Abstract: A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.

Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.

Abstract: A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include providing a metal layer coating of titanium or nickel on the surface of the ceramic or graphite substrate to be joined or using a high nickel content or high cobalt content and containing titanium. The brazing alloy contains a high nickel content 70-95% by weight, or a high cobalt content between 45-55% by weight. This brazing alloy can contain titanium in the range between 0.5-5% by weight.

Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.

Abstract: The present invention comprises a method of manufacturing a brazed body. The method comprises forming a multi-layer assembly comprising: a first material capable of forming a first oxide and having a melting temperature higher than 660° C.; a first reducing metal adjacent the first material, the reducing metal capable of reducing at least a portion of the first oxide on the first material a braze adjacent to the reducing metal; and a second material adjacent the braze, the second material comprising a material having a melting temperature higher than 660° C. The method then comprises creating a vacuum around the assembly, and heating the assembly to melt the reducing metal and the braze. The assembly is then subject to cooling to thereby form the brazed body.

Abstract: A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.

Abstract: A method of joining metal and metal, or metal and ceramic parts, wherein a first metal part is selected and then processed to form a bond coat that will effectively bond to a sealing material which in turn bonds to a second metal or ceramic part without degrading under the operating conditions of electrochemical devices. Preferred first metal parts include alumina forming alloys from the group consisting of ferritic stainless steels (such as Fecralloys), austinetic stainless steels, and superalloys, and chromia forming alloys formed of ferritic stainless steels. In the case of chromia forming ferritic stainless steels, this bond coat consists of a thin layer of alumina formed on the surface, with a diffusion layer between the first metal part and this thin layer. The bond coat provides a good bonding surface for a sealing layer of glass, braze or combinations thereof, while at the same time the diffusion layer provides a durable bond between the thin alumina layer and the first metal part.

Abstract: There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied on a predetermined portion of a surface of the metal member 14 to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer 12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal 12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer 12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member 14 and the metal layer 12b from being etched and which selectively etch the active metal layer 12b, to form a metal circuit on the ceramic substrate 10.

Abstract: A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joining surface of the supporting member. A second metal film is formed on a joining surface of the metal member. A metal adhesive is placed between the first and second films to provide an assembly. The assembly is then heated at a temperature not higher than a melting point of the metal adhesive while the assembly is subjected to isostatic pressing, so that the supporting and metal members are joined by diffusion joining.

Abstract: An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.

Abstract: A combinatorial process for production of material libraries from a single sample, comprising forming a diffusion multiple in the single sample, wherein the diffusion multiple comprises a plurality of interdiffusion regions at interfacial locations of dissimilar metals, metal oxides, or alloys, and wherein the diffusion multiple comprises at least three layers of the metals, non-metals, metal oxides, or alloys; and evaluating properties of the diffusion multiple as a function of composition at about the interdiffusion regions.

Abstract: A bonding agent for metals or ceramics comprising 0.25 to 18.0% by weight of a powder of Mg and 25 to 50% by weight of a hydroxyl solvent, the balance of its composition being a powder of AlN. The bonding agent having the constituents stated above has a large amount of reaction heat generated by the reaction of its constituents. This reaction heat destroys thermally any strong oxide film existing on the surface of a base body or a part to be joined thereto, and forming a barrier layer hindering their bonding when the base body and the part to be joined thereto are of an aluminum alloy.

Abstract: An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

Abstract: The interfacial joint area of a target/backing plate assembly is sealed so as to inhibit the migration of air and/or water vapor that may be present or trapped along the interfacial surfaces. A pool or bead of molten solder is placed along the interfacial joint and moved continuously around the full 360° circumference of the assembly so as to cover and seal the boundary area. The solder is melted, preferably, by e-beam welding in a vacuum or the like.

Abstract: A method for attaching a first element to a second element is provided. The first element has a surface portion covered with a layer of silicon, and the second element has a surface portion covered with a layer of nickel. The method includes applying pressure so that the surface portions of the first and second elements are in contact with one another. A roughness between the surface portions is less than about 1 &mgr;m, and the first and second elements are heated within a range of about 250° C. to 400° C.

Abstract: To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser chip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser chip. Therefor, when the mounting plate is overlaid to the laser chip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film.

Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.

Abstract: A sputtering target is provided, including a target material and a backing plate that are bonded with a strong adhesion at a reduced cost. The method for bonding the target material and the backing plate does not use a special soldering material, and is therefore cheaper and more reliable. The target includes an inorganic target material and a backing plate that are bonded with a soldering material between them. At least one of the target material and the backing plate is coated with a coupling agent of a semi-metal oxide or a metal oxide.

Abstract: The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat sink, wherein the surface of the ceramic member which is placed against the MMC- or copper body is coated with a first metal by heating the two bodies to above the eutectic temperature of a system comprised of the matrix metal of the MMC-body or the copper of the copper body and the first metal applied to the surface of the ceramic member; and subsequently cooling the system to room temperature.

Abstract: A method for manufacturing a cooling element comprising a housing part and ceramic lining elements arranged on the housing part surface. The ceramic lining elements (2) are connected to the element housing part (1) by using in the joint between the lining elements and the housing part a soldering/brazing agent, wherein at least the junction area is heated at least up to the melting temperature of the soldering/brazing agent, so that there is created a joint with a good thermal contact with the element housing part (1) and a ceramic lining element (2). The invention also relates to a cooling element.

Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

Abstract: A substrate for power semiconductor modules with a through-plating of solder, includes two metal plates and a ceramic plate which is seated as a layer between the metal plates and has a through hole formed therein. The substrate is plated through by making a through hole in one of the metal plates in alignment with the through hole in the ceramic plate and applying a paste solder to one side of the substrate. The substrate is then subjected to a furnace step, so that the paste solder flows into the through holes and the solder makes a permanent contact between the two metal plates. A method for producing the substrate is also provided.

Abstract: A method of joining metal and metal, or metal and ceramic parts, wherein a first metal part is selected and then processed to form a bond coat that will effectively bond to a sealing material which in turn bonds to a second metal or ceramic part without degrading under the operating conditions of electrochemical devices. Preferred first metal parts include alumina forming alloys from the group consisting of ferritic stainless steels (such as Fecralloys), austinetic stainless steels, and superalloys, and chromia forming alloys formed of ferritic stainless steels. In the case of chromia forming ferritic stainless steels, this bond coat consists of a thin layer of alumina formed on the surface, with a diffusion layer between the first metal part and this thin layer. The bond coat provides a good bonding surface for a sealing layer of glass, braze or combinations thereof, while at the same time the diffusion layer provides a durable bond between the thin alumina layer and the first metal part.

Abstract: After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.

Abstract: In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding components in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

Abstract: A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

Abstract: This disclosure describes a technique for fusing self-fluxing metallic coatings on non-cylindrical objects without the need to conduct the fuse operation in a vacuum furnace or some other type of protective environment. The technique consists of first applying the self-fluxing coating to the surface, then optionally applying a ceramic coating on top of the self-fluxing coating. The object is then submerged into a vessel containing a low-melting inert material. The aggregate is then heated, and as the glass becomes molten, it encases the object and protects it from oxidation. As heating continues, the fusing temperature is reached and the self-fluxing alloy becomes molten. The ceramic coating encases the self-fluxing alloy and acts as a mold. When fusing is complete, the aggregate is then slowly cooled to ambient temperature. The glass frit and the ceramic shell are then removed, and one is left with an object coated with a uniform thickness of a dense adherent fused coating on the surface of the object.

Abstract: The present invention comprises a method of manufacturing a brazed body. The method comprises forming a multi-layer assembly comprising: a first material capable of forming a first oxide and having a melting temperature higher than 660° C.; a first reducing metal adjacent the first material, the reducing metal capable of reducing at least a portion of the first oxide on the first material a braze adjacent to the reducing metal; and a second material adjacent the braze, the second material comprising a material having a melting temperature higher than 660° C. The method then comprises creating a vacuum around the assembly, and heating the assembly to melt the reducing metal and the braze. The assembly is then subject to cooling to thereby form the brazed body.

Abstract: A method of manufacturing heat-insulating structural and/or light elements composed of at least two wall elements of glass, a glass alloy or metal, wherein the wall elements are separated from each other by support elements and are provided on at least one of surfaces thereof facing each other with a layer reflecting heat radiation, and wherein the structural and/or light elements further are composed of a deformable sealing element for connecting the wall elements to obtain a hollow space between the wall elements which can be evacuated or supplied with gas.

Abstract: A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or containing alumina and a metal or metal alloy. The braze composition is non-reactive with alumina or a reactive composition, whose reactivity with alumina is controlled, and it is formed of aluminium, of titanium, and of a matrix made up either of palladium, or of nickel, or of a nickel and palladium alloy.

Abstract: There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.

Abstract: A diamond foam article comprises diamond deposited material on a substrate having an open contiguous structure at least partially filled with a filler material. Methods for forming a diamond foam article comprise providing a foam substrate; preparing the foam substrate for diamond deposition; depositing diamond material on the foam substrate by one of several diamond deposition methods; and at least partially filling the diamond foam article with a filler material. Diamond foam articles are bonded to other components.

Abstract: The invention includes a brazed ceramic ring that separates the positive and negative ends of the battery while still providing a leak-tight seal. The ceramic is aluminum oxide or zirconium oxide or zirconium oxide with 3% yttrium. The invention includes a brazing material that is greater than 50% gold. The invention includes a titanium alloy case (Ti-6Al-4V) which is titanium with 6% aluminum and 4% vanadium as its major alloying elements. The case has the desirable properties of titanium such as high strength for a relatively low weight; and the case has the requisite ability and electro-activity to be used as a positive current carrying element where the battery's positive electrode exhibits more than 3.5 V vs. Li/Li+.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: There are provided a bonded member comprising different materials which are bonded together, the bonded member having air tightness at the interface between the bonded materials and also having thermal cycle properties and thermal shock properties and being able to be produced by a simple operation, and an easy-to-practice production method of the bonded member comprising different materials.

Abstract: A method of joining metal and ceramic parts, wherein an alumina forming metal part and a ceramic part are provided. A braze material in placed between the alumina forming metal part and the ceramic part, and the combination is then heated in an oxidizing atmosphere, preferably in air at a temperature of between 500° C. and 1300° C. The alumina forming metal parts are selected from the group consisting of high temperature stainless steels, such as Durafoil (alpha-4), Fecralloy, Alumina-coated 430 stainless steel and Crofer-22APU, and high temperature superalloys such as Haynes 214, Nicrofer 6025, and Ducraloy. The braze material is selected as a metal oxide-noble metal mixture, preferably Ag—CuO, Ag—V2O5, and Pt—Nb2O5, and more preferably between 30.65 to 100 mole % Ag in CuO.

Abstract: This invention is an improved method for making a battery case feedthrough. It utilizes stainless steel or titanium metal clad with aluminum. The use of the clad metal enables the fabrication of the battery case and cover and feedthrough pin assembly where a high temperature ceramic-metal hermetic seal is needed between a stainless steel feedthrough pin and a ceramic insulator; and between a ceramic insulator and a surrounding hollow cylinder. A high temperature hermetic seal is also used to fasten the feedthrough pin assembly to the upper stainless steel part of the stainless steel-aluminum clad cover. Titanium can be substituted for stainless steel. Lower temperature metal-metal hermetic seals are needed between the aluminum-clad part of the cover and the aluminum battery casing.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: A method is disclosed comprising the steps of locating, on a surface of a downhole component, a plurality of thermally stable polycrystalline diamond (TSP) bearing elements, and then applying to the surface a settable facing material which bonds to the surface between the bearing elements and embraces the elements to hold them in place. A method in which bearing elements each comprising a body of TSP at least partly surrounded by a layer of less hard material are secured to the surface by welding or brazing part of the surface of each bearing element which comprises said less hard material to said component is also described.

Abstract: The invention relates to a method for producing a heat-conducting connection between two work pieces (1, 2). which is characterized by first producing a porous sintered layer (3), interposed between the two work pieces (1, 2) and sintered onto every work piece (1, 2) across a certain area, and subsequently compacting the porous sintered layer (3) sintered onto the two work pieces (1, 2) by pressing the two work pieces (1, 2) against each other.

Abstract: A method of manufacturing an article of manufacture for use in a fluxless brazing process is disclosed. The method comprises the step of applying a braze-promoting layer including one or more metals selected from the group consisting of nickel, cobalt and iron, onto a bonding layer which comprises one or more metals selected from the group consisting of zinc, tin, lead, bismuth, nickel, antimony and thallium and which is disposed on a substrate including aluminum.

Abstract: When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consisting of gold and silver, and copper as principal components, and further containing 0.001 to 5 mass % of vanadium is used. Preferably, a vanadium content is not more than 2.0 mass %, and more preferably not more than 0.5 mass %. Using this brazing-filler material, unidirectional solidification is performed from a side of diamond to form vanadium carbide in a joined interface in a shape of islands, and thereby an interface having a beautiful view with stable joining strength can be obtained. In addition, strong joining is possible also by a usual solidification method.

Abstract: Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a carbon-carbon composite support. A particulate braze mixture comprising Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto the support surface, and hafnium or zirconium foil may be introduced between the braze mixture and the refractory metal body complementary surface. Reaction-brazing is carried out at or near the eutectic point of the components, which may be influenced to some extent by the presence of carbon and boride. Heating to about 1865° C.

Abstract: This invention is an improved method for making a battery case feedthrough. It utilizes stainless steel or titanium metal clad with aluminum. The use of the clad metal enables the fabrication of the battery case and cover and feedthrough pin assembly where a high temperature ceramic-metal hermetic seal is needed between a stainless steel feedthrough pin and a ceramic insulator; and between a ceramic insulator and a surrounding hollow cylinder. A high temperature hermetic seal is also used to fasten the feedthrough pin assembly to the upper stainless steel part of the stainless steel-aluminum clad cover. Titanium can be substituted for stainless steel. Lower temperature metal-metal hermetic seals are needed between the aluminum-clad part of the cover and the aluminum battery casing.

Abstract: After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

Abstract: An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes a ceramic layer overlying the adhesion layer. In one embodiment, the ceramic layer is a thermal barrier coating (TBC), formed of stabilized zirconia (ZrO2).

Abstract: A method of joining a ceramic matrix composite rocket nozzle to a metal manifold is provided, wherein a silicon nitride insert is disposed inside the ceramic matrix composite rocket nozzle and the metal manifold to provide a joint therebetween. The silicon nitride insert is preferably co-processed with the ceramic matrix composite rocket nozzle such that the ceramic matrix provides a bond between the rocket nozzle and the insert. The metal manifold is then secured to the silicon nitride insert, preferably using brazing, to form a joint assembly.

Abstract: In order to simplify the soldering process in the production of a vacuum-tight soldered joint between a ceramic component and a copper component, a layer of silver is first applied galvanically to the copper component to form the soldering material together with the underlying surface layer of the copper component. During the heat treatment required for soldering metal components can also be soldered in the same manner to the copper component, e.g. the bellows or the screen of a vacuum switching tube.

Abstract: It is provided a method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members. A first metal film is formed on a surface to be joined of the supporting member. A second metal film is formed on a surface to be joined of the metal member. A metal adhesive is placed between the first and second films to provide an assembly. The assembly is then heated at a temperature not higher than a melting point of the metal adhesive while the assembly is subjected to isostatic pressing, so that the supporting and metal members are joined by diffusion joining.