Abstract: An processing apparatus comprises a laser oscillator, an overall control device which controls an operation of the laser oscillator, and a plurality of processing units. The processing unit comprises a holding part which movably holds a processed object, an optical system which guides the laser beam, oscillated from the laser oscillator, toward the processed object, a shutter which selectively prevents the laser beam from reaching the processed object, and an individual control device which controls an operation of the holding part, and transmits a laser request signal to the overall control device. When at least one of the plurality of individual control devices transmits the request signal, the overall control device controls the shutter of the processing unit, which has transmitted the laser request signal, to enable the laser beam to reach the processed object, and drives the laser oscillator to allow the laser oscillator to oscillate the laser beam.

Abstract: Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the region with a first beam of photons to induce generation of free electrons in the region; and machining the region with a second beam of photons having the predefined wavelength. Other embodiments are described and claimed.

Abstract: The present invention generally relates to a method of laser-marking. The method can include exposing a precursor to a laser creating a mark. The precursor can include a polymer or plastic loaded with a laser-marking additive in an amount of or greater than about 1 wt. %. The additive can include: at least one compound of the formula: MOCl where M is, independently, As, Sb, or Bi; or a compound of the formula BiONO3, Bi2O2CO3, BiOOH, BiOF, BiOBr, Bi2O3, BiOC3H5O7, Bi(C7H5O2)3, BiPO4, Bi2(SO4)3, Pb(OH)2.2PbCO3, or Pb(OH)2.PbCO3.

Abstract: In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device 1 which focuses a laser beam on the inside of a transparent medium 60, aberration of a laser beam is corrected so that a focal point of the laser beam is positioned within a range of aberration occurring inside the medium. This aberration range is not less than n×d and not more than n×d+?s from an incidence plane of the medium 60, provided that the refractive index of the medium 60 is defined as n, a depth from an incidence plane of the medium 60 to the focus of the lens 50 is defined as d, and aberration caused by the medium 60 is defined as ?s.

Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.

Abstract: A laser-based method of removing a coating from a surface comprises directing a laser pulse to a first position on the surface, removing the coating from the first position by rapidly elevating a surface temperature of the first position using the laser pulse and thereby disassociating the coating from the surface and collecting the disassociated coating. In some embodiments, the coating comprises an environmentally harmful substance such as Hexavalent Chromium. In some embodiments, the coating comprises Diamond-Like Carbon (DLC), Vitrified Contaminant Material (CMAS). The disassociated coating is collected by a waste collector.

Abstract: A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.

Abstract: A method of scribing a substrate along a scribeline includes causing a laser beam to impinge on the major surface, the point of impingement of the beam constituting a light spot, the substrate being positioned with respect to the laser beam such that the light spot is disposed proximal to the scribeline. The substrate and laser beam are moved relative to one another, such that the light spot is caused to translate substantially along the scribeline, whereby localized energy is transferred from the laser beam to the substrate along the course of the scribeline. The positioning of the light spot with respect to the scribeline is monitored by imaging a flash of light produced during the relative motion. Image recognition software is used to analyze the image and determine momentary position information. The momentary position information is used to regulate a laser beam position setpoint.

Abstract: A laser machining method includes a trial machining step of placing a machined material serving as a target of laser machining on a machining table and performing trial machining of the machined material before performing actual machining for cutting out a product from the machined material, wherein the trial machining step includes a cutting-out step of cutting out a trial-machining cut piece having a preset shape from a trial machining area that is set in the machined material by laser machining, a detecting step of detecting whether the trial-machining cut piece remains in the machined material by using the machined material having undergone the cutting-out step as a target to confirm whether the trial-machining cut piece is present, and a determining step of determining whether shifting to the actual machining is permitted according to a detection result at the detecting step.

Abstract: In the field of photolithography systems designed to produce electronic components using the technique known as “lift-off” on a plane substrate comprising one or more plane photosensitive layers, a system uses a laser direct-write technique. It comprises optical or mechanical means configured such that the useful part of the optical beam is inclined on the plane of the photosensitive layers in order to create profiles with an inverted slope within said layers, the useful part of the optical beam being the part of the optical beam which effectively contributes to creating said profiles. In one preferred embodiment, the system comprises means for partial shuttering of the optical beam situated in the neighborhood of the focusing optics.

Abstract: A coated abrasive article (1) comprises a backing (3) having an abrasive coating (5) on one side, an attachment layer (7) on the other side of the backing, and a line of weakness (9) that does not penetrate the front face of the abrasive coating (5). The line of weakness, which may be formed using a laser beam, comprises a through-cut (11) in the attachment layer (7) and perforations (13) in the backing (3), and permits one part of the abrasive article (1) to be separated from another part. Alternatively, the abrasive article can be used in its original form.

Abstract: To create a metal section (P3) of complex shape, a three-dimensional drawing is made of the final size, then plane drawings are developed and made of each of the elements that form a distinct part of the section. These elements are then cut out (A3, B3) in at least one metal plate. Cutting operations are preferably executed flat in the flat plate. If necessary, at least one of the elements (A3, B3) is then formed. Lastly, the elements (A3, B3) are assembled together by welding for example, to form the section (P3).

Abstract: A method for the production of a contact structure of a semiconductor component comprises the masking of at least one side of a semiconductor substrate with a coating and the partial removal thereof in at least one pre-determined region.

Abstract: A method for producing rough surface structures comprising the following step: running a laser beam along filling lines (1) over an area to be processed, wherein the filling line (1) is broken down into particular laser dots (2) with a distance a, and wherein the laser dots (2) are moved in a X direction and in a Y direction in a plane with a random factor b relative to the filling line (1) so that they form a cloud of dots.

Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

Abstract: A method of micro-machining comprises the steps of selectively applying a light energy coupling substance to a substrate, the light energy coupling substance absorbing a selected level of laser light energy at a selected wavelength, directing a laser light beam at the selected wavelength against the substrate in areas to which the light energy coupling substance has been applied, and manipulating one of the laser light beam and the substrate to micro-machine selected features into the substrate with the laser light beam.

Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.

Abstract: A system for automatically inspecting and trimming a ceramic patch antenna includes an inspection apparatus electrically connected to a radio frequency component testing fixture. The inspection apparatus is inputted standard parameters of electrical characteristics of the ceramic patch antenna. The ceramic patch antenna is arranged on the radio frequency component testing fixture. Then, the inspection apparatus is configured to measure electrical characteristics of the ceramic patch antenna and to judge whether the electrical characteristics of the ceramic patch antenna are the same as the standard parameters or not. The inspection apparatus is configured to drive a trimming machine for trimming a radiation metal surface of the ceramic patch antenna if the electrical characteristics of the ceramic patch antenna are different from the stand parameters.

Abstract: A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features on the suture thread while preserving strength of the suture thread. The laser-machining system enables creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology.

Abstract: A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.

Abstract: The present invention provides a method of and apparatus for marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) having a light-scattering surface (9) and the material of the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed on the workpiece (3) in such a way that the radiation passes through the workpiece (3) and its light-scattering surface (9) before impinging on the polymer matrix (7), characterized in that the light-scattering surface (9) of the workpiece (3) is wetted with a liquid or viscoelastic medium (11).

Abstract: A cutting insert includes a first surface, a second surface and a peripheral surface extending therebetween, and an insert hole extending between the first and second surfaces and having a hole axis. A cross section of at least a portion of the insert hole taken perpendicular to the hole axis has an oval shape. The cutting insert also includes a mark provided on at least one of the first and second surfaces, indicating the orientation of the cross sectional oval shape of the at least a portion of the insert hole.

Abstract: A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material.

Abstract: Systems and methods for preparing solid samples for analysis, such as microscopic examination in cross section or planimetric orientation. The sample preparation systems may include a sample support configured to secure a solid sample, an excitation beam source that generates an excitation beam configured to remove material from a surface of the sample, a beam shield configured to at least partially protect the sample from the excitation beam, and a beam shield holder configured to secure the beam shield, where the adjustment of the relative positions of the beam shield and sample holder permits the excitation beam to selectively expose a series of substantially planar surfaces of the sample.

Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

Abstract: A direct-write apparatus and end use device for selective separation of at least one layer of material from another layer of material at the interface between them using a beam of electromagnetic radiation from an ultrashort pulse source is disclosed.

Abstract: A method of selectively eliminating electrical shorts and other electrical defects from specific layers of a multilayer electronic device without damaging underlying layers. The method is based on a combination of an automated detection of the defects and selective laser ablation patterning (SLAP).

Abstract: Apparatus for interference patterning of a planar sample including a laser and a focusing arrangement positioned in a beam path of the laser so that the laser beam is imaged in a first spatial direction in a focused manner into a sample volume in which the planar sample is positioned. An expanding and splitting arrangement is positioned downstream of the focusing arrangement for the laser beam, whilst maintaining the focused imaging in a first spatial direction which can be expanded in a second spatial direction, and which can be split into two partial beams. These two partial beams can be directed onto the sample volume.

Abstract: A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

Abstract: A scribing apparatus having a function to analyze distribution of a material forming a semiconductor or solar cell in real-time in a process producing the semiconductor or solar cell of is disclosed. The scribing apparatus having the analysis function of material distribution comprises: a laser irradiation unit, which conducts scribing by irradiating laser to a position to be scribed of an analysis subject; a spectrum detection optical unit, which detects a spectrum generated from plasma, which is produced by the irradiated laser; a spectrum information storage, which stores spectrum state information of each material forming the analysis subject; and a spectrum analysis unit, which analyzes distribution state information of the material by comparing the spectrum state information and the detected spectrum.

Abstract: An apparatus and method for processing a plurality of semiconductor parts in a laser-based system adjusts a default recipe to account for work to be performed on at least one part of the plurality of parts. The work to be performed on a part is analyzed using the default recipe and a part-specific recipe including a modified parameter of the default recipe. The default or part-specific recipe is selected based on a desired processing result, and the selected recipe replaces the default recipe to perform the work using the laser-based system.

Abstract: A staggered laser-etch line graphic system, method, and articles of manufacture are provided. One described method includes the steps of laser engraving a first plurality of lines associated with a first component section of a graphic on a surface of an article; laser engraving a second plurality of lines associated with a second component section of the graphic on the surface of the article; and controlling said laser engraving of the first plurality of lines and said laser engraving of second plurality of lines to reduce the visual impact of a demarcation line separating the first component section of the graphic and the second component section of the graphic.

Abstract: Methods are generally provided of reducing speckle of a laser beam from a laser source guided through an optical waveguide. The method includes vibrating an optical waveguide at a first point along the optical waveguide at a first frequency (e.g., having a range of about 20 kHz to about 20 GHz) for a certain distance (e.g., a distance of about 0.1 mm to about 5 cm), and directing the laser beam out of the optical waveguide from the laser source to a target. Such methods are particularly useful for scribing a thin film layer on a photovoltaic module (e.g., a cadmium telluride-based thin film photovoltaic device). Fiber optic laser systems are also generally provided for reducing speckle of a laser beam from a laser source guided through an optical waveguide.

Abstract: The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.

Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

Abstract: Laser machining systems and methods may use one or more moving laser scanning stages with force cancellation. The force cancellation is provided by moving masses linearly with equal and opposition motion. One or more of the masses may be a laser scanning stage. The laser machining systems may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.

Abstract: A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.

Abstract: This invention pertains to machinery and methods for cutting a workpiece utilizing a cutting tool into at least two parts having prescribed shapes from a metal plate comprising the steps of: identifying each of the parts by one or more contour lines; cutting a workpiece along one of the identifying contour lines into one of the parts; creating at least one path diversion, wherein the diversion has an associated bounded region or opportunity; cutting the workpiece along a contour line associated with the opportunity; resuming the cutting of the part along the identifying contour line with minimal damage to the part being cut; finishing the cutting of the part and then moving the cutting tool to the opportunity and then to an associated adjacent identifying contour line and then repeating the process until all parts have been manufactured.

Abstract: A method of forming a vent in a glass substrate includes forming a defect in the glass substrate on a scribe line. A beam spot of a laser may be directed onto the defect and advanced along the scribe line. A cooling jet may be directed onto the defect such that the surface of the glass substrate is cooled from a maximum temperature. Thereafter, the cooling spot may be advanced along the scribe line with the beam spot to form the vent in the glass substrate.

Abstract: A high-throughput, low cost, patterning platform is provided that is an alternative to conventional photolithography and direct laser ablation patterning techniques. The processing methods are useful for making patterns of microsized and/or nanosized structures having accurately selected physical dimensions and spatial orientation that comprise active and passive components of a range of microelectronic devices. Processing provided by the methods is compatible with large area substrates, such as device substrates for semiconductor integrated circuits, displays, and microelectronic device arrays and systems, and is useful for fabrication applications requiring patterning of layered materials, such as patterning thin film layers in thin film electronic devices.

Abstract: In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: The disclosure relates to ceramic lithium ion electrolyte membranes and processes for forming them. The ceramic lithium electrolyte membrane may comprise at least one ablative edge. Exemplary processes for forming the ceramic lithium ion electrolyte membranes comprise fabricating a lithium ion electrolyte sheet and cutting at least one edge of the fabricated electrolyte sheet with an ablative laser.

Abstract: A ball striking device, such as a golf club, includes a head with a face having the ball striking surface located at a front of the head and a plurality of parallel face grooves extending laterally across at least a portion of the ball striking surface, a body connected to the face and extending rearward from the face, and an indicator on the ball striking surface of the face. The indicator is located in an area between the face grooves and proximate a lateral center of the ball striking surface, and includes at least one indent in the ball striking surface. The indent has a depth that is substantially less than a depth of any of the face grooves. Methods associated with such ball striking devices are also provided.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A method for determining a reference focal position of a focused laser beam passing through an opening in a nozzle body of a laser processing nozzle relative to a workpiece, in which the method includes: simultaneously cutting off a portion of the workpiece using the focused laser beam to form an edge on the workpiece and altering a distance between a focal point of the focused laser beam and the workpiece in a direction of an axis of the laser beam; determining coordinates of the edge formed on the workpiece; based on the determined coordinates, determining a section of the edge that protrudes the furthest from the workpiece; and establishing a reference focal position FL of the laser beam based on the determined coordinates corresponding to the section of the edge that protrudes the furthest from the workpiece.

Abstract: A relief printing plate manufacturing method includes: generating binary image data based on multivalued image data representing a printing image; generating, from the binary image data, target stereoscopic shape data; calculating, based on the target stereoscopic shape data, exposure amount data; providing a predetermined exposure amount to an outside image adjacent pixel in a range of predetermined pixels adjacent to an ON pixel; and applying laser light to an area of OFF pixels based on the exposure amount data to engrave a portion outside of an area, and applying laser light to the outside image adjacent pixel based on the predetermined exposure amount to form a relief having a projecting shape with a corner part of a flange part of a top face of the relief at least partially chamfered.

Abstract: A method for bonding a plastic member onto a metal housing is provided. A metal housing having an inner surface and an outer surface is prepared. A hollow-carved area is provided on the metal housing. The inner surface of the metal housing is subjected to physical process, thereby forming a bonding area. An adhesive layer is formed on the bonding area. A plastic mold member is formed on the adhesive layer by performing a first plastic injection molding. An optical plastic member is molded on the hollow-carved area by performing a second plastic injection molding.

Abstract: A method of forming a surface feature extending into a sample includes providing a laser operable to emit an output beam and modulating the output beam to form a pulse train having a plurality of pulses. The method also includes a) directing the pulse train along an optical path intersecting an exposed portion of the sample at a position i and b) focusing a first portion of the plurality of pulses to impinge on the sample at the position i. Each of the plurality of pulses is characterized by a spot size at the sample. The method further includes c) ablating at least a portion of the sample at the position i to form a portion of the surface feature and d) incrementing counter i. The method includes e) repeating steps a) through d) to form the surface feature. The sample is free of a rim surrounding the surface feature.