Abstract: A laser index device is connected to a main shaft of machine and includes a lens unit for generating a laser beam which is refracted via a prism to produce a laser mark on the product so as to guide the user to move an inspection device to inspect the produce. An image processing device is located above the lens unit and display the image on a display device. A machining display unit displays movement of tool to machine the product.

Abstract: A robot laser processing system (10) comprises at least one robot controller (14) for controlling at least one robot, a host controller (12) connected to the robot controller through a first network (11) for overall control of the robot controller, and a plurality of laser oscillators (16-1 to 16-n) selectively connectable to the processing nozzle (35) mounted on each robot and connected to the robot controller through a second network (18-1 to 18-n). An instruction from the host controller is transmitted to the robot controller through the first network, so that the robot controller determines the laser oscillator to be controlled and directly controls the particular laser oscillator through the second network. As a result, a processing command can be issued directly to the laser oscillator from the robot controller without intervention by the host controller.

Abstract: The invention provides a laser hardening method capable of preventing adjacent already-hardened layers from being annealed. In the laser hardening method of the present invention, conduits C1, C2 and C3 are processed in advance midway between pitches P1 along which a hardening nozzle 190 performs overlap hardening. After moving the nozzle 190 along a center line L3 to process a hardening layer H23, the nozzle 190 is moved in parallel for a single pitch P1 to perform hardening of a hardening layer H24. Thermal energy E1 of the laser beam LB is also irradiated toward the direction of the hardening layer H23, but it is blocked by the conduit C3 that prevents the laser beam from annealing the hardening layer H23.

Abstract: The invention relates to a method of and to an apparatus for perforating the tubular wrappers of plain or filter cigarettes and other rod-shaped articles of the tobacco processing industry. The articles are advanced sideways at the periphery of a rotary drum-shaped carrier which cooperates with a device serving to roll them about their longitudinal axes while the wrappers are being perforated by one or more pulsating beams issuing from one or more lasers and passing through a stationary cylinder lens on their way to the facets of a rotating cylindrical mirror which directs the beam(s) across the axis of the carrier and pivots the beam(s) about such axis on its or their way radially outwardly of the carrier toward a first set of stationary deflecting mirrors.

Abstract: The invention relates to an apparatus and method for clamping components (12) during machining, in particular during welding of sheet-metal components arranged in two or multiple layers, having a holder (10) for a machining head (11), in particular for a laser machining head, which can be fitted on an industrial robot in order to guide the machining head (11) along a machining line, a pressure-exerting element (14) which is fitted on the holder (10) in a movable fashion relative thereto, and a pressure-exerting device (17) which is provided operatively between holder (10) and pressure-exerting element (14), with the aid of which the pressure-exerting element (14) can be moved relative to the holder (10).

Abstract: The invention provides a laser beam machine having a light path duct with improved dust proof property. A light path system 1 of a laser beam machine comprises a light path duct 10 having a U-shaped cross-section with the upper end opened, wherein the opening portion is covered by a steel belt 30. The laser beam extraction unit 50 traveling on the light path duct 10 in the direction of arrow A elevates the steel belt 30 and extracts the laser beam from the light path duct 10. The steel belt 30 has a guiding projection 32 disposed at the center thereof. The laser beam extraction unit 50 has a guide roller 64 disposed below the steel belt 30 and a guide roller 62 having a V-shaped groove 62a for engaging the projection on the steel belt 30, thereby preventing displacement of the steel belt.

Abstract: A system and method for selectable area laser treatment of a substrate, such as thin film transistors, the system including a holder holding a substrate in proximity to reactant, and laser beams each addressing independently selectable mutually set apart locations on the substrate to induce a reaction between the substrate and the reactant.

Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: A laser processing apparatus has a first laser beam reversal apparatus which reverses the laser beam from the laser oscillator, and a second laser beam reversal apparatus which reverses the laser beam reversed by the first laser beam reversal apparatus, and guides the laser beam to the inside of the processing head, in which a first laser optical path which runs from the laser oscillator to the first laser beam reversal apparatus, a second laser optical path which runs form the first laser beam reversal apparatus to the second laser beam reversal apparatus, and a third laser optical path which runs from the second laser beam reversal apparatus to the processing head are parallel.

Abstract: Method and apparatus for heating plastic by laser beams with the aid of a number of laser points on the focal plane, the laser points being produced by an optical arrangement with the aid of a multiple wedge plate. The arrangement can be integrated in a processing head.

Abstract: A laser beam machine can make quality of machining almost constant in such a manner that a first reflecting means in a first beam guide portion is moved and driven so as to maintain a length of an optical path of laser beam to be almost constant in spite of a moved position of a machining head. According to the invention, a second reflecting means for catching laser beam in a second beam guide portion is located at a position facing the first reflecting means, thereby relatively shortening a length of the optical path between the first and second reflecting means and shortening the whole length of the optical path, and maintaining quality of machining with laser beam good.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.

Abstract: A laser processing head collision protection apparatus includes a carrier member, and a laser processing head detachably coupled to the carrier member by a plurality of pairs of truncated cones.

Abstract: A laser processing robot including a manipulator; a laser processing tool attached to the manipulator; an optical fiber for transmitting a laser beam to the laser processing tool; and a line passage formed inside the arm section to accommodate the optical fiber. The arm section includes a first member disposed fixedly about a first control axis and a second member supported on the first member rotatably about the first control axis. The line passage is formed continuously within the first and second members, an optical fiber inlet port thereof being provided in the first member and an optical fiber outlet port thereof being provided in the wrist portion. The laser processing tool includes an attachment section attached to the wrist portion rotatably about a second control axis perpendicular to the first control axis; a nozzle section extending from the attachment section and provided with a laser beam passage.

Abstract: An optical marking apparatus includes: a laser illuminator mounted in a housing for emitting a laser optical line for marking purpose, and an angle-variating device provided in the housing; whereby upon an angular rotation of the apparatus, the laser illuminator will outwardly project a laser line which is angularly corresponding to the rotating angles of the apparatus, thereby producing angle-variable laser lines for angular marking uses.

Abstract: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.

Abstract: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.

Abstract: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.

Abstract: A nozzle change magazine for laser beam machine which improves machining efficiency of a laser beam machine by installing a nozzle change magazine for laser machining tools equipped with a torch and a nozzle replaceably attached to the tip of the torch. A setup station for laser machining tools is installed outside a machining area of a laser beam machine. It includes a nozzle station which replaces a nozzle at the tip of the torch. The nozzle change station has a large number of magazines and changes the nozzle at the tip of the laser machining tool.

Abstract: An apparatus for processing workpieces by relative displacement of a plurality of simultaneously operating functional elements in relation to the workpieces being worked on is provided. The present apparatus includes a device for the mounting of the functional elements, characterized in that the device has apparatus for keeping the functional elements constantly in their operative position in relation to their workpiece section presently to be processed on the processing path by altering their position during a relative displacement with any desired change of direction. A method for tracing a processing path is also provided. The method includes tracing a processing path by a plurality of functional units arranged in succession one behind another in the path direction and moved along the path. The functional units are aligned on the path independently of each other by positioning means individually assigned to them.

Abstract: A substrate is initially positioned in the reaction chamber. One or more gases are introduced into the reaction chamber. A predetermined speed for translating a line of radiation is determined. Continuous wave electromagnetic radiation is then emitted from a continuous wave radiation source. The continuous wave electromagnetic radiation is subsequently focused into a line of radiation extending across the surface of the substrate. The line of radiation is then translated relative to the surface at the constant predetermined speed. The combination of the introduced gas/es and heat generated by the line of radiation causes the gas/es to react and deposit a layer on the surface of the substrate. Undesirable byproducts of the reaction are then flushed from the reaction chamber. This process is repeated until a layer having a predetermined thickness is formed on the surface of the substrate.

Abstract: A system for delivering energy to a substrate includes a laser energy source providing at least two laser beams, wherein each of the beams is steered to an independently selectable location on a target, and is independently focused onto the target.

Abstract: A laser drilling system for drilling blind vias in printed circuit board panels, multichip modules and chipscale packages with top and bottom surfaces and which include multiple dielectric polymer and metal layers. The system includes a first laser module comprising a laser able to form at least one via per pulse through one or more polymer layers. The vias are circular or non-circular in shape. An articulated arm is adapted to move at a speed of about 200 inches per second and at an acceleration of about 5 g's or more. A beam delivery unit is attached to the articulated arm and a conveyor adapted to move panels at a constant speed. The first laser module positioned on a separate track from the conveyor moves at a faster rate than the conveyor to drill the top surface. A second laser module is positioned to move on another separate track from the conveyor movable at a faster rate so as to drill the bottom surface.

Abstract: A laser material processing system and method focus a laser beam to a smaller spot size with a high power density using a movable beam expander to provide high resolution laser beam for engraving and/or cutting. A movable beam focusing assembly containing a beam expanding optics and a beam focusing optics is a part of a motion system providing a high power density focused beam within the material processing area minimizing size and weight of the laser beam positioning optics and avoiding the problems inherent in handling and positioning a larger diameter beam.

Abstract: An apparatus for inspecting drawing accuracy in a liquid droplet ejection apparatus performs drawing by ejecting a function liquid droplet while moving a function liquid droplet ejection head relative to a workpiece by using a moving mechanism. In response to the relative movement, a laser irradiating mechanism performs visually recognizable stippling on the workpiece by irradiating coherent light thereon. A control part drives the laser irradiating mechanism for stippling at a predetermined frequency timing.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a laser manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head. The laser manipulation system is adapted to controllably adjust the position of the laser head relative to the structure. The apparatus further includes a controller electrically coupled to the laser base unit and the laser manipulation system.

Abstract: A laser manipulation system controllably moves a laser head relative to a surface of an inhabitable structure for irradiating the surface with laser light from the laser head. The laser manipulation system includes a positioning mechanism coupled to the laser head. The positioning mechanism includes a first-axis position system adapted to move the laser head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the laser head along a second direction substantially parallel to the surface. The laser manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.

Abstract: A method and a device for the longitudinal welding of profiles (2,5, 13) is provided in which a profile (13) that is to be provided with a weld seam (22, 23) is guided through a welding device (1), and in the welding device (1) a welding head (14, 15) produces a weld point (20, 21) on the profile (13), in order to manufacture a weld seam (22, 23). The profile movement is braked at selectable intervals from an essentially constant production speed down to the point at which the profile (13) is at a standstill, and is subsequently accelerated back to the production speed, while the application of welding energy to the profile (13) is switched off below a threshold transport speed.

Abstract: A machine tool installation for laser cutting of sheet workpieces has a workpiece support, an elongated machine frame providing an arm extending over the workpiece support, and a track on the arm which extends longitudinally of the frame. A motion unit is suspended from the track and mounted for movement therealong, and there is drive assembly for moving the motion unit bidirectionally along the track. A laser cutting unit is mounted on the motion unit and includes a laser cutting head movable thereon along an axis perpendicular to the track on the machine frame. A loading unit is provided at a loading station adjacent one end of said machine frame for lifting and transporting a sheet workpiece above the plane of the upper surface of the workpiece support and the loading assembly is moveable on the track on the frame.

Abstract: A system is disclosed for monitoring and controlling laser cladding process by powder injection in real-time. The invention combines laser cladding technique along with automated direct feedback control to achieve a good quality clad in terms of dimensional and metallurgical characteristics. The system uses optical CCD-based detectors as the feedback system. The optical CCD-based detectors along with a pattern recognition algorithm is used to determine the clad characteristics in real-time. These characteristics are clad's dimensions, solidification rate, and roughness that are fed into a closed loop control system to adjust the laser power and table velocity to produce desired clad quality.

Abstract: A novel apparatus for heat treating semiconductor wafers includes a heating device which comprises an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. The tuning devices adjust the overall irradiance distribution of the light energy sources. The tuning devices can either be active sources of light energy or passive sources which reflect, refract, or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Abstract: If a machining program is reproduced in a robot controller and a robot is moved on a machining route, then a detection signal of a distance sensor is fetched through a distance sensor amplifier, and tracer control is carried out so as to keep a distance between a laser machining head and a workpiece at a predetermined value. In an acceleration and decoration processing in a corner, a restriction means that restricts a maximum acceleration and a maximum jerk is used to control an acceleration and a jerk of the robot not to exceed respective predetermined values, and prevents generation of a vibration when the laser machining head passes through the corner.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.

Abstract: A hand-held laser welding wand includes internal flow passages through which filler media, gas, and coolant may flow. The wand is dimensioned to be grasped with a single hand, thus filler media of various types and forms, gas, and coolant may be supplied to the hand-held laser welding wand via external systems and delivery devices without substantially impairing operation of the wand.

Abstract: A laser machining apparatus machines a workpiece at uniform intensity by converting a CO2 laser beam to uniform intensity using an intensity-converting element and a phase-matching element. The optical transmission system is configured such that the starting point of the laser beam pointing vector and the exit face of the intensity-converting element are mutually conjugated with respect to the optical transmission system. This structure offers stable machining by ensuring that the laser beam always enters the intensity-converting element at its center, even if the pointing vector of the laser beam shifts.

Abstract: A method of marking an article is described. A laser beam is generated. A position of a focal point of the laser beam is detected with a CCD detector that is in a predetermined position relative to a frame. The detector is then moved out of a plane of the focal point. An article is then held by a holder that is in a predetermined position relative to the frame, so that a marking surface of the article is in the plane. The laser beam is then directed onto the marking surface of the article, and the focal point is moved relatively across the marking surface. The position of the focal point on the marking surface is based on both the data set and reference position. The reference position may, for example, be deducted from factory calibration data to obtain modified calibration data, and the modified calibration data may be used to control the laser beam.

Abstract: A laser machining machine having a laser oscillator and a machining head communicating with each other through a propagation path for controlling the length of the propagation path in response to the position of the machining head. The laser machining machine divides a machining area at given intervals, and then sets an optical path position responsive to the machining area. The machine further detects the position of the machining head and controls the optical path length in response to the set optical path position.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: A model producing means for modeling a chip model at an edge of a solid model of a nozzle through a predetermined space in a three-dimensional virtual space, and a trace machining propriety judging means for watching a state of an interference between the chip model and the solid model of a workpiece at the time of simulation of laser beam machining program and outputting a predetermined signal when releasing the state of the interference are provided. If an inconvenient instruction wherein the nozzle and the workpiece do not face each other is included in the laser beam machining program, the chip model departs from the solid model of the workpiece and the trace machining propriety judging means outputs a predetermined signal, through which program error can be properly detected with no visual observation of an operator.

Abstract: An apparatus and method for perforating, cutting, or engraving a workpiece using a focused laser system to produce a focused laser. The apparatus includes a workpiece former having a complex shape to which the workpiece substantially conforms. The apparatus also includes a positioner that makes an adjustment to keep the focused laser substantially focused on the workpiece as the positional relationship between the workpiece former and the focused laser system changes to an operating position that changes the distance between the workpiece and the focused laser system due to the complex shape of the workpiece former.

Abstract: A system for shaping an optical fiber with various geometries while minimizing unwanted artifacts in the core of the optical fiber. The system facilitates control of sag in the region of the core that is exposed to a beam of optical energy. The sag is reduced, if not eliminated, by maintaining the cross-sectional area of the core that is exposed to the beam at thermal equilibrium.

Abstract: Apparatus and a method for removing particles from the surface of a substrate include determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed via an optical cleaning arm at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

Abstract: A control system (102) operates within a dynamic range, and a follow-up system (104) is commanded to reduce a positional error between the follow-up system and the control system when the dynamic range is exceeded. A linear follow-up command may be initially provided once a dead band value (208) is exceeded. The follow-up system (104) is driven relative to its base mount (103) in a direction to reduce the positional error to within a null value range (214). The follow-up command may also implement a decay function to control the follow-up system (104). A control variable transfer function may also be utilized to gradually subtract the dead band value from the follow-up system position error command as a function of time. The decaying function may include linear as well as non-linear decaying functions. In one embodiment, a figure eight-type hysteresis control function may be implemented to control the inertial position of an inertial element.

Abstract: At the time of execution of concurrent six-axes cylindrical interpolation instruction wherein a start point, an intermediate point, an end point and feed speed are instructed in a machining program PRO, a machining data computing portion 59 computes angular velocity of first, second, and third rotational axis directions and moving speed of first, second and third axial directions so as to correspond the feed speed of a torch with respect to a workpiece with the feed speed instructed in the machining program PRO, and the machining control portion 55 simultaneously controls the first, second and third axes and the first, second and third rotational axes on the basis of the angular velocity and the moving speed which are computed so as to rotate a chuck holding the workpiece and to move the torch, so that machining on the workpiece is executed.

Abstract: An auxiliary focusing tool for a laser marker for adjusting a distance between a laser focal lens and a work piece before laser marking, the tool comprises: a holding member provided on the laser marker, and a collapsible measuring kit provided on the laser marker at an outputting position of a light source, the measuring kit and the holding member get a predetermined length and are perpendicular to a working surface on the work piece after they are stretched out; and the measuring kit is collapsible to be received in the holding member when it is stored.

Abstract: This optical arm applicable to robots is comprised of: some bent tubular parts (1, 6, 16, 18), a straight tubular length (21) and an outlet part (23), coupled together with the possibility of rotation; also including some means (7) to secure the optical arm to a robot (5). The bent tubular part (1) is mounted with the possibility of rotation on the outlet (2) of a laser generator (3) secured to the third arm (4) of the robot (5). Parts (1, 6, 16 and 18) have a window (28), in each bend, equipped with some inner lugs (28) which a mirror (29) is pressed on to by means of some springs (33) foreseen with a removable part (32).

Abstract: A laser shock peening apparatus includes a laser unit for generating at least one laser beam aimed at a laser shock peening area and an anti-feedback means for preventing electromagnetic radiation reflections from the target area from entering the laser unit during laser shock peening and the anti-feedback means is located between the laser unit and a final focusing lens. The anti-feedback means may include an optical isolator at an output of the laser unit such as a faraday isolator. Alternative optical isolators may include thin film polarizers, glan prism polarizers, independent pig tailed optical isolators, mirrors with enhanced P or S polarization coatings. The laser unit may include an oscillator and a final amplifier and the output of the laser unit located after the final amplifier.

Abstract: There is provided an optical system for reducing faint interference observed when laser annealing is performed to a semiconductor film. The faint interference conventionally observed can be reduced by irradiating the semiconductor film with a laser beam by the use of an optical system using a mirror of the present invention. The optical system for transforming the shape of the laser beam on an irradiation surface into a linear or rectangular shape is used. The optical system may include an optical system serving to convert the laser beam into a parallel light with respect to a traveling direction of the laser beam. When the laser beam having passed through the optical system is irradiated to the semiconductor film through the mirror of the present invention, the conventionally observed faint interference can be reduced. Besides, the optical system which has been difficult to adjust can be simplified.

Abstract: The present invention enables the processing head to locate itself precisely on the surface of the structure being processed, and to then reposition itself correctly for the next laser spot. Further, the present invention will complete processing a laser peened area, the area including a multiplicity of spots arranged in a specific pattern, and correctly laser peen each spot in the area under control of a controller including control linkages with the laser. The invention further provides an automated laser peening processing head encompassing spatial position sensing and locating means, as well as programmed spatial positioning, application of overlay materials, verification of proper overlay condition and positioning, and notification of the laser to pulse the surface of the structure.