Abstract: An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.

Abstract: In a method for brazing a sheet material without use of flux, an inert gas is firstly introduced into an oxygen pump to reduce an oxygen partial pressure in the inert gas to 1×10?10 Pa or less, and the sheet material is heated in a brazing furnace in an atmosphere of the inert gas discharged from the oxygen pump. A core alloy of the sheet material or a brazing filler alloy cladded to a surface of the core alloy contains Mg. Both the core alloy and the brazing filler alloy may contain Mg. Accordingly, brazability of the sheet material is sufficiently improved.

Abstract: The invention describes a multi-device OLED (1) comprising a device layer stack (100) comprising a bottom electrode (11), a top electrode (14), at least one inter electrode (13) and plurality of active layers (120, 121), wherein the bottom electrode (11) is applied to a substrate (10), and each active layer (120, 121) is enclosed between two electrodes (11, 13, 14); a current distribution means (500) comprising a current distribution layer (51, 53, 54) for each electrode (11, 13, 14) of the device layer stack (100); a plurality of openings (110, 130) extending from the top electrode (14) into the device layer stack (100), wherein each opening (110, 130) exposes a contact region (111, 131) of an electrode (11, 13); and a plurality of electrical connectors (41, 42), wherein an electrical connector (41, 42) extends into an opening (110, 130) to electrically connect the electrode (11, 13) exposed by that opening (110, 130) to the current distribution layer (53, 54) for that electrode (11, 13).

Abstract: This disclosure concerns bonding a thin film of diamond to a second thick diamond substrate in a way that does not cause the exposed (un-bonded) diamond surface to become contaminated by the bonding process or when the bonded diamond is held at high temperature for many hours in vacuum.

Abstract: A powder-based material system having an intrinsic and stable degree of porosity provided by hollow ceramic spheres (26) in a fully dense matrix (27). A substrate (22) is formed from a metal powder (70), and may be partially sintered (60). A layer (24) of ceramic powder is arranged on the substrate including the pre-sintered hollow ceramic spheres plus a proportion of nano-sized ceramic particles effective to reduce the layer sintering temperature and to increase the sintering shrinkage of the layer to approximate that of the metal substrate during subsequent co-sintering. The substrate and layer are then co-sintered (61), such as with spark plasma sintering (32, 34, 36), at a temperature and for a duration to fully densify the ceramic powder matrix around the hollow spheres, thereby producing a metal/ceramic material system with low interface stress and with stable porosity during operational temperatures in a gas turbine engine.

Abstract: A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit is connected to the feedthrough.

Abstract: A manufacturing method of a semiconductor element which can improve productivity and reliability, comprises a step of forming a device structure layer including a semiconductor layer on a first substrate; a step of forming a first metal layer on the device structure layer; a step of forming a second metal layer made of the same material as the first metal layer on a second substrate; a first treatment step of heating and compressing together the first metal layer and the second metal layer placed opposite to each other, thereby bonding them with maintaining a junction interface between the first and second metal layers; and a second treatment step of heating the first and second metal layers to make the junction interface disappear. Either one of the first and second metal layers has a coarse surface having multiple pyramid-shaped protrusions formed at its surface.

Abstract: An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.

Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.

Abstract: A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.

Abstract: A measuring arrangement with a ceramic measuring cell and a metal process connection for connecting the measuring cell to a measuring environment, with the measuring cell being fastened in the process connection without gaskets and in a diffusion-resistant fashion, with the measuring cell being fastened at a ceramic ring, which is arranged at a metal ring for fastening in the process connection.

Abstract: A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.

Abstract: A hard faced surface comprises a metal substrate. Inserts are attached to the substrate as a covering layer on the substrate. Each insert comprises a thermally stable polycrystalline diamond (TSP) body (or polycrystalline diamond or cubic boron nitride) having a plan section, a contact surface and a flat top surface. A boundary coating on the ultra-hard body renders the body wettable by first braze material. A tungsten carbide cap is brazed with said first braze material to at least the top surface of the TSP block. The inserts are brazed to the substrate in a closely packed side-by-side formation with a second braze material that penetrates the gaps between the inserts and between the contact surface of the bodies and the metal substrate. The tungsten carbide caps of the inserts provide a gauge for the hard faced surface, which caps are ground in a finishing step exposing the caps and providing the hard faced surface with a desired dimension including an amount of the thickness of the caps.

Abstract: A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500?R?surface pressure (N/mm2)×2000+12000.

Abstract: A welding method of applying energy to an interface where a metal glass and a crystalline metal make contact with each other or to the metal glass near the interface, heating and melting the metal glass to form a molten layer, and joining the metal glass and the crystalline metal. The metal glass has a glass formation ability in which a nose time of a TTT curve when a solid of the metal glass is reheated is 0.2 seconds or more. The metal glass and the crystalline metal are formed with a material that satisfies a temperature range of a temperature of the metal glass at which a spread factor of the crystalline metal that has not been melted and the molten metal glass is 25% or more and a melting point of the crystalline metal to be 100 K or more.

Abstract: The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract: Embodiments of the invention are directed to bearing assemblies configured to effectively provide heat distribution from and/or heat dissipation for bearing element, bearing apparatuses including such bearing assemblies, and methods of operating such bearing assemblies and apparatuses. In an embodiment, a bearing assembly includes a plurality of superhard bearing elements distributed about an axis. Each superhard bearing element of the plurality of superhard bearing elements has a superhard material including a superhard surface. Additionally, a support ring structure that includes a support ring that supports the plurality of superhard bearing elements and a thermally-conductive structure in thermal communication with the superhard table of each of the plurality of superhard bearing elements. The thermally-conductive structure has a higher thermal conductivity than the support ring of the support ring structure.

Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.

Abstract: A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.

Abstract: A method for armoring TiAl vanes of turbomachines is disclosed. A TiAl vane is provided onto which a mixture of at least one hard material and at least one braze material is applied so that subsequently the mixture can be brazed on the TiAl vane by an inductive heating process. A TiAl vane for a turbomachine, in particular for an aircraft engine, is also disclosed. The TiAl vane includes a TiAl main part and an armor which consists of a mixture of hard materials and braze material.

Abstract: The present invention relates to a method for manufacturing at least one portion of a seal ensuring gas-tightness between at least one first and one second glass panel in a glazing system, the method including the following steps: depositing a first adhesive layer on a first peripheral area of the first panel and a second adhesive layer on a second peripheral area of the second panel; welding a first metal seal element to the first adhesive layer; welding a second metal seal element or said first metal seal element to the second adhesive layer. According to the invention, the first and second adhesive layers are deposited using a high-speed oxy-fuel flame-spraying method.

Abstract: A method of sealing a ceramic component to a metal component for a metal halide battery is provided. The method involves the steps of coating a portion of the ceramic component with a metallic coating, and then bonding the coated ceramic component to the metal component. The metallic coating includes a reactive metal. A sealing structure formed by using such a method is also presented.

Abstract: An assembly comprises a carbon structure (10), a metal sheet (40), a brazing layer (20) disposed on a surface of the carbon structure (10). The brazing layer (20) is formed by brazing a brazing material on the surface of the carbon structure (10), and a solder layer (30) disposed on a surface of the brazing layer (20) and binding the metal sheet (40) to the brazing layer (20). A method for affixing a metal sheet (40) to a carbon structure (10) and a method for metalizing a surface of a carbon structure (10) are also provided.

Abstract: A commutator (10) comprising a plurality of commutator bars (12) formed from a graphite structure (30) and a metal sheet (20) having soldered to the graphite structure (30) includes a brazing process followed by a soldering process. The brazing process includes applying a brazing material the graphite structure (30) and brazing at an elevated temperature to form a brazing layer (40). The soldering process includes applying a solder material to the brazing layer (40), placing the metal sheet (20) on the solder material, and soldering to form a solder layer (50) affixing the metal sheet (20) to the graphite structure (30). A plurality of grooves (70) are cut in the graphite structure (30) and the metal sheet (20) to form the commutator bars (12) arranged in an intermittent ring or circle.

Abstract: A thermal barrier tile (34) with a braze layer (46) co-sintered to a ceramic layer (48) is brazed to a substrate (26) of a component for fabrication or repair of a thermal barrier coating (28) for example on a gas turbine ring segment (22, 24). The tile may be fabricated by disposing a first layer of a metal brazing material in a die case (40); disposing a second layer of a ceramic powder on the metal brazing material; and co-sintering the two layers with spark plasma sintering to form the co-sintered ceramic/metal tile. A material property of an existing thermal barrier coating to be repaired may be determined (90), and the co-sintering may be controlled (93) responsive to the property to produce tiles compatible with the existing thermal barrier coating in a material property such as thermal conductivity.

Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: Provided is an anode for a lithium secondary battery capable of improving the performance and the life of a lithium air battery by forming the anode so that lithium metal is sealed, but migration of lithium ions is possible, and thus, preventing corrosion of a lithium metal and the generation of hydrogen gas caused by permeation of moisture and oxygen gas into the anode, a manufacturing method thereof, and a lithium air battery containing the same.

Abstract: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 ?m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract: In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

Abstract: A runner for a snowmobile ski is fabricated from flat metal plate stock and incorporates mounting features for securing the runner to the ski and a wear strip of a relatively harder material provided on and projecting from a lower surface of the runner body. A quick release mounting system is provided for attaching the runner to the ski, including quick installation and release wedge mounting systems. The thin runner blade and wear strip are of the same thickness and are joined by a brazed joint. The invention contemplates a method of fabricating the runner and a method of mounting the runner.

Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.

Abstract: A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C.

Abstract: Reflow solderable, surface mount LED optic mounting devices are provided. Embodiments that include turnings (e.g., made on a swiss turning machine) and stampings (e.g., made with a progressive die) are provided. The LED optic mounting devices are suitably positioned by the same pick-and-place machine that is used to mount LED on planar surface with circuitry and solder pads and are attached to the solder pads by soldering.

Abstract: A vehicle, such as a missile, is disclosed. The vehicle includes an optically transparent dome, a vehicle body, and a brazed joint directly coupling the dome to the vehicle body. The dome is formed of a Nanocomposite Optical Ceramic (NCOC) material comprising two or more different types of nanograins dispersed in one another. Each nanograin type has a coefficient of thermal expansion (CTE), and an aggregate CTE of the NCOC material is based on the CTE of each nanograin type.

Abstract: Systems, methods, and devices that have a hermetic seal formed using reflow soldering are provided. The hermetic seal may protect electrical components within a packaging for use in downhole tools and/or other applications where the electrical components may be exposed to extreme environments. In one example, an electronic device includes a ceramic substrate having a plated ring. The electronic device also includes a metal lid. A high-temperature solder is disposed between the plated ring of the ceramic substrate and the metal lid. The electronic device includes a hermetically sealed cavity formed between the ceramic substrate and the metal lid. The hermetically sealed cavity is formed via a first bond between the plated ring of the ceramic substrate and the high-temperature solder, and via a second bond between the metal lid and the high-temperature solder. Moreover, the first and second bonds are formed using reflow soldering.

Abstract: The present disclosure generally relates to methods of using active braze techniques on beta-alumina. In some specific embodiments, the present disclosure relates to a method of sealing a portion of beta-alumina electrolyte, insulated collar and metal rings of a sodium-based thermal battery.

Abstract: The invention relates to a method for joining ceramic composite parts comprising at least one ceramic material and at least one superhard material to at least one other part, the method comprising treatment of a joining surface or surfaces of the ceramic composite part; and disposition onto the treated surface or surfaces, or portions thereof, of a material capable of bonding to the ceramic composite part as well as to the at least one other part upon the application of sufficient heat. The invention extends to articles comprising a ceramic composite part comprising ceramic material and at least one superhard material, bonded to at least one other part, the article including at least one layer selected from an attachment layer, a brazeable layer, and an oxidation resistant (braze compatible) layer or combinations thereof included at an interface between the ceramic composite part and the other part.

Abstract: The invention relates to a method for assembling at least one part made of a porous carbon material with at least one part made of a copper-rich metal material, and to an alloy paste used to implement same. The method according to the invention includes a step comprising the use of an alloy based on copper and silicon, having formula I CuxSiy, wherein x and y are atomic percentages with 25?x?60, 40?y?75 and x+y?95%, in order to assemble at least one part made of a porous carbon material with at least one part made of a copper-rich metal material. The invention is particularly suitable for use in the field of thermal engineering.

Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.

Abstract: Thermally stable polycrystalline constructions comprise a body having a polycrystalline ultra-hard phase and a plurality of empty voids. A population of the voids can be filled with a reaction product. The body is substantially free of a catalyst material. The construction comprises a first support member attached to the body by a first braze material. A second support member is attached to the body and the first support member by a second braze material. The construction may include a third support member attached to the body that is integral or separate from one of the other support members. The braze materials used to attached the support members can be the same or different, as can be the materials used to form the different support members.

Abstract: A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C.

Abstract: A heat dissipation device includes a heat dissipation element and a ceramic main body. The heat dissipation element includes a heat transfer section and a heat dissipation section located on one side of the heat transfer section; and the ceramic main body is directly connected to another side of the heat transfer section opposite to the heat dissipation section by way of welding or a direct bonding copper process, so as to overcome the problem of crack at an interface between the heat dissipation device and a heat source due to thermal fatigue. A method of manufacturing the above-described heat dissipation device is also disclosed.

Abstract: A bonded body 10 includes a plate-shaped alumina or aluminum nitride ceramic member 12 and a Mo or Ti terminal 14 having a Ni coating, a Au coating, or a Ni—Au coating (Au on Ni) and joined to a recess 12a in the ceramic member 12 with a joint layer 16 therebetween. The joint layer 16 contains Au, Ge, Ag, Cu, and Ti and is in contact with at least part of the side surfaces (herein the entire side surfaces) and the bottom surface of the recess 12a. Ti is rich in the joint interface between the joint layer 16 and the ceramic member 12. The percentage (porosity) of the sum of the cross-sectional areas of pores to the cross-sectional area of the joint layer 16 in a cross-section taken across the thickness of the bonded body 10 is 0.1% to 15%.

Abstract: A method of forming and assembling at least two parts together that may be metal, ceramic, or a combination of metal and ceramic parts. Such parts may have different CTE. Individual parts that are formed and sintered from particles leave a network of interconnecting porosity in each sintered part. The separate parts are assembled together and then a fill material is infiltrated into the assembled parts using a method such as capillary action, gravity, and/or pressure. The assembly is then cured to yield a bonded and fully or near-fully dense part that has the desired physical and mechanical properties for the part's intended purpose. Structural strength may be added to the parts by the inclusion of fibrous materials.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.