Abstract: An improved electrode for use in a plasma arc torch. The electrode includes an electrode body, a cavity in a front face at a first end of the electrode body, and an insert disposed in the cavity. The first end of the electrode body is formed of high purity copper containing at least 99.81% copper. The insert has a first end and a second end and is formed of a high emissivity material. A diameter of the first end of the insert is less than a diameter of a second end of the insert. An electrode is compressed to retain the insert using radial compression. The invention also includes a method for forming the electrode, and a method of operation of an electrode in a plasma torch.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table and a processing-feed means, wherein the laser beam application means comprises a first pulse laser beam application means and a second pulse laser beam application means; the first pulse laser beam application means comprises an acousto-optic deflection means for deflecting the optical axis of a pulse laser beam oscillated by a first pulse laser beam oscillation means in the processing-feed direction (X direction), and a first condenser lens for converging a pulse laser beam passing through the acousto-optic deflection means; the second pulse laser beam application means comprises a second condenser lens for converging a pulse laser beam oscillated by the second pulse laser beam oscillation means; and an NA value of the first condenser lens is set smaller than the NA value of the second condenser lens.

Abstract: A laser beam machining device (1) is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens (8), where in the lens (8) focuses the laser light (A) and guides it onto a machining point of a work piece (7). A distance (ma, mb) between the lens (8) and the light exit point (B) and a distance (la, lb) between the lens (8) and the machining point of the workpiece (7) and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device (1) is provided.

Abstract: A laser woodworking machine for cutting wood is disclosed. The machine includes a laser cutting head having two sections structurally configured to include sensors for measurements of depth and of reflected frequencies, a laser unit for supplying power to the laser cutting head, a cabinet enclosure for housing the laser unit and including a table surface, a radial arm supported by a column secured to the inside rear portion of the cabinet enclosure and including a pair of radial supports extending perpendicularly from opposite sides of the column and parallel to each other, and a glider carriage secured to the radial supports and including two substantially flat surfaces above and below the radial supports so that the glider carriage slides along the radial supports via sleeves, the glider carriage further comprising support for the laser cutting head so that the laser cutting head is moveable along the radial arm.

Abstract: The present invention discloses a laser puncher for punching holes on tipping paper in a curve manner, which comprises a panel, a light guiding cylinder, a laser connected with the light guiding cylinder, a transmission system driving a piece of tipping paper to move and at least one focusing optical head and at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is provided with the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the external periphery of the moving optical cylinder is provided with an anti-rotation linear bearing, which is fixed on the panel, and the driving motor drives the focusing optical head to reciprocate back and forth via the screw shaft, the nut, the c

Abstract: A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members.

Abstract: A laser processing apparatus includes a beam diameter adjusting unit provided between a laser oscillator and a focusing unit, an imaging unit for detecting the beam diameter of the laser beam directed to a detection path, an optical path length changing unit for moving the imaging unit along the detection path to thereby change an optical path length, and a controller for controlling the imaging unit, the beam diameter adjusting unit, and the optical path length changing unit. The controller operates to move the imaging unit to two positions where different optical path lengths are provided, detect the beam diameters of the laser beam at the two positions, and controls the beam diameter adjusting unit according to the two beam diameters detected above so that the two beam diameters have a predetermined relation.

Abstract: The invention relates to a laser machining head (1) with an integrated sensor device for monitoring the focus position, wherein laser machining head (1) has a focusing lens (4) and a downstream protective glass (5) in order to focus a machining beam (9) that strikes focusing lens (4) as a parallel beam into a resultant focal point (11) of focusing lens (4) with downstream protective glass (5), in which focal point a workpiece (12) is arranged. A beam splitter (3), arranged upstream of focusing lens (4) in the beam path, is transmissive for a first portion of a laser beam (8) coupled into laser machining head (1), the machining beam (9), and is reflective for a second portion, a measurement beam (10).

Abstract: A method and an apparatus for laser beam processing of an element (12) that has a total transmittance for light of at least 10?5, comprising a laser unit (1) for generating a laser beam on one side of the to-be-processed element (12), an illumination unit (7), an imaging system (10) comprising a sensor unit on the one side of the to-be-processed element (12), the sensor unit recording residual light that results from light of the illumination unit (7), a scanning unit (2) for adjusting the laser beam processing position, and a control unit. The control unit is operatively connected to the laser unit (1), the imaging system (10) and the scanning unit (2), and the illumination unit (7) is positioned on the other side of the to-be-processed element (12) in relation to the laser unit (1). Since the to-be-processed element (12) allows light to pass through an otherwise opaque or almost opaque layer, a good contrast is obtained that is used to determine the position of the laser beam with high precision.

Abstract: A description is given of a modular laser processing system (10) for processing a workpiece (20) by means of a processing laser beam (14), which system has a multiplicity of functional modules (100) with a beam passage region (102) which can be connected to one another in series along a processing laser beam path, comprising a functional module (100) embodied as a fiber connection module (104) and serving for accommodating a fiber end from which the processing laser beam (14) emerges, and a functional module (100) embodied as a collimator module (106) and having a collimator lens (16a, 16b, 16c), which collimates the processing laser beam (14), wherein the collimator lens (16a, 16b, 16c) is selected from a group of collimator lenses having different focal lengths which correspond to a raster dimension (L1) or to an integer multiple thereof, characterized in that the length (A) of the beam passage region (102) of a functional module (100) along the processing laser beam path corresponds to the raster dimension

Abstract: A survival apparatus operable to ignite a combustible material wherein the survival apparatus additionally functions as a zipper pull-tab for an article of clothing. The survival apparatus further includes a body that is substantially rigid and generally rectangular in shape. The body includes a first aperture that is oval in shape and has a convex lens mounted therein. A coating is disposed over the body operable to substantially inhibit damage to the lens mounted within the first aperture during use as a zipper pull. A release strip is intermediate the body and the coating wherein the release strip further includes a tab providing an interface to engage the release strip.

Abstract: A device for applying laser radiation to an at least partially reflective or transparent region or a workpiece disposed in a working area, with a laser light source for generating the laser radiation and optics for influencing the laser radiation, such that the radiation is transferred into the working area, wherein the optics comprise at least one mirror that can reflect a part of the laser radiation reflected in the working area or a part of the laser radiation having passed through the working area, such that said part of the laser radiation is at least partially fed hack into the working area.

Abstract: A laser processing apparatus for processing a multitude of portions to be processed in an area to be processed in a subject W to be processed, including a laser device, a focusing or imaging device for laser beams provided by the laser device, and an arranging device for arranging the subject W to be processed, in which the subject W to be processed and the focusing or imaging device are fixed, and the subject to be processed is processed while relatively shifting the laser beams and the focusing or imaging device so that the focusing or imaging device is irradiated from different areas in the laser beam, inside and outside the area to be processed, and that cumulative laser beam irradiation time during the processing of each of the multitude of portions to be processed is equalized.

Abstract: A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.

Abstract: It is desirable for the production of workpieces, which are sometimes produced by a rapid prototyping method, to be further automatable. To this end a device is provided having a laser for generating a laser beam in order to set a material, and a workpiece support which can be exposed directly to the laser. There is also provided an optical instrument for redirecting and deviating the laser beam so that the workpiece support can also be exposed indirectly to the laser. Material can therefore also be cured more easily in undercuts of workpiece blanks.

Abstract: A laser processing unit includes a torch that is automatically mounted on a processing head. The torch has an assist gas chamber and a balance chamber, and the assist gas is supplied to the chambers. Constantly, equal pressures act on the both chambers, and an upward first force and a downward second force that act on a lens holder offset each other because pressure reception areas are equal. Gas is supplied to a gas spring chamber to provide a constant upward force to the lens holder. A driving device has an arm driven by a servomotor. The arm is in contact with a pin and the lens holder is moved to a predetermined position for automatically adjusting a focus position FC of a collective lens.

Abstract: A laser processing apparatus including a detecting unit. The detecting unit includes a white light source for emitting white light, a focusing lens for focusing the white light to the workpiece, a first optical fiber for guiding the white light emitted from the white light source to the focusing lens, a detector for detecting the intensity of reflected light from the workpiece, and a second optical fiber for guiding the reflected light to the detector. Accordingly, the white light to be focused to the workpiece can be easily handled and only a wavelength component focused on the workpiece can be stably propagated.

Abstract: A laser machining system and method uses a shaped laser beam, such as a long, narrow beam, and effectively scans the beam in the narrow direction across a mask having an aperture pattern. The pattern on the mask is imaged onto a moving workpiece and the patterned laser beam selectively removes material from the workpiece. The workpiece may be moved using a coordinated synchronized rotational motion. The laser may use a longer wavelength (e.g., 248 nm) and the beam may be scanned at a high rate of speed to reduce the dissipation of the residual thermal energy in the material being machined. In one embodiment, this system and method may be used to machine a complex pattern into a curved surface with relatively high resolution and high speeds.

Abstract: A laser beam applying apparatus includes a laser beam oscillating unit, a focusing lens, and a diffractive optic element provided between the laser beam oscillating unit and the focusing lens for defining the spot shape of the laser beam oscillated by the laser beam oscillating unit. A zeroth-order light removing unit removes zeroth-order light emerging from the diffractive optic element and leaves first-order light whose spot shape has been defined by the diffractive optic element and the focusing lens. A first prism has an incident surface and an emergent surface inclined with respect to the incident surface. A second prism has a zeroth-order light reflecting surface for reflecting the zeroth-order light and a first-order light emerging surface from which the first-order light emerges. A damper absorbs the zeroth-order light reflected on the zeroth-order light reflecting surface of the second prism.

Abstract: Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces.

Abstract: An apparatus 101 for singulating an object is disclosed. The apparatus 101 comprises a laser 103 configured to emit a laser beam 105 with a Gaussian irradiance profile, as well as a beam-shaping device 115 configured to reshape the Gaussian irradiance profile of the laser beam 105 emitted from the laser 103. In particular, the beam-shaping device 115 has a plurality of aspherical lenses 117, 119 to redistribute irradiance of the laser beam 105, so as to reduce variation of the irradiance in an effective irradiation spectrum of the laser beam 105 for singulating the object. By redistributing the irradiance of the laser beam 105, irradiation energy may be more efficiently delivered to the semiconductor wafer 102 for laser singulation, compared with conventional laser beams with Gaussian irradiance profiles which are non-uniform. A method of singulating an object is also disclosed.

Abstract: Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region.

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: A laser machining device 1 includes a laser light source 10, a spatial light modulator 20, a controller 22, a converging optical system 30, and a shielding member 40. The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10, displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91, and machines an object to be machined 90.

Abstract: A laser processing apparatus having a holding unit for holding a workpiece to be processed and a processing unit for applying a laser beam to the workpiece held by the holding unit. The processing unit includes an oscillator for oscillating the laser beam, a focusing lens for focusing the laser beam oscillated by the oscillator toward the workpiece, and a focal position adjusting mechanism for adjusting the focal position of the laser beam focused by the focusing lens. The focal position adjusting mechanism includes a movable unit having a permanent magnet and supporting the focusing lens, a fixed portion having a coil for moving the movable unit in a direction perpendicular to the workpiece and a gas bearing for supporting the movable unit by using a gas, and a supporting member for supporting the movable unit from the under side by using a magnetic repulsive action.

Abstract: Laser beam positioning systems for material processing and methods for using such systems are disclosed herein. One embodiment of a laser-based material processing system, for example, can include (a) a radiation source configured to produce a laser beam and direct the beam along a beam path, and (b) a laser beam positioning assembly in the beam path. The laser beam positioning assembly can include a first focusing element, first and second reflective optical elements, and a second focusing element. The first focusing element can focus the laser beam to a first focal point between the first and second reflective optical elements. The first and second reflective optical elements can direct the laser beam toward a material processing area while the laser beam has a decreasing or increasing cross-sectional dimension. The second focusing element can focus the laser beam and direct the beam toward the material processing area.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Abstract: An adjustable plasma spray gun apparatus is disclosed. In one embodiment, an adjustable plasma spray gun apparatus includes: a plasma spray gun body having a fore portion and an aft portion; and a first coupler configured to removably attach to the plasma spray gun body at the aft portion, the coupler including: a first portion having a first axial opening configured to removably attach to the plasma spray gun body at the aft portion; and a second portion having a second axial opening configured to removably attach to one of an electrode body or a second coupler.

Abstract: The invention relates to a process for the adjustment of a laser light spot of high intensity for the laser processing of work pieces as well as a laser device for performing the proposed process. The laser device comprises a laser emitting a laser beam and at least one focusing lens for converging the laser beam as well as an optical operating element for adjusting the beam diameter of the laser beam. The invention proposes to use as operating element a diffractive optical element that separates the laser beam emitted by the laser into partial laser beams, with the partial laser beams generated by the diffractive optical element being assembled to form a resulting laser beam that acts on the work piece. By means of a suitable design of the diffractive optical element it is possible to adjust, in particular enlarge, the diameter of the laser light spot as required.

Abstract: Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.

Abstract: A laser processing system and a laser processing method that can highly accurately and efficiently specify a focus position of a processing laser using visible lasers are provided.

Abstract: Provided herein are methods and systems for scribing solar cell structures to create isolated solar cells. According to various embodiments, the methods involve scanning an excimer laser beam along a scribe line of a solar cell structure to ablate electrically active layers of the structure. A photomask having variable transmittance is disposed between the beam source and the solar cell structure. The transmittance is calibrated to produce variable fluence levels such that a stepped scribed profile is obtained. In certain embodiments, a front contact/absorber/back contact stack is removed along a portion of the scribe line, while a front contact/absorber stack is simultaneously removed along a parallel portion, with the back contact layer unremoved. In this manner, the scribe electrically isolates solar cells on either side of the scribe line, while providing a contact point to the back contact layer of one of the solar cells for subsequent cell-cell interconnection.

Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Abstract: A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract: An object to be processed 1 is irradiated with a laser light L modulated by a reflection type spatial light modulator 203 such that aberration of the laser light L converged inside the object 1 becomes a predetermined aberration or less. Therefore, aberration of the laser light L generated at a position on which a converging point P of the laser light L is located is made as small as possible, to enhance the energy density of the laser light L at that position, which makes it possible to form a modified region 7 with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator 203 is used, it is possible to improve the utilization efficiency of the laser light L as compared with a transmissive type spatial light modulator. Such improvement of the utilization efficiency of the laser light L is particularly important in the case in which the modified region 7 serving as a starting point for cutting is formed in the plate-shaped object 1.

Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.

Abstract: The invention concerns a laser device for joining work pieces made of plastic by means of beam welding technology, with a processing head that has focusing devices for the laser beam. Here, the focusing device that is closest to the work pieces has a rotatably supported cylinder lens in the shape of a roller that focuses the laser beam along a single axis and presses the work pieces together in the form of a line in an area around the impact point of the laser beam. In order to enable the cylinder lens to always contact the surface of the work piece facing the processing head in a precisely tangential manner, the processing head has a pendulum-type suspension for the rotatable cylinder lens. This also makes it possible for the contact pressure exerted by the processing head to always act perpendicularly on the work pieces so that they are pressed together in all welding places in the same way in a defined manner during the welding process.

Abstract: Disclosed are systems for scoring non-flat materials including non-flat glass sheets (1000). In one embodiment, a laser scoring system is described. The laser scoring system includes a laser (102) and an optical head (106). The optical head (106) is configured to receive output from the laser (102) and focus the output into an elongated laser beam having a beam waist and an extended focal depth of greater than +/?5 mm relative to the center of the beam waist with a power density sufficient for scoring a material having at least a portion within the extended focal depth. In one aspect the system can include a beam expander (104). The beam expander (104) receives the output from the laser (102), expands the output from the laser to an expanded laser beam, and transmits the expanded laser beam to the optical head (106).

Abstract: A laser beam machining apparatus including a laser beam irradiation unit, the laser beam irradiation unit including: a laser beam oscillator for oscillating a laser beam; a beam splitter by which the laser beam oscillated by the laser beam oscillator is split into a first laser beam and a second laser beam; a rotary half-wave plate disposed between the laser beam oscillator and the beam splitter; a condenser lens disposed in a first optical path for guiding the first laser beam split by the beam splitter; a first reflecting mirror disposed in a second optical path for guiding the second laser beam split by the beam splitter; a first quarter-wave plate disposed between the beam splitter and the first reflecting mirror; a second reflecting mirror disposed in a third optical path for splitting thereinto the second laser beam returned to the beam splitter through the second optical path; a second quarter-wave plate disposed between the beam splitter and the second reflecting mirror; and a cylindrical lens dispose

Abstract: A laser beam machining apparatus including a beam oscillator; a beam adjusting unit disposed between the beam oscillator and a condenser lens and by which the beam diameter and the divergence angle of the beam oscillated from the beam oscillator are adjusted; and a beam diameter and divergence angle detecting unit for detecting the beam diameter and the divergence angle of the beam having passed through the beam adjusting unit. The apparatus further includes a control unit which computes the beam diameter and the divergence angle of the beam, based on detection signals from the beam diameter and divergence angle detecting unit, and which controls the beam adjusting unit, based on the computed beam diameter and divergence angle of the beam and the beam diameter and the divergence angle of the laser beam incident on the beam diameter and divergence angle detecting unit.

Abstract: A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens to the first conducting layer. Portions of the first conducting layer are scribed form a trench through the layer. The lens focuses the beam and has a focal length at least 100 mm. The focused beam includes an effective portion effective for the scribing and an ineffective portion ineffective for the scribing. The substrate sags and the first conducting layer remains in the effective portion of the focused beam across the area during the step of applying. One or more active layers are provided on the first conducting layer. A second conducting layer is provided on the one or more active layers.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second pulsed laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs respective first and second pulses from the first and second pulsed laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device generating at least two beams including a first beam and a second beam, the first beam and the second beam each having an impact point on the workpiece, the first and second impact points being positioned diagonally with respect to the X and Y axes of the workpiece, and at least one actuator to move at least one of the impact points relative to the workpiece and the workpiece relative to the impact points.

Abstract: A laser processing beam machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means; and the condenser comprises a condenser lens opposed to the workpiece held on the chuck table, a cylindrical lens arranged on the upstream side in the laser beam application direction of the condenser lens, and an interval adjustment mechanism for adjusting the interval between the condenser lens and the cylindrical lens.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for emitting a pulse laser beam; a defection section for deflecting the pulse laser beam emitted from the laser beam oscillation section; and a concentrator having an ellipsoidal focusing spot forming section for focusing the pulse laser beam deflected by the deflection unit and forming a focusing spot into an ellipse.

Abstract: A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.

Abstract: An apparatus that divides a single laser beam into two or more beams that can be directed at an object, such as a work piece, to perform laser heat treatment is disclosed. An adapter stage is in optical communication with a light source, such as a laser source, and arranged to receive a light beam from the light source. A focus stage in optical communication with the adapter stage is arranged to receive the light beam from the adapter stage and to focus the light beam. A beam splitting stage in optical communication with the focus stage is arranged to receive the focused light beam and to split the focused light beam into a multiple light beams. A redirection stage in optical communication with the beam splitting stage is arranged to receive the multiple light beams and to direct them toward a plurality of target locations on the object.