With Pretreating Other Than Heating Or Cooling Of Work Part Of Filler Prior To Bonding And Any Application Of Filler Patents (Class 228/203)
  • Patent number: 5312026
    Abstract: Disclosed is a welded tube with an excellent corrosion-resistant inner surface, in which the inner surface including the bead part has a first plate layer of one metal material selected from Sn, Sn--Zn, Sn--Ni, Ni--P and Ni--B and the first plate layer is overcoated with a second plate layer of one metal material selected from Ni, Co and alloys based on the metals. The welded tube is free from exposure of the steel base out of the plate layer and is also free from cracks, pin holes, overplated spots and peeling of the plate layer. It has excellent corrosion resistance and good workability for working the terminals. The welded tube is produced by forming a first plate layer of Sn, Sn--Zn, Sn--Ni, Ni--P or Ni--B on at least one surface of a steel strip, then forming a second plate layer of Ni, Co or an alloy based on the metals over the first plate layer, shaping the thus plated steel strip into a tube by welding with the plated surface being inside and then heat-treating the tube.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: May 17, 1994
    Inventor: Hiroshi Yamanashi
  • Patent number: 5296198
    Abstract: A heater is composed of (a) a honeycomb structure having a large number of passages, (b) an adsorbent composed mainly of zeolite or an adsorbent-catalyst composition comprising adsorbent and a catalyst component supported on the adsorbent, the adsorbent or adsorbent-catalyst composition being coated on the honeycomb structure and (c) at least two electrodes fixed to the honeycomb structure for electrification of the honeycomb structure, wherein a gas is flowed through the passages in the honeycomb structure and is heated. A catalytic converter has at least one main monolith catalyst and the above heater provided upstream or downstream of the main monolith catalyst or between two main monolith catalysts.
    Type: Grant
    Filed: September 24, 1991
    Date of Patent: March 22, 1994
    Assignee: NGK Insulators, Ltd.
    Inventors: Fumio Abe, Keiji Noda
  • Patent number: 5284290
    Abstract: NiAl is preheated to a temperature between 1530.degree. C. and 1638.degree. C. causing some of the aluminum to evaporate along the faying surfaces thereby forming a glazed layer of nickel rich self-generated filler metal. The glazed faying surfaces are placed in contact, heated to 1530.degree. C. to 1570.degree. C., and pressed together to form a fusion weld.
    Type: Grant
    Filed: April 23, 1993
    Date of Patent: February 8, 1994
    Assignee: The United States of America as represented by the Adminstrator of the National Aeronautics and Space Administration
    Inventors: Thomas J. Moore, Joseph M. Kalinowski
  • Patent number: 5251804
    Abstract: Steel strip (1) is cleaned by shot blast machine (3) and its upper surface is coated with zinc in molten plating device (4). The strip is formed by roll forming machine (6) into a tube and the outer surface of the tube is coated by plating device (11).
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: October 12, 1993
    Assignee: Daiwa Steel Tube Industries Co., Ltd.
    Inventor: Matsuichi Nakamura
  • Patent number: 5180099
    Abstract: A process of joining galvanized steel sheets using a solder comprising copper and 10.about.30% by weight nickel with a welding machine. The process of joining the galvanized steel sheets includes a first step of phosphatizing before the joining.
    Type: Grant
    Filed: July 18, 1991
    Date of Patent: January 19, 1993
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Makoto Okabayashi, Masami Ishii, Juniti Mita, Shigeo Shinagawa
  • Patent number: 5178965
    Abstract: A roughened surface of a conductive substrate, such as copper, provides uniform Sn-Pb solder coatings and improved solder retention at printed wiring board (PWB) plated through-hole rims (knees) and surface pads during solder dipping or reflow. A high density of copper surface features of moderate average roughness provides the most favorable solder coating thickness distribution. Various chemical or electrochemical etching processes may be used to produce the desired copper surface topography. Reflowed solder thickness distribution in a PWB knee region attained with a ferric chloride copper etching process peaks at 4 .mu.m, which provides a good margin of safety for preventing exposure/oxidation of the underlying Cu-Sn intermetallics. The ferric chloride copper etching process yields only 1% of solder thickness measurements in the undesirable 0-1.5 .mu.m range for plated through-hole rims. Copper surface roughening is expected to greatly reduce solderability loss in mass produced PWBs.
    Type: Grant
    Filed: February 14, 1992
    Date of Patent: January 12, 1993
    Assignee: Rockwell International Corporation
    Inventors: D. Morgan Tench, Dennis P. Anderson
  • Patent number: 5176309
    Abstract: According to this invention, there is provided a method of manufacturing a highly reliable circuit board in which a copper member is strongly, directly bonded to a substrate made of an aluminum nitride sintered body, thereby obtaining high peel strength. The method of manufacturing the circuit board includes the steps of bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 .mu.m formed on a surface of a substrate made of an aluminum nitride sintered body, and heating the substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu.sub.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: January 5, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akihiro Horiguchi, Mitsuo Kasori, Fumio Ueno, Hiroshi Komorita, Mitsuyoshi Endo
  • Patent number: 5163602
    Abstract: A multi-walled steel pipe comprises a metal strip plated with copper and including a brazing layer thereon. At least one surface of the metal strip is roughened and braze welded to the other, overlapping surface when the metal strip is rolled. The roughened surface has a roughness in the range of between 10 and 30.mu.m. A method of making a multi-walled steel pipe comprises roughening at least one surface of a metal strip, the metal strip being previously plated with copper and including a brazing layer thereon, rolling the metal strip a plurality of times by a pipe forming machine to provide a pipe body with the roughened surface directed toward the other overlapping surface, while the metal strip being fed between a plurality of sets of rollers in the pipe forming machine, and heating the pipe body to a melting temperature of the brazing layer in a furnace so as to braze weld the overlapping surfaces of the metal strip together.
    Type: Grant
    Filed: February 4, 1991
    Date of Patent: November 17, 1992
    Assignee: Usui Kokusai Sangyo Kaisha-Ltd.
    Inventor: Masayoshi Usui
  • Patent number: 5160090
    Abstract: The invention relates to a method of making high-strength brazed joints in metal/ceramic and ceramic/ceramic composite materials. The brazing surface of the ceramic part is structured prior to brazing by introducing bores having an average diameter in the range of 50 .mu.m-500 .mu.m and a depth in the range of 100 .mu.m-2 mm. Preferably, the structuring is effected by laser working. Brazing is subsequently carried out in a conventional manner. The resulting joint displays increased strength characteristics and resistance to thermal stresses over joints produced by conventional methods.
    Type: Grant
    Filed: September 20, 1991
    Date of Patent: November 3, 1992
    Assignee: Schwarzkopf Technologies Corporation
    Inventors: Christian Friedrich, Nikolaus Reheis, Walter Thalmann
  • Patent number: 5152452
    Abstract: A sheet of work-hardenable, non-heat-treatable, corrosion-resistant steel is cold rolled into a tube (12) and welded (10). The cold rolling strengthens the material. The welding causes the weld area (10) to revert to its annealed condition, but the ends (24, 30) of the tube (12) are then swaged into open domes (14, 16) to form a symmetrically-swaged tube having further work-hardened ends which overcome the apparent weakness of the weld (10). A spherical disk (20) is then welded on to one end to form a bottom and a port section (26) is welded on to the other end to complete the bottle construction.
    Type: Grant
    Filed: March 10, 1992
    Date of Patent: October 6, 1992
    Assignee: York Industries, Inc.
    Inventor: Edwin Fendel
  • Patent number: 5104032
    Abstract: A welded lap or web joint for galvanized sheets, having a laser weld orientated transversely to the overlapped sheets and penetrating through the sheet layers. The sheet layers are held at a distance by protrusions or beads which are integrated, in such a way as to run next to the laser weld, in at least one of the sheets are pressed into it.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: April 14, 1992
    Assignee: Mercedes-Benz AG
    Inventors: Berard Spies, Volker Thoms
  • Patent number: 5060844
    Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.
    Type: Grant
    Filed: July 18, 1990
    Date of Patent: October 29, 1991
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, Anson J. Call, Francis F. Cappo, Marie S. Cole, Karl G. Hoebener, Bruno T. Klingel, John C. Milliken
  • Patent number: 5005757
    Abstract: A number of rare earth-cobalt permanent magnet segments are temporarily secured together by means of a tool. Before securement the segment surfaces at each interface are pre-tinned. A solder pre-form in the shape of a "wagon wheel" rests on one transverse end of the magnet so that the spokes of the pre-form overlie the interface joints. The magnet is then lowered into a gradually heated glycerine bath until the solder melts and directly flows over each interface. Upon slow cooling of the cylinder, metallurgical bonding is effected between the various segments of the magnet.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: April 9, 1991
    Assignee: Grumman Aerospace Corporation
    Inventors: Michael G. Kornely, Jr., Robert G. Micich, John M. Miller
  • Patent number: 5000371
    Abstract: A method for producing a metallic interface suitable for overlaying consists of exposing the area of an alloy combination to be overlayed to a temperature above its lower critical until an element reduced zone arises. This element reduced zone more easily accepts element diffusion that takes place during overlaying. Accordingly, an improved interface, one that is more ductile and less prone to cracking, is produced.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: March 19, 1991
    Assignee: Cooper Industries, Inc.
    Inventor: James W. Johnson
  • Patent number: 4997122
    Abstract: A process for treating the surface of solid fusible solder supported on a substrate, comprises a heated tool having a treatment surface with a selected shape. The heated tool is brought into contact with the solder for fusing the solder to reshape the surface of the solder. The tool is allowed to cool to permit the solder to resolidify, and when withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material which is not wettable by the solder. Stops may be utilized for limiting movement between the tool and the substrate to a specified gap for the treatment surface.
    Type: Grant
    Filed: July 20, 1989
    Date of Patent: March 5, 1991
    Assignee: Productech Inc.
    Inventor: Gero Zimmer
  • Patent number: 4948030
    Abstract: An electrical joint using spheroidal tipped leads improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead alloys the lead with any non-wettable solder mask rendering a wettable spheroid. Surface tension in the molten metal forms the spheroid. The spheroid increases the area to which solder or other bonding agent adheres to. Solder mask remaining on the lead decreases solder wicking further up the lead. Reduced solder wicking retains the compliance of the lead. Controlled melting of the lead maintains planarity for multileaded components.
    Type: Grant
    Filed: January 30, 1989
    Date of Patent: August 14, 1990
    Assignee: Motorola, Inc.
    Inventors: Marc K. Chason, Michael J. Onystok, Nathan P. Bellin
  • Patent number: 4928872
    Abstract: A brazing process is disclosed for joining two or more metal parts. The metal parts are brazed by interposing between the parts to be joined a brazing paste composed of a homogeneous microcrystalline rapidly solidified alloy powder having a composition consisting essentially of about 15 to 40 weight percent copper, 0 to 32 weight percent zinc, 0 to 24 weight percent cadmium, 0 to 3 weight percent nickel and 0 to 10 weight percent tin, the balance being silver and incidental impurities, and a phase structure such that the largest dimension of any precipitated phase ranges from about 0.01 to 0.1 micrometer, heating the powder to melt the powder, and thereafter cooling the parts to produce a brazed product. The brazing process can be carried out at lower temperatures as compared to prior art processes employing conventional BAg-alloy powders.
    Type: Grant
    Filed: March 6, 1989
    Date of Patent: May 29, 1990
    Assignee: Allied-Signal Inc.
    Inventor: Anatol Rabinkin
  • Patent number: 4911353
    Abstract: A method of making a solar energy collector where the absorber plate, selective surface, and protective outer skin of the collector are formed by spraying molten metal particles onto a substrate and building a coating of metal up to a desired thickness. This process allows greater flexibility in permitting a greater choice of materials and geometric shapes to be used for manufacturing the collector. The process may also be used to create the individual components of the collector, i.e., body, absorber plate, or selective surface as well as a storage tank.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: March 27, 1990
    Inventor: David Deakin
  • Patent number: 4905886
    Abstract: Diffusion bonding of aluminum alloy objects of different sizes and shapes may be greatly improved when the surface of the object is exposed to a thermal spray source which deposits fine metal particles on the surface. Rapid quenching of solidification occurs at the surface. Such treatment results in the formation of finer grains at the surface which enhances the strength of a diffusion bond.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: March 6, 1990
    Assignee: Grumman Aerospace Corporation
    Inventors: James R. Kennedy, Edmund Y. Ting
  • Patent number: 4899923
    Abstract: Fabrication of the test structure is functionally illustrated in FIG. 9. More specifically, the first step in the process is to machine the cavity 40 in the third body of austenitic material 42, as functionally illustrated at reference numeral 80. After the cavity 40 has been machined, the fault sample 34 is installed into the cavity by heating the third body of austenitic material 42 and cooling the fault sample 34. This process is functionally illustrated at reference numeral 82. After installation of the fault sample 34, the interface is welded to seal the junction and the combined structure HIP bonded, as functionally illustrated at Reference Numerals, 84 and 86. After bonding the test structure is machined into the desired configuration, as functionally illustrated at Reference Numeral 88.
    Type: Grant
    Filed: February 6, 1989
    Date of Patent: February 13, 1990
    Assignee: Electric Power Research Institute, Inc.
    Inventor: Shane J. Findlan
  • Patent number: 4889275
    Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.
    Type: Grant
    Filed: November 2, 1988
    Date of Patent: December 26, 1989
    Assignee: Motorola, Inc.
    Inventors: William B. Mullen, III, Douglas W. Hendricks
  • Patent number: 4858294
    Abstract: A method of producing an object of at least two parts movable relative to each other, one of which parts is essentially locked inside the other, and wherein a rolling bearing is disposed, between the two parts in races, which includes at least one row of rolling elements enclosed thereby, one of the parts consisting of at least two separate pieces of steel subjected to a hardening operation, wherein these pieces are placed against each other in a proper position to form a parting seam, and wherein the rolling elements are inserted and the two parts are held together in that position, and wherein a high-energy radiation welding means is passed over the seam and activated, while a rotary motion of the energy beam and the two parts are brought about to weld the two pieces together, characterized in that the steel pieces are subjected to a surface hardening with the regions of the pieces bordering upon the seam shielded from the hardening process, so that they are not hardened.
    Type: Grant
    Filed: May 13, 1988
    Date of Patent: August 22, 1989
    Assignee: SKF Industrial Trading and Development Co. B.V.
    Inventor: Graham E. Hollox
  • Patent number: 4830265
    Abstract: Diffusion bonding of aluminum alloy objects of different sizes and shapes are greatly improved when the surface of the object is exposed to a high energy source which causes a heat treatment or melting and rapid quenching or solidification at the surface. Such treatment results in the formation of finer grains at the surface which enhances the strength of a diffusion bond.
    Type: Grant
    Filed: May 13, 1988
    Date of Patent: May 16, 1989
    Assignee: Grumman Aerospace Corporation
    Inventors: James R. Kennedy, Edmund Y. Ting
  • Patent number: 4817858
    Abstract: Method of manufacturing a workpiece of any given cross-sectional dimensions from an oxide-dispersion-hardened nickel-based superalloy available in the form of coarse-grained longitudinally directed columnar crystals by connecting previously very finely machined workpiece parts derived from a semi-finished product by diffusion-bonding using hot isostatic pressing, the workpiece parts being first heat-treated under a protective gas in the temperature range of 50.degree. to 100.degree. C. below the recrystallization temperature, under a pressure p.sub.k of not more than 5 MPa with the machined surfaces to be connected joined together, the workpiece then being heated at least to a critical temperature T.sub.K, above which no further cold working takes place, and the pressure then being gradually increased to the diffusion bonding pressure p.sub.max of 100 to 300 MPa with simultaneous increase in temperature are a heating rate of not more of 2.degree. C./min to the diffusion bonding temperature T.sub.D of 0 to 50.
    Type: Grant
    Filed: May 11, 1988
    Date of Patent: April 4, 1989
    Assignee: BBC Brown Boveri AG
    Inventor: Clemens Verpoort
  • Patent number: 4799973
    Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.
    Type: Grant
    Filed: April 2, 1984
    Date of Patent: January 24, 1989
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Eugene Shapiro
  • Patent number: 4767049
    Abstract: The present invention relates to a process for forming improved bonds between components of electrical or electronic devices. The process of the present invention preferably comprises annealing a metallic substrate to form a substantially uniform, substantially continuous oxide layer on a surface of the substrate, exposing the oxidized substrate to a reducing atmosphere so as to form an irregular surface on the substrate, and bonding another component to the irregular surface.
    Type: Grant
    Filed: May 19, 1986
    Date of Patent: August 30, 1988
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Julius C. Fister, Jacob Crane
  • Patent number: 4749119
    Abstract: For thermocompression sealing at least one of the materials to be joined is provided with an oxide skin before or during the sealing operation. The oxide skin can be formed, for example by firing in air. It has been found that the method is particularly advantageous for seals between a CrNi-alloy and, for example a second element which consists of aluminium, for example the seal between an Al entrance window and a CrNi-steel envelope of an X-ray intensifier tube. Notably by addition of an intermediate material, in particular aluminium, seals can thus be realized between many materials.
    Type: Grant
    Filed: April 21, 1986
    Date of Patent: June 7, 1988
    Assignee: U.S. Philips Corp.
    Inventors: Johannes van Esdonk, Johannes T. Klomp, Michael D. Martin
  • Patent number: 4744506
    Abstract: The ends of a plurality of copper conductors bearing superconductive strands, for example of niobiumtitanium, are treated with a liquid metal solvent to selectively remove the copper from the superconductive strands. The liberated strands of superconductor are then soldered with a superconducting solder. The joint is included in a coil which at superconducting temperatures induces a high magnetic field of 0.5 Tesla and above.
    Type: Grant
    Filed: April 18, 1986
    Date of Patent: May 17, 1988
    Assignee: General Electric Company
    Inventor: Roy F. Thornton
  • Patent number: 4734753
    Abstract: Copper leads having an average grain size from 0.035 to 0.055 mm are thermocompression bonded to a metallized portion of a ceramic substrate. Surprisingly, such large grain size substantially decreases the "ceramic pullout" of the bonded leads.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: March 29, 1988
    Assignees: American Telephone and Telegraph Company, AT&T Technologies, Inc.
    Inventors: Benjamin H. Cranston, Richard L. Hunsberger, Donald A. Machusak
  • Patent number: 4732312
    Abstract: Diffusion bonding of surface layers of an alloy, such as an aluminum alloy, having surface oxides of low solubility in the alloy includes treating the surface layers to be bonded to remove existing surface oxide coatings, and diffusion bonding the surface layers to one another by placing the alloy to be bonded under sufficient pressure to cause disruption of the oxide coatings by localized surface deformation of the alloy, enhanced by a superplastic microstructure, without substantial deformation of the alloy, i.e., macroscopic deformation approaching zero percent, while heating the alloy in a non-oxidizing atmosphere for a time sufficient for diffusion bonding to occur. The alloy may be treated so that at least the surface layers thereof have a fine grain structure of the type associated with superplastic forming properties. Components may be formed by diffusion bonding and superplastic forming.
    Type: Grant
    Filed: November 10, 1986
    Date of Patent: March 22, 1988
    Assignee: Grumman Aerospace Corporation
    Inventors: James R. Kennedy, Edmund Y. Ting
  • Patent number: 4724120
    Abstract: A method for the assembly and connection of bodies, massive parts or powder grains, of alloys comprising at least 50% of nickel, cobalt or iron, comprises a preliminary operation of deposition at the interface of the said bodies of a product of the type MBF.sub.x, x being equal to 3 or 4, M designating a radical of the type NH.sub.4 giving off when hot a gaseous component such as NH.sub.3 or a metallic element and a sequence of treatment of cleaning/activation by passage of the coated body at a temperature in excess of the temperature of sublimation of the said product.
    Type: Grant
    Filed: October 17, 1986
    Date of Patent: February 9, 1988
    Assignees: Association pour la Recherche et le Developpement des Methodes et Processus Industriels "A.R.M.I.N.E.S.", Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "S.N.E.C.M.A."
    Inventors: Yves C. Bienvenu, Thierry J. M. E. Massart
  • Patent number: 4722469
    Abstract: Components made of a dispersion-hardened superalloy are connected together by pressure bonding, the individual parts previously processed at their bonding surfaces only by milling, without fine machining such as grinding, electro-polishing, etc., being subjected before bonding to a heat treatment in the temperature range of between 60.degree. C. and 210.degree. C. below the recrystallization temperature for the purpose of reducing the driving force. During the subsequent coarse-grain heat treatment of the bonded workpiece, no sort of fine crystalline banding occurs in the bonding zone and the strength of the workpiece corresponds to that of the material before bonding.
    Type: Grant
    Filed: May 29, 1986
    Date of Patent: February 2, 1988
    Assignee: BBC Brown, Boveri & Company, Limited
    Inventors: Hans Rydstad, Robert Singer
  • Patent number: 4717068
    Abstract: The invention is directed to a process for plating Al alloys containing lithium by hot co-rolling under the usual heating conditions, in the air. The process comprises effecting controlled oxidation of the core alloy by heating in the air at between 450.degree. C. and 550.degree. C. for a period of time such that the depth affected by the surface loss of Li is between 50 and 700 .mu.m. The core is then treated mechanically or chemically to remove the surface oxides with a loss of alloy less than 30 .mu.m. An assembly of the core and platings is then co-rolled with reheating to a temperature of less than 500.degree. C. for less than 24 hours. The result is perfect adhesion of the core to the surface platings.
    Type: Grant
    Filed: February 17, 1987
    Date of Patent: January 5, 1988
    Assignee: Cegedur Societe de Transformation
    Inventor: Philippe Meyer
  • Patent number: 4700879
    Abstract: A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.
    Type: Grant
    Filed: June 3, 1985
    Date of Patent: October 20, 1987
    Assignee: Brown, Boveri & Cie AG
    Inventors: Werner Weidenauer, Bernd Leukel, Klaus Bunk
  • Patent number: 4678114
    Abstract: The invention provides a bonding wire which prevents electric short-circuiting even if it comes into contact with another bonding wire, a bonding method using the same, and a semiconductor device including the same. The bonding wire comprises a core wire made of a metal and an insulating film which surrounds it. The insulating film is eliminated from the ends of the bonding wire by thermal decomposition and scattering, while simultaneously each end of the bonding wire is connected to a bonding pad of the semiconductor device or to a lead frame. In the semiconductor device, the bonding pads are respectively connected to lead frames by means of the bonding wires.
    Type: Grant
    Filed: October 24, 1984
    Date of Patent: July 7, 1987
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideharu Egawa, Katsuya Okumura
  • Patent number: 4659006
    Abstract: A typical method for bonding a die to a substrate includes the steps of placing a solder preform onto the substrate, contacting the die to the preform and applying heat sufficient for the solder to flow and wet the substrate and die forming a bond therebetween. The present invention comprises heating the substrate and preform to a temperature below the melting point of the solder preform and thereafter maintaining this temperature while applying pressure to the preform sufficient to substantially reduce the thickness of the preform and to cause the preform to adhere to the substrate prior to contacting the die thereto.
    Type: Grant
    Filed: September 26, 1985
    Date of Patent: April 21, 1987
    Assignee: RCA Corporation
    Inventor: Carl Polansky
  • Patent number: 4653996
    Abstract: Disclosed herein is a die for extruding honeycomb structural body, which comprises a die base body made of an alloy steel and a plate of a wear resistant alloy which is joined to the front face side of the die base body. In the wear resistant alloy plate are formed forming slits having a sectional profile conforming to that of a honeycomb structural body to be shaped and having a given depth from the front face of the die toward the rear face thereof, and a plurality of openings are formed independently of each other in the die base body from the rear face of the die toward the front face thereof to communicate with the forming slits. The wear resistant alloy plate may be joined to the die base body through an alloy steel plate having the same as or thinner than the thickness of the wear resistant alloy plate. A method of manufacturing such a honeycomb structural body-extruding die is also disclosed.
    Type: Grant
    Filed: October 23, 1984
    Date of Patent: March 31, 1987
    Assignees: NGK Insulators, Ltd., Institute of Technology Precision Electrical Discharge Works
    Inventors: Sei Ozaki, Shoji Futamura
  • Patent number: 4618088
    Abstract: A process for improving the solderability of a layer of a silver frit burnt onto a glass pane and a current connecting element wherein a layer of enamel is disposed and the surface of soldering and the glass pane. According to the process the surface is treated with a fluorine containing etching agent prior to soldering. The fluorine containing etching agent may be an aqueous solution of an acid fluoride, such as ammonium hydrogen fluoride or alkali hydrogen fluoride.
    Type: Grant
    Filed: December 7, 1984
    Date of Patent: October 21, 1986
    Assignee: Saint Gobain Vitrage
    Inventor: Heinz Karla
  • Patent number: 4598859
    Abstract: Gases entrapped in a metal assembly are exhausted through a vent closed off by a metal or metal alloy which has a melting point below the temperature at which said assembly is hot rolled. The metal assembly is designed to bond dissimilar metals on hot rolling.
    Type: Grant
    Filed: February 8, 1985
    Date of Patent: July 8, 1986
    Assignee: Pfizer Inc.
    Inventors: Peter Cajthaml, Jr., James R. Hunter
  • Patent number: 4572939
    Abstract: A method of brazing comprises sand blasting the surfaces of the components to be brazed with particles of a brazing material to clean the surfaces and to embed brazing material in the surfaces, applying the brazing material to the surfaces, and heating the brazing material to form a brazement between the components.
    Type: Grant
    Filed: January 27, 1984
    Date of Patent: February 25, 1986
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Donald G. Harast
  • Patent number: 4541480
    Abstract: An improved plate-type heat exchanger and a method for joining the plates thereof is disclosed. The heat exchanger includes a core containing a plurality of spaced parallel plates. The core is attached to the housing of the heat exchanger by means of a spray weld process and a standard weld process. In the spray weld process a filler metal is deposited on the core and the housing frame at the joint where the end portion of the plates and the housing frame meet. The filler metal used in the spray weld process forms a spray weld fillet which increases the thickness of the plates. The standard weld process further secures the plates to the heat exchanger housing frame.
    Type: Grant
    Filed: December 22, 1982
    Date of Patent: September 17, 1985
    Inventor: Kenneth B. Beckmann
  • Patent number: 4492849
    Abstract: A method of autogenous welding steel strip is disclosed including the steps of applying to at least one edge of a section of the strip to be welded, a material selected from the group consisting of titanium, titanium alloys, aluminum and manganese, positioning the edges in desired relative relationship and effecting welding. The applied material effects a chemical change in the steel strip to resist hot cracking in the weld, provides increased ductility and increased strength. The steel strip is preferably silicon steel or stainless steel strip.
    Type: Grant
    Filed: May 26, 1981
    Date of Patent: January 8, 1985
    Assignee: Allegheny Ludlum Steel Corporation
    Inventor: Jack M. Biegay
  • Patent number: 4452389
    Abstract: The invention is a method for welding together two parts with the help of ion implantation. The method comprises weakening the chemical and atomic bonds of the surface and near surface atoms of at least one of the surfaces to be welded together by ion implantation techniques. The ion implanted surface may then be cold or diffusion welded to the surface of the other part using conventional methods. The method is particularly applicable to welding together parts of dissimilar metals normally difficult to affect a satisfactory weld.
    Type: Grant
    Filed: April 5, 1982
    Date of Patent: June 5, 1984
    Assignee: The Bendix Corporation
    Inventor: Kamal E. Amin
  • Patent number: 4423120
    Abstract: A method of laminating first and second metal sheets to one another, comprises the steps of superposing the metal sheets and including therebetween a layer of amorphous metal and laminating the sheets to one another. During the lamination a pressure is applied by cold rolling for bonding the first and second sheets together.
    Type: Grant
    Filed: February 23, 1982
    Date of Patent: December 27, 1983
    Assignee: Fr. Kammerer GmbH
    Inventors: Manfred Paulus, Norbert Fromel
  • Patent number: 4373656
    Abstract: A method for preserving the solderability of copper conductors comprises stabilizing a cleaned, mildly etched conductor surface with a phosphoric acid-glycol solution then immersing the surface in imidazole followed by a rinse to remove excess imidazole.
    Type: Grant
    Filed: July 17, 1981
    Date of Patent: February 15, 1983
    Assignee: Western Electric Company, Inc.
    Inventors: John L. Parker, Jr., Robert B. Ranes
  • Patent number: 4360968
    Abstract: A method of inhibiting solder sticking between circuit elements of a partially uncured rubber-modified epoxy printed circuit board comprises exposing the board containing the circuit pattern thereon to UV radiation prior to the application of solder thereto.
    Type: Grant
    Filed: July 27, 1981
    Date of Patent: November 30, 1982
    Assignee: Western Electric Company, Incorporated
    Inventors: John F. D'Amico, Michael A. DeAngelo, Jr., Manjini Saminathan
  • Patent number: 4319938
    Abstract: A method of butt-joining metal tapes coated on one or both sides with a film of thermoplastic polymer material.The film is detached from an end portion of each tape (1A 1B) by immersion in a solvent at its boiling point. The detached film is removed and the ends of the two tapes welded together. A film (17, 18) of high-density polyethylene and ionomer resin is applied to the stripped area and bonded thereto by the application of heat and pressure. Device for implementation of the method.
    Type: Grant
    Filed: January 10, 1980
    Date of Patent: March 16, 1982
    Assignee: Societe Anonyme dite: Les Cables de Lyons
    Inventor: Jean-Patrick Vives
  • Patent number: 4247037
    Abstract: In welding tubular members of stainless steel, metal is deposited by build-up welding on a portion of the inner surface of each tubular member adjacent an edge thereof where welding gives a heat affection and exposed to a corrosive fluid when in service, and melting a portion of the inner surface of each tubular member in a zone adjacent to the metal deposited by build-up welding and affected by the heat of the build-up welding, said portion being exposed to the corrosive fluid when in service. Following the completion of these two steps, the tubular members of stainless steel are welded at the edges thereof to be joined. The method has the effect of preventing the occurrence of stress corrosion cracking at the inner surface of the piping which is near the joint and exposed to the corrosive fluid.
    Type: Grant
    Filed: July 10, 1979
    Date of Patent: January 27, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Yasumasa Tamai, Teruo Matsumoto
  • Patent number: 4196923
    Abstract: The present invention is directed to a method and apparatus for joining aluminum members within an aluminum heat exchanger coil. A tubular member to be joined to a separate member in the coil has its exterior surface roughened by sand blasting to enhance adhesive adherence. The roughened surface is covered with a conversion coating to replace any accumulated aluminum oxide, to prevent the formation of additional aluminum oxides and to simultaneously provide a surface adapted to adhere to an adhesive. An adhesive is then applied to the mating areas of the tubular members to be joined and subsequently cured to form a tight secure joint. This invention is particularly useful in field repair of aluminum heat exchanger coils.
    Type: Grant
    Filed: November 25, 1977
    Date of Patent: April 8, 1980
    Assignee: Carrier Corporation
    Inventors: Robert H. Zimmerli, James E. Greever
  • Patent number: 4172548
    Abstract: Failure under stress of brazed aluminum assemblies prepared by fluxless brazing is prevented by controlling the grain size before brazing of the material in contact with the brazing alloy to be at least 60.mu..
    Type: Grant
    Filed: December 29, 1977
    Date of Patent: October 30, 1979
    Assignee: Sumitomo Precision Products Company, Limited
    Inventor: Masakazu Nakamura