Abstract: A laser crystallization apparatus for crystallizing a thin film of a substrate, the laser crystallization apparatus includes a laser beam emitting unit configured to scan the substrate in a predetermined direction with a laser beam, a stage configured to support the substrate, a fixing part disposed on a first part of the stage, the fixing part having a shape corresponding to a corner of the substrate, and a driving unit configured to lift a second part of the stage to be higher than the first part of the stage, the substrate on the stage being configured to slide toward and engage with the fixing part.

Abstract: A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens to the first conducting layer. Portions of the first conducting layer are scribed form a trench through the layer. The lens focuses the beam and has a focal length at least 100 mm. The focused beam includes an effective portion effective for the scribing and an ineffective portion ineffective for the scribing. The substrate sags and the first conducting layer remains in the effective portion of the focused beam across the area during the step of applying. One or more active layers are provided on the first conducting layer. A second conducting layer is provided on the one or more active layers.

Abstract: Embodiments of the present invention provide apparatus and method for reducing noises in temperature measurement during thermal processing. One embodiment of the present invention provides a chamber for processing a substrate comprising a chamber enclosure defining a processing volume, an energy source configured to direct radiant energy toward the processing volume, a spectral device configured to treat the radiant energy directed from the energy source towards the processing volume, a substrate support disposed in the processing volume and configured to support the substrate during processing, and a sensor assembly configured to measure temperature of the substrate being processed by sensing radiation from the substrate within a selected spectrum.

Abstract: A laser beam irradiation apparatus irradiates a laser beam to a sealing unit disposed between a first substrate and a second substrate to seal the first substrate and the second substrate. The laser beam irradiation apparatus includes a laser head for irradiating the laser beam; and a control unit for controlling a drive-velocity and a drive-direction of the laser beam. The laser beam is controlled by the control unit which repetitively performs a backward and forward movement along a first direction, and passes a same position at least twice.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device generating at least two beams including a first beam and a second beam, the first beam and the second beam each having an impact point on the workpiece, the first and second impact points being positioned diagonally with respect to the X and Y axes of the workpiece, and at least one actuator to move at least one of the impact points relative to the workpiece and the workpiece relative to the impact points.

Abstract: A laser processing beam machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means; and the condenser comprises a condenser lens opposed to the workpiece held on the chuck table, a cylindrical lens arranged on the upstream side in the laser beam application direction of the condenser lens, and an interval adjustment mechanism for adjusting the interval between the condenser lens and the cylindrical lens.

Abstract: A device for structuring a solar module. A retainer device arranged above the solar modules to be machined comprises retainer means which retain the solar modules. The retention is achieved in a non-contact manner. In a region beneath the solar module a structuring tool is arranged mounted to be mobile in a longitudinal and a transverse direction. The structuring tool can thus machine the complete surface of the solar module.

Abstract: A laser processing machine head, a laser processing machine head monitoring system, and a method of monitoring an optical element of a laser processing machine feature a light-transmissive optical element and an optical element holder defining a cavity in which the optical element is retained against rotation. A light source mounted to the holder directs a beam of light into the optical element through a peripheral surface of the optical element. A light receiver is responsive to light from the light source reflected through the optical element. Monitoring a signal from the light receiver allows a status of the optical element to be assessed.

Abstract: It is an object to provide a laser irradiation apparatus for enlarging an area of a beam spot and reducing a proportion of a region with low crystallinity. It is also an object to provide a laser irradiation apparatus for enhancing throughput with a CW laser beam. Furthermore, it is an object to provide a laser irradiation method and a method for manufacturing a semiconductor device with the laser irradiation apparatus. A region melted by a first pulsed laser beam having harmonic is irradiated with a second CW laser beam. Specifically, the first laser beam has a wavelength of visible light or a shorter wavelength than that of visible light (approximately not more than 830 nm, preferably, not more than 780 nm). Since the first laser beam melts a semiconductor film, an absorption coefficient of the second laser beam to the semiconductor film increases drastically and thereby being more absorbable.

Abstract: A laser machine tool for carrying out cutting or welding operations includes a laser head carried by a moving member which is displaceable with respect to a workpiece along two horizontal cartesian axes in a relatively wide space with movements involving relatively low accelerations. The laser head is displaceable on the moving member, along a pair of horizontal cartesian axes in a relatively restricted space with high speeds and accelerations, via a pair of slides to which respective balancing weights are operatively associated.

Abstract: A method for machining workpieces (6) uses a moving laser beam (4), whereby the laser tool (3) is held at a separation above the workpiece (6) by means of a multi-axis mechanical manipulator (2) with a manipulator hand (8) and moved along a given track in an offset movement. During the machining process an at least partly opposing compensation movement of the laser beam (4) is superimposed on the offset movement. A device is provided for machining workpieces (6) with a moving laser beam (4). The laser tool (3) is held by means of a multi-axis mechanical manipulator (2) and a device for generation of a opposing compensation movement of the laser beam (4) is superimposed on the offset movement.

Abstract: A laser material manipulation system is provided for material processing, such as laser ablation, laser deposition and laser machining. The system includes a laser for emitting laser pulses and a laser imaging device having an array of controllable imaging elements. The laser imaging device receives the laser pulses emitted from the laser, forms a laser image through the controllable imaging elements, and projects the laser image onto a target material which is to be processed. The projected laser image processes the material according to a desired pattern. The laser can be a femtosecond laser. The laser imaging device can be a liquid crystal display (LCD) or a digital micromirror device (DMD). An SEM can be used for monitoring the material distribution and dynamically adjust the laser image according to the monitor result.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit includes an energy wave generator and a head coupled to the energy wave generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further includes a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.

Abstract: A method of drilling holes in a work piece includes receiving a laser beam directed along an optical path; and directing the laser beam through a beam former, disposed in the optical path, to form an array of sub-beams of a first pitch size. The method demagnifies the array of sub-beams to form a reduced-size pattern of a second pitch size on the work piece. The array of sub-beams is translated, or moved in a perpendicular direction to the optical path. After translating the array of sub-beams, the method forms the reduced-size pattern of the second pitch size on the work piece. The second pitch size may be smaller than the wavelength of the laser beam.

Abstract: A laser irradiation apparatus includes a plurality of laser heads from which a laser is irradiated, can adjust arranged intervals of the laser heads, and moves freely to irradiate the laser along a shape of a subject. A laser oscillator oscillates a laser. A plurality of laser heads linearly irradiate the laser oscillated by the laser oscillator. A first driving means adjusts arranged intervals of the laser heads, and moves the laser heads in an X direction. A second driving means moves the laser heads in a Y direction different from the X direction.

Abstract: A laser processing machine head, a laser processing machine head monitoring system, and a method of monitoring an optical element of a laser processing machine feature a light-transmissive optical element and an optical element holder defining a cavity in which the optical element is retained against rotation. A light source mounted to the holder directs a beam of light into the optical element through a peripheral surface of the optical element. A light receiver is responsive to light from the light source reflected through the optical element. Monitoring a signal from the light receiver allows a status of the optical element to be assessed.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: This invention is intended to provide a laser annealing method by employing a laser annealer lower in running cost so as to deal with a large-sized substrate, for preventing or decreasing the generation of a concentric pattern and to provide a semiconductor device manufacturing method including a step using the laser annealing method. While moving a substrate at a constant rate between 20 and 200 cm/s, a laser beam is radiated aslant to a semiconductor film on a surface of the semiconductor substrate. Therefore, it is possible to radiate a uniform laser beam to even a semiconductor film on a large-sized substrate and to thereby manufacture a semiconductor device for which the generation of a concentric pattern is prevented or decreased. By condensing a plurality of laser beams into one flux, it is possible to prevent or decrease the generation of a concentric pattern and to thereby improve the reliability of the semiconductor device.

Abstract: A laser beam machining device includes at least one laser beam source for acting upon at least one workpiece using an annular laser focus. Means are provided for imaging the laser radiation reflected from the workpiece on a sensor unit. A method for adjusting the focal position of an annular laser focus in relation to at least one workpiece is also provided.

Abstract: An apparatus for cutting and/or marking products using laser beams includes at least one laser light emitter moveable in a first direction along a cross-bar, the cross-bar being in turn moveable above a working plane in a second direction transversal to the first direction, and at least two motors for moving the laser light emitter and the cross-bar. The laser light source is positioned to direct a laser light beam onto said working plane. Advantageously the two motors are positioned fixed and are coupled together and both to the laser light source, and to the cross-bar, by a transmission belt.

Abstract: Methods for performing manual laser deposition are provided. In this regard, a representative method includes: directing a laser beam at a first deposit location of a substrate to re-melt: at least a portion of a first deposit of weld filler, at least a portion of a second deposit of weld filler located at a second deposit location that partially overlaps the first deposit, and at least a portion of the substrate.

Abstract: A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction. The AOD subsystem may be used for aligning a processing laser beam to workpiece features.

Abstract: A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.

Abstract: A material processing machine configured to process a workpiece with a processing head movable with respect to the workpiece, including a workpiece support, a processing head carrier movable with respect to the workpiece support, the carrier including a first half of a releasable head coupling, and a processing head carried by the head carrier and positioned to operably engage a workpiece supported by the support to process the workpiece, the processing head including a second half of the releasable head coupling. The releasable head coupling defines an adjustable head release force.

Abstract: A device (100) for stripping an outer covering (141) of a cable (140) includes a base (110) having a shaft (111) coupled thereto, a laser generator (130) configured for emitting a laser beam and a rotating arm (120). The shaft defines a central axis configured for coaxial alignment with the cable. The laser generator is arranged at rest relative to the rotating arm. The rotating arm includes at least one light directing member configured for directing the laser beam emitted from the laser generator to impinge upon a circumference of the outer covering of the cable. The rotating arm is rotatable relative to the central axis associated with the shaft in a manner such that the circumference of the outer covering of the cable can be impinged upon by the laser beam thus stripping the outer covering of the cable.

Abstract: A laser processing apparatus, in accordance with at least one exemplary embodiment, is configured to contemporaneously perform the functions of observing a surface of a substrate and concentrating laser light to a given position inside the substrate. The laser processing apparatus can include an optical system having an afocal optical subsystem configured to concentrate laser light inside the substrate. Adjustment of the position of a laser light concentrating point can be achieved independent of adjustment of a focal point by the automatic focusing mechanism to observe the surface of the substrate irradiated with laser light.

Abstract: A method and apparatus is presented for laser machining complex features in workpieces using programmable laser focal spot shapes. A deformable mirror is inserted into the laser beam path of a laser machining system and programmed to alter the shape of the laser beam focal spot in real time as the workpiece is being laser machined in order to achieve improved control over the shape and size of laser machined features.

Abstract: The laser irradiation apparatus of the present invention is configured to include a laser and at least two mirrors each having a concave surface for unidirectionally homogenizing an energy density of laser light emitted from the laser. A focal position of a first mirror exists between the first mirror and an irradiation surface. A focal position of a second mirror does not exist between the second mirror and the irradiation surface, but exists behind the irradiation surface. The laser irradiation apparatus thus configured enables laser irradiation of, for example, semiconductor films.

Abstract: Multi-axis laser cutting systems are provided. The cutting systems include a multi-axis, relatively high acceleration drive system, which includes drives that are configured to generate balanced inertial forces. In some implementations, the drives operate according to a polar coordinate systems.

Abstract: A method and apparatus for performing laser thermal processing (LTP) using a two-dimensional array of laser diodes to form a line image, which is scanned across a substrate. The apparatus includes a two-dimensional array of laser diodes, the radiation from which is collimated in one plane using a cylindrical lens array, and imaged onto the substrate as a line image using an anomorphic, telecentric optical imaging system. The apparatus also includes a scanning substrate stage for supporting a substrate to be LTP processed. The laser diode radiation beam is incident on the substrate at angles at or near the Brewster's angle for the given substrate material and the wavelength of the radiation beam, which is linearly P-polarized. The use of a two-dimensional laser diode array allows for a polarized radiation beam of relatively high energy density to be delivered to the substrate, thereby allowing for LTP processing with good uniformity, reasonably short dwell times, and thus reasonably high throughput.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: Combined illumination is used to detect the positions of features such as scribe lines in different layers of a workpiece. Because combinations of layers of different material can scatter, reflect, scatter, and/or transmit light in different ways, combining and adjusting such illumination can allow positions of multiple features to be detected concurrently, such that the position of a feature being formed in one layer can be adjusted to a relative position with respect to a feature in another layer, even where those layers are of different materials with different optical properties.

Abstract: A focused laser beam having an optical axis passes sequentially through a simple, positive lens, a pair of plane, parallel windows, and a second, simple, negative lens. Each of the plane, parallel windows are mounted to a galvanometer motor and positioned orthogonally to one another. The focused laser beam is therefore displaced in a controlled manner from the optical axis to enable laser machining of very precise geometric features over a large processing window. A field size of one thousand microns is achieved.

Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

Abstract: A laser emitter arranged to face a plastic substrate makes relative movement along a surface of the plastic substrate, while it is emitting a laser, so as to laser-cut the plastic substrate. In this process, a shield member is arranged outside a laser irradiation region on the plastic substrate.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.

Abstract: The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whilst there is continuous relative displacement between the ring and the laser treatment device.

Abstract: A system for deleting the edges from coated substrates (6) and for separating said substrates into individual modules along the edge-deleted strips, wherein a laser scanner (2) for edge deletion and a laser head (9) for separating the substrate are disposed on opposite surfaces of the substrate (6) and, depending on the machine direction, can be positioned relative to each other, and their movement can be jointly controlled in such a manner that the laser scanner (2), in the machine direction, is always disposed at a fixed distance in front of the laser head (9), with two directions that are perpendicular to each other, preferably each with alternating directions of movement being available as machine directions.

Abstract: An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body (2) is irradiated with a laser beam that circles around an outer circumference of the tubular body (2), a heating width W in a circumferential direction heated by the laser-beam irradiation and a laser-beam moving speed V in the circumferential direction are set so that a stress in the circumferential direction in an inner surface of the tubular body (2) produced by the heating with the laser beam is at least larger than a yielding stress of a material that the tubular body (2) is made of.

Abstract: A system, method and masking arrangement are provided of enhancing the width of polycrystalline grains produced using sequential lateral solidification using a modified mask pattern is disclosed. One exemplary mask pattern employs rows of diamond or circular shaped areas in order to control the width of the grain perpendicular to the direction of primary crystallization.

Abstract: A management method for a redundant axis laser machine of the type comprising a movable structure controlled by actuators and operated according to a first set of variables (X, Y, Z, A) and an operating head operated according to a second set of said variables (W, B, C), said first set of variables (X, Y, Z, A) and second set of variables (W, B, C) identifying one or more redundant variables. Such method envisions a filtering allowing the work trajectory to be decomposed into defined trajectories for a first low dynamic system made up of said first set of variables (X, Y, Z, A) and a second high dynamic system made up of said second set of said variables (W, B, C), respectively.

Abstract: Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects a first target location on or within the semiconductor substrate. The method also generates a second laser beam that propagates along a second laser beam axis that intersects a second target location on or within the semiconductor substrate. The second target location is offset from the first target location in a direction perpendicular to the lengthwise direction of the rows by some amount such that, when the first target location is a structure on a first row of structures, the second target location is a structure or between two adjacent structures on a second row distinct from the first row.

Abstract: A method for laser beam machining, in particular laser beam welding of bodywork components (14), with the aid of a remote laser head (3). The laser head is guided by a robot (5) including a multi-axial robot hand (7). During the welding process, the emitted laser beam (12) is guided along the welding path (19) on the component (14) by orientation modifications and with a variable irradiation angle beta. said orientation modifications only being produced by pivoting displacements (7) of the manipulator hand (7) about at least one of its hand axes IV, V, VI.

Abstract: A silicon crystallizing device includes a laser beam source emitting a laser beam, a projector unit converging and changing a pattern of the laser beam from the laser beam source, a stage loading/unloading a substrate, a mirror deflecting the laser beam from the projector unit to an outside of the substrate, and a cooling device receiving the laser beam deflected by the mirror and sinking heat generated by the laser beam received, thereby warming up the projection lens before completion of loading the substrate, or cutting off laser beam incident on the substrate after crystallization of the substrate.

Abstract: Moving enclosures for laser equipment are provided. A machine tool installation is disclosed including (a) a laser cutting head configured to be movable in three dimensions; (b) a workpiece support configured to support a workpiece in operative relationship with the laser cutting head (c) a skirt configured to surround the laser cutting head on three sides and intercept light that passes from the head and is reflected off of the workpiece or workpiece support; and (d) a protective cover positioned to intercept light that is reflected off of the workpiece or workpiece support and is not intercepted by the skirt. The skirt and protective cover are configured to move laterally with the laser cutting head.

Abstract: A diamond element (10) having a convex surface is disclosed, the convex surface including a spherical segment for which the maximum peak to valley deviation from a perfect spherical surface is less than about 5 ?m. The diamond element (10) may be a solid polycrystalline diamond material and/or may comprise base material which is coated with diamond. Alternatively or in addition, the RMS deviation from a perfect spherical surface may be less than about 500 nm, or the RMS roughness less than about 30 nm. A diamond element (10) with a radius of curvature less than about 20 mm is also disclosed. In one aspect a diamond element (10) having a conical half-angle greater than about 10° is described. Diamond elements (10) of this type are intended for use as metrology tips.

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path.