Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A method for profiling the perimeter border of a semiconductor chip, characterized by the following steps: the semiconductor chip is supported near to the perimeter border on supporting points which are spaced apart in the perimeter direction of the semiconductor chip, laser beams are directed to the perimeter border with the aid of at least two lasers or of two lens systems coupled with at least one laser, which are arranged on the perimeter of the laser chip, the lasers or lens systems and the semiconductor chip are rotated in relation to each other around the centre of the semiconductor chip, and the lasers or lens systems are moved in a plane vertical to the rotational plane such that portions of the perimeter border between the supporting points are profiled by laser irradiation, subsequently, the supporting points on the semiconductor chip are changed and the remaining border portions of the perimeter border are profiled, and during profiling, the hitting point of the laser beams on the perimeter border

Abstract: For introducing a weakened line into a component 10, which is rigid per se and does not conform to a supporting mold or a receiving means in correspondence with the true shape, especially into an injection-molded part such as an instrument panel of an automobile, a device is provided comprising a multi-axis machine tool with a CNC-control suited for processing base-oriented programs, and a receiving means 11 for the component 10 to be processed, distance sensors 13 for the CNC-control being assigned to the receiving means to detect the actual three-dimensional position of the component.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.

Abstract: Disclosed herein is a laser beam processing machine having a chuck table for holding a workpiece, a laser beam applicator for applying a laser beam capable of passing through the workpiece to the workpiece held on the chuck table, and a processing-feeder for moving the chuck table and the laser beam applicator relative to each other, the laser beam applicator having a laser beam oscillator, an optical transmitter for transmitting a laser beam oscillated from the laser beam oscillator and a condenser lens for converging a laser beam transmitted by the optical, transmitter. The optical transmitter includes a birefringence lens for separating the laser beam oscillated from the laser beam oscillator into normal light and abnormal light; and the condenser lens converges respectively the normal light and the abnormal light separated by the birefringence lens to form the focal point of the normal light and the focal point of the abnormal light.

Abstract: A hybrid laser processing apparatus 1 includes a laser oscillator 4 which oscillates a laser beam L, a high-pressure pump 5 which supplies liquid, wherein liquid supplied from the high-pressure pump 5 is injected from an injection nozzle 13 provided at a tip of a processing head 6 and becomes a liquid column W to reach an object to be processed 2. A first inclined plane 13b which reduces the diameter toward the object to be processed 2 is formed in the injection nozzle 13, the condensing lens 12 which condenses the laser beam L is designed so that the focus of the laser beam L is positioned beyond the injection nozzle 13 and closer to the side of the object to be processed 2 and the laser beam L on the side outer than the minimum diameter part 13d is reflected on the first inclined plane 13b and thereafter guided to the liquid column W. Positional matching of the condensing lens and the injection nozzle is simple and the guided laser beam does not pop out of the liquid column.

Abstract: The present invention relates to an apparatus (1) for generating a rotating laser beam (5) which may used for various applications including welding, cutting, drilling or ablation of materials. More particularly, the apparatus (1) according to the present invention is able to produce a fast rotating and accurate laser beam, because the main optical device (100) that is rotated consists of a first reflecting surface (102) rotating about an axis (X1), a second reflecting surface (26) having an annular shape, wherein the first reflecting surface (102) redirects said laser beam in to the direction of the second reflecting surface (26), which reflects said laser beam towards said axis (X1).

Abstract: A galvanometer mirror rotates in one direction when the galvanometer mirror is used. A spot can be scanned on an irradiated surface at a more constant speed by rotating the galvanometer mirror and by using the inertia. Moreover, it is preferable to make the galvanometer mirror heavy because the inertia becomes higher so that the spot is scanned at a more constant speed. In addition, in a polygon mirror of this invention, mirrors are arranged so as not to contact each other because a change time of the scanning position between the mirrors is provided. By moving the irradiated object with timing together when the laser light is not irradiated, the laser process can be performed efficiently.

Abstract: A scanning/laser ablation apparatus includes an orbiting objective mounted on a radial arm that is rotated around a central axis such that the objective travels along a circular scan path. An input laser beam is directed along the central axis to a first mirror, which redirects the beam to the orbiting objective, e.g., by way of a second mirror. The orbiting objective focuses the beam at a focal point that coincides with the planar surface of a target object (e.g., a solar cell wafer having a blanket passivation layer). As the focused beam passes over the target object, the laser beam is repeatedly pulsed to ablate corresponding portions of the passivation layer such that contact openings are formed during each scan pass. The laser pulses are timed such that associated contact openings from multiple scan passes are aligned in parallel columns that are subsequently connected by metallization.

Abstract: A laser scanning mechanism and multiple processing stations are circumferentially disposed around a central axis. The laser scanning mechanism includes a rotating member driven by a motor to rotate around the central axis, and an optical system fixedly mounted on the rotating member and arranged to redirect input laser beam pulses from the central axis along a circular scan path. Each station including a mechanism for moving a corresponding target object radially across the circular scan path. The laser beam pulses output from the scanning mechanism can be used to process (e.g., ablate material from) multiple target objects simultaneously. The laser scanning mechanism redirects the input laser beam pulses such that the laser beams remain on-axis and in focus as they are scanned along the circular (curved) scan path. A system for producing photovoltaic devices utilizes the laser ablation apparatus and a direct-write metallization apparatus.

Abstract: A method of machining a mold surface using laser includes the steps of preparing a laser device and an optical zoom lens assembly disposed in front of the laser device; using a computer to compute a sectional curvature of the mold surface to be machined, so as to obtain parameters for controlling variance in laser focal length; and machining the mold surface twice to remove mold material from desired areas and to polish the mold surface, so that the machined areas are blended with the original coarse surface to show the designed patterns while showing a polishing effect. Therefore, a product molded using the machined mold would show different changes or refraction of light.

Abstract: Crystallization by irradiation of laser light forms a plurality of convex portions (ridges) on the surface of a crystalline semiconductor film that is obtained, which decreases a film quality. A method of laser irradiation comprises the steps of: overlapping an area which is irradiated with a first laser beam of a pulsed oscillation having a wavelength of equal to or shorter than that of visible light with an area which is irradiated with a second laser beam of a pulsed oscillation having a longer wavelength than that of the first laser beam; and irradiating a subject to be irradiated with the first laser beam and the second laser beam while synchronizing the pulsed oscillation of the first laser beam with that of the second laser beam, and moving the subject to be irradiated, and the first laser beam and the second laser beam relatively each other.

Abstract: A method and apparatus for simultaneously heating materials, in particular for welding plastic components, having an arbitrary shape of a flat heating contour by laser radiation is provided. The apparatus has, an appropriate optical arrangement that is used to convert a laser beam into an annular laser beam and focus it onto the end wall of a light-guiding tube and couple it in. At an exit end, the tube is deformed in accordance with the desired heating contour such that the emerging laser beam has this heating contour.

Abstract: A laser welding apparatus and method for easily adjusting a laser focusing position according to a distance from a laser irradiating device to a laser irradiating point on a work piece, or a welding point. A post-collimation laser diameter is measured when the laser emitting end has an optimal laser diameter on the work piece with respect to the distance from the laser processing head to the work piece. Corresponding data is stored with the above distance and the post-collimation laser diameter corresponding to each other. During welding, a diameter of the laser beam passing through a collimate lens is measured by a laser diameter measuring device. The post-collimation laser diameter is adjusted to be an optimal value according to the corresponding data.

Abstract: Portable microwave plasma systems including supply lines for providing microwaves and gas flow are disclosed. The supply line includes at least one gas line or conduit and a microwave coaxial cable. A portable microwave plasma system includes a microwave source, a waveguide-to-coax adapter and a waveguide that interconnects the microwave source with the waveguide-to-coax adapter, a portable discharge unit and the supply line. The portable discharge unit includes a gas flow tube coupled to the supply line to receive gas flow and a rod-shaped conductor that is axially disposed in the gas flow tube and has an end configured to receive microwaves from the microwave coaxial cable and a tapered tip positioned adjacent the outlet portion of the gas flow tube. The tapered tip is configured to focus microwave traveling through the rod-shaped conductor and generate plasma from the gas flow.

Abstract: A method for laser welding at least two metal parts, wherein the parts are welded along a weld area, includes simultaneously applying a continuous laser beam and a pulsed laser beam onto the weld area. The action of the pulsed laser is added to that of the continuous laser; with the continuous laser, it is possible to establish a stable molten bath in the weld area, the pulsed laser by its large peak energy, facilitating penetration of the energy and therefore of the molten bath, which allows deeper welding. A device for implementing the method is also disclosed.

Abstract: Optical apparatus for projecting a line of light includes a diode-laser bar having a plurality of individual emitters, input and output microlens arrays, a lens and other optical elements. The diode-laser bar, the microlens arrays, and the lens are configured and arranged such that the microlens arrays form three or more slow-axis intermediate near-field images of each emitter in a plane immediately adjacent the output microlens array, and in a telecentric arrangement with the lens. The lens and the optical elements project overlapping elongated far-field images of the intermediate near-field images to form the line of light.

Abstract: The invention is directed to an apparatus for cutting material by means of a milling cutter and laser radiation. The apparatus comprises a milling unit, a work spindle, a milling cutter, a laser, deflecting elements, focusing optics, and a work table. According to the invention, a workpiece can be milled and lasered simultaneously or successively at the same cutting location in that the laser beam is coupled into a channel coaxial to the mill axis.

Abstract: An energy beam machining system includes an emitter for emitting an energy beam and beam adjusting optics, such as a zoom telescope, for adjusting the pupil size of the system to multiple values. The adjusting of the pupil size can be carried out automatically, semi-automatically, or manually. In manual modes, instructions can be presented to the operator (e.g., via a monitor or pre-programmed audio instruction) indicating how to adjust pupil size. A focus lens focuses the adjusted beam directed along each path at a different focal point within a scan field encompassed in the field of view of the focus lens. Beam directing optics are configured to enable multiple scan fields within the field of view of the focus lens.

Abstract: A laser machining system is provided that includes a work-piece and at least one light source that produces a laser light along a first axis. The laser light defines a first portion of laser light and a second portion of laser light radially inward relative to the first portion. An optical element reflects the first portion of laser light at an angle relative to the first axis so that the second portion of laser light passes through the optical element along the first axis. A first optical assembly collimates the first portion of laser light into a first cross-sectional area on the work-piece at a sufficient power density to machine the work-piece.

Abstract: A glass substrate is irradiated with a converged laser beam to thereby form a spherical or nearly spherical convex portion on a surface of the glass substrate. More preferably, there may be used a method including the steps of: sticking a glass substrate to a flat member having a predetermined spherical or aspherical concave portion formed therein; and irradiating a converged laser beam onto a surface of the glass substrate just under the concave portion while making the converged laser beam penetrate through the flat member to thereby form a spherical or aspherical convex portion in the inside of the concave portion in accordance with the shape of the concave portion.

Abstract: To operate an optical device comprising an SLM with a two-dimensional array of controllable phase-modulating elements groups of individual phase-modulating elements are delineated, and control data selected from a store for each delineated group of phase-modulating elements. The selected control data are used to generate holograms at each group and one or both of the delineation of the groups and the selection of control data is/are varied. In this way upon illumination of the groups by light beams, light beams emergent from the groups are controllable independently of each other.

Abstract: A processing method including steps for splitting a single beam into a plurality of beams including a zero-order diffracted beam, by diffracting the single beam by a diffractive element, for turning an array of focused beam spots obtained from the plurality of beams about the center of the zero-order diffracted beam according to the direction of an array of welding points where parts mounted on a circuit board are welded to the board, for causing a spot interval between focused beam spots in the array to agree with the interval between the plurality of welding points by adjusting the distance from the diffractive element to the board, and for increasing the intensity of the plurality of beams, to a welding intensity, and connecting the parts by simultaneously irradiating the welding points with the focused beam spots in the array having the determined direction and spot interval.

Abstract: A laser machining apparatus machines a workpiece at uniform intensity by converting a CO2 laser beam to uniform intensity using an intensity-converting element and a phase-matching element. The optical transmission system is configured such that the starting point of the laser beam pointing vector and the exit face of the intensity-converting element are mutually conjugated with respect to the optical transmission system. This structure offers stable machining by ensuring that the laser beam always enters the intensity-converting element at its center, even if the pointing vector of the laser beam shifts.

Abstract: A laser material processing apparatus for processing a workpiece (22) in such a way as to separate one laser light (26) into two laser beams (26a, 26b) via first polarizer (25), one laser beam being passed via the mirrors (24), the other laser beam being scanned biaxially by a first galvano scanner (29), and conduct two laser beams (26a, 26b) to a second polarizer (27) for scanning via a second galvano scanner (30), wherein an optical path is constituted such that the laser beam (26b) transmitted through the first polarizer (25) is reflected by the second polarizer (27), and the laser beam (26a) reflected by the first polarizer (25) is transmitted through the second polarizer (27).

Abstract: The invention is an apparatus and a method for drilling holes in a work piece with a laser. A laser beam is received by the optical system and directed along an optical path. The system directs the laser beam through a moveable mask aperture creating a sub-beam, that is reduced in size by a lens system as it is imaged onto a work piece. Multiple features are formed in the work piece by moving the mask.

Abstract: In a laser processing apparatus including an ultra-short pulse laser a focusing optical system and processing a work by projecting a beam delivered through the focusing optical system on to the work, the focusing optical system has at least a pair of diffractive surface and a refractive surface, and chromatic aberration is corrected or chromatic aberration and pulse extension are corrected by making use of the diffractive dispersions due to and the diffractive surface the refractive dispersion due to of the refractive surface. With this arrangement, chromatic aberration is corrected or both chromatic aberration and pulse expansion are corrected in the processing with the ultra-short pulse laser and thereby improve the practical use and value of the processing by improving its accuray, qualiy and speed.

Abstract: A method and system are described aimed at substantially increasing the lifetime of sensitive optical elements subjected to high power laser radiation. The lifetime enhancement is accomplished by spatially distributing the laser beam spots both globally and locally according to algorithms that are custom tailored to the subject element as well as the system and application needs. The methods of the invention are particularly well-suited to non-linear crystals used to convert radiation from high repetition rate, diode-pumped laser systems into the UV spectral range, where lifetime requirements are particularly challenging. The methods of the invention further enable effective utilization of available experimental data characterizing the element's performance in combination with a stored library of preferred spot scanning patterns that may be executed on the surface of the element according to the selected algorithm.

Abstract: The present invention relates to a method for writing an optical structure within a workpiece of a dielectric material using FLDM. In a first embodiment system parameters for the FLDM are determined in dependence upon the dielectric material, a predetermined volume element and a predetermined change of the refractive index of the dielectric material within the predetermined volume element. The system parameters are determined such that self-focusing of a pulsed femtosecond laser beam is inhibted by non-linear absorption of the energy of the pulsed femtosecond laser beam within the dielectric material. A pulsed femtosecond laser beam based on the determined system parameters is focused at a predetermined location within the workpiece for inducing a change of the refractive index through dielectric modification within the predetermined volume element, the volume element including the focus. Various embodiments enable writing of various different optical structures into a workpiece.

Abstract: A laser irradiating system, comprising a light source for emitting a laser beam in elliptical shape, a light source holder for holding the light source, a base for rotatably supporting the light source holder, a first driving unit for rotating the light source holder, a deflecting optical means for deflecting the laser beam from the light source in a direction perpendicular to an optical axis, a rotator holder for holding the deflecting optical means and being rotatable around the optical axis of the light source, a cylindrical lens being arranged so that a center of the cylindrical lens is aligned with the optical axis and the laser beam from the deflecting optical means enters perpendicularly to the optical axis and for diffusing the transmitting laser beam to a fan-shaped laser beam, a control unit for controlling the first driving unit and a receiver for receiving a signal for remote-control operation, wherein an irradiating direction of the fan-shaped laser beam can be operated in remote control operatio

Abstract: A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F? lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F? lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F? lens, and an object is set to be not more than 0.08.

Abstract: A footprint (an area on a plane necessary for processing) of a laser irradiation apparatus for moving a stage supporting thereon a substrate in X and Y direction becomes unavoidably large when the substrate becomes greater in size, and the apparatus becomes very great as a whole. In a laser irradiation apparatus of the invention, a galvanomirror or a polygon mirror irradiates and scans a laser beam to and on a semiconductor film and always keeps an angle ? of incidence of the laser beam to the semiconductor film at a certain angle.

Abstract: A laser cutting or welding device, the device having a laser head (10) and a robot (35), wherein the laser head is attached to the robot (35). The laser head (10) has a housing (12), a focal lens (26) disposed within the housing and a light source (18) in optical communication with the focal lens (26). The housing (12) has a nozzle with a tip (90), the tip having an exit port (17). The laser head (10) has means (33) for adjusting a light path of a light beam directed from the light source onto a focal optic to center a focusing beam formed by the focal optic coaxial with the tip. In one aspect hereof, the laser device has a crash avoidance system.

Abstract: A plurality of feedthrough holes are efficiently formed on the present invention by splitting a laser beam emitted from a laser source into plural laser beams by allowing the beam to pass through a diffraction grating, followed by simultaneously forming a plurality of the feedthrough holes on the ceramic green sheet by irradiating the ceramic green sheet with the split laser beam.

Abstract: Preferred embodiments of a system and methods to deliver different magnitudes of laser power density to a work piece while maintaining a constant focusing spot size are described. In particular, the system includes a laser, an optical focusing assembly and an overlay. The overlay receives a laser beam having a perimeter at a first magnitude of power and transmits the laser beam to the optical focusing assembly at about the same perimeter and at a magnitude lower than the first magnitude. In a preferred embodiment, the overlay can include an optically neutral blocking lens or a neutral density filter. A method of laser machining an orifice at a suitable average power density sufficient to machine the orifice with reduced heat affected zone, spatters, soots or recasts is described. A method of providing a focusing spot size of a generally constant effective area by a laser machining system is also described.

Abstract: A magnetic disk is provided which comprises a nonmetallic glass or glass ceramic substrate having one or more under layers, a magnetic layer applied over the under layers, and a hard carbon layer applied over the magnetic layer. A plurality of bumps are formed on the magnetic disk by applying a beam from a near infrared wavelength laser to the surface of the carbon layer.

Abstract: A diode-pumped, solid-state laser (52) of a laser system (50) provides ultraviolet Gaussian output (54) that is converted by a diffractive optical element (90) into shaped output (94) having a uniform irradiance profile. A high percentage of the shaped output (94) is focused through an aperture of a mask (98) to provide imaged to provide imaged shaped output (118). The laser system (50) facilitates a method for increasing the throughput of a via drilling process over that available with an analogous clipped Gaussian laser system. This method is particularly advantageous for drilling blind vias (20b) that have better edge, bottom, and taper qualities than those produced by a clipped Gaussian laser system. An alternative laser system (150) employs a pair of beam diverting galvanometer mirrors (152, 154) that directs the Gaussian output around a shaped imaging system (70) that includes a diffractive optical element (90) and a mask (98).

Abstract: An optical processing apparatus has high reliability and stable welding quality. In the processing apparatus, a semiconductor laser and an optical system are disposed to a flow path of processing gas. The gas protects the semiconductor laser and the optical system from moisture and dust while cooling them. In addition, the apparatus also leads the processing gas to flow through a holder of the optical system to increase cooling effect for the optical system and to improve an optical accuracy. The apparatus guides the processing gas along a surface of a cover glass inside a nozzle ejecting the processing gas to a workpiece, to prevent the surface of the cover glass from being damaged and stained. The processing gas is ejected in a direction coaxial with a direction of output light, so as to shield an area being processed.

Abstract: A laser machining head for machining a workpiece by a laser beam. The head has a head housing through which the laser beam passes along a central axis. A carrier member for a lens optics system for focusing the laser beam is mounted on the head housing and is displaceable relative to the latter in the direction of the central axis. A first setting device includes a cable connected to the carrier member and a cable drum connected to the head housing for winding up the cable in order to move the carrier member towards the head housing. A second setting device causes the carrier member to be displaced in the direction away from the head housing, with the second setting device being separate from the first setting device.

Abstract: As the output of laser oscillators become higher, it becomes necessary to develop a longer linear shape beam for a process of laser annealing of a semiconductor film. However, if the length of the linear shape beam is from 300 to 1000 mm, or greater, then the optical path length of an optical system for forming the linear shape beam becomes very long, thereby increasing its footprint size. The present invention shortens the optical path length. In order to make the optical path length of the optical system as short as possible, and to increase only the length of the linear shape beam, curvature may be given to the semiconductor film in the longitudinal direction of the linear shape beam. For example, if the size of the linear shape beam is taken as 1 m×0.4 mm, then it is necessary for the optical path length of the optical system to be on the order of 10 m.

Abstract: A device (1) for machining materials by means of a laser beam (2) comprises a lens arrangement (4) through which passes the light emitted by a laser source. Said lens arrangement (4) is tilted relative to the optical axis (5) and arranged eccentrically in order to change the cross-sectional area of the laser beam (2), particularly from an elliptical to a circular geometry, and at the same time to compensate an inclination angle of the laser beam passing through the lens arrangement in relation to the optical axis. This makes it possible to ensure the quality of the cut surface through essentially corresponding entry and exit cross-sectional areas of the laser beam (2) on the material, without the laser beam (2) having to be circularly polarized for this purpose. The costs for producing the device (1) can thereby be kept comparatively low.

Abstract: A laser process in which stripe formation due to laser annealing is prevented and uniform laser annealing is made over the whole surface of a substrate. A laser beam having an energy distribution with an edge which has a nearly vertical shape l used, and when scanning of the laser beam is carried out, the scanning is carried out while the edge having the nearly vertical shape is made the front of the scanning.

Abstract: The present invention provides an improved nozzle assembly for deriving the final focus of a laser beam for a fine precision cut. A dial is integrally coupled to a nozzle body and a focusing lens group housing. The dial can be rotated in a clockwise or counterclockwise direction along its own axis. As the dial is being rotated, the dial's rotary motion engages the focusing lens group housing to also rotate on its own axis, and the focusing lens group contained within the housing can therefore be appreciably raised or lowered, significantly aiding the final focus. The dial has units of measurement that can be used to track the rotational position of the final focus. Similarly, the height indicator contains a micrometer that registers the final focus such that it can be recorded and replicated.

Abstract: A laser machining apparatus machines a workpiece at uniform intensity by converting a CO2 laser beam to uniform intensity using an intensity-converting element and a phase-matching element. The optical transmission system is configured such that the starting point of the laser beam pointing vector and the exit face of the intensity-converting element are mutually conjugated with respect to the optical transmission system. This structure offers stable machining by ensuring that the laser beam always enters the intensity-converting element at its center, even if the pointing vector of the laser beam shifts.

Abstract: The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.

Abstract: This invention relates to a laser beam machining apparatus equipped with a spatial light modulator. The laser beam machining apparatus according to this invention comprises a reflection-type spatial light modulator, hologram pattern writing means for writing onto said reflection-type spatial light modulator a hologram pattern corresponding to the desired optical image intended to be irradiated onto a target, laser beam irradiating means for irradiating readout light onto said reflection-type spatial light modulator at an incidence angle &thgr;, and a Fourier lens for performing a Fourier transform of said readout light, phase modulated by said reflection-type spatial light modulator. Through use of this laser beam machining apparatus, improvement in utilization efficiency of the readout light and improvement in the level of freedom in machining patterns can be expected.

Abstract: A laser irradiating system, comprising a light source for emitting a laser beam in elliptical shape, a light source holder for holding the light source, a base for rotatably supporting the light source holder, a first driving unit for rotating the light source holder, a deflecting optical means for deflecting the laser beam from the light source in a direction perpendicular to an optical axis, a rotator holder for holding the deflecting optical means and being rotatable around the optical axis of the light source, a cylindrical lens being arranged so that a center of the cylindrical lens is aligned with the optical axis and the laser beam from the deflecting optical means enters perpendicularly to the optical axis and for diffusing the transmitting laser beam to a fan-shaped laser beam, a control unit for controlling the first driving unit and a receiver for receiving a signal for remote-control operation, wherein an irradiating direction of the fan-shaped laser beam can be operated in remote control operatio

Abstract: A maskless patterning apparatus allows for laser beam ablation of one or more layers of material while not etching an underlying different material layer. A micromirror array produces the desired complex pattern on the workpiece and a continuous feature and end point detection system provides location and material parameter changes to accurately control the pattern position and depth of etching. End point detection includes monitoring energy reflected from a specially prepared replica of the material to be ablated, whose thickness and consistency match the active workpiece area. The process terminates when the proper amount of material is removed.

Abstract: A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Abstract: Methods and devices are described that are needed to design and fabricate modified surfaces on contact lenses or on corneal tissue that correct the eye's optical aberrations beyond defocus and astigmatism. The invention provides the means for: 1) measuring the eye's optical aberrations either with or without a contact lens in place on the cornea, 2) performing a mathematical analysis on the eye's optical aberrations in order to design a modified surface shape for the original contact lens or cornea that will correct the optical aberrations, 3) fabricating the aberration-correcting surface on a contact lens by diamond point turning, three dimensional contour cutting, laser ablation, thermal molding, photolithography, thin film deposition, or surface chemistry alteration, and 4) fabricating the aberration-correcting surface on a cornea by laser ablation.