings.

Abstract: The present invention resides in a method of providing a mark on a surface of a metal component, where the mark comprises a symbol (301) representing a first entity of information and the method comprises a step of laser marking, in which a controllable laser beam is used to form the symbol (301) from two or more separate line segments (33 1-334), each line segment (33 1.334) having at least one point of overlap with another line segment. According to the invention, the method further comprises a step of embedding a second entity of information within the mark by modifying a sequence in which the two or more separate line segments (33 1-334) are formed.

Abstract: Disclosed is a resin composition for laser engraving, comprising (Component A) a macromonomer comprising only one radically polymerizable group in the molecule, (Component B) a polyfunctional ethylenically unsaturated compound comprising two or more radically polymerizable groups in the molecule, (Component C) a binder polymer, and (Component D) a radical polymerization initiator.

Abstract: An alignment system for permanently marking a workpiece with a marking device includes a camera, a display operatively connected to the camera and configured to generate an image as a function of camera input, a template having a marking area designation located in relation to the display such that the image is displayed against the marking area designation, and an adjustment table configured to allow controllable repositioning of the workpiece relative to the marking device.

Abstract: A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets.

Abstract: The invention relates to a new technology which uses a surface modification method for ultra-precision machining, and in particular relates to a particle beam-assisted ultraprecision machining method for single-crystal brittle materials. The invention, the particle beam-assisted ultra-precision machining method for single-crystal brittle materials, can significantly improve machining accuracy, reduce surface finish and greatly reduce tool wear during ultra-precision machining of brittle materials.

Abstract: A rear face 1b of an object to be processed 1A and a front face 10a of an object to be processed for separation 10A are bonded to each other by anode bonding, whereby a fracture 17 generated in a thickness direction of the object for separation 10A from a molten processed region 13 acting as a start point reaches a front face 1a of the object 1A continuously without substantially changing its direction. Then, after cutting the objects 1A, 10A, the object 10A is removed from the object 1A, so as to yield chips 19.

Abstract: A method of laser scribing a CdTe solar cell structure includes providing a laser operable to produce an optical pulse. The optical pulse is characterized by a temporal profile having a first power level during a first portion of the optical pulse and a second power level less than the first power level during a second portion of the optical pulse. The method also includes directing the optical pulse to impinge on the CdTe solar cell structure. The CdTe solar cell structure includes a substrate, a transmission spectrum control layer adjacent the substrate; a barrier layer adjacent the transmission spectrum control layer, and a conductive layer adjacent the barrier layer. The method further includes initiating a removal process for the conductive layer and terminating the removal process prior to removing the barrier layer.

Abstract: An apparatus for etching multiple surfaces of a hydroformed powder coated luminaire reflector is described. The system includes a laser, one or more high speed scan heads, a laser marking station and a conveyance device. The system positions a reflector into optical alignment with the scan heads to allow permanent etching of the surface thereof.

Abstract: Coating removal systems for optical fibers are disclosed. Related methods and optical fibers processed with these methods and coating removal systems are also disclosed. An optical fiber includes a glass fiber, having a cladding and core, surrounded by a protective coating which does not contribute to the optical performance of the optical fiber. By removing the coating at an end portion of the optical fiber, the end portion may be precisely positioned and secured to enable reliable optical communications. A laser beam may be directed at the protective coating to remove the protective coating by one or more ablating, melting, vaporizing, and/or thermal decomposing processes. The optical fiber may also be optionally cleaved. In this manner, the coating may be efficiently removed while retaining at least fifty percent of the tensile strength of the optical fiber.

Abstract: A machine for the surface treatment of a cylinder includes a first operative station for supporting the cylinder and for bringing it into rotation around its longitudinal axis, and at least a second operative station cooperating with the first station for generating and emitting, by means of an optical fiber apparatus, pulsed laser radiations randomly striking the surface of the cylinder and defining a desired roughness on the same surface; the second station being adjustably coupled with the first station in a first direction parallel with respect to the axis of the cylinder and carrying one or more pulsed laser radiation emitting heads, and slidingly assembled with respect to the cylinder in a second direction perpendicular to the axis of the cylinder.

Abstract: An apparatus for laser scribing two transparent electrically conductive layers (72A,B; 73A,B) deposited on opposite surfaces of a transparent substrate (71A; 71B) comprising; a laser beam (74A), one or more lenses (75A, 76A, 77A) configured and positioned for adjusting the focal spot (78A; 78B) of the laser beam between a first position (78A) and a second position (78B), means for holding a substrate in a plane between the first and second position and means for moving the relative positions of the substrate (71A; 71B) and laser beam (74A) in two dimensions within the plane or a plane parallel to it, wherein in use, the first and second positions (78A; 78B) coincide with or are adjacent to exposed surfaces of the two transparent electrically conducting layers (72A,B; 73A,B).

Abstract: Container (10, 10?) for the laboratory area, having: a body (1) with a layer (2) that is opaque to an optical reader, is applied to the body and has clearances (21) in the form of machine-readable data, the body (1) having at least one local material modification (3), and the material modification (3) together with the opaque layer (2) forming a reading area (6), in which the machine-readable data can be read from the outside by an optical reader on the basis of the optical contrast between the material modification (3) and the opaque layer (2).

Abstract: A modified region 7 to become a starting point region for cutting is formed in a GaAs substrate 12 along a line to cut 5 upon radiation with laser light L which is pulsed laser light. As a consequence, the modified region 7 formed in the GaAs substrate 12 along the line to cut 5 is likely to generate fractures in the thickness direction of an object to be processed 1. Therefore, the modified region 7 having an extremely high function as a starting point region for cutting can be formed in the planar object to be processed 1 comprising the GaAs substrate 12.