Abstract: A screw cap and a method of manufacturing a screw cap for closing a preserving jar is provided. The screw cap has a weakening line, which can be broken by means of finger force applied thereto, by removing material from the cap at the intended location of the weakening line so as to obtain a slot.

Abstract: Thermal removal of optical fiber coatings by insertion through heated ferrules to form ferrule assemblies for fiber optic connectors, and related assemblies are disclosed. An optical fiber includes a glass fiber, having a cladding and core, surrounded by a protective coating. By removing the coating at an end portion of the optical fiber, the end portion may be precisely positioned and secured within a ferrule to enable reliable optical communications. The coating may be thermally removed, or substantially thermally removed, by inserting the optical fiber through a rear opening of the ferrule which has been heated above a temperature sufficient to change the coating to a non-solid state. In this manner, the coating may be efficiently removed from the end portion of the optical fiber while being inserted into the ferrule bore of the ferrule to enable efficient forming of a ferrule assembly for a fiber optic connector.

Abstract: The present invention provides a method for producing a blank printing sleeve for laser engraving, comprising: (1) a step of laminating a photosensitive resin composition layer (a) on a hollow cylindrical support (b); (2) a step of photo-curing the laminated photosensitive resin composition layer (a) to form a cured photosensitive resin layer (c); and (3) a step of cutting the hollow cylindrical support (b) and the cured photosensitive resin layer (c) approximately in a circumferential direction of the hollow cylindrical support (b) by a laser cutting method and/or a water beam cutting method.

Abstract: An arrangement and method that compensates for variation in grating strength associated with forming multiple gratings in multicore fiber is proposed where the writing efficiency of the beam(s) used to form the gratings is controlled to compensate for fiber lensing effects. In one case, a spacing between the multicore optical fiber and the beam source is controlled such that the writing efficiency (which decreases as a function of the space between the source and the fiber) compensates (at least in part) for the increased beam intensity attributed to the lensing effect of the fiber itself. The width of beam itself may also be controlled to modify the writing efficiency.

Abstract: The present invention relates to an object comprising a region of its surface suitable for showing a plurality of images. Each of these images is observable from a different direction such that upon observing one of the images the other images stop being observable and do not interfere in the viewing of the observed image. The configuration which allows generating the region of surfaces suitable for showing the plurality of images allows for mass production by means of stamping or minting techniques and complicates the reproduction by unauthorized manufacturers. A method which allows obtaining the object having a region suitable for showing a plurality of images is also an object of the present invention.

Abstract: Disclosed herein are a tube continuum robot and a method for manufacturing a tube. More particularly, disclosed are a tube continuum robot and a method for manufacturing a tube, which is used in the tube continuum robot having a plurality of overlapping tubes and has anisotropic patterns for controlling the bending rigidity and torsional rigidity of the tube. In an embodiment, a tube continuum robot has a plurality of overlapping tubes, one or more of the plurality of overlapping tubes having a curved shape, wherein a plurality of anisotropic patterns are formed on the outer circumferential surface of the one or more tubes along the lengthwise or circumferential direction of the tubes.

Abstract: The present disclosure relates to methods of preparing a material for welding. The material is prepared by utilizing a laser to obliterate contaminants from the material surface.

Abstract: A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: The wafer stack (100) comprises a first wafer (OW1) referred to as optics wafer and a second wafer (SW) referred to as spacer wafer, said optics wafer (OW1) having manufacturing irregularities. The spacer wafer (SW) is structured such that it at least partially compensates for said manufacturing irregularities. The corresponding method for manufacturing a device, which in particular can be an optical device, comprises carrying out a correction step for at least partially compensating for manufacturing irregularities. Such a correction step comprises providing a wafer (SW) referred to as spacer wafer, wherein that spacer wafer is structured for at least partially compensating for said manufacturing irregularities. Those manufacturing irregularities may comprise a deviation from a nominal value, e.g., a irregularities in focal length. The invention can allow to mass produce high-precision devices at a high yield.

Abstract: A charged particle beam and a laser beam are used together to micromachine a substrate. A first beam alters the state of a region of the work piece, and the second beam removes material whose state was altered. In one embodiment, an ion beam can create photon absorbing defects to lower the local ablation threshold, allowing the laser beam to remove material in a region defined by the ion beam. The combination of laser beam and charged particle beam allows the creation of features similar in size to the charged particle beam spot size, at milling rates greater than charged particle processing because of the increased energy provided by the laser beam.

Abstract: A method and apparatus to perform laser ablation in the vicinity of a charged particle beam while simultaneously protecting the light optical components of the apparatus utilized to perform the ablation from being coated with debris resulting from the ablation process. According to preferred embodiments of the present invention, a protective transparent screen is used to shield the laser optical components. A preferred screen could be replaced or repositioned without breaking vacuum in the sample chamber and would not be particularly susceptible to undesirable charging effects.

Abstract: A series of laser pulses in a pulse train, each pulse with a beneficial temporal power shape instead of the conventional laser temporal power shape, scribes a line in a thin film of material on a substrate. The beneficial temporal pulse shape has a spike/plateau chair shape or a square pulse shape. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is an overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with beneficial pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with the conventional pulse shape.

Abstract: A system, method, and device for etching an indicia onto a substrate includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the substrate. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the substrate.

Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Abstract: Laser etching antenna structures (AS) for RFID antenna modules (AM). Combining laser etching and chemical etching. Limiting the thickness of the contact pads (CP) to less than the skin depth (18 m) of the conductive material (copper) used for the contact pads (CP). Multiple antenna structures (AS1, AS2) in an antenna module (AM). Incorporating LEDs into the antenna module (AM) or smartcard (SC).

Abstract: A permanently-effective element for discharging any accumulation of static electrical charges from the housing of an electronic device includes a main body with an anodized layer formed on the main body. The main body defines a plurality of blind holes of varying shapes and sizes, topped with a layer of conductive paint held in place with a binding film. The incidence of oxidation of the discharging element is significantly reduced and the effectiveness of the discharging element thus improved. A method for manufacturing the housing is also provided.

Abstract: A laser match honing system and method are provided for processing one of a pair of mechanically matching components (1, 2) having matching portions (12, 22, 16, 26) that will be fitted with each other. A dimension of the matching portion (12, 16) of the first component (1) is measured and is then used for calculating the desired dimension of the corresponding matching portion (22, 26) of the second component (2). An actual dimension of the matching portion (22, 26) of the second component (2) is also measured. Then, the matching portion (22, 26) of the second component (2) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Abstract: Systems and processes for improved laser machining, such as micro machining, of a workpiece. Systems and processes involve directing at a first surface of the workpiece a laser beam and wherein at least the laser-irradiated region of the first surface of the workpiece is immersed in a liquid, and delivering to the liquid-immersed and laser-irradiated workpiece surface region at least a first ultrasound output from a first ultrasound device. The ultrasound output and the laser beam desirably impact the workpiece first surface substantially simultaneously.

Abstract: A display such as a liquid crystal display has a display substrate that includes a layer of liquid crystal material sandwiched between a color filter layer and a thin-film-transistor layer. An oversized polarizer is laminated to the surface of the display substrate. Laser-based polarizer trimming equipment is used to trim away excess portions of the polarizer from the display substrate. A thickness gauge gathers thickness information from the laminated polarizer and display substrate. The thickness information is used to adjust the position of a laser relative to the polarizer during polarizer trimming operations. The laser beam moves along a cutting path that is unique to the display substrate. A vision system performs an inspection to determine whether the display substrate is damaged following polarizer trimming operations. Based on the inspection, laser parameters may be adjusted prior to performing polarizer trimming operations on additional polarizers and display substrates.

Abstract: The angle of incidence (?) and azimuth (?) of a beam axis (32) can be moved relative to a workpiece (22) to provide desirable taper characteristics to a side wall (124) of a resulting kerf (120) produced by a focused laser beam (30) propagated along the beam axis (32).

Abstract: Method for fabricating a catheter including providing an inner tubular member formed from a first polymeric material, the inner tubular member having a distal section, a distal end, and a lumen defined therein by a first inner diameter; necking down at least a portion of the distal section of the inner tubular member to form a necked tip having a second inner diameter; and removing a portion of polymeric material from an inner surface along the necked tip to define a third inner diameter for the necked tip. The method can include positioning the distal section of the inner tubular member in a balloon having a working length, a distal neck, and a distal leg, with the distal end of the inner tubular member extending distally beyond a distal end of the distal leg, and coupling the distal leg of the balloon to at least a portion of the distal section of the inner tubular member.

Abstract: An apparatus and method for laser-assisted machining (LAM) of bone without raising the temperature of the surrounding bone is discussed. The method of LAM of bone involves determining a target bone needing to be machined an then scanning a high power density laser beam along the bone at a machining rate that produces low-heat affected zones (HAZ) on the target bone. The process and apparatus is advantageous over conventional technologies because it provides a chemically clean, coherent, and monochromatic beam to the region to be machined.

Abstract: A method of creating thin wafers of single crystal silicon wherein an ingot of single-crystal silicon with a (111) axis is flattened and polished at one end normal to the axis, and a notch with a vertex in the (111) plane is produced on a side or edge of the ingot, such that the distance between this vertex and said end is the desired thickness of a wafer to be cleaved from the ingot and such this vertex is in the desired plane of cleavage. Light of a wavelength able to penetrate into the silicon crystal without significant absorption, when the intensity of the beam is low, but is efficiently absorbed and converted to heat when the intensity of the beam is high, is focused to an elongated volume with an axis of elongation in the desired cleavage plane, parallel to and a short distance from said notch edge.

Abstract: A substrate for controlling the transmission of light therethrough has a light reflecting layer affixed to a light transmitting layer. The light reflecting layer is divided into a plurality of subdivisions arranged in a plurality of rows. Each subdivision has an area, is spaced apart from adjacent subdivisions, and has a different thickness than the light transmitting layer between the subdivisions. By controlling the size, spacing and thickness of the subdivisions and the thickness of the light reflecting layer between the subdivisions it is possible to control the light transmitted through and reflected from the substrate. A method of making the substrate by ablating the light reflecting layer is also disclosed.

Abstract: A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.

Abstract: The present invention relates to a method of forming an optical element that includes a mark. The method involves, irradiating at least a portion of a surface of the optical element with laser radiation, thereby forming a plurality of substantially parallel elongated grooves in the portion of the surface, which are each aligned substantially parallel with a common longitudinal direction that extends from a center point of the plurality of elongated grooves. The plurality of elongated grooves together define the mark. A clear film is formed over at least the portion of the surface and the plurality of elongated grooves. Depending on the orientation of a source of electromagnetic radiation as viewed through the optical element relative to the common longitudinal direction of the grooves, the mark is either observable or unobservable. The present invention also relates to an optical element having a mark, as described above.

Abstract: An embodiment includes a loading unit with an alignment mark configured to support a substrate, a laser beam generating unit configured to generate a laser beam toward the upper surface of the loading unit, a vision unit that causes the laser beam generating unit to irradiate the laser beam onto the substrate on the loading unit to form an alignment mark on the substrate and that generates corrected coordinate values based on the formed alignment mark on the substrate, a position detector located at the center of the loading unit to detect information about the laser beam generated by the laser beam generating unit, and a controller that controls an X-Y scanning mirror according to the corrected coordinate values, and controls power of the laser beam generated by the laser beam generating unit or the position of the loading unit according to the information detected by the position detector.

Abstract: In removal processing using a pulsed laser beam, processing deviation occurs in the depthwise direction to cause a processing error in a predetermined removal shape. A first pulsed laser beam L1 is a pulsed laser beam having a wavelength that exhibits transmittance to a workpiece 6, and a second pulsed laser beam L2 is a pulsed laser beam having a wavelength that exhibits absorption to the workpiece 6. The first pulsed laser beam L1 is focused into the workpiece 6, and a focal point P1 of the first pulsed laser beam L1 is scanned along the outline of a predetermined removal region R1 to form a modified portion 6A along the outline of the predetermined removal region R1. Next, removal processing is performed by scanning the second pulsed laser beam L2 in a region enclosed by the modified portion 6A.

Abstract: A method is devised for providing a code on a tool. The method includes the steps of providing a tool, providing a coating on the tool by electroplating, and providing a code on the coating by using laser to make dents in the coating, with patches left in the coating. The dents are used as black lines or dots of a bar or array code printed on paper while the patches are used as blank lines or dots of the bar or array code printed on the paper.

Abstract: A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed at a surface of the sapphire substrate using a solid state laser and locating edges of the substrate. The cutting is stopped based on the edge location, to prevent impacting background elements. The pulses of laser energy have a wavelength below about 560 nanometers, and preferably between about 150 in 560 nanometers. In addition, energy density, spot size, and pulse duration are established at levels sufficient to induce ablation of sapphire.

Abstract: A stent manufacturing device and methods for making intravascular stents and other medical devices. The stent manufacturing device may include a base, a laser or other cutting device coupled to the base, a horizontal motor coupled to the base, and a rotary motor coupled to the horizontal motor. A workpiece can be attached to the cutting device, for example adjacent the rotary motor, and the workpiece can be cut with the cutting device.

Abstract: A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.

Abstract: The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer. The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate. The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.

Abstract: A method for manufacturing a high temperature superconductor (=HTS) coated tape (20), with the following steps: preparation of a substrate tape (1), deposition of at least one buffer layer (2), deposition of an HTS film (3), deposition of a metallic protection layer (35) on the HTS film (3) and deposition of a metallic shunt layer (36) is characterized in that, prior to deposition of the metallic shunt layer (36), the partially prepared coated tape (10) undergoes a laser beam cutting in order to provide a desired tape form, wherein the laser beam cutting is applied together with a gas flow and/or a liquid flow (23). The method reduces the loss of critical current and reduces or avoids a deterioration of the critical temperature in a HTS coated tape due to tape cutting.

Abstract: A thin film solar cell includes a first substrate, a transparent conductive layer on an inner surface of the first substrate, the transparent conductive layer having an uneven top surface and including through-holes, a light-absorbing layer on the transparent conductive layer, a reflection electrode on the light-absorbing layer, a second substrate facing and attached with the first substrate, and a polymeric material layer on an inner surface of the second substrate.

Abstract: A method for machining a metallic frictional surface for wet-running applications is provided in which the metallic frictional surface is machined using a laser.

Abstract: An apparatus for etching multiple surfaces of a hydroformed powder coated luminaire reflector is described. The system includes a laser, one or more high speed scan heads, a laser marking station and a conveyance device. The system positions a reflector into optical alignment with the scan heads to allow permanent etching of the surface thereof.

Abstract: A method comprises spatially selectively irradiating in a predetermined pattern with an output beam of a laser system an interface between a polymer substrate and a metal film on the polymer substrate. The polymer substrate is substantially transparent to the output beam of the laser system; the metal film absorbs a substantial fraction of the output beam. Laser system output comprises a sequence of pulses. Beam size at the polymer/metal interface, pulse energy, and pulse duration are selected so that each pulse from the laser system that irradiates an area of the polymer/metal interface substantially completely removes by ablation the metal film from at least a portion of the irradiated area without substantially altering the surfaces or bulk of the polymer substrate and without leaving on the polymer substrate or on remaining areas of the metal film substantial residue of metal that resolidified after being melted by the laser irradiation.

Abstract: The invention relates to a tire made of rubbery material comprising a sidewall on which there is formed at least one pattern that contrasts with this sidewall. The pattern comprises a plurality of strands distributed through the pattern with a density of at least five strands per square millimetre (mm2), each strand having a mean cross section of between 0.003 mm2 and 0.06 mm2. The tire also comprises on the said sidewall at least two ribs that pass through the pattern and between which strands of the pattern are present, the said ribs being distant from one another by at most 10 mm, each rib having a height of at least 0.25 mm and a mean width of at least 0.20 mm, the said pattern following the relief formed by the ribs.

Abstract: The innovation involves the use of a laser to ablate a calculated microstructure or employ an adaptation of maskless photolithography using a Digital Micromirror Device to serve as a Spatial Light Modulator to embed a covert diffraction screen, holding encrypted information under transparent surfaces of plastics or glass substrates. One method includes the steps of fragmenting the calculated diffraction screen into at least first and second parts that are placed in separate locations. In this method the binary pattern in each of the parts includes information representing a respective portion of the original image and needs to be interrogated simultaneously to provide a meaningful visual output: each part by itself being incapable of generating any meaningful information. The fragmentation method allows a public-private key type of secure system platform.

Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Abstract: A structured surface is formed with the method of the present invention. The method of making this structured surface includes the steps of applying an ablatable radiation sensitive coating on the major surface of the substrate, and exposing the ablatable radiation sensitive coating to radiation such that exposed portions of the ablatable radiation sensitive coating ablate from the substrate to form a structured surface. The structured surface then includes a substrate and a pattern of structures framed by at least one separation bank. The method may also include the steps of depositing a flowable material on to the structures and the separation bank to form a pattern of flowable material in the structures.

Abstract: The present invention relates to a method of manufacturing a bearing component, in which a visually undetectable identification mark is created on a surface of the component by means of laser marking performed in a protective gas environment. The protective gas environment prevents the formation of a visible oxide layer, while the temperatures induced at the component surface and below the component surface, due to the laser marking, are sufficient to alter the microstructure of the bearing steel from which the component is made. The altered microstructure is revealable by applying an etchant to the visually undetectable mark, thereby allowing authentication of the bearing component.

Abstract: A light concentrator or distributor is provided, which includes a plurality of light conducting cells that are lined up in a transparent light conducting body. The light conducting cells are defined by boundary faces, which are produced within the light conducting body using laser radiation.

Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

Abstract: In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values. By the method, it is possible to remarkably increase scribing speed of the work plate of the fragile materials without increasing heating temperature.

Abstract: Laser device comprising at least two gas laser units (10), stacked in layers, each laser unit comprising a plurality of resonator tubes (12), the resonator tubes being in fluidic communication with each other and forming a common tubular space, connecting elements (20, 21) for connecting adjacent resonator tubes so as to form a loop, mirrors (22) arranged in the connecting elements for reflecting the laser light between the resonator tubes, a rear mirror (44) and a partially reflecting output coupler (42) for coupling out a laser beam. In each laser unit an integrated output flange (40) comprises the rear mirror, the partially reflecting output coupler and an output mirror (46) which deflects the laser beam passing through the output coupler to a scanning device (80) located in the central space (8) surrounded by the resonator tubes. The invention also relates to a method for marking an object.

Abstract: A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of first micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of second micro-grooves overlaid on the first micro-grooves, each of the second micro-grooves having an average depth greater than the average depth of the first micro-grooves. Some embodiments can also have a plurality of textured surface treatment regions superimposed on the overlaid first and second micro-grooves so as to at least partially intersect the micro-grooves.