Abstract: The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.

Abstract: A process for metalizing a ceramic surface or attaching a ceramic to a metal is provided. The process may comprise: immersing the ceramic into an aluminum or aluminum alloy melt, making the ceramic move or stay still relative to the melt to adhere the melt to the ceramic; and then removing the ceramic from the melt to unaffectedly cool the film adhered thereto. The process can attach an aluminum or aluminum alloy thin film having a thickness of several to tens of micrometers on a ceramic surface. The thin film is formed by solidification, and does not have microscopic faults such as oxide film inclusions or pores, therefore having proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself. This invention discloses a process for metalizing the surface of a ceramic and a process for attaching a ceramic to a metal.

Abstract: A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.

Abstract: A target for generating x-rays includes a target substrate comprising molybdenum and having a beveled surface according to a desired track angle, a track comprising tungsten and configured to generate x-rays from high-energy electrons impinging thereon, wherein the track comprises a brazing surface having an area that is less than an area of the beveled surface of the target substrate, and a braze joint attaching the brazing surface of the track to the beveled surface of the target substrate.

Abstract: A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%. A method of manufacturing the ceramic/metal composite structure is also provided.

Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part comprising: providing a SUS part, a SiC ceramic part, a Mo foil and a Ni foil; depositing a nickel coating on a surface of the SiC ceramic part; placing the SiC ceramic part, the Mo foil, the Ni foil, and the SUS part into a mold, the Mo foil and the Ni foil located between the SiC ceramic part and the SUS part; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part with the nickel coating, the SiC ceramic part, the Mo foil, and the Ni foil at least until the SUS part, the SiC ceramic part, the Mo foil and the Ni foil form a integral composite article.

Abstract: Disclosed herein is a manufacturing method for a ceramic heater. The manufacturing method includes the step of manufacturing a sintered ceramic substrate using a ceramic material and forming a conductive through hole in the ceramic substrate, the step of screen printing low temperature firing paste on the ceramic substrate, thus forming a heating wire, the step of screen printing Ag paste on the through hole, thus forming an electrode, the step of joining, using heat and pressure, a green sheet to a surface of the ceramic substrate on which the heating wire is formed, the step of firing the joined ceramic substrate and green sheet at low temperature, thus manufacturing a substrate body, and the step of brazing the lead wire to the electrode of the substrate body using filler metal while the lead wire is exposed to atmosphere.

Abstract: A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation.

Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part comprising: providing a SUS part, a SiC ceramic part, a Mo foil and a Ti foil; placing the SiC ceramic part, the Mo foil, the Ti foil, and the SUS part into a mold, the Mo foil and the Ti foil located between the SiC ceramic part and the SUS part, the Mo foil abutting the SiC ceramic part, the Ti foil abutting the SUS part and the Mo foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the SiC ceramic part, the Mo foil, and the Ti foil at least until the SUS part, the SiC ceramic part, the Mo foil and the Ti foil form a integral composite article.

Abstract: A process for joining a stainless steel part and a titanium carbide ceramic part comprising: providing a SUS part, a TiC ceramic part, a Ti foil and a Fe foil; placing the TiC ceramic part, the Ti foil, the Fe foil, and the SUS part into a mold, the Ti foil and the Fe foil located between the TiC ceramic part and the SUS part, the Ti foil abutting the TiC ceramic part, the Fe foil abutting the SUS part and the Ti foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the TiC ceramic part, the Ti foil, and the Fe foil at least until the SUS part, the TiC ceramic part, the Ti foil and the Fe foil form a integral composite article.

Abstract: A process for joining a stainless steel part and a zirconia ceramic part comprising: providing a SUS part, a ZrO2 ceramic part, a Mo foil and a Cu foil; depositing a nickel coating on a surface of the ZrO2 ceramic part; placing the ZrO2 ceramic part, the Mo foil, the Cu foil, and the SUS part into a mold, the Mo foil and the Cu foil located between the ZrO2 ceramic part and the SUS part; placing the mold into a chamber of a hot press sintering device, heating the chamber and pressing the SUS part with the nickel coating, the ZrO2 ceramic part, the Mo foil, and the Cu foil at least until the SUS part, the ZrO2 ceramic part, the Mo foil and the Cu foil form a integral composite article.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A method for making a thermal interface structure which includes a carbon nanotube layer, in which the carbon nanotubes are oriented parallel to the direction of thermal transmission and metal layers provided on two edge surfaces of the carbon nanotube layer, the edge surfaces being perpendicular to the direction of the thermal transmission and located substantially parallel to the orientation direction at which edges of the carbon nanotubes are oriented.

Abstract: The present invention provides a wiring material for forming wiring on a substrate by causing coalescence of conductive particles through heating, and including a binder layer and a wiring layer. The binder layer contains metal particles and having a binder function to be adhered to the substrate; and the wiring layer contains metal particles and laminated on the binder layer. The metal particles of the binder layer and the metal particles of the wiring layer are in contact with each other. With this arrangement, it is possible to provide a wiring material allowing use of a larger variety of materials, while also ensuring low resistance of wiring and improvement of adhesion between the wiring and the substrate.

Abstract: Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219° C. and 1000° C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.

Abstract: The invention relates to a method for producing a ceramic-metal connection that is repeatedly subjected to great changes in temperature during use, in which the metal and ceramic are brazed to one another two-dimensionally.

Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part, comprising steps of: providing a stainless steel part, a SiC ceramic part, and a Al foil; bringing surfaces of the stainless steel part, SiC ceramic part, and Al foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a pulsed electric current to the stainless steel part, SiC ceramic part, and Al foil, heating the stainless steel part, SiC ceramic part, and Al foil to a joining temperature of about 500-650° C., and simultaneously applying a joining pressure of about 50-100 MPa to the stainless steel part, SiC ceramic part, and Al foil while the current is applied, and maintaining the joining temperature and the joining pressure for about 10-30 minutes.

Abstract: A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic. The metallization is applied by active soldering before patterning. An intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.

Abstract: A method of forming and assembling at least two parts together that may be metal, ceramic, or a combination of metal and ceramic parts. Such parts may have different CTE. Individual parts that are formed and sintered from particles leave a network of interconnecting porosity in each sintered part. The separate parts are assembled together and then a fill material is infiltrated into the assembled parts using a method such as capillary action, gravity, and/or pressure. The assembly is then cured to yield a bonded and fully or near-fully dense part that has the desired physical and mechanical properties for the part's intended purpose. Structural strength may be added to the parts by the inclusion of fibrous materials.

Abstract: A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the length of a feedthrough pin, which micro-flanges grabs and compresses the insulator material to form a hermetic seal. Because the seal design produces positive compression of the insulator, the seal is relatively insensitive to changes in temperature and to differences in thermal expansion coefficients (“TCEs”) between the metal feedthrough and the insulator. It is therefore possible to use a wider variety of materials for the insulator and the feedthrough with the described sealing design, while achieving a superior hermetic seal.

Abstract: Disclosed is a target for isotope production, that comprises a porous, nanostructured material with structure elements having in at least one dimension an average size of 700 run or less, preferably 500 nm or less and most preferably 150 nm or less, said nanostructured material comprising one Of Al2O3, Y2O3 and ZrO2.

Abstract: A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and a unit adhesion material layer that contains Sn, Sn alloy, Pb alloy or Bi alloy is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the unit adhesion material layer is sandwiched therebetween; and causing a light including the predetermined wavelength to enter the unit substrate to melt the unit adhesion material layer. The unit adhesion material layer melted by the light including the predetermined wavelength can ensure high alignment accuracy as well as higher bonding strength and less change with time.

Abstract: Apparatus, systems and methods for forming a structure that includes a metal and a composite material are disclosed. According to one aspect, a layer stack includes a metal layer with a first surface, the first surface including at least one protruding feature. The layer stack also includes a non-metal layer molded to the first surface of the metal layer, wherein the non-metal layer is molded over and/or around the at least one protruding feature.

Abstract: A method of manufacturing metal to glass, metal to metal and metal to ceramic connections to be used in SOFC applications, said connections being produced as a mixture of a base glass powder and a metal oxide powder. As a result, the inherent properties of the glass used in the composite seals may be altered locally in the metal-coating interface by adding e.g. MgO in order to control the viscosity and wetting, and at the same time maintain the bulk properties such as high coefficient of thermal expansion of the basic glass towards the seal components.

Abstract: An electrical connector including a base pad formed of aluminum and having a bottom surface. An electrical contact can be connected to the base pad. A layer of copper can be on the bottom surface of the base pad.

Abstract: The present invention's composite-to-metal attachment methodology—bolt-free and adhesive-free—features the implementation of an intermediary structure containing metallic fibrous material. The intermediary structure couples a first adherend (which contains nonmetallic fibrous material) with a second adherend (which contains metallic nonfibrous material). The intermediary structure's fibrous attribute is availed of for effecting its co-cure attachment to the first adherend. The intermediary structure's metallic attribute is availed of for effecting its weld attachment to the second adherend. According to typical inventive practice, respective panels of the first adherend and the intermediary structure are arranged and connected so as to describe a stepped configuration at the interface between the first adherend and the intermediary structure. The first adherend and a first portion of the intermediary structure are co-impregnated with a uniform resinous system and are co-cured.

Abstract: A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.

Abstract: Disclosed is a method of assembling a metallic-graphite structure (10) including arranging one or more layers of graphite fiber material (12) and locating at least one metallic sheet (18) adjacent to the one or more layers of graphite fiber material (12). The at least one metallic sheet (18) is secured to the one or more layers of graphite fiber material (12) via brazing. Further disclosed is a metallic-graphite structure (10) including one or more layers of graphite fiber material (12) and at least one metallic sheet (18) located adjacent to the one or more layers of graphite fiber material (12). The at least one metallic sheet (18) is secured to the one or more layers of graphite fiber material (12) via brazing.

Abstract: The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.

Abstract: A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase nanocrystalline magnetic metal-aluminum powder at an interface between the at least two parts to be joined and applying an alternating magnetic field (AMF). The AMF has a magnetic field strength and frequency suitable for inducing magnetic hysteresis losses in the metal-aluminum powder and is applied for a period that raises temperature of the metal-aluminum powder to an exothermic transformation temperature. At the exothermic transformation temperature, the metal-aluminum powder melts and resolidifies as a metal aluminide solid having a non-magnetic configuration.

Abstract: The present disclosure relates to methods for joining ceramics to metals and a tool for use in the methods. A medical device and a method of manufacturing a medical device is also disclosed.

Abstract: A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.

Abstract: An injection molding nozzle having improved corrosion and wear resistance is disclosed for use in a hot runner injection molding system. The nozzle includes a nozzle body having a nozzle melt channel for receiving a melt stream of moldable material from a melt source. The nozzle has a nozzle seal comprised of a tip retainer and a nozzle tip having a tip melt channel, wherein the tip retainer secures the nozzle tip to the nozzle body such that the tip melt channel receives the melt stream from the nozzle melt channel. The nozzle tip further includes a tip base of a thermally conductive material that has a diamond crown secured to a downstream end thereof. The diamond crown sits within a vestige area of the injection molding system and provides improved corrosion and wear resistance to the nozzle tip.

Abstract: A method of assembling two or more parts together that may be metal, ceramic, metal and ceramic parts, or parts that have different CTE. Individual parts are formed and sintered from particles that leave a network of interconnecting porosity in each sintered part. The separate parts are assembled together and then a fill material is infiltrated into the assembled, sintered parts using a method such as capillary action, gravity, and/or pressure. The assembly is then cured to yield a bonded and fully or near-fully dense part that has the desired physical and mechanical properties for the part's intended purpose. Structural strength may be added to the parts by the inclusion of fibrous materials.

Abstract: A method of joining metals to a ceramic material such as a ceramic matrix composite is provided which utilizes a compliant interlayer having a coefficient of thermal expansion between the coefficient of thermal expansion of the metal and that of the ceramic matrix composite. The compliant interlayer is bonded to the metal, and the ceramic matrix composite is then bonded to the bonded interlayer/metal. The method results in a high strength joint between a metal having a high coefficient of thermal expansion and a ceramic material having a low coefficient of thermal expansion.

Abstract: Diamond bonded constructions comprise a body comprising a plurality of bonded together diamond grains with interstitial regions disposed between the grains that are substantially free of the catalyst material used to initially sinter the body. A metallic substrate is attached to the body, and a braze joint is interposed between the body and the substrate. The body is metallized to include a metallic material disposed along a substrate attachment surface in contact with the braze joint, wherein the metallic material is different from the braze joint material. The metallic material may exist within a region of the body extending fully or partially into the body, and/or may exist as a layer extending away from the substrate attachment surface. The body includes a working surface characterized by empty interstitial regions or by interstitial regions filled with an infiltrant material, wherein the infiltrant material is different from the metallizing material.

Abstract: A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the length of a feedthrough pin, which micro-flanges grabs and compresses the insulator material to form a hermetic seal. Because the seal design produces positive compression of the insulator, the seal is relatively insensitive to changes in temperature and to differences in thermal expansion coefficients (“TCEs”) between the metal feedthrough and the insulator. It is therefore possible to use a wider variety of materials for the insulator and the feedthrough with the described sealing design, while achieving a superior hermetic seal.

Abstract: A matrix drill bit and method of manufacturing a matrix bit body from a composite of matrix materials is disclosed. Two or more different types of matrix materials may be used to form a composite matrix bit body. A first matrix material may be selected to provide optimum fracture resistance (toughness) and optimum erosion, abrasion and wear resistance for portions of a matrix bit body such as cutter sockets, cutting structures, blades, junk slots and other portions of the bit body associated with engaging and removing formation materials. A second matrix material may be selected to provide desired infiltration of hot, liquid binder material with the first matrix material to form a solid, coherent, composite matrix bit body.

Abstract: Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.

Abstract: An improved electrical connector for use with a glazing is disclosed. The glazing preferably comprises a ply of glazing material having a first electrically conductive component mounted thereon, and a second electrically conductive component, joined to the first by a lead-free solder. The second component has a thickness t and comprises first and second connector feet linked by a bridge portion, the bridge portion being at a height h above each of the connector feet. T and/or h are chosen to minimise the occurrence of stress faults in the glass in the region of the solder. Preferably, the glazing is an automotive glazing.

Abstract: The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.

Abstract: The x-ray target assemblies have an oxide dispersion strengthened (ODS) refractory metal alloy substrate that is bonded to a carbon-containing heat sink. The x-ray target assemblies have excellent bonding between the substrate and the heat sink. The improved bonding is achieved by placing an oxide-free barrier layer between the ODS metal substrate and the heat sink. The oxide-free barrier layer minimizes or eliminates chemical reactions that would otherwise be possible between the dispersed oxides and the carbon-based heat sink during the manufacturing process. Preventing these undesired reactions while manufacturing the x-ray target assembly yields a device with improved bonding between the heat sink and the substrate, compared to devices manufactured without the barrier layer.

Abstract: A device including a metal substrate and a ceramic substrate including a back-tapered groove separated from each other by a sealed flexible link. The link includes: a metal element including an end connected to the metal substrate and at another end housed in the groove of the ceramic substrate, the metal element being elastically deformable both in the groove along a direction radial to the groove and, in the separation space between the metal substrate and the ceramic substrate along the separation direction, and a joint-forming mass with a greater thermal expansion coefficient than that of the ceramic substrate and adhesively bonded to the end of the metal element housed in the back-tapered groove, the joint fitting with direct contact a portion of the height of convergent sidewalls of the groove.

Abstract: A heat sink designed as a heat pipe has an interior space in a body of the heat sink that is closed toward the outside. The interior space has at least one vapor channel and at least one fluid space connected with the vapor space and having a porous or capillary structure. The heat pipe is made using the DCB process to connect each end of posts within the interior space directly with one of the two opposing walls forming the interior space.

Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.

Abstract: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 ?m at least over the majority of the soldering surface.

Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.

Abstract: This invention provides methods and systems for brazing. One aspect of the invention provides a method of brazing cutter teeth. The method includes providing a bit body, pressing at least one cutter against the bit body with a spring device, placing the bit body and the at least one cutter in an inert gas filled chamber with about 10% H2, and heating the chamber to a temperature above the melting point of the filler metal thereby melting the filler metal. A quantity of filler metal is held between each of the at least one cutters and the bit body.

Abstract: According to one embodiment t of the present invention a method of manufacturing metal-to-ceramic seals comprising the steps of: (a) providing a ferric stainless steel part selected from the group consisting of high temperature stainless steels and high temperature superalloy; (b) providing a ceramic part; (c) providing a braze material in between the ferric stainless steel part and said ceramic part, the braze containing Ag and metal oxide wetting agents; and (d) heating said ferric stainless steel part, braze material, and ceramic part in an oxidizing atmosphere.

Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.