Abstract: A laser processing head includes a housing including a mounting surface for mounting the laser processing head on a carrier; a plurality of optical components arranged within the housing; and an access opening formed in the housing for removing or inserting at least one first optical component among the optical components, the access opening being formed in the mounting surface.

Abstract: A manufacturing method for a shaft 1 by imparting a residual compressive stress to an inner surface 4p of the lateral hole 4 of the workpiece 2 includes a disposing step and an irradiation step. In the disposing step, a lateral-hole mirror 14a is disposed inside the lateral hole 4. In the irradiation step, a laser beam L is emitted from one of an inner-side opening 4a and an outer-side opening 4b of the lateral hole 4 toward the lateral-hole mirror 14a, making the laser beam L reflect on the lateral-hole mirror 14a, and thereby applying the laser beam L to the inner surface 4p of the lateral hole 4.

Abstract: A laser processing method includes holding a single crystal silicon wafer as a workpiece, selecting a laser beam having a wavelength of 1950 nm or more in a transmission wavelength region to the single crystal silicon wafer, and applying the laser beam to the single crystal silicon wafer along a predetermined area with the focal point of the laser beam set inside the wafer, thereby forming a plurality of shield tunnels arranged along the predetermined area. Each shield tunnel is composed of a fine hole and an amorphous region formed around the fine hole for shielding the fine hole. The fine hole extends from a beam applied surface of the wafer where the laser beam is applied to the other surface opposite to the beam applied surface.

Abstract: A laser processing head, by means of which lenses in the beam path of the laser beam may be interchanged for the purposes of changing the beam diameter at the workpiece, wherein the laser processing head may have a structurally simple and compact embodiment.

Abstract: A vaporizer has a housing containing a power source. A laser assembly containing a laser module, such as a laser diode, is electrically coupled to the power source. A laser intensifier thermal transfer module contains a heating plate and is attached to the laser assembly. A cartridge assembly includes an inhalant supply cartridge containing inhalant, such as liquid or concentrate. The inhalant is in contact with the heating plate by way of a wick that draws the inhalant out of the supply cartridge. The laser assembly is receives electric current from the power source to activate the laser module causing the laser module to emit a beam directed toward the heating plate. The heating plate focuses the beam and generates heat sufficient to vaporize the inhalant. The inhalant is drawn through an air passageway in the cartridge for inhalation by the user.

Abstract: A deposition head for additive manufacturing may include a material feeder including a first feeder to deposit a first feed material to a growth surface, and a second feeder to deposit a second feed material to the growth surface, and an electromagnetic energy source to direct electromagnetic energy to the growth surface, wherein the electromagnetic energy forms a melt pool on the growth surface, and wherein the melt pool may include at least one of a molten first feed material and a molten second feed material.

Abstract: A weapon for tactical simulations provided with at least one projection device of electromagnetic beams to simulate the projectile fired by the weapon. The projection device includes a plurality of emitters of electromagnetic beams housed in projectors, each susceptible to emit electromagnetic beams having geometrical parameters different from those of the electromagnetic beams emitted by the other emitters so that each beam emitted realistically simulates a section of the path that the projectile to be simulated would cover. The weapon further includes an adjusting system of the electromagnetic beam emitted by the emitters to vary the geometric features so that the overall electromagnetic beam has, for all the path that the projectile to be simulated would cover, geometric features with values includes between predetermined intervals so as to realistically simulate the projectile.

Abstract: A method and system for providing vision correction to a patient is disclosed. The method and system employ a vision care POD to engage and provide vision diagnostics and correction options to a patient. More specifically, method and system may include educating the population of a geographic area through sources that target particular identified groups in need of vision correction; providing an eye examination to patients using a vision care POD to generate a personalized vision correction ID card; providing one or more vision correction solution(s) to the patient; supplying the patient with the one or more vision correction solution(s) and the corresponding training for the solution(s); and providing ongoing care and support to the patient.

Abstract: A numerical controller controls a laser beam machine in accordance with a program and performs three-dimensional laser beam machining on a workpiece. The numerical controller obtains a ratio between a machining speed at an upper surface of the workpiece and a machining speed at a lower surface of the workpiece on the basis of a posture of a nozzle of the laser beam machine and changes a machining condition specified by the program on the basis of the obtained ratio.

Abstract: A laser system capable of producing a stable and accurate high-power output beam from one or more input beams of corresponding laser sources comprises one or more optical elements configured to receive the input beams wherein at least one of said one or more optical elements is made of high purity fused silica.

Abstract: Elastomeric components, such as a shoe outsole, are treated with a plasma application to clean and activate the elastomeric component. The application of plasma is controlled to achieve a sufficient surface composition change to enhance adhesion characteristics while not adversely physically deforming the elastomeric component. The plasma treatment is applied to increase carbonyl functional group concentrations within an altered region of the elastomeric component to within at least a range of 2%-15% of carbon atomic percentage composition. The cleaning and activation is controlled, in part, by ensuring a defined height offset range is maintained between the elastomeric component and the plasma source by a generated tool path. The elastomeric component may then be adhered, with an adhesive, to another component.

Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

Abstract: An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

Abstract: A laser nozzle comprising a nozzle body (1) comprising a first axial housing (5) comprising a first outlet orifice (11) located in a front face (1a) of the nozzle body (1); a movable element (2) arranged in the first axial housing (5) of the nozzle body (1), comprising a front portion (2a) forming a skirt and an axial passage (4) having a second outlet orifice (12) emerging from said front portion (2a) forming a skirt; and an elastic element (8) arranged in the first axial housing (5), between the nozzle body (1) and the movable element (2). According to the invention, the movable element (2) is able to move translationally in the first axial housing (5) in the direction of the first outlet orifice (11) under the effect of a gaseous pressure exerted on the movable element (2), and the elastic element (8) exerts an elastic return force on the movable element (2) tending to oppose the translational movement in the first axial housing (5) in the direction of the first outlet orifice (11).

Abstract: A phoropter having a line of sight for a viewer to see through comprises a lens system in the line of sight, wherein a shape or focal length of at least one lens in the lens system is controllable by means of an electrical signal, electrical field or current. Wavefront sensors of the phoropter detect local tilts of light wavefronts emerging from the eye and generate output signals that are used for controlling the shape or focal length of the at least one lens. Holographic or diffractive elements are used to collect light scattered from an eye of the viewer and image the scattered light to the wavefront sensors. Preferably one or more of the holographic or diffractive elements are away from the line of sight of the viewer. To use the phoropter, light is passed to the lens system, and light scattered by the eye is collected by the holographic or diffractive elements and imaged onto the wavefront sensors.

Abstract: A laser processing apparatus including a processing head and a light-focusing optical section for focusing a laser beam having a diffusion angle and enabling the laser beam having a convergent angle to be emitted from the processing head. The laser processing apparatus includes a transmissive optical member located upstream of the light-focusing optical section so as to transmit the laser beam while keeping the diffusion angle constant, or located downstream of the light-focusing optical section so as to transmit the laser beam while keeping the convergent angle constant. The transmissive optical member includes a focused-beam diameter increasing part for increasing a focused beam diameter of the laser beam transmitted through the focused-beam diameter increasing part, as compared to a focused beam diameter of the laser beam in a case where the laser beam is not transmitted through the focused-beam diameter increasing part but is focused by the light-focusing optical section.

Abstract: A coded localization system includes a plurality of optical channels arranged to cooperatively image at least one object onto a plurality of detectors. Each of the channels includes a localization code that is different from any other localization code in other channels, to modify electromagnetic energy passing therethrough. Output digital images from the detectors are processable to determine sub-pixel localization of the object onto the detectors, such that a location of the object is determined more accurately than by detector geometry alone. Another coded localization system includes a plurality of optical channels arranged to cooperatively image partially polarized data onto a plurality of pixels. Each of the channels includes a polarization code that is different from any other polarization code in other channels to uniquely polarize electromagnetic energy passing therethrough. Output digital images from the detectors are processable, to determine a polarization pattern for a user of the system.

Abstract: The invention relates to an optimized laser cutting method for cutting a part from a material by means of a cutting system comprising: a laser source for producing a laser beam having a certain power; and a cutting head comprising an end nozzle for passage of a cutting laser beam, wherein the method comprises: determining a cutting power Pd such that Pd=Max(Popt;?e) where Max is the mathematical operator of the maximum, Popt is an optimal power of the laser beam of the cutting system, which is predetermined in accordance with the part to be cut, and/or with cutting parameters and/or with system parameters, in order to minimize the amount of aerosols produced when the part is cut, ? is a leading coefficient representing the number of kW required for cutting the part per mm of the thickness of the part, and e is the thickness of the part in mm.

Abstract: Methods of cutting laminate strengthened glass substrates are disclosed. A method is disclosed which includes providing a laminate strengthened glass substrate having a glass core layer with first and second surface portions, and at least one glass cladding layer fused to the first surface portion or the second surface portion of the glass core layer. The glass core layer has a core coefficient of thermal expansion that is larger than a cladding coefficient of thermal expansion. The method further includes forming an edge defect on the laminate strengthened glass substrate, heating first and second regions of the laminate strengthened glass substrate on the at least one glass cladding layer. The first and second regions are offset from first and second sides of a desired line of separation, respectively. The method further includes propagating a crack imitated at the edge defect between the first and second regions.

Abstract: A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed 1 is irradiated with measuring laser light along a line to cut 5, astigmatism is added to a reflected light component of the measuring laser light reflected by a front face 3 of the object 1 irradiated with the measuring laser light, a displacement sensor signal corresponding to a converged light image of the reflected light component having the astigmatism added thereto is detected, and the displacement sensor signal is made to become a feedback reference value corresponding to the quantity of the reflected light component, so as to locate the converging point of the processing laser light at a predetermined position with respect to the front face 3.

Abstract: The invention relates to a process for the adjustment of a laser light spot of high intensity for the laser processing of work pieces as well as a laser device for performing the proposed process. The laser device comprises a laser emitting a laser beam and at least one focusing lens for converging the laser beam as well as an optical operating element for adjusting the beam diameter of the laser beam. The invention proposes to use as operating element a diffractive optical element that separates the laser beam emitted by the laser into partial laser beams, with the partial laser beams generated by the diffractive optical element being assembled to form a resulting laser beam that acts on the work piece. By means of a suitable design of the diffractive optical element it is possible to adjust, in particular enlarge, the diameter of the laser light spot as required.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract: Laser nozzle usable for laser cutting, especially with a fiber or disk laser, comprising: a nozzle body comprising an axial housing passing axially through the nozzle body and comprising a first output orifice located in the front side of the nozzle body; a movable element able to move in translation in the axial housing in the direction of the first output orifice under the effect of a gas pressure acting on the movable element; and an elastic element arranged in the axial housing, between the nozzle body and the movable element, the elastic element exercising an elastic return force on the movable element tending to oppose the translation movement in the axial housing in the direction of the first output orifice.

Abstract: An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.

Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.

Abstract: A laser irradiation apparatus is provided. The laser irradiation apparatus includes a laser beam generator configured to generate laser beams; a slit unit configured to selectively transmit the laser beams; a mirror unit configured to change a path of the selectively transmitted laser beams, so as to irradiate the selectively transmitted laser beams onto a processing target; a first optical system, wherein a first portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the first optical system; and a second optical system, wherein a second portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the second optical system.

Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

Abstract: Embodiments of the invention provide an apparatus including a substrate support, a source of laser radiation emitting laser radiation along an optical path, and an illumination optics disposed along the optical path. The illumination optics includes a set of slow-axis and fast-axis lenses. The apparatus further includes a homogenizer disposed between of the illumination optics and the substrate support along the optical path. The homogenizer includes a first and a second micro-optic lenslet arrays of cylindrical lenses, wherein the second micro-optic lenslet array of cylindrical lenses has a relatively larger lenslet pitch than that of the first micro-optic lenslet array of cylindrical lenses, and lenslet axes of the first micro-optic lenslet array and lenslet axes of the second micro-optic lenslet array are oriented along an axis that is parallel to a fast axis of the source of laser radiation.

Abstract: In a laser irradiation device, a patterning method and a method of fabricating an Organic Light Emitting Display (OLED) using the same. The laser irradiation device includes a light source, a mask, a projection lens, and a Fresnel lens formed at a predetermined portion of the mask to change an optical path. When an organic layer pattern is formed using the laser irradiation device, laser radiation is irradiated onto a region of an organic layer, which is to be cut, and the laser radiation is appropriately irradiated onto a region of the organic layer, which is to be separated from a donor substrate. The laser radiation irradiated onto an edge of the organic layer pattern has a laser energy density greater than that of the laser radiation irradiated onto other portions of the organic layer pattern. As a result, it is possible to form a uniform organic layer pattern and reduce damage of the organic layer.

Abstract: Provided is a semiconductor processing apparatus, including a first laser beam irradiation unit having a first variable beam expanding telescope and a first galvanometer scanner transferring a first laser beam having a first wavelength, a second laser beam irradiation unit having a second variable beam expanding telescope and a second galvanometer scanner transferring a second laser beam having a second wavelength, and a telecentric lens.

Abstract: A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference ? has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference ? exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.

Abstract: Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.

Abstract: In the case where the workpiece (1) is processed, the laser beam is S-polarized by an optical modulator (7). Thus, the laser beam is mainly diverted toward a workpiece (1) by a polarizer (6). An optical path through which the laser beam passes is caused to have a high light converging ability with respect to a target spot by an optical device (9). In the case where the workpiece (1) is not processed, the laser beam is P-polarized by the optical modulator (7). Thus, the laser beam is mainly diverted to a beam damper (10) side by the polarizer (6). However, the workpiece 1 is irradiated with the laser beam having leaked from the polarizer (6). An optical path through which the laser beam passes is caused to have a low light converging ability with respect to the target spot by the optical device (9).

Abstract: The invention discloses a method and a device of improving crystallization ratio of polysilicon, which is applied to the process that the amorphous silicon layer converts into the polysilicon layer. More specifically, superposing at least two pulse laser beams into a superposed pulse laser beam. The pulse width of the superposed pulse laser beam is larger than each pulse laser beam. Next, utilizing the superposed pulse laser beam to irradiate onto the amorphous silicon layer for transforming the amorphous silicon layer into polysilicon layer. The superposed pulse laser beam irradiates onto the surface of the amorphous silicon layer. The amorphous silicon layer is transformed into the polysilicon layer. Consequently, the crystallization ratio of polysilicon is improved.

Abstract: A laser beam irradiation apparatus and method of manufacturing an organic light emitting display device using the same are disclosed. The laser beam irradiation apparatus is configured to irradiate a laser beam to an object extending in a first direction while moving the laser beam relative to the object in the first direction, where the laser beam has a cross-section taken in a plane perpendicular to a second direction in which the laser beam is irradiated from the apparatus, the cross-section comprising two substantially symmetrical portions that are substantially symmetrical about a centerline of the cross-section extending in the first direction, where the cross-section has a centerline length taken in the centerline, where at least part of the substantially symmetrical portions has a length in the first direction that is longer than the centerline length.

Abstract: A laser crystallization device includes a first light source providing a first light and a second light source providing a second light. The device further includes a first lens set receiving the first light to generate a first transmitted light, the first transmitted light having a first profile, the first profile having a first profile error portion and a first non-error portion. The device further includes a second lens set receiving the second light to generate a second transmitted light, the second transmitted light having a second profile, the second profile having a second profile error portion and a second non-error portion, the second profile error portion corresponding to the first non-error portion, the second non-error portion corresponding to the first profile error portion. The device further includes an optical system combining the first transmitted light with the second transmitted light.

Abstract: A method and apparatus to perform laser ablation in the vicinity of a charged particle beam while simultaneously protecting the light optical components of the apparatus utilized to perform the ablation from being coated with debris resulting from the ablation process. According to preferred embodiments of the present invention, a protective transparent screen is used to shield the laser optical components. A preferred screen could be replaced or repositioned without breaking vacuum in the sample chamber and would not be particularly susceptible to undesirable charging effects.

Abstract: The invention relates to a device (and a corresponding method) for the interference structuring of a planar sample, comprising a laser, a focusing element, which is arranged in the beam path of the laser and by means of which the laser radiation can be focused in a first spatial direction, a first prism, in particular a biprism, which is arranged in the beam path of the laser and by means of which the laser radiation can be directed at a sample volume in a second spatial direction preferably perpendicular to the first spatial direction by means of two beams, in such a way that the two beams interfere within the sample volume in an interference area, the sample volume, in which the planar sample is or can be placed in the interference area, and a moving unit, by means of which the beam(s) of the laser radiation can be moved in the first, the second, or the first and second spatial directions and/or by means of which a/the sample can be moved in the sample volume in the first, the second, or the first and secon

Abstract: A novel apparatus and method for laser-assisted micro-milling. The disclosed laser-assisted micro-milling system and method provides unique micro-milling capabilities for very difficult-to-machine materials, such as ceramics, high temperature alloys and composites. A low power laser beam is focused at a very small spot, thus producing a very high power density, the spot being located just ahead of a mechanical micro-milling cutter to preheat the material prior to machining. This localized heating thermally weakens the workpiece resulting in lower cutting forces, improved surface finish, and longer tool life. The system is capable of micro-milling difficult-to-machine materials that may be conductive or non-conductive with high material removal rates compared to existing systems and methods.

Abstract: An apparatus for manufacturing includes: a build chamber including a build platform; a material dispenser configured to distribute a layer of powdered material over the build platform; a mirror arranged over the build platform and defining a mirrored planar surface; a first laser output optic configured to output a first energy beam toward the mirror; a second laser output optic adjacent the first laser output optic and configured to output a second energy beam toward the mirror; a first actuator configured to maneuver the first laser output optic and the second laser output optic relative to the build platform; a lens arranged between the mirror and the build platform; and a second actuator configured to maneuver the mirror to scan the first and second energy beams across the lens, the lens outputting the first energy beam and the second energy beam toward and substantially normal to the build platform.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract: In removal processing using a pulsed laser beam, processing deviation occurs in the depthwise direction to cause a processing error in a predetermined removal shape. A first pulsed laser beam L1 is a pulsed laser beam having a wavelength that exhibits transmittance to a workpiece 6, and a second pulsed laser beam L2 is a pulsed laser beam having a wavelength that exhibits absorption to the workpiece 6. The first pulsed laser beam L1 is focused into the workpiece 6, and a focal point P1 of the first pulsed laser beam L1 is scanned along the outline of a predetermined removal region R1 to form a modified portion 6A along the outline of the predetermined removal region R1. Next, removal processing is performed by scanning the second pulsed laser beam L2 in a region enclosed by the modified portion 6A.

Abstract: A beam shaping unit for focusing a divergent laser beam includes a first optical element to receive the laser beam, a second optical element to receive the beam from the first optical element, an optical focusing unit to receive the beam from the second optical element, a first focal point adjustment device coupled to the first optical element, the first focal point adjustment device being configured to adjust the beam focal point diameter by manipulating the first optical element, and a second focal point adjustment device coupled to the second optical element, the second focal point adjustment device being configured to adjust, in the beam propagation direction, the beam focal position by manipulating the second optical element, and in which the beam shaping unit is configured to image the beam from the first optical element through an intermediate focal point onto the second optical element.

Abstract: A laser welding apparatus includes a laser welding unit including a first lens adapted to focus a laser beam; a second lens adapted to diffuse the laser beam to the first lens; and a third lens adapted to guide the laser beam to the second lens. The relative positions of the first lens, the second lens, and the third lens, are adjusted to adjust a diffusion angle and a beam width of the laser beam entering the first lens. The laser welding apparatus performs: actuating the laser welding unit to travel at a predetermined speed along a predetermined trajectory; directing the laser beam at a first welding spot; adjusting the focal length to focus the laser beam at the first welding spot; holding the laser focal spot size substantially constant; and directing the laser beam at a second welding spot after completion of welding for the first welding spot.

Abstract: Device for processing a substrate are described herein. Devices can include a radiation source and an aperture positioned to receive radiant energy from the radiation source. The aperture can include one or more members, and one or more interfering areas, wherein the interfering areas surround a transmissive area. The one or more structures can affect transmission of radiant energy through a portion of the transmissive area of the aperture. Structures disposed on the aperture can reduce or redirect transmission to provide for more uniform overall transmission of radiant energy through the aperture.

Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

Abstract: An apparatus 101 for singulating an object is disclosed. The apparatus 101 comprises a laser 103 configured to emit a laser beam 105 with a Gaussian irradiance profile, as well as a beam-shaping device 115 configured to reshape the Gaussian irradiance profile of the laser beam 105 emitted from the laser 103. In particular, the beam-shaping device 115 has a plurality of aspherical lenses 117, 119 to redistribute irradiance of the laser beam 105, so as to reduce variation of the irradiance in an effective irradiation spectrum of the laser beam 105 for singulating the object. By redistributing the irradiance of the laser beam 105, irradiation energy may be more efficiently delivered to the semiconductor wafer 102 for laser singulation, compared with conventional laser beams with Gaussian irradiance profiles which are non-uniform. A method of singulating an object is also disclosed.

Abstract: The present invention relates to a laser material processing system for processing a workpiece by means of a laser beam, comprising an optical system having at least one optical component for focusing the laser beam to form a focal point on the workpiece or in a defined position relative to the workpiece, at least one inertial sensor for detecting a transitional and/or rotational acceleration of the at least one optical component of the optical system and/or the workpiece, and a processing unit connected to the at least one inertial sensor for determining a relative transitional and/or rotational acceleration between the focal point and the workpiece.

Abstract: While a converging lens 108 is relatively moved along a line 50 including a line to cut 5, measuring laser light L2 is converged with the lens 108 when the lens 108 is positioned on a processing region 30 having an outer shape between an object to be processed 1 and a frame 22, and a reflected light component of the laser light L2 reflected by a front face 3 of the object 1 is detected. While keeping a substantially constant distance between the front face 3 and the lens 108 such that a converging point P of processing laser light L1 is positioned at a constant distance from the front face 3 according to the detection, the laser light L1 is converged by the lens 108, so as to form a molten processed region 13 within the object 1.