Abstract: A method includes producing sheet steel products, in which steel blanks or steel strips of different thicknesses and/or material grades are welded together along a joint formed by edges of the steel blanks or steel strips. In order that the welding seam of such a sheet steel product does not lose the hardened microstructure obtained by abrupt cooling during warm forming with heating to an austenization temperature, before the welding process, a viscous liquid, such as a paste, or a solid, pulverulent, or aerosol-like substance that contains at least one component that increases the strength of the weld seam that is to be produced, is applied to at least one weld edge of the steel blanks or steel strips that are to be welded together.

Abstract: A method of providing a mould with a conformal cooling passage includes rough machining a mould cavity generally corresponding to a moulded part shape using CAD data. Conformal cooling slots are cut in the mould cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mould part shape using the CAD data.

Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.

Abstract: An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Abstract: To provide a target device that can easily be reused in which the amount of gas discharge is small. The present invention is a target device including a backing plate and a target plate that is fixed to the backing plate with a metal brazing material, in which a protective film made of a TiN thin film in which a proportion of (111) plane is at a maximum is formed on an exposed portion of the backing plate. The discharge amount of gas is small, and the brazing material that adheres when fixing the target plate can be easily peeled off.

Abstract: A solder ball device has a contact surface and a solder ball that is connected electrically conductively to the contact surface. Between the solder ball and the contact surface, a conductive polymer is situated, which is connected to the solder ball and the contact surface.

Abstract: Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode.

Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part is configured to fit inside a second portion of the second part, preplacing a first self-fluxing braze alloy on one or more of the first portion and second portion, preplacing a non-phosphorous braze alloy on the first self-fluxing braze alloy, preplacing another layer of the first self-fluxing braze alloy on the non-phosphorous braze alloy, thermally treating at least one of the first portion and second portion, to create a temperature differential between the first portion and second portion, inserting the first portion into the second portion, and heating at least one of the first portion and second portion to melt both layers of the first self-fluxing braze alloy and the non-phosphorous braze alloy. The first portion is joined by brazing to the second portion.

Abstract: Ball grid array to pin grid array conversion methods are provided. An example method can include coupling a plurality of solder balls to a respective plurality of pin grid array contact pads. Each of the plurality of solder balls is encapsulated in a fixed material. A portion of the plurality of solder balls and a portion of the fixed material is removed to provide a plurality of exposed solder balls. The exposed solder balls are softened and each of a plurality of pin members is inserted in a softened, exposed, solder ball. The plurality of pin members forms a pin grid array package.

Abstract: [Problems] To provide a process for producing a thermal sprayed, metal plated steel tube having a metal layer substantially uniform and favorable over the whole surface in a highly productive manner. [Means for solving] A process for producing a metal tube comprising continuously forming a metal plate composed of a first component into a tubular shape and continuously welding its butted ends to form the metal tube, wherein, after the continuous welding, a metal layer composed of a second component which is different from the first component is formed by thermal spraying directly over the surface of the metal tube, the metal layer having no discontinuities in the circumferential and lengthwise directions. Especially it is preferred that the process comprises a process step of making the thickness distribution of the metal layer more uniform after formation of the thermal sprayed metal layer over the external surface.

Abstract: A method of performing primary solder bonding of a semiconductor chip to an organic interposer, and secondary solder bonding of the organic interposer to a motherboard and a 3-dimension stacked assembly structure formed by the method thereof. The method includes: providing on the organic interposer, a first solder bump, where the first solder bump has a solder material of a relatively high melting point stacked on a solder material of a relatively low melting point; heating the first solder material to a first temperature that melts the solder material of a relatively low melting point but does not melt the solder material of a relatively high melting point; sealing, using an underfill material, the gap between the semiconductor chip and the organic interposer; and heating the first solder bump to a second temperature that melts the solder material of a relatively high melting point.

Abstract: A method for brazing a component in a power generation system, the brazed power generation system component, and braze are provided to improve repairing power generation systems. The method includes providing the component having a feature in a surface of the component and coating a particulate material with a filler material to obtain a coated particulate material. The method includes preparing the feature to obtain a treatment area and filling the treatment area in the surface of the component with the coated particulate material. The method includes heating the treatment area and surrounding component to a brazing temperature and applying oxidation protection to the treatment area. After the brazing temperature is obtained, the method includes brazing the treatment area and the screen and cooling the component to obtain a brazed joint.

Abstract: A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package.

Abstract: Embodiments of the present invention provide a wiring substrate which is excellent in terms of the reliability of connection between the wiring substrate and a semiconductor chip. In some embodiments the wiring substrate comprises a first build-up layer in which resin insulation layers and conductor layers are laminated alternately. The outermost conductor layer can include a plurality of connection terminal portions to which a semiconductor chip is flip-chip connected. The plurality of connection terminal portions can be exposed through openings of a solder resist layer. Each of the connection terminal portions includes a connection region to which a connection terminal of the semiconductor chip is to be connected, and a wiring region which extends in a planar direction from the connection region and which is narrower than the connection region. The surface of the wiring region has a solder wettability lower than that of the surface of the connection region.

Abstract: Methods of forming connection bumps for semiconductor devices in which rewiring patterns are formed. The method includes preparing a semiconductor substrate on which a pad is partially exposed through a passivation film, forming a seed layer on the pad and passivation film, forming a photoresist pattern including an opening pattern comprising a first opening that exposes a portion of the seed layer on the pad and a second opening that exposes a portion of the seed layer on the passivation film and is separated from the first opening, performing a first electroplating to form filler layers in the opening patterns, performing a second electroplating to form a solder layer on the filler layers, removing the photoresist pattern and performing a reflow process to form a collapsed solder layer that electrically connects the filler layers to each other and a solder bump on the filler layer formed in the second opening.

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

Abstract: A method for reliably soldering microwave dielectric ceramics with metal adopting the way of vapor soldering, a strict process of heating up, then soldering under heat preservation and finally cooling is provided. Therefore, thermal stress generated during the soldering of dielectric ceramics and metal material is reduced, reliability of a solder structure is ensured, porosity of the soldering side is effectively lowered, soldering quality is improved, soldering cost is reduced, and the demand of large-scale production can be met.

Abstract: A process is disclosed, whereby soldered connections to electrical conductors incorporated on thin glass are achieved. Sufficient resistance to cracking is obtained by virtue of surface stresses induced locally in a region where soldering is to be done. In a preferred embodiment, surface stresses imparted during a press bending operation are relied upon.

Abstract: In an embodiment, a method of forming a bonded structure is provided. The method may include forming at least one first under bump metallurgy (UBM) structure on a first substrate, forming a first gold layer on the at least one first under bump metallurgy structure; forming a tin layer on the first gold layer, forming an indium layer on the tin layer, forming an inhibition layer configured to inhibit oxygen penetration on the indium layer, and forming at least one second under bump metallurgy structure on a second substrate, forming s second gold layer on the at least one second under bump metallurgy structure; and bringing the inhibition layer into contact with the second gold layer at a predetermined temperature to form a resultant intermetallic structure between the first substrate and the second substrate thereby bonding the first substrate to the second substrate and forming the bonded structure.

Abstract: A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small diameter metal balls, which includes a small-diameter aperture area that corresponds to the small-diameter aperture on the solder resist layer. A metal ball having a second diameter larger than the first diameter is mounted in the large-diameter aperture by using a mask for large diameter metal balls, which includes a large-diameter aperture area that corresponds to the large-diameter aperture on the solder resist layer.

Abstract: In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.

Abstract: The invention provides a textile product (1) having a lighting function. The textile product (1) comprises (a) a coated textile structure (2) comprising a textile (200) with a first textile coating (211) at a first side (210) and optionally a second textile coating (222) at a second side (220) of the textile (200); (b) a lighting unit (300) comprising a substrate (310) with a substrate surface (311) and a light source (330) comprised by the substrate surface (311), wherein the lighting unit (300) is arranged within the coated textile structure (2), wherein the lighting unit (300) is arranged to provide light (331) through the first textile coating (211), wherein the substrate surface (311) further comprises an electrically conductive connector part (340), and wherein the connector part (340) is arranged to supply electrical power to the light source (330) when electrically connected to an electrical power source (500).

Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Abstract: A method of bonding a first component (10) comprising a titanium-containing alloy to a second metal component (12), wherein a coating layer (14,16) is applied to each of the first and second components in the region to be bonded. The coating layers (14,16) comprise a precious metal. An intermediate metallic layer (18) is interposed between the coating layer (14) of the first component and the coating layer (16) of the second component. The respective coating layers are held in contact with the intermediate layer (18) and the coating layers and the intermediate layer are heated to initiate melting of at least one of said layers so as to form a bond between the first and second components by brazing.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.

Abstract: Disclosed herein are an electric joint structure including a joint, an intermetallic compound (IMC), and a solder layer, wherein the intermetallic compound (IMC) is generated from an electroless surface treatment plating layer including nickel plating coating of 1 ?m or less, a method for preparing the same, and a printed circuit board including the same. The electric joint structure having the intermetallic compound structure according to the exemplary embodiment of the present invention can have a joint structure capable of improving impact resistance by suppressing the generation of a Ni—Sn based intermetallic compound and a P-enriched layer at a solder joint interface during a reflow process and improving workability including the Ni layer before the reflow process.

Abstract: A method for sealing the curved vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the curved glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A curved vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.

Abstract: A method for brazing a surface of a metallic substrate having a generally passive metal oxide layer includes activating the surface of the metallic substrate by machining the metallic substrate with a hard metal tool, grit blasting powdered particles of an activating material on the surface, and wetting the grit blasted surface of the metallic substrate with a filler material at a brazing temperature, wherein the activating material is reactive with the metal oxide layer at the brazing temperature.

Abstract: A process for manufacturing a device comprising at least a support and a component, joined together by at least one braze, includes a brazing operation which is carried out starting from a metal oxalate. Advantageously, it is a silver oxalate or a mixture of silver and copper oxalates, the component and/or the support being covered with a film comprising gold or copper in contact with said braze and the component possibly being a power component.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: A photoresist layer is applied over a solder resist layer on a substrate such as a wafer. Openings in the solder resist and photoresist layers are filled with flux-free molten solder using IMS. The process is applicable to fine pitch applications and chip size packaging substrates. A protection layer may be employed to facilitate removal of the photoresist layer from the substrate. An oversized substrate including an adhesive layer on a peripheral area may be employed for providing greater adhesion of a dry film layer to the peripheral area of the substrate than the central portion thereof. The peripheral area is removed following IMS.

Abstract: The present application presents a cutter element fabricated from a material harder than the surface to be cut having a fluted cube that continuously presents an acute angle to the cutter edge thereby prolonging the wear of the cutter as the cutter element wears. Six-sides of the cutter element can provide four, five or six fluted sides and the flutes can be parallel on opposing sides or could provide perpendicular flutes on each of the four, five or six sides. In an alternative embodiment, two of the six sides of the cube can be concave thereby providing a chip breaker indentation in the cube to remove cuttings from the surface being scrapped or cut.

Abstract: A bump with nanolaminated structure is provided. The bump with nanolaminated structure includes a bump, a nanolaminated structure and an organic layer. The nanolaminated structure is located on the bump. The organic layer is located between the bump and the nanolaminated structure. The organic molecular of the organic layer includes two terminal function groups, wherein a first terminal function group is bonded with a first metal atom of the bump and a second terminal function group is bonded with a second metal atom of the nanolaminated structure.

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Abstract: Toolings containing a composite having a coefficient of thermal expansion of less than about 5 ppm/° C. are described. The composites contain a matrix material and a carbon nanotube material and are operable for forming a part thereon. Methods for forming such toolings and use of such toolings to form parts thereon are also described. The carbon nanotube material can be a carbon nanotube-infused fiber material. Use of the carbon nanotube material in the tooling allows decreased curing and consolidation process times of the part to be realized.

Abstract: A cooking vessel, such as kettle, frying pan or cooking pot, has a bottom part suitable for heating by induction. In solutions known before, an attachment of ferromagnetic plate, placed at the bottom, to blank container is multistage, demanding exceptional precision and/or non-reliable. In addition, in solutions known before, stainless steel is used; to which use some disadvantages are related. In the present invention a plate is used as ferromagnetic member, which is coated, at least from its one surface, by another material, such as aluminum. Ferromagnetic piece is attached e.g. by pressure welding to blank container. In solution provided by the invention it is possible to use an iron plate as ferromagnetic material.

Abstract: Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting at least one of the first metallic bond part and the second metallic bond part.

Abstract: The invention relates to a method of soldering a conducting body to a substrate using an alloy chosen from either a tin-silver alloy or a tin-silver-copper alloy. The method comprises metallization of the substrate by depositing a tie layer on the substrate, depositing a diffusion barrier layer, or depositing a wetting layer comprising gold. The tie layer having any one of the chemical components chosen from chromium, titanium or titanium alloy. The diffusion barrier layer comprising a material chosen from platinum or palladium.

Abstract: This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically.

Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.

Abstract: A method of welding alloys having directionally-solidified grain structure. The methods improve the weldability of these alloys by creating a localized region of fine grain structure, wherein the welding occurs in these localized regions. The localized regions are formed by applying strain energy using a variety of different methods, such as by hammer peening, laser peening or sand blasting. Then, a heat treatment step may be used to create recrystallized grains having the fine grain structure. The region of fine grain structure provides better weldability.

Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: The invention relates to the manufacture of protective coatings onto interior surface of long-length tubes or pipes having relatively small diameter, in order to prevent corrosion-, erosion-, or wear damage of said surface. The method for manufacturing a tube comprising an embedded corrosion-resistant and wear-resistant-coating, wherein the tube consists of an external tube layer, a bond layer, a corrosion- and wear-resistant coating, and an internal tube layer, includes: depositing the corrosion- and wear-resistant coating (CWRC) onto outer surface of the internal tube, depositing a bonding material onto CWRC, inserting the internal tube with deposited CWRC and bond material into the external tube to provide an embedded CWRC between external and internal tube layers, and bonding both tubes with the interior CWRC in one solid structure. A crack-healing compound or release compound is additionally deposited onto internal tube before CWRC, which is preferably alumina ceramic or hard thermal-sprayed alloy.