Applying Preliminary Bond Facilitating Metal Coating Patents (Class 228/208)
  • Patent number: 5118025
    Abstract: A method for fabricating a titanium aluminide composite structure consisting of a filamentary material selected from the group consisting of silicon carbide, silicon carbide-coated boron, boron carbide-coated boron, titanium boride-coated silicon carbide and silicon-coated silicon carbide, embedded in an alpha-2 titanium aluminide metal matrix, which comprises the steps of providing a beta-stabilized Ti.sub.3 Al foil containing a sacrificial quantity of beta stabilizer element in excess of the desired quantity of beta stabilizer, fabricating a preform consisting of alternating layers of foil and a plurality of at least one of the aforementioned filamentary materials, and applying heat and pressure to consolidate the preform. In another embodiment of the invention, the beta-stabilized Ti.sub.3 Al foil is coated on at least one side with a thin layer of sacrificial beta stabilizer.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: June 2, 1992
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Paul R. Smith, Jr., William C. Revelos, Daniel Eylon
  • Patent number: 5110034
    Abstract: A method of bonding a superconductive ribbon lead to a superconducting bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.
    Type: Grant
    Filed: August 30, 1990
    Date of Patent: May 5, 1992
    Assignee: Quantum Magnetics, Inc.
    Inventor: Michael B. Simmonds
  • Patent number: 5102031
    Abstract: Braze filler alloy is specifically applied and metallurgically bonded to a desired region of a nickel based superalloy workpiece using an electrospark deposition technique. The braze filler alloy is deposited onto, and concurrently metallurgically alloyed into, the desired region of the base metal by transfer of the material from the electrode using a short duration electrical impulse. The time and energy involved are small enough that total heat input to the base metal is minimal so that distortion and metallurgical structure changes of the base metal are negligible.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: April 7, 1992
    Assignee: General Motors Corporation
    Inventors: Peter W. Heitman, Stephen N. Hammond, Lawrence E. Brown, Elizabeth J. Holmes
  • Patent number: 5102032
    Abstract: Potential difficulties with corrosion in heat exchangers utilizing aluminum fins are avoided by using fin and tube constructions made by a method which includes the steps of providing a flattened tube (50) of ferrous material (80) and having an exterior coating (82) predominantly of aluminum; providing at least one serpentine fin (56) of aluminum (86) and clad with a predominantly aluminum braze cladding (88); assembling (102) the fin (56) to the flattened tube (50); applying (94), (100), (104), a brazing flux to at least one of the fin (56) and the tube (50); raising (106) the temperature of the assembly to a level sufficient to at least partially melt the braze cladding (88); and maintaining the temperature for a sufficient period of time to achieve a brazed joint (60) between the fin (56) and the tube (50) but a time insufficient to convert the coating (82) and the cladding (88) to ferrous-aluminum intermetallic compound or intermediate phase.
    Type: Grant
    Filed: May 8, 1991
    Date of Patent: April 7, 1992
    Assignee: Modine Manufacturing Company
    Inventors: Andrew J. Cottone, Zalman P. Saperstein
  • Patent number: 5086966
    Abstract: A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon cooling, produces a strong metallurgical bond. In a preferred embodiment, lead-tin solder balls are pretreated by applying tin-palladium colloidal particles and dissociating the particles to form a discontinuous metallic palladium deposit.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: February 11, 1992
    Assignee: Motorola Inc.
    Inventors: Cynthia M. Melton, Carl J. Raleigh, Steven Scheifers, William Beckenbaugh
  • Patent number: 5083697
    Abstract: A method for joining a first metal surface to a second metal surface employs metallized particles or protuberances disposed between said surfaces. The metallized particles include a core particulate composed of a material having a hardness greater than that of the metals to be bonded. By compressing the metal surfaces together in a generally normal or perpendicular direction, one or both of the metal surfaces is compressed into a metal region formed around the particulate core. In this way, very high local regions of stress are created which cause the metal to elastoplastically deform, enhancing the ability to form diffusion bonds. Alternatively, temporary electrical or other junctions may be formed by bringing the surfaces together under less rigorous conditions and/or using metals which are incapable of forming diffusion bonds.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: January 28, 1992
    Inventor: Louis Difrancesco
  • Patent number: 5074458
    Abstract: There is disclosed a method of producing a bimetal for use as a material for a plain bearing. A copper alloy powder is placed on a back steel. The back metal and the copper alloy powder are preheated to a temperature near a Curie point of the steel in a reducing atmosphere by high-frequency induction heating. The preheated back steel and copper alloy powder are heated to a temperature of 770.degree. C. to 950.degree. C. in one of an electric resistance furnace and a gas furnace in a reducing atmosphere so that the copper alloy powder is sintered to form a sintered copper alloy layer and at the same time the sintered copper alloy layer is bonded to the back steel, thereby producing the bimetal.
    Type: Grant
    Filed: February 15, 1991
    Date of Patent: December 24, 1991
    Assignee: Daido Metal Company, Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Hideyuki Kidokoro
  • Patent number: 5044546
    Abstract: First and second aluminum members are joined by the steps of(a) dissolving and removing completely the aluminum oxide layer from the surface of each of the first and second members to be joined and replacing each of the aluminum oxide layers with a layer consisting essentially of zinc;(b) plating at least one of the zinc layers with a non-alloy cadmium;(c) assembling and retaining together the first and second aluminum members so that the surfaces to be joined are held in contact with one another and placing the aluminum members in a vacuum; and(d) heating the members while in the vacuum thereby forming a bond between the first and second aluminum members.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: September 3, 1991
    Assignee: Hazeltine Corporation
    Inventor: Charles E. De Clerck
  • Patent number: 5031822
    Abstract: A method of brazing a silicon component to a molybdenum and/or tungsten component wherein prior to brazing the surface of the molybdenum and/or tungsten component is first provided with a thin gold coating and then a coating of palladium, platinum or rhodium. This allows satisfactory brazing to be effected using conventional aluminum-based brazes at temperatures below 650.degree. C.
    Type: Grant
    Filed: January 30, 1990
    Date of Patent: July 16, 1991
    Assignee: Marconi Electronic Devices Limited
    Inventors: Giles Humpston, David M. Jacobson, Brian P. Cameron
  • Patent number: 5018662
    Abstract: A coating and brazing technique for the manufacture of an assembly of metallic components for use in the fuel system of an internal combustion engine. A layer of corrosion resistant material is deposited on the interior of the various metallic components. The components are brazed together using a brazing compound having satisfactory corrosion resistance, and which has a melting temperature below that of the coating material. The interior of the assembly is thereby provided with a completely continuous layer of corrosion resistant material.
    Type: Grant
    Filed: February 26, 1990
    Date of Patent: May 28, 1991
    Assignee: P & J Industries, Inc.
    Inventor: Glenn A. Metts
  • Patent number: 4995546
    Abstract: A technique for assembling semiconductor devices in which semiconductor elements, especially lasers or LEDs, are mounted on a first packaging element such as a heat spreader that is mounted on a second packaging element such as a heat sink. Handling of solder preforms is avoided by coating at least one of each of the pairs of surfaces to be brought into contact with a layer of solder and heating the assembly to melt both solder layers in a single operation. In a preferred embodiment a heat spreader is coated in solder on both sides and interposed between a semiconductor element and a heat sink and the assembly is heated. Molybdenum may be used as a layer to aid wetting and adhesion and gold/tin solder may be used. Slightly different solidification temperatures and compositons for the layers may result from different take up of metallization layers from the components into the solder.
    Type: Grant
    Filed: October 18, 1989
    Date of Patent: February 26, 1991
    Assignee: BT&D Technologies Limited
    Inventor: John C. Regnault
  • Patent number: 4962586
    Abstract: A turbine rotor is formed from two rotor segments that are composed of different low alloy steels, one a high temperature alloy and the other a low temperature alloy. The rotor segments have cavities in confronting faces that form an annular flange at the outer surface, with the segments welded together across the flange. A clad layer is first welded on one of the flanges and a filler material welds the clad layer to the other flange to form a composite turbine rotor.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: October 16, 1990
    Assignee: Westinghouse Electric Corp.
    Inventors: Robert E. Clark, Robert L. Novak, Dennis R. Amos
  • Patent number: 4961528
    Abstract: The invention relates to a method of providing a semiconductor body on a support with the interposition of a metal layer of aluminum. The adherence is effected in that the semiconductor body and the support are pressed against each other during the supply of heat at the area of the metal layer. The metal layer of aluminum is first applied to the support by flame spraying.
    Type: Grant
    Filed: March 21, 1989
    Date of Patent: October 9, 1990
    Assignee: U.S. Philips Corporation
    Inventor: Petrus J. M. Peters
  • Patent number: 4958763
    Abstract: An aluminum or aluminum alloy surface is coated with molten AgNO.sub.3, the ilver nitrate is decomposed (at about 450.degree. C.-550.degree. C.) leaving a thin layer of silver metal, and then an inter-diffusion layer of silver and aluminum is formed (at about 570.degree. C.-660.degree. C.). The treated surface can be soldered by conventional means.
    Type: Grant
    Filed: August 29, 1989
    Date of Patent: September 25, 1990
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Amarnath P. Divecha, William A. Ferrando, Philip W. Hesse, Subhash D. Karmarkar
  • Patent number: 4948031
    Abstract: A process for joining first and second aluminum sheets in which the bonding surfaces of the aluminum sheets have their aluminum oxide layer replaced by a zinc layer and the zinc layers are plated with a non-alloy metal bonding material such as cadmium. The first and second aluminum sheets are then assembled and fastened together with an engaging means for holding the sheets together, and then the assembled sheets are placed in a vacuum. The sheets are subsequently heated in the vacuum thereby creating a bond of cadmium between them, removed from the vacuum, and then passivated.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: August 14, 1990
    Assignee: Hazeltine Corporation
    Inventor: Charles E. De Clerck
  • Patent number: 4932585
    Abstract: A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a molten solder bath. The electronic device, with the leads to be solder plated exposed, is lowered horizontally in the solder bath and is pulled out horizontally. A large quantity of solder adhering on the inclined plate pulls solder adhering on the leads sequentially along an inclined surface of the plate to obtain uniform thickness of solder plating on the leads without causing bridging.
    Type: Grant
    Filed: July 6, 1989
    Date of Patent: June 12, 1990
    Assignee: Senju Metal Industry Co., Ltd.
    Inventor: Hideki Nakamura
  • Patent number: 4908932
    Abstract: A torque sensor comprising a magnetic member whose magnetostrictive characteristics vary with the amount of torque applied thereto and coils for detecting magnetostrictive variation disposed opposite the magnetic member, and a method of manufacturing the same. The torque sensor is constituted as an independent unit separate from the shaft whose torque is to be measured. The independent unit consists of a cylindrical member having the magnetic member attached thereto and an enclosure member which is provided with the coils and is mounted so as to cover the cylindrical member and be rotatable about the same axis as the cylindrical member.
    Type: Grant
    Filed: October 20, 1988
    Date of Patent: March 20, 1990
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Toru Yagi, Tsuneo Takahashi, Masayuki Nishiguchi
  • Patent number: 4891275
    Abstract: An aluminum or aluminum alloy shape for manufacture of heat exchangers is coated with a metallic layer of a zinc-base alloy constituting a fluxless soldering or low temperature brazing material when heated. A process for direct coating of formed aluminum shapes in nascent state includes the steps of providing a non-reactive atmosphere around the shape, providing a coating material of zinc-base alloy and bringing the aluminum shape and the coating material into contact and maintaining the contact at an elevated temperature for a predetermined period of time for forming a coherent coating on the aluminum shape.
    Type: Grant
    Filed: June 27, 1986
    Date of Patent: January 2, 1990
    Assignee: Norsk Hydro a.s.
    Inventor: Richard Knoll
  • Patent number: 4854495
    Abstract: This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method.The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.
    Type: Grant
    Filed: June 18, 1987
    Date of Patent: August 8, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Akihiko Yamamoto, Akiomi Kohno, Toshihiri Yamada, Motohiro Satou, Keiji Taguchi, Kazuaki Yokoi
  • Patent number: 4849247
    Abstract: A method is provided for improving the adhesion of a substrate material which does not form stable bonds to a bondable material by applying high energy bondable ions to the surface of the substrate to create an interface alloy layer and then adhering a bondable material to the surface of the substrate material. The high energy ions used may be meal ions. Before adhering, the thickness of the interface layer may be increased to form a layer utilizing conventional processes such as flame spray, plasma spray or D-gun spray. Additionally, the method may be used to join similar or dissimilar first and second substrate materials.
    Type: Grant
    Filed: December 14, 1987
    Date of Patent: July 18, 1989
    Assignee: Sundstrand Corporation
    Inventors: John F. Scanlon, William D. Sherman
  • Patent number: 4844323
    Abstract: A method or joining ceramics comprising the steps: of preparing a ceramics body and another body to be connected with the ceramics body; of interposing a layer of ultra-fine particles having smaller size than the surface roughnesses of the contact surfaces of the ceramics body and the other body, the layer having larger thickness than the surface roughnesses, and the ultra-fine particles being reactive with the ceramics body and the other body and forming a reaction produce which has a strong bonding power to the ceramics body and the other body; and then of pressing and heating the piled composition of the ceramics body, other body and layer.
    Type: Grant
    Filed: February 23, 1988
    Date of Patent: July 4, 1989
    Assignees: Nihon Sinku Gijutsu Kabusiki Kaisha, Japan Atomic Energy Research Institute
    Inventors: Hitoshi Kondo, Hiroaki Kawamura, Konosuke Inagawa, Tetsuya Abe, Yoshio Murakami
  • Patent number: 4821404
    Abstract: A method for connecting a magnetic head core (1) with a mounting plate (2) in which the magnetic head core consists of ferrite and is separated from a preformed core block (4). Prior to separation the core block is soldered to a metal block (5) and the magnetic head core is then separated jointly with the mounting plate, from the overall block.
    Type: Grant
    Filed: August 3, 1987
    Date of Patent: April 18, 1989
    Inventors: Horst Gukkenberger, Karl Eberle, Klaus J. Kopnick
  • Patent number: 4814236
    Abstract: A laminated metal structure and a method of hardsurfacing stainless steel base metals are herein provided for resisting wear of steam turbine components at elevated temperatures. The laminated metal structure employs a buttering layer, sandwiched between the stainless steel base metal and a hardsurfacing layer. The buttering layer consists essentially of nickel or a nickel-based alloy and is selected to have a coefficient of thermal expansion which is between that of the base metal and that of the hardsurfacing material. This improved structure produces a relatively crack-free deposit that can provide greater service life for turbine components with less downtime due to repairs.
    Type: Grant
    Filed: June 22, 1987
    Date of Patent: March 21, 1989
    Assignee: Westinghouse Electric Corp.
    Inventors: Javaid I. Qureshi, Roland H. Kaufman, Michael E. Anderson, William L. Spahr
  • Patent number: 4804132
    Abstract: The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.
    Type: Grant
    Filed: August 28, 1987
    Date of Patent: February 14, 1989
    Inventor: Louis DiFrancesco
  • Patent number: 4790473
    Abstract: A cam follower and process of manufacture in which a hardenable cast iron reaction member is welded, as by high energy beam welding, to the end of a tubular, mild steel base member. The surface of the reaction member may be decarburized before welding. The weld is preferably characterized by austenitic properties and is formed by an alloy of nickel with the metal of the cam follower members.
    Type: Grant
    Filed: January 22, 1987
    Date of Patent: December 13, 1988
    Assignee: Eaton Corporation
    Inventors: Sundaram L. Narasimhan, Ronald J. Lake, Jay M. Larson
  • Patent number: 4787551
    Abstract: Disclosed is a method of welding a temperature-sensing thermocouple to a silicon wafer for sensing the temperature of the wafer during rapid thermal processing using TIG welding and/or electron-beam welding. In one embodiment, a ball of silicon is formed on the bead at one end of a thermocouple by placing the thermocouple on a silicon chip and then melting the silicon chip with a TIG welder. The ball and thermocouple are then placed on the surface of a silicon wafer and the ball and surface are then melted whereby the ball of silicon flows into the silicon wafer. In placing the thermocouple on an edge portion of a silicon wafer, the wafer is supported on a tantalum plate with the edge portion of the wafer extending beyond the plate. A molybdenum sheet is positioned on the top surface of the wafer with the edge portion of the wafer exposed. A TIG arc is established with the molybdenum layer and then the arc is moved to the edge portion of the wafer for melting the silicon.
    Type: Grant
    Filed: May 4, 1987
    Date of Patent: November 29, 1988
    Assignee: Stanford University
    Inventors: Judy L. Hoyt, Kenneth E. Williams, James F. Gibbons
  • Patent number: 4785989
    Abstract: Alumina is bonded to a metal by means of an active brazing filler alloy. When the metal to which the alumina is bonded is a high blushing metal, that is, a metal on which the active brazing filler alloy readily flows on the surface, a thin layer of a low blushing metal is disposed therebetween.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: November 22, 1988
    Assignee: GTE Products Corporation
    Inventors: Howard Mizuhara, Eugene Huebel
  • Patent number: 4771018
    Abstract: An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform and the gold/silicon seed, wherein the seed acts as a catalyst to form an eutectic bond.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: September 13, 1988
    Assignee: Intel Corporation
    Inventors: Bidyut K. Bhattacharyya, Eric S. Tosaya
  • Patent number: 4756467
    Abstract: A wire having enhanced solderability characteristics is formed by applying a very thin uniform coat of silver to a clean copper wire substrate. A coat of tin is plated on top of the silver. Heat treatment causes the silver and tin to form an interface alloy. The device can be other than a wire and the substrate can be other than copper.
    Type: Grant
    Filed: April 3, 1986
    Date of Patent: July 12, 1988
    Assignee: Carlisle Corporation
    Inventor: Myron D. Schatzberg
  • Patent number: 4749118
    Abstract: When a ceramic is bonded to a metal having a low thermal expansion, if a Cr layer of a Cr diffusion layer is formed on the surface of the metal and the ceramic is bonded to the metal through this Cr layer or Cr diffusion layer by an Al insert, a bonded structure having a good air-tightness and a high strength is obtained.
    Type: Grant
    Filed: February 2, 1987
    Date of Patent: June 7, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Kazuaki Yokoi, Toshihiro Yamada, Akiomi Kohno, Motohiro Satou, Hiroyuki Kawamoto
  • Patent number: 4744506
    Abstract: The ends of a plurality of copper conductors bearing superconductive strands, for example of niobiumtitanium, are treated with a liquid metal solvent to selectively remove the copper from the superconductive strands. The liberated strands of superconductor are then soldered with a superconducting solder. The joint is included in a coil which at superconducting temperatures induces a high magnetic field of 0.5 Tesla and above.
    Type: Grant
    Filed: April 18, 1986
    Date of Patent: May 17, 1988
    Assignee: General Electric Company
    Inventor: Roy F. Thornton
  • Patent number: 4737418
    Abstract: A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.
    Type: Grant
    Filed: December 22, 1986
    Date of Patent: April 12, 1988
    Assignee: Advanced Materials Technology Corp.
    Inventor: James A. Slattery
  • Patent number: 4720036
    Abstract: A rotary wire brush is used to transfer nickel, copper or brazing filler metal, like gold and silver from a slab of metal to the surface of a workpiece. The brush cleans the metal workpiece to expose a metal surface freshly and rubs metal of the metal slab for quick transfer for the freshly exposed metal surface of the workpiece where it sticks to build up a layer between one and one hundred microns thick in somewhere between one and two minutes. Metal slab and workpiece are both pressed against the brush, but the workpiece is not pressed enough to score the workpiece. The surface of the workpiece coated in this way can then be joined to another workpiece surface thus coated in a fluxless brazing or soldering process in which the temperature does not need to be higher than 1000.degree. C.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: January 19, 1988
    Assignee: Kernforschungsanlage Julich Gesellschaft mit beschranker Haftung
    Inventors: Rudolf Lison, Hans Dienstknecht, Egon Sigismund
  • Patent number: 4710103
    Abstract: Steam turbine blades are fastened in an outer layer of weld material applied by deposit welding to the outer surface of the rotor body, the composition of the weld material being optimally matched with respect to hot strength and/or corrosion resistance, in particular stress corrosion resistance, to the local mechanical, thermal and chemical requirements. A possible option is additionally to insert a deposit welded intermediate layer of medium alloying element content. Steels with 10-14% Cr, low carbon and additions of Mo and possibly V are preferred as the weld material for the layer.
    Type: Grant
    Filed: June 11, 1986
    Date of Patent: December 1, 1987
    Assignee: BBC Brown, Boveri & Company, Limited
    Inventors: Guy Faber, Gottfried Kuhnen
  • Patent number: 4703884
    Abstract: A two-stage bonding technique for bonding high density silicon nitride and other ceramic materials to stainless steel and other hard metals, and multilayered ceramic-metal composites prepared by the technique are disclosed. The technique involves initially slurry coating a surface of the ceramic material at about 1500.degree. C. in a vacuum with a refractory material and the stainless steel is then pressure bonded to the metallic coated surface by brazing it with nickel-copper-silver or nickel-copper-manganese alloys at a temperature in the range of about 850.degree. to 950.degree. C. in a vacuum. The two-stage bonding technique minimizes the temperature-expansion mismatch between the dissimilar materials.
    Type: Grant
    Filed: November 20, 1986
    Date of Patent: November 3, 1987
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Richard L. Landingham, Thomas E. Shell
  • Patent number: 4681251
    Abstract: There is disclosed a method of joining Ni-base heat-resisting alloys which comprises forming, under an inert atmosphere, an aluminum layer on at least surfaces to be joined of a constructional member which has been divided into a plural number of parts composed of a Ni-base heat-resisting alloy reinforced by a .gamma.' phase in Ni.sub.3 Al system, followed by heating the parts so that said aluminum is dispersed in said Ni-base heat-resisting alloys, the joining portion (joint) contains substantially no .beta.-NiAl phase and a .gamma.'-Ni.sub.3 Al phase is dispersed therein to join the parts. The joint provided by the method according to the present invention has been improved in its strength and corrosion resistance at a high temperature. Further, the method according to the present invention can be carried out with a high degree of freedom in supplying a joining filler metal.
    Type: Grant
    Filed: October 2, 1985
    Date of Patent: July 21, 1987
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Shuichi Komatsu, Kazumi Shimotori, Hiromitsu Takeda, Masako Nakahashi
  • Patent number: 4674675
    Abstract: Appropriately cleaned titanium or titanium alloy and iron-nickel alloy parts are bonded together to obtain a compound part by providing particular metallic layers in between them and diffusion welding the assembly together. The layer sequence is critical whereby vanadium is used always adjacent the titanium part and chromium or iron or nickel is used adjacent the iron-nickel part whereby chromium and iron can be directly bonded to the vanadium layer; in the case of nickel either chromium or tungsten and platinum are interposed.
    Type: Grant
    Filed: February 2, 1984
    Date of Patent: June 23, 1987
    Assignee: Messerschmitt-Boelkow-Blohm GmbH
    Inventor: Dietmar Mietrach
  • Patent number: 4650108
    Abstract: A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer 18 of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface 20 such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film 14 and metal surface 20 when the assembly cools.
    Type: Grant
    Filed: August 15, 1985
    Date of Patent: March 17, 1987
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian D. Gallagher
  • Patent number: 4643347
    Abstract: A permanent magnet of a hard magnetic material, such as rare earth-cobalt intermetallic compounds or AlNiCo, is joined to a mounting surface by way of intermediate layers. These layers avoid heating the magnet above the maximum service temperature of the magnetic material, and thus prevent losing the magnetic properties.
    Type: Grant
    Filed: October 9, 1984
    Date of Patent: February 17, 1987
    Assignee: North American Philips Corporation
    Inventors: Robert L. Bronnes, Richard C. Sweet, James K. McKinlay
  • Patent number: 4615952
    Abstract: An aluminum or aluminum alloy shape for manufacture of heat exchangers, coated with a metallic layer of a zinc-base alloy constituting a fluxless soldering or low temperature brazing material when heated. A process for direct coating of formed aluminum shapes in nascent state includes the steps of providing a non-reactive atmosphere around the shape, providing a coating material of zinc-base alloy and bringing the aluminum shape and the coating material into contact and maintaining the contact at an elevated temperature for a predetermined period of time for forming a coherent coating on the aluminum shape.
    Type: Grant
    Filed: January 16, 1984
    Date of Patent: October 7, 1986
    Assignee: Norsk Hydro a.s.
    Inventor: Richard Knoll
  • Patent number: 4613069
    Abstract: Aluminum, magnesium, or their alloys are soldered by means of a tin-lead system following initial application of a thin coating of nickel-copper alloy.
    Type: Grant
    Filed: January 6, 1984
    Date of Patent: September 23, 1986
    Assignee: The United States of America as represented by the Secretary of the Interior
    Inventors: Wilbert L. Falke, Agnes Y. Lee, Leander A. Neumeier
  • Patent number: 4591088
    Abstract: A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.
    Type: Grant
    Filed: October 31, 1984
    Date of Patent: May 27, 1986
    Assignee: Hughes Aircraft Company
    Inventors: Richard R. Mulliner, James S. Ajioka
  • Patent number: 4582243
    Abstract: A die (40) for extrusion of optical grade fibers has its hard insert (42) placed under compression within a sleeve (44). Sleeve (44) is provided with a tapered interior surface (50) which matches the tapered exterior surface (48) of the insert (42). A metal lubricating layer (60) is provided between the tapered surfaces. The insert is pressed in to obtain compressive prestressing thereof, and the lubricating metal diffuses at the tapered surfaces to lock the insert in the sleeve.
    Type: Grant
    Filed: December 14, 1984
    Date of Patent: April 15, 1986
    Assignee: Hughes Aircraft Company
    Inventor: Jon H. Myer
  • Patent number: 4567110
    Abstract: High-temperature joints formed from metallized ceramics are disclosed wherein the metal coatings on the ceramics are vacuum sputtered thereon.
    Type: Grant
    Filed: July 17, 1981
    Date of Patent: January 28, 1986
    Assignee: Massachusetts Institute of Technology
    Inventor: Philip O. Jarvinen
  • Patent number: 4564743
    Abstract: A method for fusion welding together two portions of a parent metal comprised by an aluminum alloy includes the steps of surface abrading the two portions in at least the region of their mutual interface and intended weld zones, applying to each abraded surface a hot-sprayed coating comprised by a metal having a lower electrochemical potential than the parent metal, abutting the two coated portions at the mutual interface, and fusing them together by fusion welding.
    Type: Grant
    Filed: August 23, 1983
    Date of Patent: January 14, 1986
    Assignee: The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Northern Ireland
    Inventors: Stuart S. Birley, Philip E. Roper
  • Patent number: 4541480
    Abstract: An improved plate-type heat exchanger and a method for joining the plates thereof is disclosed. The heat exchanger includes a core containing a plurality of spaced parallel plates. The core is attached to the housing of the heat exchanger by means of a spray weld process and a standard weld process. In the spray weld process a filler metal is deposited on the core and the housing frame at the joint where the end portion of the plates and the housing frame meet. The filler metal used in the spray weld process forms a spray weld fillet which increases the thickness of the plates. The standard weld process further secures the plates to the heat exchanger housing frame.
    Type: Grant
    Filed: December 22, 1982
    Date of Patent: September 17, 1985
    Inventor: Kenneth B. Beckmann
  • Patent number: 4516715
    Abstract: A vacuum container of a radiation image multiplier tube is disclosed, which is provided with a radiation input window made of Al or an Al alloy and an output portion made of a glass or ceramic insulator for outputting radiation image multiplied signals. Between the input window and the output portion is interposed a ring made of Fe or an Fe alloy, and an airtight joint between the ring of the input window is effected by hot pressure-bonding through a thin layer of Ni, Cu or Al. A method of manufacturing the vacuum container by means of such hot pressure-bonding is also disclosed.
    Type: Grant
    Filed: February 18, 1983
    Date of Patent: May 14, 1985
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Fumio Sugimori, Chikae Nishino, Norio Harao
  • Patent number: 4474323
    Abstract: Connection to a tantalum capacitor electrode (17) is effected using a conductive paint layer (15), incorporating pure silver and pure copper particles, which minimizes silver leeching by a tincontaining solder alloy (18) by which the lead wire (17) is connected to the conductive paint layer (15), and thus minimizes power factor degradation.
    Type: Grant
    Filed: September 30, 1982
    Date of Patent: October 2, 1984
    Assignee: International Standard Electric Corporation
    Inventors: Ronald D. Weeks, David J. Croney
  • Patent number: 4407441
    Abstract: The surface of the stainless steel object to be welded is flame sprayed with a powder mixture of aluminium and a metal having a high melting point, e.g. nickel, to form a thin film undercoat which in turn is flame sprayed with a layer of very pure aluminium. The aluminium object is then welded to the coated surface of the stainless steel object using very pure aluminium as filler. Flame spraying is advantageously made using a plasma gas mixture including one part of hydrogen and ten parts of nitrogen. The bonded portions of the two objects may be electroplated with a thin film of nickel.
    Type: Grant
    Filed: April 8, 1981
    Date of Patent: October 4, 1983
    Assignee: Agence Spatiale Europeenne
    Inventor: Kornelis J. Aarts
  • Patent number: 4406059
    Abstract: A mechanical and electrical connection for a piezoelectric member of polyic material such as polyvinylidene fluoride, and method for forming such a connection. To form the connection, the piezoelectric member is first masked to prevent a preselected portion of its surface from being coated during subsequent coating operations. An electrically conductive member such as a lead wire or a solderable terminal is then attached to the nonmasked area of the piezoelectric member with adhesive such as epoxy. The masked piezoelectric member, the electrically conductive member, and (incidentally) the mask are then coated with a conductive coating such as sputtered gold to electrically connect the conductive member to the piezoelectric member. The mask can now be removed from the piezoelectric member if desired, although it can be left in place as a convenient vise.
    Type: Grant
    Filed: April 22, 1981
    Date of Patent: September 27, 1983
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: William R. Scott, Philip Bloomfield, William T. Weist, Karen M. McMahon