Methods Patents (Class 219/121.69)
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Publication number: 20140202742Abstract: Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.Type: ApplicationFiled: January 22, 2014Publication date: July 24, 2014Applicant: CAMBRIOS TECHNOLOGIES CORPORATIONInventors: David Jones, Paul Mansky, Michael A. Spaid
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Patent number: 8785813Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.Type: GrantFiled: March 15, 2012Date of Patent: July 22, 2014Assignee: IMRA America, Inc.Inventors: Lawrence Shah, Gyu Cheon Cho, Jingzhou Xu
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Patent number: 8785812Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.Type: GrantFiled: May 27, 2005Date of Patent: July 22, 2014Assignee: Tel Solar AGInventors: Richard Grundmüller, Johannes Meier, Arthur Büchel
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Patent number: 8779327Abstract: A laser scribe processing method of forming a crack that runs along a scribe direction of a processing target substance uses a light source that emits a laser beam, and an optical system for irradiation that leads the laser beam onto the processing target substance, the method including: an emission step of emitting a laser beam from the light source; a splitting step of splitting the laser beam into an ordinary light component and an extraordinary light component having different travel directions; a light converging step of converging the ordinary light component and the extraordinary light component to form multiple pairs of beam spots; and an irradiation step of intermittently irradiating with the laser beam having multiple pairs of beam spots in a scribe direction of the processing target substance. For splitting the ordinary light component and the extraordinary light component in the splitting step, a birefringent prism disposed in the optical system for irradiation may be used.Type: GrantFiled: June 10, 2010Date of Patent: July 15, 2014Assignee: Seishin Trading Co., Ltd.Inventor: Toshikazu Kajikawa
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Patent number: 8779326Abstract: A device for accurately positioning laser scribed lines in a thin top layer of material with respect to lines already scribed in lower layers for the purpose of making solar panels. An alignment detector system is attached to and displaced from an optics unit that generates laser beams by a distance such that the detector measures the position of scribed lines in the lower layers in the area of the panel that will be scribed at a subsequent time. A motion and control system moves the panel such that the detector follows the path of one or more of the lines scribed in one of the lower layers and measures the position of the lines. The system accepts data from the alignment detector and uses the data to correct the relative position of the optics unit.Type: GrantFiled: November 5, 2007Date of Patent: July 15, 2014Assignee: Tel Solar AGInventor: Philip Rumsby
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Patent number: 8772671Abstract: Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.Type: GrantFiled: May 20, 2011Date of Patent: July 8, 2014Assignee: Resonetics, LLCInventors: Sergey V. Broude, Chen-Hsiung Cheng, Pascal Miller, Glenn Ogura, David L. Wall
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Publication number: 20140182104Abstract: A method of repairing a substrate that may prevent a metal layer from being corroded. A substrate including a metal layer and an insulating layer on the metal layer is first provided. Then, a laser beam having a wavelength range having a high transmittance with respect to the insulating layer is irradiated to selectively remove a portion of the metal layer. Also, a first laser beam is irradiated to remove a portion of the metal layer and a portion of the insulating layer, and then a second laser beam is irradiated onto side surfaces of the exposed insulating layer to melt the insulating layer, thereby forming a corrosion preventing layer covering the metal layer.Type: ApplicationFiled: August 2, 2013Publication date: July 3, 2014Inventor: Sung Bae JU
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Patent number: 8766135Abstract: A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.Type: GrantFiled: July 6, 2012Date of Patent: July 1, 2014Assignee: Samsung Corning Precision Materials Co., Ltd.Inventors: Hyung-sang Roh, Ja-Yong Koo, Sung Cheal Kim, Won-Kyu Park, Chang-Ha Lee
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Patent number: 8766140Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.Type: GrantFiled: October 6, 2011Date of Patent: July 1, 2014Assignee: Lincoln Global, Inc.Inventor: Paul Edward Denney
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Publication number: 20140175067Abstract: A method and laser processing system (2) addresses a substrate (102) with three different sets of laser processing parameters to achieve different surface effects in the substrate (102). A first set of laser parameters is employed to form a recess (106) in the substrate. A second set of laser parameters is employed to polish a surface (108) of the recess (106). A third set of laser parameters is employed to modify a polished surface (108) of the recess (106) to have optical characteristics that satisfy conditions for a desirable visual appearance.Type: ApplicationFiled: December 19, 2013Publication date: June 26, 2014Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Robert Reichenbach, Jeffrey Howerton, Hisashi Matsumoto, Fang Shan, Michael Shane Noel
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Publication number: 20140176127Abstract: A method and apparatus are described for forming a pattern including one or more markings on a substrate. The method includes the step of forming each marking by locally heating the substrate, for example using a fibre laser. A step is also performed of monitoring the temperature of the substrate, e.g. using a temperature sensor, whilst each marking is being formed. The method may be used to form a magnetic encoder scale on a stainless steel substrate having a high content of martensitic material. The local heating causes the martensitic material to be transformed into austenitic material. An encoder scale made using the method is also described.Type: ApplicationFiled: May 25, 2012Publication date: June 26, 2014Applicants: RENISHAW PLC, RLS MERILNA TEHNIKA D.O.O.Inventors: Peter Kogej, Matija Jezersek, Janez Mozina, Ales Babnik
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Publication number: 20140175070Abstract: A laser processing method including the steps of covering the back side of a workpiece with fine particles having absorptivity to the wavelength of a laser beam to be applied to the workpiece, thereby forming a fine particle layer on the back side of the workpiece, and next applying the laser beam through the fine particle layer to the back side of the workpiece to thereby perform ablation to the workpiece. The laser beam applied to the workpiece is absorbed by the fine particle layer to thereby suppress the scattering of the energy of the laser beam and the reflection of the laser beam, so that the ablation to the workpiece can be efficiently performed.Type: ApplicationFiled: December 11, 2013Publication date: June 26, 2014Applicant: Disco CorporationInventors: Yukinobu Ohura, Daigo Shitabo, Nobuyasu Kitahara, Seiji Harada
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Patent number: 8759713Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process bonds multiple interconnect wires to bond pads with electrical linkages between the bond pads and then subsequently separates the adjacent bond pads.Type: GrantFiled: June 14, 2009Date of Patent: June 24, 2014Assignee: Terepac CorporationInventor: Jayna Sheats
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Publication number: 20140151347Abstract: Sheet metal pieces intended to be welded can be made with weld notches located along one or more edges. A weld notch is characterized by the absence of certain material constituents so that they do not unacceptably contaminate nearby welds. The weld notch can be created by first forming an ablation trench along the sheet metal piece, then separating the sheet metal piece along the formed ablation trench into two separate pieces, at least one of which includes a newly formed and weldable edge.Type: ApplicationFiled: December 2, 2013Publication date: June 5, 2014Inventors: James J. Evangelista, Michael Telenko, JR., Jason E. Harfoot, Jack A. Atkinson, James W. Walther, Anthony M. Parente
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Publication number: 20140144894Abstract: A method and a device for engraving a flexible strip, the device including a drive device for moving a flexible strip in a longitudinal direction of the flexible strip; a support device for supporting the strip in a circumferential direction of a cylinder on a surface segment of the cylinder acting as a support surface; a processing head oriented towards the support surface for engraving the strip with at least one tool oriented towards the support surface; and a drive device for moving the processing head, wherein the processing head is pivotable through the drive device about a longitudinal axis of the cylinder. In order to engrave a closed loop with a single processing head it is proposed that the processing head is pivotable through a drive device about a longitudinal axis of the cylinder.Type: ApplicationFiled: April 18, 2013Publication date: May 29, 2014Applicant: 4JET Technologies GmbHInventor: Stefan Bergfeld
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Publication number: 20140147346Abstract: A patterned circuit, including a hydrophilic substrate, a hydrophobic layer formed on the hydrophilic substrate, and a pattern formed in the hydrophobic layer to expose the hydrophilic substrate.Type: ApplicationFiled: August 22, 2011Publication date: May 29, 2014Inventors: Girish Chitnis, Babak Ziaie, Zhenwen Ding
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Patent number: 8735772Abstract: Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.Type: GrantFiled: February 20, 2011Date of Patent: May 27, 2014Assignee: Electro Scientific Industries, Inc.Inventors: Juan Chacin, Irving Chyr, Jonathan Halderman
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Patent number: 8735771Abstract: A laser processing method which can reduce the chipping generated when a plate-like object to be processed formed with a modified region is turned into small pieces in steps other than its dividing step. In a part extending along a line to cut in an object to be processed, laser light is oscillated in a pulsing fashion in an intermediate portion including an effective part, and is continuously oscillated in one end portion and the other end portion on both sides of the intermediate portion. Since the laser light intensity becomes lower in continuous oscillation than in pulse oscillation, modified regions can be formed in the intermediate portion but not in one end portion and the other end portion. This keeps the modified regions from reaching the outer face of the substrate, thus making it possible to prevent particles from occurring when forming the modified regions.Type: GrantFiled: March 20, 2006Date of Patent: May 27, 2014Assignee: Hamamatsu Photonicks K.K.Inventors: Koji Kuno, Tatsuya Suzuki
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Patent number: 8729426Abstract: The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern.Type: GrantFiled: May 27, 2009Date of Patent: May 20, 2014Assignee: M-Solv Ltd.Inventor: Philip Thomas Rumsby
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Patent number: 8728849Abstract: A method of laser cutting through dissimilar materials separated by a metal foil. A material stack includes a semiconductor layer or film, with a metal foil layer attached to the back surface. The metal foil layer is attached to an insulative support material layer. A laser parameter is selected and optimized for the material stack. A laser beam creates a kerf in the material stack down to the metal foil layer. The laser beam removes metal through the kerf primarily by gasification rather than melting. Kerf formation continues after optimization of the laser parameter for removal of material from the remaining layers. A debris field resulting from the laser cutting of the metal layer is reduced and/or a portion of the debris is removed in an assisted manner as the beam cuts. The materials are diced by cutting the kerf through all materials.Type: GrantFiled: August 31, 2011Date of Patent: May 20, 2014Assignee: Alta Devices, Inc.Inventors: Laila Mattos, Daniel G. Patterson
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Patent number: 8723077Abstract: A method of marking an object for identification purposes uses a local heating source, preferably a solid-state or fiber laser, to form a multi-symbol encoded encrypted monochrome or polychrome message with identification parameters of the object by impacting its surface. The message is created by modifying optical properties and structural configuration of the surface to create contrast microscopic imprints comprising cluster nanostructures of elements of the material of the surface. Encoding the message is based on a primary code array of correspondence of each of the message symbols to a multibit combination of 0 and 1 respectively representing absence and presence of the heating source impact imprint. Encrypting is effected by creating particular code arrays based on the primary one by means of random perturbation of its components. The invention makes it practically impossible to counterfeit the objects, replace them, or make a subject of others illegal actions.Type: GrantFiled: June 27, 2011Date of Patent: May 13, 2014Inventors: Evgeniy Ivanovich Pryakhin, Ekaterina Vladimirovna Larionova, Mikhail Grigor'evich Afon'kin
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PORTABLE ELECTRONIC DEVICE BODY HAVING LASER PERFORATION APERTURES AND ASSOCIATED FABRICATION METHOD
Publication number: 20140126172Abstract: A method of fabricating the body of the portable electronic device as well as the resulting portable electronic device and its body are provided to facilitate the transmission of radio frequency signals through the body of the portable electronic device. In the context of a method, at least one aperture and, in some instances, a plurality of apertures are defined by laser perforation through a conductive portion of the body of the portable electronic device. The method may also anodize the conductive portion including at least partially filling the at least one aperture with an anodization layer. As such, the conductive portion of the body of the portable electronic device has a relatively consistent, metallic appearance, even though laser perforation apertures are defined therein for supporting the transmission of radio frequency signals.Type: ApplicationFiled: November 2, 2012Publication date: May 8, 2014Inventors: Anton Fahlgren, Harri Lasarov, Sung-Hoon Oh, Axel E. Meyer, Ville Henrikki Vehkapera, Janne H. Rautio, Mika Nenonen, Nicolas Lylyk -
Patent number: 8716128Abstract: A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.Type: GrantFiled: April 14, 2011Date of Patent: May 6, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chyi Shyuan Chern, Hsin-Hsien Wu, Chun-Lin Chang, Hsing-Kuo Hsia, Hung-Yi Kuo
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Publication number: 20140115886Abstract: A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine.Type: ApplicationFiled: October 26, 2012Publication date: May 1, 2014Applicants: VOLEX PLC, APPLIED MICRO CIRCUITS CORPORATIONInventor: Benoit SEVIGNY
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Publication number: 20140110384Abstract: The invention is a method and an apparatus for marking an article and the article thus marked. It includes providing the article. Generating a plurality of groups of laser pulses. At least one of the plurality of groups is generated by modulating a beam of laser pulses to form a plurality of beamlets. Each, of the plurality of beamlets, include at least one laser pulse. It also includes directing the plurality of groups of laser pulses onto the article such that laser pulses within the at least one of the plurality of groups impinge upon the article at spot areas that do not overlap one another, wherein laser pulses within the plurality of groups are configured to produce a visible mark on the article.Type: ApplicationFiled: October 21, 2013Publication date: April 24, 2014Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Jan Kleinert, Robert Reichenbach, Mark Unrath, Hisashi Matsumoto, Jefferey Howerton, Mehmet E. Alpay, Andy MOORE
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Patent number: 8704126Abstract: A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator.Type: GrantFiled: October 9, 2008Date of Patent: April 22, 2014Assignee: Disco CorporationInventor: Masaru Nakamura
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Patent number: 8704128Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.Type: GrantFiled: October 24, 2013Date of Patent: April 22, 2014Assignee: Siemens AktiengesellschaftInventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
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Patent number: 8705245Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.Type: GrantFiled: January 28, 2011Date of Patent: April 22, 2014Assignee: EPCOS AGInventors: Gerald Kloiber, Heinz Strallhofer, Norbert Freiberger
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Publication number: 20140103022Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.Type: ApplicationFiled: October 28, 2013Publication date: April 17, 2014Applicant: Saxum LLCInventor: Teo Chong Teck
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Patent number: 8692153Abstract: Provided is a method for manufacturing a photoelectric-conversion-device capable of controlling the groove depth of a processed groove to a desired value. The method for manufacturing a photoelectric conversion device (10) includes a groove forming step of irradiating an intermediate-contact-layer separating groove (15) constituting a photoelectric conversion device (10) with a picosecond laser and of moving the picosecond laser relative to the intermediate-contact-layer separating groove (93), thereby forming a processed groove (15) in a predetermined scanning direction. In the groove forming step, interference fringes arranged in parallel in one direction are formed in an irradiated area corresponding to a beam diameter of the picosecond laser, and the picosecond laser is relatively moved such that the interference fringes are joined in the scanning direction.Type: GrantFiled: August 25, 2009Date of Patent: April 8, 2014Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Kohei Kawazoe, Kazutaka Uda, Tomoyoshi Baba, Takashi Ishide, Sachiko Nakao
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Patent number: 8692154Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.Type: GrantFiled: September 30, 2010Date of Patent: April 8, 2014Assignee: Fujitsu LimitedInventors: Hiroaki Tamura, Fumihiko Tokura, Michinao Nomura
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Publication number: 20140091069Abstract: Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.Type: ApplicationFiled: December 5, 2013Publication date: April 3, 2014Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Jeffrey A. Albelo, Peter Pirogovsky
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Patent number: 8685185Abstract: Embodiments of the present invention are generally directed to materials processing methods using femtosecond duration laser pulses, and to the altered materials obtained by such methods. The resulting nanostructured (with or without macro- and micro-structuring) materials have a variety of applications, including, for example, aesthetic applications for jewelry or ornamentation; biomedical applications related to biocompatibility; catalysis applications; and modification of, for example, the optical and hydrophilic properties of materials including selective coloring.Type: GrantFiled: October 5, 2011Date of Patent: April 1, 2014Assignee: University of RochesterInventors: Chunlei Guo, Anatoliy Y. Vorobyev
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Publication number: 20140082939Abstract: A method for cleaning a turboshaft engine blade comprising a superalloy body covered with a coating, in which the coating of the blade is at least partially machined using a pulsed laser. At least the feed rate of the pulsed laser and the pulse frequency of the pulsed laser are parameterised such that the machined surface of the blade has a roughness of 4 ?m to 10 ?m.Type: ApplicationFiled: May 2, 2012Publication date: March 27, 2014Applicant: SNECMAInventors: Juliette Hugot, Franck Bourdin, Thierry Fevrier, Jerome Gestin
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Publication number: 20140083983Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.Type: ApplicationFiled: September 20, 2013Publication date: March 27, 2014Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Haibin Zhang, Fang SHAN, Mathew Rekow, Min Zhang, Glenn Simenson, Qian XU, James Brookhyser, Joe Frankel, Michael Darwin, Jack Rundel, Matthew Pysher
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Publication number: 20140083986Abstract: The invention is method, and an apparatus for performing the method having the steps of providing a workpiece, generating a plurality of free electrons at a region of the exterior surface, and machining a portion of the workpiece adjoining the first region by directing laser energy onto the workpiece.Type: ApplicationFiled: September 20, 2013Publication date: March 27, 2014Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Haibin Zhang, Glenn Simenson
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Patent number: 8680429Abstract: Techniques are described for laser-scribing a feature on a surface in relation to a reference feature on that surface, such as a feature created by a previous placement of the laser beam. In particular, using a laser beam focusing and deflection system to direct a laser scribing spot onto a surface through an optical path, an optical detection system provides reliable detection of the position of an existing feature on the surface as viewed through the optical path of the deflection system. Based on feedback provided from the detection system to the deflection system, the position of the laser beam may be modified through the deflection system in relation to the viewed feature to scribe a subsequent feature on the surface which tracks the existing feature in real time. A method of scribing to accomplish the objectives is also disclosed.Type: GrantFiled: November 9, 2010Date of Patent: March 25, 2014Assignee: Instrument Associates LLCInventors: Brian Patrick Stokes, Robert T. Milkowski, Jr., Carl Brian Candiloro
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Patent number: 8674258Abstract: A method of making metrological scale for scale reading apparatus includes directing a laser beam onto a scale substrate (12). The laser parameters are such that the local area of the scale substrate (12) on which the laser beam is incident is caused to be displaced, thus creating scale markings (16, 20, 22).Type: GrantFiled: May 10, 2006Date of Patent: March 18, 2014Assignee: Renishaw PLCInventors: Alexander David Scott Ellin, James Reynolds Henshaw
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Patent number: 8674260Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.Type: GrantFiled: July 21, 2011Date of Patent: March 18, 2014Assignee: Donadon Safety Discs and Devices S.R.L.Inventors: Mario Modena, Antonio Ruggero Sante Donadon
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Patent number: 8669488Abstract: Temporal focusing of spatially chirped femtosecond laser pulses overcomes previous limitations for ablating high aspect ratio features with low numerical aperture (NA) beams. Simultaneous spatial and temporal focusing reduces nonlinear interactions, such as self-focusing, prior to the focal plane so that deep (˜1 mm) features with parallel sidewalls are ablated at high material removal rates.Type: GrantFiled: March 30, 2011Date of Patent: March 11, 2014Assignee: Colorado School of MinesInventors: Jeffrey Squier, Dawn Vitek, Charles Durfee, Daniel Adams, David Kleinfeld
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Publication number: 20140065359Abstract: Methods of forming a pattern on a substrate are provided. The methods include providing a substrate and radiating a laser beam through a transmitting phase mask on the substrate. The transmitting phase mask includes a pattern and radiating the laser beam through the transmitting phase mask forms the pattern on a first surface of the substrate.Type: ApplicationFiled: August 30, 2012Publication date: March 6, 2014Applicant: Jawaharial Nehru Centre for Advanced Scientific ResearcInventors: Giridhar UDAPI ROA KULKARNI, Narendra KURRA, Abhay Abhimanyu SAGADE
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Publication number: 20140065356Abstract: A method of scoring a multi-layer film structure, wherein the multi-layer film structure comprises a metal layer and polymer layer bonded to each other, the method comprises using a single laser beam incident to the polymer layer to produce a score line in the polymer layer, wherein the laser energy is absorbed only by the metal layer.Type: ApplicationFiled: December 19, 2012Publication date: March 6, 2014Applicant: Preco, Inc.Inventors: Christopher Chow, James J. Bucklew, Daniel B. Miller, Feng Wu
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Patent number: 8663754Abstract: A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.Type: GrantFiled: March 9, 2009Date of Patent: March 4, 2014Assignee: IMRA America, Inc.Inventors: Bing Liu, Zhendong Hu, Makoto Murakami, Jingzhou Xu, Yong Che
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Patent number: 8658937Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.Type: GrantFiled: January 7, 2011Date of Patent: February 25, 2014Assignee: UVTech Systems, Inc.Inventors: Kenneth J. Harte, Ronald P. Millman, Jr., Victoria M. Chaplick, David J. Elliott, Eugene O. Degenkolb, Murray L. Tardif
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Publication number: 20140048066Abstract: Nebulizer ampoules are labelled by laser-marking or laser-engraving data on a film to produce a data film and affixing the film onto a nebulizer ampoule using a non-migratory adhesive.Type: ApplicationFiled: August 14, 2013Publication date: February 20, 2014Applicant: Holitas LimitedInventors: Mark Gibson, Peter Ernest Tasko
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Publication number: 20140048520Abstract: A system, method, and device for etching an indicia onto a substrate includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the substrate. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the substrate.Type: ApplicationFiled: October 29, 2013Publication date: February 20, 2014Inventors: Timothy J. Miller, Thomas A. DeRossett, JR.
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Publication number: 20140047703Abstract: The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.Type: ApplicationFiled: October 28, 2013Publication date: February 20, 2014Applicant: Avery Dennison CorporationInventors: Ian James FORSTER, Christian K. OELSNER, Robert REVELS, Benjamin KINGSTON, Peter COCKERELL, Norman HOWARD, Moris AMON
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Patent number: 8648278Abstract: The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.Type: GrantFiled: April 8, 2011Date of Patent: February 11, 2014Assignee: Asahi Glass Company, LimitedInventor: Guangyao Niu
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Patent number: 8648277Abstract: Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.Type: GrantFiled: March 31, 2011Date of Patent: February 11, 2014Assignee: Electro Scientific Industries, Inc.Inventors: Mehmet E. Alpay, Hisashi Matsumoto, Mark A. Unrath, Guangyu Li
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Patent number: RE44945Abstract: A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.Type: GrantFiled: November 1, 2012Date of Patent: June 17, 2014Assignee: Canon Kabushiki KaishaInventors: Toshiyasu Sakai, Shuji Koyama, Kenji Ono, Jun Yamamuro