Abstract: A cutting machine includes a suction duct that is movable with a cutting head of the cutting machine, using a common drive. The suction duct is disposed beneath the workpiece support and coupled to the motion unit supporting the cutting head so that it moves with the motion unit while an opening of the suction duct remains positioned below the cutting head during a cutting operation. The suction duct removes cutting debris and dust, and protects underlying machine components from beam damage.

Abstract: Methods and systems for forming a scribe line in a thin film stack on an inner surface of a thin film photovoltaic superstrate are provided via the use of a cleaning laser beam and a scribing laser beam. The cleaning laser beam is focused directly onto the exposed surface of the superstrate such that the cleaning laser beam removes debris from the exposed surface of the superstrate, and the scribing laser beam is focused through the exposed surface of the superstrate and onto the thin film stack such that the scribing laser beam passes through the superstrate to form a scribe within the thin film stack on the inner surface of the superstrate. The method and system can further utilize a conveyor to transport the superstrate in a machine direction to move the superstrate past the cleaning laser source and the scribing laser source.

Abstract: A laser processing apparatus includes a stage unit moving a substrate having a plurality of work sections along longitudinal and lateral axes and rotating the substrate at a predetermined angle about a rotational axis, a laser beam oscillating unit oscillating laser beams to process holes in the substrate, a camera unit taking and providing an image of each of the work sections, and a controller correcting a processing location data using the image taken by the camera unit to allow the laser oscillating unit and the scanner unit to accurately process the holes in the substrate.

Abstract: A method for machining a workpiece is proposed where a laser beam and/or a workpiece are moved relative to each other and a cutting edge is produced on the workpiece by means of the removal of material by laser ablation. First, initial alignment of the workpiece (1) and/or the laser beam (2) relative to each is performed. Then an initial removal of material from the workpiece (1) by the laser beam (2) is carried out. An initial section (4) of the workpiece (1) is removed. Then the alignment of the workpiece (1) and laser beam (2) relative to each other is changed. The second alignment process performed differs from the first alignment process of the workpiece (1) and laser beam (2) relative to each other. In a second removal of material from the workpiece (1) a second section (12, 18, 24) of the workpiece (1) is removed with the laser beam (2?, 2?, 2??). The cutting edge (16, 23, 29) is produced at the end of the second material removal process.

Abstract: A manipulation system controllably moves a head relative to a surface of an inhabitable structure for irradiating the surface with energy waves from the head. The manipulation system includes a positioning mechanism coupled to the head. The positioning mechanism includes a first-axis position system adapted to move the head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the head along a second direction substantially parallel to the surface. The manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: It is presented an organic LED device 101 with, when in use, a predetermined pattern on its light emitting parts. The organic LED device 101 comprises an anode 105, a cathode 103, and an organic light emitting layer 107. The organic light emitting layer 107 is configured to emit light, wherein the organic light emitting layer 107 comprises portion with reduced light emitting properties, the portions of the organic light emitting layer 107 having been irradiated by light with a wavelength in the absorption band of the organic light emitting layer 107, the light intensity being below an ablation threshold of the cathode layer 103, the anode layer 105 and the organic light emitting layer 107 of the organic LED device 101, reducing the light emitting properties of the irradiated portions of the organic light emitting layer 107. It is also presented a method for reducing the light emitting properties of the organic LED device 101.

Abstract: The present invention relates to an apparatus for laser working of flat or basically flat pieces or elements, such as plastic sheets, glass or ceramic sheets, metal plates, wooden panels or fabric slivers of various kinds. In particular, the invention relates to an apparatus provided with a simple structure suitable for supporting and moving a fiber laser head capable of reaching any point of a flat piece by means of a combined crosswise-rotating movement.

Abstract: An apparatus for forming a pattern using a laser is provided. The apparatus includes a pattern storing unit, a controller, a laser oscillating unit, an X-Y driver, a header unit, and a stage. The pattern storing unit stores data on light guide patterns of a discontinuous straight line shape. The controller transmits position signal of the light guide patterns to the X-Y driver and simultaneously, transmits a switching signal to the laser oscillating unit. The laser oscillating unit outputs a laser beam synchronized with a movement of the header unit. The X-Y driver moves the header unit and the stage. The header unit moves along a first guide rail. The stage moves along a fixed second guide rail in the front and rear direction of the light guide panel.

Abstract: A laser welding method basically includes providing a robot that is moveably in accordance with predetermined movement data, and controlling the controlling a laser beam emitting section of the robot to emit a laser beam onto a predetermined irradiation position of a workpiece to conduct welding. The laser welding method further includes: measuring a current movement position of the robot with respect to a movement position specified in the predetermined movement data; operating of the robot to change the current movement position of the robot to a prescribed position based on the predetermined movement data; and adjusting a laser emission direction by controlling an emission changing section of the laser beam emitting section based on the current movement position of the robot and the predetermined movement data such that a laser beam is emitted from the laser beam emitting section and strikes the predetermined irradiation position of the workpiece.

Abstract: A laser processing apparatus including a holding unit for holding a workpiece, a processing unit for applying a laser beam to the workpiece held by the holding unit, a surface displacement detecting unit for detecting a surface displacement of the workpiece, and a focal position adjusting unit for adjusting the position of a focusing lens provided in the processing unit according to the surface displacement detected. The surface displacement detecting unit includes a detecting light source capable of oscillating light having a plurality of wavelengths different from the wavelength of the laser beam and a wavelength selecting section configured to select one of the plurality of wavelengths as the wavelength of detecting light. The detecting light having the selected wavelength is focused by the focusing lens and applied to the workpiece.

Abstract: A semiconductor device includes a plurality of active areas disposed on a semiconductor substrate. A manufacturing method of the semiconductor device includes performing a first annealing process on the semiconductor substrate by emitting a first laser alone a first scanning direction, and performing a second annealing process on the semiconductor substrate by emitting a second laser alone a second scanning direction. The first scanning direction and the second scanning direction have an included angle.

Abstract: A light irradiation device and method for irradiating converged light with an object include a light source configured to output a light, a phase-modulating spatial light modulator, a controller, and a converging optical system. The phase-modulating spatial light modulator is configured to input the light outputted from the light source and to display a hologram modulating a phase of the light at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated light. The controller is configured to cause the spatial light modulator to display a hologram such that the light outputted from the spatial light modulator is converged at a plurality of converging positions. The controller causes the spatial light modulator to display a first hologram and performs a feedback of the first hologram so as to modify the first hologram. The modifying of the first hologram is performed by measuring intensity of the light converged.

Abstract: The present invention provides an apparatus and a system for improving depth of focus (DOF), wherein an optical lens for optical processing is actuated to vibrate whereby the DOF of the optical processing is increased due to the variation of focal point. In the embodiment of the present invention, an actuator is coupled to the optical lens for providing vibration energy wherein the optical lens is actuated by the vibration energy so as to vibrate on an optical axis thereof so as to increase the DOF during the optical processing, thereby improving the quality and efficiency of optical processing.

Abstract: Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer.

Abstract: A combined machine for punching and laser cutting of a flat sheet metal includes a fixed base, a fixed punching head, a laser cutting head and a manipulator for the movement of the sheet metal on a Cartesian plane. The laser cutting head is carried by a variable-aperture compass structure, which is mobile along a linear guide.

Abstract: A laser processing apparatus including a workpiece holding unit for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece held by the workpiece holding unit. The laser beam applying unit includes a laser oscillator for oscillating a laser beam, a focusing unit for focusing the laser beam oscillated by the laser oscillator onto the workpiece held by the workpiece holding unit, and an optical system provided between the laser oscillator and the focusing unit for transmitting the laser beam oscillated by the laser oscillator. The laser beam applying unit further includes a wavelength converting mechanism provided between the optical system and the focusing unit for converting the wavelength of the laser beam oscillated by the laser oscillator into a short wavelength.

Abstract: A microstructure manufacturing method includes (a) generating first light including an interference fringe by crossing two laser beams, (b) forming a denatured region and a non-denatured region on an object having thermal non-linearity by applying the first light onto the object, so that the denatured region and the non-denatured region are disposed so as to correspond to a period of the interference fringe of the first light, and (c) etching the object so that the denatured region or the non-denatured region is selectively eliminated.

Abstract: In the present invention, each laser light emitted from a plurality of lasers is divided, and laser light including at least one laser light that is emitted from a different laser and that has different energy distribution is synthesized with another such laser light, or laser light including at least one laser light that has different energy distribution is synthesized with another such laser light through a convex lens that is set at an angle to the direction each laser light travels, to form laser light having excellent uniformity in energy distribution.

Abstract: By irradiating laser light 20 obliquely onto a substrate 6, the laser soldering apparatus reduces the laser light passing through an insertion hole 61a in the substrate 6 and prevents damage to low-heat-resistance portions of a component 62 disposed on the rear surface side of the substrate 6. Moreover, the substrate 6 can be observed from a normal direction with a camera 23. Therefore, even if the insertion hole 61 for inserting a component lead or the like is provided in the substrate 6, the laser light does not leak out to the side of a component mounting surface 17 of the substrate 6.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.

Abstract: A control system for controlling a laser machining/processing apparatus and uses two separate control modules, each of which operates interdependently with the other. A laser control module contains instructions for controlling the laser beam while a movement control module contains instructions for controlling the movement of the laser apparatus relative to a workpiece. The instructions in each module are executed in parallel and interdependently of the instructions in the other module. The laser control module controls the actions of the laser apparatus while, in parallel, the movement control module controls the relative movements and/or positioning of the laser beam relative to the workpiece.

Abstract: A laser woodworking machine for cutting wood is disclosed. The machine includes a laser cutting head having two sections structurally configured to include sensors for measurements of depth and of reflected frequencies, a laser unit for supplying power to the laser cutting head, a cabinet enclosure for housing the laser unit and including a table surface, a radial arm supported by a column secured to the inside rear portion of the cabinet enclosure and including a pair of radial supports extending perpendicularly from opposite sides of the column and parallel to each other, and a glider carriage secured to the radial supports and including two substantially flat surfaces above and below the radial supports so that the glider carriage slides along the radial supports via sleeves, the glider carriage further comprising support for the laser cutting head so that the laser cutting head is moveable along the radial arm.

Abstract: A method for processing workpieces includes performing a laser processing operation in which a laser beam is directed at a first mirror face and at a second mirror face of a redirecting mirror. The second mirror face is at least partially surrounded by the first mirror face. During the laser processing operation, the second mirror face performs a pendulum movement relative to the first mirror face.

Abstract: There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device.

Abstract: An exemplary cutting apparatus for cutting components from a sprue includes a sprue retainer, a laser cutting unit, and a rotating driving unit. The sprue retainer has a supporting surface. The supporting surface defines a receiving hole, and grooves extending across the entire supporting surface. The grooves are in communication with the receiving hole. The laser cutting unit is disposed above the sprue retainer and is configured for emitting a laser beam to cut the sprue carried on the sprue retainer. The sprue retainer is coupled to the rotating driving such that the rotating driving unit is capable of driving the sprue retainer to rotate.

Abstract: Moving enclosures for laser equipment are provided. A machine tool installation is disclosed, including (a) a laser cutting head configured to be movable in three dimensions; (b) a workpiece support configured to support a workpiece in operative relationship with the laser cutting head; (c) a skirt configured to surround the laser cutting head on three sides and intercept light that passes from the head and is reflected off of the workpiece or workpiece support; and (d) a protective cover positioned to intercept light that is reflected off of the workpiece or workpiece support and is not intercepted by the skirt. The skirt and protective cover are configured to move laterally with the laser cutting head.

Abstract: A staggered laser-etch line graphic system, method, and articles of manufacture are provided. One described method includes the steps of laser engraving a first plurality of lines associated with a first component section of a graphic on a surface of an article; laser engraving a second plurality of lines associated with a second component section of the graphic on the surface of the article; and controlling said laser engraving of the first plurality of lines and said laser engraving of second plurality of lines to reduce the visual impact of a demarcation line separating the first component section of the graphic and the second component section of the graphic.

Abstract: A method of annealing and real-time monitoring by applying laser beam includes steps of emitting a laser beam and splitting it into a first light beam and a second light beam; irradiating the first light beam along a first path at a to-be-annealed work-piece in order to process annealing for the work-piece; irradiating the second light beam along a second path at the to-be-annealed work-piece; having the to-be-annealed work-piece changed to an annealed work-piece after the process of annealing is completed for the to-be-annealed work-piece; retrieving a characteristic of a characteristic of changes of properties of matter generated from the second light beam irradiated at the to-be-annealed work-piece and the annealed work-piece.

Abstract: A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.

Abstract: A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members.

Abstract: An embodiment of an apparatus for laser shock peening a treatment region of a metallic member includes a base oriented along a longitudinal axis; an engagement member actuable to engage a surface of the metallic member, the base in connection with engagement member; and a laser peening head adapted to emit laser radiation disposed with the base, the laser peening head moveable relative to the longitudinal axis.

Abstract: A management method for a redundant axis laser machine of the type comprising a movable structure controlled by actuators and operated according to a first set of variables (X, Y, Z, A) and an operating head operated according to a second set of said variables (W, B, C), said first set of variables (X, Y, Z, A) and second set of variables (W, B, C) identifying one or more redundant variables. Such method envisions a filtering allowing the work trajectory to be decomposed into defined trajectories for a first low dynamic system made up of said first set of variables (X, Y, Z, A) and a second high dynamic system made up of said second set of said variables (W, B, C), respectively.

Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

Abstract: A device for cutting, using laser beams (B1, B2), a material (A) such as a material for manufacturing sanitary products comprises a supporting formation for the material (A), such as a motor-driven belt, including a net (72) for supporting said material (A) in a position corresponding to the area of cutting where the laser beam (B1, B2) acts. Typically said net is a wire net, e.g., made of steel, bronze or a combination of the two, to which there is preferentially associated a rotary cleaning brushes (9) and suction and/or air jets systems.

Abstract: Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.

Abstract: An additive manufacturing assembly includes a work space including a plurality of separate regions and an energy transmitting device for focusing an energy beam to a specific location within one of the plurality of regions within the work space. The energy transmitting device includes features for expanding the workspace for fabricating parts of increased size and volume.

Abstract: A laser irradiation apparatus is disclosed. In one embodiment, the apparatus includes i) an X-axis location control board configured to move a plurality of drivers in an X-axis direction and ii) a plurality of output heads cooperatively arranged with the drivers and configured to move with movement of the drivers, wherein the output heads are configured to receive laser beams. The apparatus may further include a Z-axis location control board cooperatively arranged with the X-axis location control board and configured to move the X-axis location control board in an Z-axis direction, wherein the output heads alternatively protrude with different lengths along an Y-axis direction.

Abstract: Various method embodiments move web equipment from a first web processing station to a second web processing station. According to a method embodiment, the web equipment is raised away from the first web processing station, where raising includes rotating the web equipment about a rotary axis. The rotary axis is linearly moved along a linear axis. The web equipment is lowered toward the second web processing station, wherein lowering includes rotating the web equipment about the rotary axis. Various embodiments move a laser head from one web processing station into operational position at another web processing station.

Abstract: An optical device wafer processing method including a laser processed groove forming step of applying a laser beam for performing ablation to the front side or back side of a substrate of an optical device wafer along streets, thereby forming a laser processed groove as a break start point on the front side or back side of the substrate along each street, and a wafer dividing step of applying an external force to the optical device wafer after performing the laser processed groove forming step to thereby break the wafer along each laser processed groove, thereby dividing the wafer into individual optical devices. In performing the laser processed groove forming step, an etching gas atmosphere for etching a modified substance produced by applying the laser beam to the substrate is generated, whereby an etching gas in the etching gas atmosphere is converted into a plasma by the application of the laser beam to thereby etch away the modified substance.

Abstract: A laser welding system includes a robot control unit that acquires movement amount measurement values from encoders provided on axes of the robot and calculates the current position of a laser processing head based on the measurement values. Based on the calculated current position of the laser processing head, the robot control unit calculates a laser beam emission direction specifying the direction in which the laser beam should be aimed in order to strike a predetermined laser irradiation position. The robot control unit sends a command indicative of the laser beam emission direction to a processing head control unit which changes the direction of a reflecting mirror provided inside the laser processing head such that the laser beam is emitted in the specified direction.

Abstract: A pulsed laser beam is applied to a workpiece held on a chuck table by a laser beam applying unit. The laser beam applying unit includes a pulsed laser beam oscillator, a focusing lens, and a piezoelectric motor for displacing the focusing unit in a direction inclined at a predetermined angle (?) with respect to the Z direction. A controller controls the frequency and voltage of an RF current to be applied to the piezoelectric motor in relation to the repetition frequency of the pulsed laser beam to move the focusing unit in the X direction by ?x and in the Z direction by ?z in feeding the chuck table in the X direction, thereby displacing the focal point of the pulsed laser beam to be focused by the focusing lens in the thickness direction of the workpiece held on the chuck table.

Abstract: A solid-state laser lift-off apparatus comprises: a solid-state laser (1), a light beam shaping lens (3), motors of oscillating mirrors (5,7), oscillating mirrors (4,6), a field lens (9), a movable platform (10), an industrial control computer and control software (8). The light beam shaping lens (3) is behind the solid-state laser (1), shaping the laser beam from the solid-state laser (1) into required shape. The motors of oscillating mirrors (5,7) are in front of the field lens (9), controlling the movement of the oscillating mirrors (4,6) according to the instruction of the control software (8) to implement different light beam scanning paths. A lift-off method for applying the solid-state laser lift-off apparatus uses a small laser spot to perform scanning, and enables damage-free separation of GaN from a sapphire substrate.

Abstract: A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.

Abstract: The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.

Abstract: The invention relates to a method for welding with a laser beam, using a welding nozzle comprising: a nozzle body having an axis and including at least an upper surface, a lower surface and a peripheral wall; an axial cavity extending between the upper and lower surfaces of the nozzle body so as to define an outer channel recessed from the surface of said peripheral wall; and a plurality of inner passages drilled through the nozzle body between the upper and lower surfaces. The laser welding method of the invention provides a dynamic gas jet mechanically interacting with the molten metal bath, and further enables better control of the bath hydrodynamic flows, and thus better laser-welding efficiency.

Abstract: A method and device (1) for laser machining vehicle bodies or body parts (2) uses a laser beam (14) that is guided from a laser source (13) to a remote laser tool (15) on a robot hand by a guiding device (16). The robot (4) maintains the laser tool (15) in a suspended manner over the tool (2), at a focal length (F) and at a contact free distance and guides it along a machining path (30). The laser beam (14) is deviated, by movement of the hand axis (IV, V, VI), about a variable deviation angle (?), and the laser source (13), whose power is variable, is controlled according to the movement of the laser beam. The beam deviation of the hand axis (IV, V, VI) can be superimposed on an offset movement of the robot (4).

Abstract: The present invention generally relates to methods and apparatus for thermally processing substrates. The apparatus include an energy source, a plurality of chambers, and one or more energy switches. The one or more optical switches are adapted to direct an amount of energy emitted from the energy source to one of the plurality of chambers, and then change switch positions to direct the energy to a second of the plurality of chambers at a preselected time. The plurality of chambers may each include a heated support and a plurality of lamps therein to heat a substrate. The methods generally include thermally processing a first substrate in a first chamber while preheating or aligning a second substrate in a second chamber. After the first substrate is thermally processed, the second substrate is processed in the second chamber using the same energy source as was used to process the first substrate.

Abstract: A mechanical device is used to change a laser nozzle on a nozzle receiving member of a laser processing machine for processing workpieces. The mechanical device has a nozzle magazine having a nozzle holder carrier, and at least one nozzle holder for a laser nozzle being provided on the nozzle holder carrier. The mechanical device also includes a positioning drive and a change drive, both drives having a common drive motor. Between the drive motor on the one hand and the nozzle holder carrier and the nozzle holder on the other hand, there is provided a coupling that can be switched by means of a switching device between a supply state, in which a drive connection exists between the drive motor and the nozzle holder carrier, and a change state, in which a drive connection exists between the drive motor and the nozzle holder.