Abstract: In a manufacturing technology for forming a thin film transistor comprising a laser irradiation step, objects of the present invention are to obtain a high performance and multifunction semiconductor manufacturing apparatus and thin film transistor manufacturing method. A silicon thin film 201 is formed on a glass substrate 202, and laser 203 is irradiated onto this thin film 201 whereby a re-crystallization film is obtained. This re-crystallization film undergoes a hydrogen plasma processing so that dangling-bonds of silicon are terminated. Moreover, a step for forming a silicon dioxide film 205 on the re-crystallization film is included. These steps are performed under the conditions that the glass substrate 202 is not exposed to the air and a processing temperature is 350° C. or less.

Abstract: A diode-pumped, solid-state laser (52) of a laser system (50) provides ultraviolet Gaussian output (54) that is converted by a diffractive optical element (90) into shaped output (94) having a uniform irradiance profile. A high percentage of the shaped output (94) is focused through an aperture of a mask (98) to provide imaged to provide imaged shaped output (118). The laser system (50) facilitates a method for increasing the throughput of a via drilling process over that available with an analogous clipped Gaussian laser system. This method is particularly advantageous for drilling blind vias (20b) that have better edge, bottom, and taper qualities than those produced by a clipped Gaussian laser system. An alternative laser system (150) employs a pair of beam diverting galvanometer mirrors (152, 154) that directs the Gaussian output around a shaped imaging system (70) that includes a diffractive optical element (90) and a mask (98).

Abstract: A method for controlling a seat of an optical lens on a laser processing machine comprising the following steps: a. the optical laser lens-seat divides the working zone into three parts when it is moved over the working piece; b. the optical laser lens-seat is accelerated when it stays at the first part, is in a constant speed when it stays at the second part, and is decelerated when it stays at the third part; c. the optical laser lens-seat keeps its normal output power when it is at the part with said constant-speed, its output power is relatively increased when it is at the part being accelerated, and its output power is relatively reduced when it is at the part being decelerated; d. the amount of laser irradiation in each displacement unit thus is equal, both sides of the working piece do not need to leave inactive sides, hence working time is reduced.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: In a laser processing apparatus including an ultra-short pulse laser a focusing optical system and processing a work by projecting a beam delivered through the focusing optical system on to the work, the focusing optical system has at least a pair of diffractive surface and a refractive surface, and chromatic aberration is corrected or chromatic aberration and pulse extension are corrected by making use of the diffractive dispersions due to and the diffractive surface the refractive dispersion due to of the refractive surface. With this arrangement, chromatic aberration is corrected or both chromatic aberration and pulse expansion are corrected in the processing with the ultra-short pulse laser and thereby improve the practical use and value of the processing by improving its accuray, qualiy and speed.

Abstract: In a laser processing apparatus including an ultra-short pulse laser a focusing optical system and processing a work by projecting a beam delivered through the focusing optical system on to the work, the focusing optical system has at least a pair of diffractive surface and a refractive surface, and chromatic aberration is corrected or chromatic aberration and pulse extension are corrected by making use of the diffractive dispersions due to and the diffractive surface the refractive dispersion due to of the refractive surface. With this arrangement, chromatic aberration is corrected or both chromatic aberration and pulse expansion are corrected in the processing with the ultra-short pulse laser and thereby improve the practical use and value of the processing by improving its accuray, qualiy and speed.

Abstract: A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method includes generating a laser beam, modifying the laser beam to obtain a modified laser beam, and sequentially and relatively positioning the modified laser beam into at least one non-round spot having a predetermined non-round energy distribution on the designated region to remove the target material in the designated region. The predetermined non-round energy distribution covers an area of the designated region such that energy is more efficiently coupled into the designated region for the non-round energy distribution than energy coupled into the designated region for a round energy distribution covering the same area.

Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of non-collimated light at a second time interval during the first time interval. The apparatus includes at least one source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.05 microns and approximately 0.

Abstract: A footprint (an area on a plane necessary for processing) of a laser irradiation apparatus for moving a stage supporting thereon a substrate in X and Y direction becomes unavoidably large when the substrate becomes greater in size, and the apparatus becomes very great as a whole. In a laser irradiation apparatus of the invention, a galvanomirror or a polygon mirror irradiates and scans a laser beam to and on a semiconductor film and always keeps an angle &thgr; of incidence of the laser beam to the semiconductor film at a certain angle.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.

Abstract: A low cost method and apparatus for simultaneous block melting of a material by laser enabling completion of work in a short time. A laser beam from a YAG laser source etc. strikes a diffraction type optical element like a diffraction lens and is split into a large number of beams by diffraction and transmission. The beams are focused by a condensing lens etc. on a plastic surface as a large number of points or a line. The plastic is simultaneously heated to melt at these focused points for welding with another object or for removal. Therefore, no deformation occurs in the worked material like in the prior art where a surface was scanned by a focused point. The worked material may be a metal etc. in addition to a plastic.

Abstract: An apparatus and a method for controlling the intensity distribution of a laser beam for processing a substrate provide that the laser radiation passes a homogenizing device, subsequent to which partial beams of the laser beam superimpose one another so that a homogenization of the intensity distribution of the laser beam is achieved. By arrangement of a diaphragm at a position in the radiation path of the laser beam, radiation is cut out off the partial beams superimposing one another in such a way that varied portions of at least some of the partial beams are cut out.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Abstract: In a laser processing apparatus including an ultra-short pulse laser a focusing optical system and processing a work by projecting a beam delivered through the focusing optical system on to the work, the focusing optical system has at least a pair of diffractive surface and a refractive surface, and chromatic aberration is corrected or chromatic aberration and pulse extension are corrected by making use of the diffractive dispersions due to and the diffractive surface the refractive dispersion due to of the refractive surface. With this arrangement, chromatic aberration is corrected or both chromatic aberration and pulse expansion are corrected in the processing with the ultra-short pulse laser and thereby improve the practical use and value of the processing by improving its accuray, qualiy and speed.

Abstract: Methods and apparatuses are disclosed which allow uniform coatings to be applied by pulsed laser deposition (PLD) on inner and outer surfaces of cylindrical objects, such as rods, pipes, tubes, and wires. The use of PLD makes this technique particularly suitable for complex multicomponent materials, such as superconducting ceramics. Rigid objects of any length, i.e., pipes up to a few meters, and with diameters from less than 1 centimeter to over 10 centimeters can be coated using this technique. Further, deposition is effected simultaneously onto an annular region of the pipe wall. This particular arrangement simplifies the apparatus, reduces film uniformity control difficulties, and can result in faster operation cycles. In addition, flexible wires of any length can be continuously coated using the disclosed invention.

Abstract: A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Abstract: A laser machining head for machining a workpiece by a laser beam. The head has a head housing through which the laser beam passes along a central axis. A carrier member for a lens optics system for focusing the laser beam is mounted on the head housing and is displaceable relative to the latter in the direction of the central axis. A first setting device includes a cable connected to the carrier member and a cable drum connected to the head housing for winding up the cable in order to move the carrier member towards the head housing. A second setting device causes the carrier member to be displaced in the direction away from the head housing, with the second setting device being separate from the first setting device.

Abstract: A method and associated structure for excising laminate chip carriers from a panel that has a thickness less than about 100 mils. A laser beam is focused on a surface of the panel, and the panel is moved relative to the laser beam in a geometric pattern, such that cells of the panel (e.g., chip carriers) are excised from the panel. The laser parameters include a wavelength between about 500 nanometers and about 600 nanometers, a pulse width greater than about 100 nanoseconds and less than about 350 nanoseconds, an average power of at least about 1 watt, a pulse repetition rate between about 5,000 pulses/sec and about 20,000 pulses/sec, and a target diameter (D) between about 2 microns and about 30 microns. The kerf width between adjacent excised cells is between about 2 microns and about 75 microns. The width of an excised cell is at least 5 mm. A displacement between successive pulses of the laser beam is less than about 2D.

Abstract: This invention relates to a laser beam machining apparatus equipped with a spatial light modulator. The laser beam machining apparatus according to this invention comprises a reflection-type spatial light modulator, hologram pattern writing means for writing onto said reflection-type spatial light modulator a hologram pattern corresponding to the desired optical image intended to be irradiated onto a target, laser beam irradiating means for irradiating readout light onto said reflection-type spatial light modulator at an incidence angle &thgr;, and a Fourier lens for performing a Fourier transform of said readout light, phase modulated by said reflection-type spatial light modulator. Through use of this laser beam machining apparatus, improvement in utilization efficiency of the readout light and improvement in the level of freedom in machining patterns can be expected.

Abstract: A laser welding method and apparatus includes a laser manipulator that directs a laser beam emitted from a laser generator at various predetermined angles toward predetermined positions within a laser work zone. A transport device passes workpieces through the laser work zone where the laser beam manipulator can direct a laser beam at desired interfacing portions of each workpiece to weld those interfacing portions together. The controller is programmed to cause the manipulator to weld the workpieces without halting their motion through the laser work zone.

Abstract: A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method includes generating a laser beam, modifying the laser beam to obtain a modified laser beam, and sequentially and relatively positioning the modified laser beam into at least one non-round spot having a predetermined non-round energy distribution on the designated region to remove the target material in the designated region. The predetermined non-round energy distribution covers an area of the designated region such that energy is more efficiently coupled into the designated region for the non-round energy distribution than energy coupled into the designated region for a round energy distribution covering the same area.

Abstract: A laser processing method for removing glass by melting, evaporation or ablation from sheet-like glass substrate for forming microscopic concavities and convexities. Diffraction grating and planar microlens array obtained thereby.

Abstract: The present invention comprises an array lens illumination system for shaping laser light in a band-like beam, a mask which is arranged in an optical path of the laser light from the array lens illumination system and on which a plurality of circular apertures are formed in a staggered shape in accordance with an arranged state of orifices formed on an orifice plate, a shift member which is arranged at the incident side of the laser light rather than the mask, and which splits the laser light incident on the mask into a plurality of beams in accordance with the number of circular apertures and irradiates the split beams onto the respective circular apertures of the mask, and a projecting lens for forming an image of the laser light passing through the mask on the orifice plate.

Abstract: A laser machining method and apparatus for performing high- speed and high-precision machining on a thin film deposited on a substrate, as well as a liquid crystal panel having an electrode structure patterned using the laser machining apparatus and according to this method are disclosed.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Abstract: A method of producing microbore holes in a multi-layer substrate (5), preferably a printed circuit board substrate, that is displaced below writing optics (4) by an XY stage (6), using the optics to generate a spot from a light source (1), preferably a laser. The method reduces the treatment time and preferably compensates for distortions in the substrate material. To this end, the position of the spot within a working field is changed simultaneously with the treatment positions by electronically controlled, movable mirrors. The position of the substrate is determined by an interferometer (9, 11), and the signals corresponding to the substrate position are processed by a suitable computer system (16) to obtain an actual position of the table system. The computer system (16) is preferably provided with all bore hole coordinates and additional information such as bore hole diameter, especially in tabular form.

Abstract: A method and system for treating internal surface material overlying the interior of a tubular a substrate, and more particularly, to a system for ablating contaminates and other unwanted material from an internal surface 52 using a pulsed laser beam (38). The system includes three main sub-systems: a back end (30), a work head (100), and an umbilical tube (31) to protect conduits communicating between the back end (30) and the work head (100). The back end (30) includes heavy and bulky equipment such as a laser (32), chiller (4), pressurized air source (70), suction system (84), waste containment system (82), and electric power source (78). A conveyance such as a trailer (17) may enclose the back end (30) to make it transportable. The work head (100) includes a propeller driven rotating mirror assembly (380), and a lens assembly (520). During operation, the work head (100) is inserted in the tube or pipe and the laser (32) activated.

Abstract: A diode-pumped, solid-state laser (52) of a laser system (50) provides ultraviolet Gaussian output (54) that is converted by a diffractive optical element (90) into shaped output (94) having a uniform irradiance profile. A high percentage of the shaped output (94) is focused through an aperture of a mask (98) to provide imaged to provide imaged shaped output (118). The laser system (50) facilitates a method for increasing the throughput of a via drilling process over that available with an analogous clipped Gaussian laser system. This method is particularly advantageous for drilling blind vias (20b) that have better edge, bottom, and taper qualities than those produced by a clipped Gaussian laser system. An alternative laser system (150) employs a pair of beam diverting galvanometer mirrors (152, 154) that directs the Gaussian output around a shaped imaging system (70) that includes a diffractive optical element (90) and a mask (98).

Abstract: A method and apparatus for forming an array of microcavities in the surface of a metal film uses an excimer laser or an ultrashort laser which to produce a beam of laser light pulses. An optical mask divides the beam into multiple beams and a lens system focuses the multiple beams onto the metal film. The device operates by generating multiple beams of laser pulses of a first diameter and then magnifying the pulses by a magnification factor less than 1 to produce multiple beams of pulses having a second diameter, less than the first diameter, which are applied to the metal film. The magnification factor and the intensity of the laser is such that the fluence of the laser on the optical mask is not sufficient to cause ablation while the fluence on the metal film is sufficient to cause ablation. A diffractive optical element may be used in the device in place of the optical mask. The apparatus includes a quarter wave plate that converts the beam of laser light pulses into a beam of circularly polarized pulses.

Abstract: A method for physically separating non-metallic substrates by forming a microcrack in the substrate and controllingly propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate between its top and bottom surfaces. A scribe beam is applied onto the substrate on a separation line. A helium coolant stream intersects with, or is adjacent to, the trailing edge of the scribe beam. The temperature differential between the heat affected zone of the substrate and the coolant stream propagates the microcrack. Two breaking beams on opposing sides of the separation line follow the coolant stream. The breaking beams create controlled tensile forces that extend the crack to the bottom surface of the substrate for full separation. The scribe and break beams and coolant stream are simultaneously moved relative to the substrate. A preheat beam preheats the heat affected area on the substrate.

Abstract: Method and plant for cutting or welding by a laser beam with dual-flow and double-focus cutting head. The plant includes a laser generator to generate at least one main laser beam (10), a first optical element (1) enabling the main laser beam (10) to be divided into at least two subsidiary laser beams (11, 12), a first outlet nozzle (4) through which one (11) of the subsidiary laser beams passes, and a second outlet nozzle (3) through which the other (12) of the subsidiary laser beams passes, the first and second outlet nozzles (4, 3) being approximately coaxial one with the other. In this way, it is possible to focus the central beam (11) onto a focusing point (PF) by a first focusing element (1), such as a lens, and the other beam (12) onto an annular focusing zone (ZAF).

Abstract: A method of correcting laser beam intensity, a laser beam intensity correction mechanism and a multi-branched laser oscillation device having the correction mechanism to adjust the laser beam intensity easily and smoothly, are provided.

Abstract: When a laser beam is focussed onto a substrate for the purpose of substrate processing, the optical units such as beam expander, deflecting unit, and optical imaging device prescribe the range of depth of focus in which it is possible to work with a minimum spot size. The difficulty of boring thin holes, especially in thick substrates, is overcome with a second laser beam that is widened via a second beam expander and likewise focused onto the substrate via the deflecting unit and the optical imaging device. The position and the length of the second range of depth of focus can be varied by selecting the magnification of the second beam expander or by maladjustment. Thin holes can also be bored into thick substrates by using the two laser beams one after another.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: The invention relates to a changing device for a lens holder of a connecting head for a laser machining tool. The lens holder includes a focusing optical system arranged therein. The changing device has at least one station including a holder for gripping and holding a lens holder and an actuator for engaging a fastener provided on the connecting head. The fastener fixes and/or releases the lens holder from the connecting head. Each station may further include structure for installing/removing a cutting nozzle, cleaning a cutting nozzle, and/or inspecting the optical system or cutting nozzle.

Abstract: In a laser machining apparatus comprising a deflector for changing a direction of a laser beam outputted from a laser oscillator, and a converging lens for refracting the laser beam introduced from the deflector and focusing the laser beam onto a work to be machined, a lens position adjusting unit is provided for changing a relative position between a plurality of lenses constituting the converging lens and the lens position adjusting unit change the relative positions of the lenses so as to cancel a change in refractance of the lenses due to a change in the temperature.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: A light beam heating apparatus having a condensing lens mechanism including an aspherical lens and a spherical lens disposed in a light path. The light beam heating apparatus also includes a light source and a light path which transmits the light beam irradiated from the light source, to an object to be heated. The light beam is transmitted through an optical fiber along part the light path, and the aspherical lens and spherical lens are disposed on the optical fiber side and on the object-to-be-heated side respectively. The above-described construction functions to suppress lateral aberration when the diameter of an optical fiber in use is changed, thereby preventing deterioration of the imaging capacity. Also, the occurrence of chromatic aberration can be suppressed to a minimum. Thus, energy concentration in the light condensing section can be improved.

Abstract: A method and apparatus for positioning a surface of a workpiece for laser machining. A laser beam is focused to a focal point to form a plasma generating a plasma emission. An imaging system is oriented to receive the plasma emission and generate a plasma image. The imaging system is adjusted to focus the plasma image and is then fixed. The laser is then diverted away from the focal point and an illumination source is activated to illuminate the surface of the workpiece. The imaging system generates an image of the surface of the workpiece. The workpiece is adjusted in position toward the focal point until the image of the surface of the workpiece is in focus.

Abstract: Method and apparatus for cutting a workpiece made of stainless steel, coated steel, aluminum or aluminum alloy by the use of a transparent or reflecting optical means for focusing a laser beam and of an assist gas for said laser beam. The optical means is of the multifocus type and is chosen from lenses, mirrors and combinations thereof. The assist gas is oxygen or a nitrogen/oxygen mixture containing at least 90% nitrogen. The method of the invention makes it possible to increase the cutting performance by 40% compared with a conventional laser cutting method.

Abstract: An apparatus for physically separating non-metallic substrates by forming a microcrack in the substrate and controlling propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate between its top and bottom surf. A scribe beam is applied onto the substrate on a separation line. A helium coolant stream intersets with, or is adjacent to, the trailing edge of the scribe beam. The temperature differential between the heat affected zone of the substrate and the coolant stream propagates the microcrack. Two breaking beams on opposing sides of the separation line follow the coolant stream. The breaking beams create controlled tensile forces that extend the crack to the bottom surface of the substrate for full separation. The scribe and break beams and coolant stream are simultaneously moved relative to the substrate. A preheat beam preheats the heat affected area on the substrate.

Abstract: An imaging system for ablating an array matrix of high-density vias in a flexible and rigid desired object. The apparatus contains a mirror based x, y scanning repeat positioning and/or a single axis scanner positioning system that directs a single point of a coherent light radiation beam at desired individual mask segments. These mask segments are formed into a planar mask array. A flat field collimating lens system is positioned between the mirror scanning system and the mask arrays to correct the angular beam output of the repeat positioning mirror and redirects the beam so that it strikes a specific rear surface segment(s) of in the mask array. The flat field collimating lens provides a beam that either illuminates the mask perpendicular to its surface or at preselected optimized illumination angles. Once illuminated, the specific segment of the mask array images and processes a single or a plurality of desired holes or features in a top surface of a flexible or rigid desired object to be processed.

Abstract: Magnetic data storage disks, particularly along dedicated transducing head contact regions, are laser textured according to a process in which beam shaping optical components impart an elliptical or otherwise elongated cross-section to the laser beam. Consequently, individual texturing features such as rims and nodules are elliptical or elongate, with more gradual height gradients in directions parallel to their major axes. The texturing features further are oriented with respect to the direction of transducing head accelerations and decelerations, which yields high performance in terms of reduced flying height, improved glide avalanche, reduced dynamic friction, reduced stiction and better wear characteristics. Texturing features are formed in a variety of patterns, including patterns with adjacent features contacting one another. A further refinement involves forming features with substantially different slopes on opposites sides of a maximum height region.

Abstract: A laser system for marking or perforating, including a laser tube and a head having an adjustable optical system with at least one focusing lens. The telescopic tube, a system of lenses for the light beam correction, and a deflexion system are integrally provided with the laser tube. In order to easily optimize the focal distance, a focusing lens is situated in a mobile tube of the telescopic tube which includes a mobile tube (17b) and a fixed tube (17a).

Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Abstract: An apparatus and method for trimming dye coated on a recordable disc substrate during production of an optical memory disc which includes a substrate rotation assembly for rotating the disc substrate, an optic assembly for directing a laser beam directly upon the rotatable substrate to trim the dye coated thereon, and a process byproduct removing assembly for removing the trimmed byproducts from the substrate.

Abstract: The substrate of a magnetic recording medium is laser textured using a continuous wave laser light beam and microfocusing lens system to form a laser textured data zone comprising a plurality of substantially uniform concentric microgrooves. A suitable microfocusing lens system includes an array of horizontally and vertically spaced apart microfocusing lenses, each optically linked to a fiber optic cable.

Abstract: A method of processing material with a laser beam. The material has two surfaces. The beam is focused by a multilens objective in a number of focal points which are approximately positioned on a common axis with an angle to the first surface. The focal points are spaced apart and used for cutting plates with several focal points being utilized for melting and cutting the plate material. As a result, a good cutting notch is obtained with good separation of the cut parts and poor adhesion of slag.