Abstract: A method for soldering aluminum or aluminum alloys is disclosed, together with an alloy useful in the method. The method includes heating, for example by using a torch, at least one aluminum piece to a temperature within the range of 90-150 degrees celsius, cleaning at least one heated surface thereof, for example by wire brushing, further heating the cleaned piece to a temperature within the range of 350-490 degrees celsius, and applying, for example by rub soldering, to the cleaned and further-heated piece a quantity sufficient to enable subsequent soldering, as required, of a tin/lead/zinc alloy consisting essentially of, by weight, from 1.7 to 2.2 percent aluminum, from 0.01 to 0.02 percent magnesium, from 45.9 to 50.4 percent zinc, from 14.2 to 34 percent tin, and from 16.6 to 36.7 percent lead.

Abstract: A method for brazing a surface of an age hardened chrome copper member to a surface of a stainless steel member is disclosed. The process includes plating surfaces with copper, applying a brazed material of a copper/gold alloy between said surfaces, applying a brazing paste between said surfaces and rapidly heating the materials to fuse them together in a protected atmosphere. A particular disclosed embodiment of the method comprises the brazing of the cooler body assembly of a continuous casting die for casting copper strands.

Abstract: Disc- or plate-shaped targets for sputtering systems are attached to associated cooling plates by plasma-spraying a surface of such target with a compatible adhesive layer, for example composed of Ni; Ni/Cr mixtures; 80/20 Ni/Al mixtures; Ni/Al/Mo mixtures; Al/bronze mixtures; Mo; W; Al/Si mixtures, Zn, Cu, Cu/glass mixtures, etc., and then coating such adhesive layer with a solderable layer, for example composed of Cu, Cu/glass mixture or Ag, etc., and soldering such solderable layer onto the surface of a cooling plate. Preferably, the adhesive layer and the solderable layer are applied via plasma spraying.

Abstract: A method is disclosed for soldering leads to electrical components such as capacitors on which a thin contacting layer of solder metal is provided. The leads are soldered on by pressing them into the contact layer by means of two electrodes. The leads are heated by a current which flows between the electrodes. In order to save material, the leads are contacted by the electrodes along the entire extent to be sealed in to heat them uniformly and to press them into the contact layer. This method is suitable for contacting capacitors whose dielectrics consist of synthetic films and whose coatings consist of regenerable thin metalizations.

Abstract: A housing package for the encapsulation of electrical components. The package comprises a base plate and a cap which encapsulate the electrical components. Electrical leads are lead through the base plate. The package is provided with a coating which increases the solderability of the electrical leads and increases the corrosion resistance of the housing.

Abstract: A method for pressure bonding metal members by utilizing eutectic reaction comprising the steps of bringing two metal members of dissimilar metals to be bonded into contact with each other under a predetermined contacting pressure P.sub.1 lower than the plastic deformation pressures of the metals of the two members and heating the contacting surfaces of the two members to a temperature lower than melting point temperatures of the metals and not lower than the eutectic temperature thereof to produce a liquid of eutectic composition by eutectic reaction between the surfaces of the two members to be bonded, applying an upset pressure P.sub.2 higher than the contacting pressure P.sub.1 to the surfaces to be bonded to squeeze out the liquid from the contacting surfaces of the two members to outside, and cooling the bonded surfaces of the two members.

Abstract: The invention concerns a process for assembling aluminum-based members and steel members.This process is characterized by:covering the steel member with a metal film on the part of the surface to be assembled,disposing grains of silicon at the aluminium-steel interface,providing protection from oxidation for the faces to be assembled,heating the members so as to achieve an interface temeperature of from 500.degree. C. to 650.degree. C. and applying a pressure which is sufficient to totally or partially expel the liquid eutectic which is thus formed,cooling the assembly.The assembly which is produced in this way is used in particular in so-called `clad` connecting members for igneous electrolysis vessels, in armour plating requiring high mechanical strength and in all cases where connections are to be made, which have good electrical and mechanical properties, for continuous use in a temperature range from at least -200.degree. C. to at least +450.degree. C.

Abstract: A method of brazing a stainless steel with a stainless steel or another metal wherein, in brazing the stainless steel with a stainless steel or another metal, the stainless steel side of both opposed jointing parts is plated with copper, then a copper base-tin alloy of a melting point of 850.degree. to 1081.degree. C. is used as a brazing material and said brazing material is heated together with the jointing parts to a temperature lower than the melting point of copper in a nonoxidizing gas atmosphere such that the brazing material may be melted at said temperature.The brazed stainless steels are cooled by being quickly passed through a temperature range of 850.degree. to 600.degree. C. The bonding force of the resulting stainless steels is much higher than heretofore obtained.

Abstract: A solid state laser rod and a mount through which heat is dissipated from the rod are joined together at a bond comprised of a reflective layer on the surface of the rod, a barrier layer over the reflective layer, and a solder layer between the barrier layer and the mount. The reflective layer may be applied by sputter or other deposition procedures and is highly reflective in the region of the spectrum at which the laser operates, thus insuring optimum efficiency for the rod. The barrier layer may be applied to the reflective layer by the same deposition procedure, and it is impervious to the solder so that the solder does not penetrate it and scavenge the reflective layer. The solder should have a low melting point so as to avoid setting up excessive mechanical stresses in the rod when the solder solidifies. Both the mount and the barrier layer may be covered with a wetting layer prior to soldering to achieve better adhesion of the solder.

Abstract: An interlayer for transient liquid phase diffusion bonding is provided by depositing a metallic coating on at least one of the superalloy surfaces to be bonded and boriding a portion of the metallic coating to form a working coating having an overall composition resembling that of an interlayer alloy and an overall melting temperature less than that of the superalloys. When the superalloy surfaces are placed in contact and heated to above said melting temperature, the partially borided metallic coating functions as an interlayer alloy to effect bonding.

Abstract: Disclosed is a method of joining, by brazing, two metal pieces at least one of which is a powdered metal piece, each piece having a joint surface. The method includes the step of plating the joint surface of the powdered metal piece with a thin layer of metal having a relatively high melting point, assembling the pieces with their joint surfaces in substantial abutment, and applying a metal brazing composition having a flow temperature at least about 300.degree.-400.degree. F. or more less than melting point of the plating metal to the joint surfaces while heating the joint with a torch. The method eliminates the need for rigorous temperature control customarily employed in powdered metal brazing.

Abstract: A radioluscent window structure comprised of an aluminum pane gas-impermeably sealed to a metal frame, as on a vacuum tube, is produced by applying a silver layer on the outer frame edges and on the outer pane edges, positioning the resultant metal frame and pane so that the silver layers thereof are in contact with one another and subjecting the resulting structure to diffusion welding conditions sufficient to achieve a gas-impermeable seal between the frame and the pane.

Abstract: A feedthrough connector for use on an implantable electronic cardiac pacer. A single structure provides a means for connecting a heart lead to the pacer and feedthrough into the body of the pacer. The feedthrough may include filtering means to protect against external interferences. The entire structure has provisions for physical compliance to absorb stresses due to different heat coefficients and as may be caused during assembly and use. Also disclosed is a method for making the feedthrough connector.

Abstract: A method of producing a clad shaped body by roll-bond cladding of a sandwich-like cladding package closed on all sides, which is evacuated before being heated to rolling temperature employs a metallic intermediate layer comprised of a pure iron sheet provided between the base material comprised of steel and the cladding material comprised of titanium.

Abstract: A bond between a refractory metal or semiconductor and a ductile metal and a method for making the same includes forming a layer of a refractory metal wetting agent such as titanium on the refractory metal before bonding to allow wetting of the refractory metal by the ductile metal.

Abstract: A method of high temperature assembly of similar or different metallic, nonmetallic or partially metallic components without any direct contact with a cleaning flux, by means of an added metal or alloy with a melting point below that of the most fusible component, characterized in that the components to be assembled and the added metal or alloy are brought to a temperature at least equal to that required to melt the added metal or alloy, in a chamber from which air is substantially evacuated and which contains one or more halogens in the free or combined state, at least a fraction of these free or combined halogens being or passing into the gaseous state for at least part of the heating time.

Abstract: A method of bonding a semiconductor body to a supporting member where the whole back face of the semiconductor body is covered with a thin evaporated layer of chromium or titanium, which layer is then covered with a thin evaporated layer of rhodium, platinum or palladium, which is in turn bonded by a film of solder to the supporting member.

Abstract: A method is described for joining first and second surfaces by depositing a layer of metal on the first surface, preparing the second surface to expose fresh metal, placing the deposited metal and the exposed metal in contact, and applying sufficient pressure to join the surfaces, all done in a protective environment, such as vacuum. Also described is a related apparatus comprising an evacuable chamber, an electron-beam heated vapor source, and a pair of rollers for contacting and applying pressure to join the surfaces.

Abstract: A method of bonding film-forming metals and their alloys has been developed. The method comprises applying a first coating of a metal, compound, or alloy of the platinum metal group to the film-forming metal. A second coating of copper is then applied to the first coating. A second metal, such as steel, can then be readily soldered to the copper coating to form a strong, durable bond.This bonding method can be used, for example, to solder a titanium screen or mesh to an electroconductive metal in the assembly of electrolytic cells for the production of chlorine or oxychlorine compounds.

Abstract: A method of bonding metal particles to solid electrolytic material, suitably for making an electrolytic cell for measuring the oxygen content of gases. In a first stage of the method thin, generally flat metal particles are applied to a surface of the electrolyte and bonded to the surface by heating. In a second stage, further metal particles are bonded to the particles applied in the first stage. The further particles are thicker in relation to their other dimensions than are the particles employed in the first stage.

Abstract: A method of producing composite material for bearings or sliding members, comprising applying pressure, by rolling, simultaneously to a strip having a steel backing and a layer of copper-base alloy bonded to the steel backing, and a strip of lead-base alloy with the copper-base alloy layer positioned between said steel backing and said lead-base alloy strip, said pressure being such as to bond the two strips to each other to form the composite material.

Abstract: The inside of a sheath of titanium, zirconium or tantalum (or an alloy of one of said metals) is coated with a tinning metal or alloy by heating the sheath while the inside of the sheath is covered with the molten tinning metal, and moving an ultrasonically excited probe over substantially the whole of the outer surface of the sheath, said probe being in contact with the outer surface of the sheath. The coated sheath is then bonded as by soldering to a metal article such as copper or aluminum.

Abstract: An improved method for brazing aluminum and alloys of aluminum in which at least one of the surfaces to be joined is coated with a controlled quantity of metallic manganese which is effective during the high temperature vacuum brazing operation to promote a wetting and flow of the brazing filler metal between the surfaces to be joined and a penetration of the tenacious aluminum oxide film thereon, thereby producing a substantially uniform and high strength bond.

Abstract: A method of brazing aluminum parts where the brazing occurs between one aluminum part and a second part formed of either aluminum or another metal, wherein the aluminum or aluminum alloy has a braze cladding which is plated with a bond-promoting alloy prior to the brazing operation. If an aluminum brazing foil is utilized between the parts, the bond-promoting metal is plated onto the brazing foil. The bond-promoting alloy includes nickel or cobalt with a small amount of lead added thereto, such that the nickel-lead or cobalt-lead may be used individually or in combination.

Abstract: An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said metallic seal member, said second common interface located externally of said glass envelope. The improvement comprises providing a secondary path for heat transfer in the form of a substantially uniform copper coating along the entire first common interface between said electrical device and said seal member to thereby facilitate the removal of heat from within said semiconductive device.

Abstract: A process for manufacturing a glazing unit by jointing a metallized margin of a sheet of glass to an intervening spacer strip following a course along the peripheral margin of the unit, the joint between the sheet and the strip along at least a section of such course being formed by applying molten solder into the corner angle between the sheet and the strip to form a solder bead along the section, the joint being progressively traversed by at least one flame so that at each moment during its progress along the joint such flame acts on such solder metal before it has completely solidified whereby the final bead is formed by solidification of solder metal from the molten condition in which it is left by such flame and apparatus for carrying out such process.

Abstract: A ferrite-to-metal bond suitable for the environment of a high-power microwave circulator is disclosed. The bonding surface of a gyromagnetic ferrite or garnet button is metallized by a sputtering process that deposits successive layers of nichrome, copper and gold thereon. During the sputtering process, a flexible stainless steel band surrounds the button to prevent sputtered material from being deposited on other than the bonding surface of the button. The metallized bonding surface is then soldered to a metal wall of the circulator. The bond so formed is capable of withstanding a peak power level in the circulator of 2.0 megawatts and an average power level of 3.5 kilowatts under standing-wave conditions.